JP4601157B2 - Method and apparatus for correcting mark position of program in electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, when an electronic component is mounted on a substrate by an electronic component mounting apparatus, the mark position of the program for correcting the mark position incorporated in the NC program to an optimum position so as to correspond to the actual mark position of the substrate The present invention relates to a position correction method.
[0002]
[Prior art]
The electronic component mounting apparatus is an apparatus for mounting an electronic component on a substrate at a predetermined position. In recent years, electronic components have been reduced in size and density, and electronic component mounting apparatuses are required to have extremely strict accuracy. Therefore, before mounting an electronic component, two or more marks printed on the substrate are recognized by the board image pickup device attached to the electronic component mounting apparatus, and the actual mounting position of the electronic component is determined from these positions. The positions of these marks are described in numerical data called NC programs.
[0003]
When an electronic component is mounted on a board by an electronic component mounting apparatus, the NC program is set so that the mark position incorporated in the NC program becomes an optimum position corresponding to the mark position of the board actually placed on the mounting apparatus. It is necessary to correct the mark position. As a method of correcting the mark position, {circle over (1)}. A method of correcting numerical data on the NC program, and (2). There is a method of recognizing a mark on an actual board using a board image pickup device of an electronic component mounting apparatus, converting the mark coordinates by the image pickup apparatus into coordinates of an NC program, and registering them using a procedure called teaching. .
[0004]
[Problems to be solved by the invention]
However, if the mark position is specified by correcting the numerical data on the NC program of (1), there is a problem that it is not known whether the mark position is correct until the operation for actually mounting the electronic component is started. is doing.
[0005]
In addition, in the case of specifying the actual mark position on the board by the teaching of (2), if the number of marks on the board is large, the teaching must be performed for all the marks, which takes a lot of man-hours. At the same time, there is a problem that work mistakes are likely to occur.
[0006]
In recent years, NC data is often created on another computer using CAD data or the like, not on actual equipment. In such a case, there is a problem that no means for confirming the mark position on the created data is prepared, and it is impossible to determine whether the position is appropriate until actual production.
[0007]
The present invention can correct a mark position on an NC program to an accurate position corresponding to an actual board mark position in a short time with a small number of man-hours, and can correct a mark position of a program in an electronic component mounting apparatus that can reduce work errors. Methods and apparatus are provided.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the mark position correction method for a program in an electronic component mounting apparatus according to claim 1, wherein an NC program is used to operate a mounting table of the electronic component mounting apparatus and / or a movable table holding a board, and When mounting an electronic component on a substrate, a mark position extraction step for extracting all mark positions in the NC program, which is numerical data for mounting the electronic component, and a substrate image pickup device at all the extracted mark positions A mark imaging step of moving and imaging the mark on the substrate at the position; a deviation amount calculating step of calculating a deviation amount between the mark position of the captured image and the mark position on the NC program corresponding to the captured image; Based on the calculated amount of deviation, the NC position so that the mark position of the captured image matches the mark position on the NC program. This comprises a mark position correcting step of correcting the NC position by correcting the mark position on the program.
[0009]
According to a third aspect of the present invention, there is provided a program mark position correcting device for an electronic component mounting apparatus, wherein an electronic component is placed on the substrate by operating a mounting robot of the electronic component mounting device and / or a movable table for holding a substrate by an NC program. An NC program mark position correcting device for mounting NC program storing means for storing an NC program for mounting electronic components, and mark position extracting means for extracting all mark positions in the NC program of the NC program storing means, From the image picked up by the image pickup device, the image pickup device movement command means for moving the image pickup device or / and the substrate, arranging the field of view of the image pickup device at all the extracted mark positions, and picking up the mark on the substrate Recognize the mark, and the mark position on the NC program corresponding to the mark position and the captured image Image processing calculation means for correcting the NC program by correcting the mark position on the NC program so that the mark position of the captured image coincides with the mark position on the NC program Is provided.
[0010]
According to the above configuration, for all the marks designated by the NC program, the marks are photographed by the board image pickup device, and the mark position on the NC program is corrected from the mark position. It can be corrected to an accurate and optimum position corresponding to the actual mark position on the substrate, and since the positions of all the marks on the substrate are not recognized, the correction can be made in a short time with less man-hours.
[0011]
According to a second aspect of the present invention, there is provided a method for correcting a mark position of a program by manually changing a field of view of an imaging device when a mark is not recognized on an image in the mark imaging step according to claim 1. It has a manual correction process for imaging the upper mark.
[0012]
According to the above configuration, even if there is a mark that is largely deviated from the mark position specified in advance by the NC program and the mark position on the actual board, it is only necessary to manually teach only the mark that is largely deviated, The data creator's labor can be greatly reduced.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a mark position correcting apparatus for a program in an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings.
[0014]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to the present invention, and FIG. 2 