JP2005340799A - Electronic component mounting method and electronic component mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attain more stable adsorption while reducing a reaction against disturbance by decreasing a feedback rate, involved in improved adsorption rate. <P>SOLUTION: A displacement of an electronic component relative to a suction nozzle before the electronic component is mounted on a printed wiring board is stored in a RAM 41 for predetermined adsorption frequency portions of a component feeding unit 18, then a CPU 40 calculates an average value (r) of the displacement. When a predetermined set adsorption frequency is reached, a temporary coefficient (At) is obtained by adding an initial value (A) to a value obtained by multiplying a coefficient (a) by the adsorption frequency (c), then the CPU 40 calculates a feedback value (R) by multiplying the temporary coefficient (At) by the average value (r). The calculated feedback value (R) is added to an offset value for a component adsorbing position to update an offset, which is used in next adsorbing operation of the component feeding unit 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  According to the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and the electronic component sucked by the suction nozzle by a component recognition camera The present invention relates to an electronic component mounting method and an electronic component mounting apparatus that capture an image, perform recognition processing by a recognition processing device, and mount the image on a printed board.

Before the electronic component is taken out from the component supply unit and mounted on the printed circuit board, the electronic component picked up and held by the suction nozzle is imaged by the component recognition camera, and the suction position deviation information obtained by the recognition processing by the recognition processing device is obtained. Each component supply unit is reflected in the next suction (see, for example, Patent Document 1).
JP 2000-141174 A

  However, if the adsorption position deviation information obtained by the recognition process is reproducible, the adsorption rate is improved. However, if the reproducibility is poor, the adsorption is not stable even if the adsorption is once stabilized. There was a problem.

  Accordingly, an object of the present invention is to reduce the feedback rate as the adsorption rate increases, thereby reducing the reaction to disturbance and further stabilizing the adsorption.

Therefore, according to the first aspect of the present invention, an electronic component is picked up and picked up by a picking nozzle based on an offset value related to a picking-up position from an arbitrary component supply unit among a plurality of component supply units, and picked up by a picking nozzle by a component recognition camera. In the electronic component mounting method of picking up an imaged electronic component, recognizing it by the recognition processing device and mounting it on the printed circuit board,
Decrease the feedback value with the stabilization of adsorption after the start of operation,
The offset value related to the component suction position is updated based on the feedback value and used in the next suction operation of the component supply unit.

According to a second aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and is electronically picked up by the suction nozzle by a component recognition camera. In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When a predetermined set number of adsorptions is reached, a temporary coefficient is obtained by adding the initial value to the value obtained by multiplying the coefficient by the adsorption number,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component suction position to update the offset and used in the next suction operation of the component supply unit.

According to a third aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and the electronic picked up by the suction nozzle by a component recognition camera In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined number of suctions has not been reached, an initial value is used as a temporary coefficient, and if the set number of suctions has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of suctions. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component suction position to update the offset and used in the next suction operation of the component supply unit.

According to a fourth aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and is electronically picked up by the suction nozzle by a component recognition camera. In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When a predetermined set number of feedback times is reached, a temporary coefficient is obtained by adding an initial value to the value obtained by multiplying the coefficient by the number of feedback times,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component pick-up position to update the offset, and used in the next pick-up operation of the component supply unit.

According to a fifth aspect of the present invention, an electronic component is picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and is electronically picked up by the suction nozzle by a component recognition camera. In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined set number of feedbacks has not been reached, the initial value is used as a temporary coefficient, and if the set number of feedbacks has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of feedbacks. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component pick-up position to update the offset, and used in the next pick-up operation of the component supply unit.

According to a sixth aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and the electronic picked up by the suction nozzle by a component recognition camera In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When the predetermined adsorption rate is reached, the initial value is added to the value obtained by multiplying the coefficient by the number of adsorptions to obtain a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component pick-up position to update the offset, and used for the next pick-up operation of the component supply unit.

According to a seventh aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and is electronically picked up by the suction nozzle by a component recognition camera. In an electronic component mounting method in which a component is imaged, recognized by a recognition processing device, and mounted on a printed circuit board.
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined suction rate has not been reached, the initial value is used as a temporary coefficient, and if the set number of suction mistakes has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of suctions. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
The calculated feedback value is added to the offset value related to the component pick-up position to update the offset, and used in the next pick-up operation of the component supply unit.

According to an eighth aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and is electronically picked up by the suction nozzle by a component recognition camera. In an electronic component mounting apparatus that images a component, recognizes it by a recognition processing apparatus, and mounts it on a printed circuit board.
Means for storing a positional shift amount of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An acquisition means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying the coefficient by the number of adsorptions when a predetermined set number of adsorptions is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
Control means for adding the feedback value calculated by the calculating means to the offset value related to the component pick-up position and updating the offset so as to be used in the next pick-up operation of the component supply unit is provided. It is characterized by.

According to a ninth aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and the electronic picked up by the suction nozzle by a component recognition camera In an electronic component mounting apparatus that images a component, recognizes it by a recognition processing apparatus, and mounts it on a printed circuit board,
Storage means for storing a positional deviation amount of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An acquisition means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying a coefficient by the number of feedback times when a predetermined set feedback count is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
There is provided a control means for controlling the feedback value calculated by the calculating means to be added to the offset value related to the component pick-up position and updating the offset to be used in the next pick-up operation of the component supply unit. It is characterized by that.

According to a tenth aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle based on an offset value related to a component suction position from an arbitrary component supply unit among a plurality of component supply units, and the electronic picked up by the suction nozzle by a component recognition camera In an electronic component mounting apparatus that images a component, recognizes it by a recognition processing apparatus, and mounts it on a printed circuit board,
Storage means for storing a positional deviation amount of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An obtaining means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying the coefficient by the number of adsorption times when a predetermined adsorption rate is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
There is provided a control means for controlling the feedback value calculated by the calculating means to be added to the offset value related to the component pick-up position and updating the offset to be used in the next pick-up operation of the component supply unit. It is characterized by that.

  In the present invention, as the adsorption rate is improved, by reducing the feedback rate, the reaction to disturbance can be reduced and the adsorption can be further stabilized.

  Embodiments of the present invention will be described below with reference to the drawings. First, in the plan view of the electronic component mounting apparatus 5 in FIG. 1, reference numeral 11 denotes a Y table that moves in the Y direction by driving a Y axis drive motor 12, and 13 denotes a Y table 11 driven by an X axis drive motor 14. The XY table moves in the XY direction as a result of moving in the X direction, and the printed circuit board 9 on which the chip-like electronic component 8 is mounted is fixed and mounted on a fixing means (not shown).

  Reference numeral 17 denotes a component supply table, in which a large number of component supply units 18 serving as a component supply device for supplying the electronic component 8 to the component extraction position are arranged. Reference numeral 19 denotes a supply table driving motor. When the ball screw 20 is rotated, the supply table 17 is guided to the linear guide 22 via the nut 21 fitted to the ball screw 20 and fixed to the supply table 17. Move in the direction. Reference numeral 23 denotes an intermittently rotating rotary table, and mounting heads 25 having a plurality of suction nozzles 24 as take-out nozzles are arranged at equal intervals according to the intermittent pitch on the outer edge of the table 23.

  The stop position due to the intermittent rotation of the rotary table 23 of the mounting head 25 where the suction nozzle 24 sucks and takes out the electronic component 8 from the supply unit 18 is the suction station A, and the mounting head 25 descends at the suction station A. Thus, the suction nozzle 24 sucks and takes out the electronic component 8.

  The position B is a recognition station in which the mounting head 25 that sucks the electronic component 8 stops due to the intermittent rotation of the rotary table 23, and an image of the component 8 is picked up by the component recognition camera 15, and the positional deviation of the component 8 with respect to the suction nozzle 24 occurs. Recognition processing is performed by the recognition processing device 43.

  The position C is a mounting station where the mounting head 25 stops in order to mount the electronic component 8 held by the suction nozzle 24 on the printed circuit board 9, and the XY table 13 moves as the mounting head 25 moves down to a predetermined position. The component 8 is mounted on the printed circuit board 9 stopped at the position.

  Further, as shown in FIG. 2, the mounting head 25 is attached to a linear guide 32 via a head block 31 and is movable up and down with respect to the rotary table 23.

  Reference numeral 26 denotes an elevating lever that moves up and down to oscillate the oscillating lever 27 of the component supply unit 18, and an unillustrated storage wound around the tape supply reel 28 by oscillating the elevating lever 27 at the suction station A The storage tape as a member is fed, and the electronic component 8 stored in the storage tape is supplied to the suction position of the nozzle 24.

  Next, the control block diagram of FIG. 3 will be described. Each electronic component mounting device 5 includes a CPU 40 as a control unit that performs overall control of the mounting device 5 and a RAM connected to the CPU 40 via a bus line. (Random Access Memory) 41 and ROM (Read Only Memory) 42 are provided. Then, based on the data stored in the RAM 41, the CPU 40 follows the program stored in the ROM 42, and the operation relating to the removal and mounting of the electronic component of the electronic component mounting apparatus is performed via the interface 44 and the drive circuit 48. Oversee and control.

  The RAM 41 stores mounting data for each type of printed circuit board 9 related to component mounting. For each mounting order (for each step number), the X direction (indicated by X) in the printed circuit board 9, Y Information of direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 18 and the like are stored. The RAM 41 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers (lane numbers) of the component supply units 18 for each type of the printed circuit boards 9, that is, component arrangement information. Further, component library data relating to the size of the electronic component is stored for each component ID.

  The RAM 41 stores, for each component supply unit 18, an offset value in the X and Y directions related to a suction position, which is a component extraction position by the suction nozzle 24 of each component supply unit 18.

  A recognition processing device 43 is connected to the CPU 40 via the interface 44. The recognition processing device 43 performs recognition processing of an image captured by the component recognition camera 15, and the processing result is sent to the CPU 40. Is sent out. That is, the CPU 40 outputs an instruction to the recognition processing device 43 so as to perform recognition processing (calculation of the amount of misalignment) of the image captured by the component recognition camera 15 and receives the recognition processing result from the recognition processing device 43. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 43, the result is sent to the CPU 40, and the CPU 40 drives the XY by the Y-axis drive motor 12 and the X-axis drive motor 14 of the previous XY table 13. By moving the printed circuit board 9 in the direction, the suction nozzle 24 used by the pulse motor 47 is rotated by θ, and the rotational angular position around the X and Y directions and the vertical axis is corrected.

  The recognition processing device 43 captures an image captured by the component recognition camera 15, and the captured image is displayed on the CRT 45. The CRT 45 is provided with various touch panel switches 46 as input means for data setting, and various settings can be performed by an operator operating the touch panel switch 46. A keyboard may be used as the input means.

  The operation will be described below with the above configuration. First, the printed circuit board 9 is supplied from the upstream device, is fixed by the fixing means on the XY table 13, and moves to the component mounting position. Further, when the mounting head 25 stops at the suction station A by intermittent rotation through the index mechanism of the rotary table 23, the supply base 17 is moved by the drive of the supply base drive motor 19, and the mounting data stored in the RAM 41 is stored. Accordingly, the component supply unit 18 for storing the electronic component 8 to be supplied is stopped at the suction position of the suction nozzle 24 of the mounting head 25 of the suction station A, and the electronic component 8 is taken out when the suction nozzle 24 is lowered.

  At this time, the elevating lever 26 is lowered to swing the swing lever 27 of the component supply unit 18, and the storage tape wound in the tape supply reel 28 is fed at the suction station A and stored in the storage tape. The electronic component 8 is supplied to the suction position of the nozzle 24. Further, the CPU 40 controls the supply table drive motor 19 and the index mechanism according to the offset values in the XY directions related to the component suction positions stored in the RAM 41, and the supply table 17 is driven by the supply table drive motor 19 in the X direction. In the Y direction, the rotary table 23 is moved by driving the index mechanism to correct the component suction position, and the electronic component 8 is taken out by lowering the suction nozzle 24.

  In addition, since each suction position is slightly shifted from the designed position for each component supply unit 18, offset values in the X direction and the Y direction are stored in the RAM 41 for each component supply unit 18. .

  Next, the rotary table 23 rotates intermittently via the index mechanism, and the mounting head 25 holding the electronic component 8 moves to the next station and stops, and further rotates to the recognition station B. Moving. Then, the electronic component 8 picked up by the suction nozzle 24 is picked up by the component recognition camera 15, and the image is recognized by the recognition processing device 43, and the positional deviation of the electronic component 8 relative to the suction nozzle 24 is recognized.

  Next, when the recognition process is completed, the CPU 40 of the electronic component mounting apparatus 5 calculates the amount to be corrected based on the recognition result in addition to the XY coordinates and mounting angle of the mounting data stored in the RAM 41. At this time, the CPU 40 drives the Y-axis drive motor 12 and the X-axis drive motor 14 by adding a pulse motor 47 that rotates the suction nozzle 24 and the correction amount to the position indicated by the mounting data in the plane direction. To do.

  Then, the rotary table 23 rotates intermittently to reach the mounting station C, and the electronic component 8 that has finished the angular positioning taking the correction amount into consideration is moved to the XY table 13 to finish the positioning in the plane direction. Install on top.

  In this manner, the electronic components 8 are sequentially picked up and taken out from the various component supply units 18, and the electronic components 8 are mounted on the printed circuit board 9. Then, the printed circuit board 9 on which all the electronic components 8 are mounted is delivered to the downstream device, and the electronic components 8 are mounted on the printed circuit board 9 in the same manner.

  The suction operation as described above will be performed one after another. The control for stabilizing the suction operation will be described below in accordance with the flowchart shown in FIG. 4 along with the suction operation and the mounting operation.

  First, when a suction operation is performed in which the suction nozzle 24 extracts the electronic component 18 from the component supply unit 18, a first counter (not shown) for counting the number of times of suction is incremented by “1”, and the count value is set. The CPU 40 determines whether or not the predetermined set sample number Sm has been reached. When the CPU 40 determines that the set sample number Sm has not been reached, a sampling operation is performed, and the recognition processing device 43 recognizes the image of the electronic component 8 captured by the component recognition camera 15 as described above. When the positional deviation of the electronic component 8 relative to the suction nozzle 24 is recognized after processing, the positional deviation amount is stored in the RAM 41.

  Then, the suction operation for taking out the electronic component 8 from the component supply unit 18 is performed one after another, and the CPU 40 determines that the count value of the first counter (not shown) has reached the predetermined set sample number Sm. Then, the average value r of the positional deviation amount of the electronic component 8 stored in the RAM 41 with respect to the suction nozzle 24 is calculated by the CPU 40 and stored in the RAM 41. Then, the CPU 40 determines whether or not the count value of the first counter has reached a predetermined set number of times of adsorption C. If it is determined that the number of times of adsorption C has not been reached, the CPU 40 temporarily A typical coefficient At is set to an initial value A obtained as an optimum value by trial, and stored in the RAM 41.

  Then, the CPU 40 calculates the feedback value R by multiplying the initial value A as the temporary coefficient At by the average value r and stores it in the RAM 41. Further, the CPU 40 adds the calculated feedback value R to the offset value in the X and Y directions related to the component suction position to update the offset, and uses it in the next suction operation of the component supply unit 18.

  That is, the CPU 40 controls the supply base drive motor 19 and the index mechanism according to the added value, and moves the supply base 17 by driving the supply base drive motor 19 in the X direction, and rotary by driving the index mechanism in the Y direction. By moving the table 23, the component suction position is corrected, and the electronic component 8 is taken out by the lowering of the suction nozzle 24. Then, the suction operation according to the added value is performed until the predetermined set number of times C is reached.

  Eventually, if the CPU 40 determines that the count value of the first counter has reached a predetermined number of times of adsorption C and the adsorption has stabilized, the feedback value is decreased and the feedback rate is decreased. The CPU 40 controls. That is, the CPU 40 adds the initial value A to the value obtained by multiplying the negative coefficient a by the number of times of adsorption c, and the temporary coefficient At which is a number smaller than the initial value A (for example, 0.5). (0 <At ≦ 1). Then, the CPU 40 calculates a feedback value R by multiplying the temporary coefficient At by the average value r of the positional deviation amount. The calculated feedback value R is smaller than the feedback value (the value obtained by multiplying the initial value A by the average value of the displacement amount) until the number of adsorptions C is reached, and when the feedback value R decreases, the feedback rate (feedback) The value / component positional deviation amount (average value r)) also decreases. The calculated feedback value R is stored in the RAM 41. Further, the CPU 40 adds the calculated feedback value R to the offset value in the XY direction related to the component suction position to update the offset value, and uses it in the next suction operation of the component supply unit 18 as described above. To do.

  In this embodiment, when the initial value A is 0.5, the number of times of adsorption is 200 times, and the coefficient a is −0.001, At = 0.5−0.001 × 200 = 0.3. The temporary initial value At decreases from 0.5 to 0.3, and the feedback value R (At × r) also decreases.

  Further, when the initial value A is obtained by adding the initial value A to the value obtained by multiplying the coefficient a by the number of times of suction c, the number of times of suction is reset once, and the coefficient increases as the number of times of suction c thereafter increases. At may be decreased, the feedback value may be decreased, and the feedback rate may be decreased. Further, in order to obtain the temporary coefficient At, in addition to the above method, for example, after the count value of the first counter reaches a predetermined number of adsorptions C, the coefficient At is decreased as the number of adsorptions increases. The coefficient may be obtained using a simple relational expression.

  By performing the electronic component suction operation as described above, for example, the reaction to disturbance is reduced, and the suction operation can be further stabilized.

  Next, a second embodiment of the control for stabilizing the adsorption operation will be described below in accordance with a flowchart as shown in FIG. First, when a suction operation is performed in which the suction nozzle 24 takes out the electronic component 18 from the component supply unit 18, a second counter (not shown) for counting the number of times of suction is incremented by “1”, and the count value is set. The CPU 40 determines whether or not the predetermined set sample number Sm has been reached. When the CPU 40 determines that the set sample number Sm has not been reached, a sampling operation is performed, and the recognition processing device 43 recognizes the image of the electronic component 8 captured by the component recognition camera 15 as described above. When the positional deviation of the electronic component 8 relative to the suction nozzle 24 is recognized after processing, the positional deviation amount is stored in the RAM 41.

  When the CPU 40 determines that the electronic counter 8 is successively taken out from the component supply unit 18 and the count value of the second counter has reached a predetermined set sample number Sm, the RAM 41 The average value r of the positional deviation amount of the electronic component 8 stored in the suction nozzle 24 is calculated by the CPU 40 and stored in the RAM 41. Then, a third counter (not shown) increments the feedback count f by “1”, and the CPU 40 determines whether or not the count value has reached a predetermined set feedback count F.

  If it is determined that the set feedback count F has not been reached, the CPU 40 sets the temporary coefficient At to the initial value A obtained as an optimum value by trial and stores it in the RAM 41.

  Then, the CPU 40 calculates the feedback value R by multiplying the initial value A as the temporary coefficient At by the average value r and stores it in the RAM 41. Further, the CPU 40 adds the calculated feedback value R to the offset value in the X and Y directions related to the component suction position to update the offset, and uses it in the next suction operation of the component supply unit 18.

  That is, the CPU 40 controls the supply base drive motor 19 and the index mechanism according to the added value, and moves the supply base 17 by driving the supply base drive motor 19 in the X direction, and rotary by driving the index mechanism in the Y direction. By moving the table 23, the component suction position is corrected, and the electronic component 8 is taken out by the lowering of the suction nozzle 24. Then, the suction operation according to the added value is performed until the set feedback count F is reached.

  Eventually, when the CPU 40 determines that the count value of the third counter has reached a predetermined set feedback count F and the adsorption has stabilized, the CPU 40 controls to change the feedback rate. That is, the CPU 40 adds the initial value A to a value obtained by multiplying the negative coefficient a by the number of feedbacks f to obtain a temporary coefficient At. Then, the CPU 40 calculates the feedback value R by multiplying the temporary coefficient At by the average value r and stores it in the RAM 41. Further, the CPU 40 updates the offset by adding the calculated feedback value R to the offset value in the X and Y directions related to the component pickup position, and uses it in the next pickup operation of the component supply unit 18 as described above. .

  By performing the electronic component suction operation as described above, for example, the reaction to disturbance is reduced, and the suction operation can be further stabilized.

  Next, a third embodiment of the control for stabilizing the adsorption operation will be described below according to a flowchart as shown in FIG. First, when a suction operation is performed in which the suction nozzle 24 extracts the electronic component 18 from the component supply unit 18, a fourth counter (not shown) for counting the number of times of suction is incremented by “1”, and the suction operation is performed. However, the CPU 40 determines whether or not an adsorption error has occurred.

  If it is not an adsorption mistake, the CPU 40 determines whether or not the number of adsorptions has reached a predetermined set sample number Sm. If the CPU 40 determines that the set sample number Sm has not been reached, a sampling operation is performed. Then, the next adsorption operation is performed. However, if it is an adsorption mistake, a fifth counter (not shown) for the number of adsorption mistakes increments “1” and the adsorption rate R = (1−e / c) based on the number of adsorptions c and the number of adsorption mistakes e. ), The CPU 40 similarly determines whether or not the number of adsorptions has reached a predetermined set sample number Sm. If the CPU 40 determines that the set sample number Sm has not been reached, the sampling operation is performed. Then, the next adsorption operation is performed.

  When the suction operation is performed in this manner and the CPU 40 determines that the count value of the fourth counter has reached the predetermined set sample number Sm, the suction of the electronic component 8 stored in the RAM 41 by the sampling operation is performed. The average value r of the positional deviation amount with respect to the nozzle 24 is calculated by the CPU 40 and stored in the RAM 41.

  Then, the CPU 40 determines whether or not a predetermined set suction rate R in which the suction rate has been set has been reached. When it is determined that the set adsorption rate R has not been reached, the CPU 40 sets the temporary coefficient At to the initial value A obtained as an optimum value by trial and stores it in the RAM 41.

  Then, the CPU 40 calculates the feedback value R by multiplying the initial value A as the temporary coefficient At by the average value r and stores it in the RAM 41. Further, the CPU 40 adds the calculated feedback value R to the offset value in the X and Y directions related to the component suction position to update the offset, and uses it in the next suction operation of the component supply unit 18.

  That is, the CPU 40 controls the supply base drive motor 19 and the index mechanism according to the added value, and moves the supply base 17 by driving the supply base drive motor 19 in the X direction, and rotary by driving the index mechanism in the Y direction. By moving the table 23, the component suction position is corrected, and the electronic component 8 is taken out by the lowering of the suction nozzle 24. Then, the suction operation according to the added value is performed until the set suction rate R is reached.

  Eventually, with the stabilization of the adsorption after the start of operation, the adsorption rate based on the count values of the fourth counter and the fifth counter is improved, and the CPU 40 determines that the predetermined adsorption rate R has been set. Then, the CPU 40 controls so as to change the feedback rate. That is, the CPU 40 adds the initial value A to a value obtained by multiplying the negative coefficient a by the number of times of suction c to obtain a temporary coefficient At. Then, the CPU 40 calculates the feedback value R by multiplying the temporary coefficient At by the average value r and stores it in the RAM 41. Further, the CPU 40 updates the offset by adding the calculated feedback value R to the offset value in the X and Y directions related to the component pickup position, and uses it in the next pickup operation of the component supply unit 18 as described above. .

  By performing the electronic component suction operation as described above, for example, the reaction to disturbance is reduced, and the suction operation can be further stabilized.

  The coefficient a is stored in advance in the RAM 41. However, a plurality of types of coefficients a may be stored in the RAM 41 in advance so that they can be selected.

  In addition, although what was called a rotary table type | mold high-speed chip mounter was taken as an example as an electronic component mounting apparatus of this embodiment, you may apply not only to this but to a multifunctional type chip mounter.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a side view of an electronic component mounting apparatus. It is a control block diagram. It is a flowchart figure of 1st Embodiment. It is a flowchart figure of 2nd Embodiment. It is a flowchart figure of 3rd Embodiment.

Explanation of symbols

5 Component mounting device 15 Component recognition camera 17 Component supply stand 18 Component supply unit 24 Suction nozzle 40 CPU
41 RAM
43 Recognition processing device

Claims (10)

Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Decrease the feedback value with the stabilization of adsorption after the start of operation,
An electronic component mounting method, wherein the offset value related to a component suction position is updated based on the feedback value and used in the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When a predetermined set number of adsorptions is reached, a temporary coefficient is obtained by adding the initial value to the value obtained by multiplying the coefficient by the adsorption number,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset and used in the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined number of suctions has not been reached, an initial value is used as a temporary coefficient, and if the set number of suctions has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of suctions. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset and used in the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When a predetermined set number of feedback times is reached, a temporary coefficient is obtained by adding an initial value to the value obtained by multiplying the coefficient by the number of feedback times,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset, and used for the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component with respect to the suction nozzle before mounting on the printed circuit board for the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined set number of feedbacks has not been reached, the initial value is used as a temporary coefficient, and if the set number of feedbacks has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of feedbacks. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset, and used for the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
When the predetermined adsorption rate is reached, the initial value is added to the value obtained by multiplying the coefficient by the number of adsorptions to obtain a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset, and used for the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting method in which recognition processing is performed by a recognition processing device and mounted on a printed circuit board,
Stores the positional deviation amount of the electronic component before the mounting on the printed circuit board with respect to the predetermined number of times of suction of the component supply unit,
Calculate the average value of this displacement,
If the predetermined suction rate has not been reached, the initial value is used as a temporary coefficient, and if the set number of suction mistakes has been reached, the initial value is added to the value obtained by multiplying the coefficient by the number of suctions. Add to get a temporary coefficient,
Multiply this temporary value by the average value to calculate the feedback value,
An electronic component mounting method, wherein the calculated feedback value is added to the offset value related to a component suction position to update the offset, and used for the next suction operation of the component supply unit. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting apparatus that is subjected to recognition processing by a recognition processing apparatus and mounted on a printed circuit board,
Means for storing a positional shift amount of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An acquisition means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying the coefficient by the number of adsorptions when a predetermined set number of adsorptions is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
Control means for adding the feedback value calculated by the calculating means to the offset value related to the component pick-up position and updating the offset so as to be used in the next pick-up operation of the component supply unit is provided. An electronic component mounting apparatus characterized by the above. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting apparatus that is subjected to recognition processing by a recognition processing apparatus and mounted on a printed circuit board,
Storage means for storing the amount of positional displacement of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An acquisition means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying a coefficient by the number of feedback times when a predetermined set feedback count is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
There is provided a control means for controlling the feedback value calculated by the calculating means to be added to the offset value related to the component pick-up position and updating the offset to be used in the next pick-up operation of the component supply unit. An electronic component mounting apparatus characterized by that. Based on the offset value related to the component suction position from an arbitrary component supply unit among the plurality of component supply units, the electronic component is picked up by the suction nozzle, and the electronic component picked up by the suction nozzle is picked up by the component recognition camera. In an electronic component mounting apparatus that is subjected to recognition processing by a recognition processing apparatus and mounted on a printed circuit board,
Storage means for storing a positional deviation amount of the electronic component with respect to the suction nozzle before being mounted on the printed circuit board for a predetermined number of times of suction of the component supply unit;
A calculating means for calculating an average value of the positional deviation amounts;
An obtaining means for obtaining a temporary coefficient by adding an initial value to a value obtained by multiplying the coefficient by the number of adsorption times when a predetermined adsorption rate is reached;
A calculating means for multiplying the temporary coefficient acquired by the acquiring means by the average value to calculate a feedback value;
There is provided a control means for controlling the feedback value calculated by the calculating means to be added to the offset value related to the component pick-up position and updating the offset to be used in the next pick-up operation of the component supply unit. An electronic component mounting apparatus characterized by that.

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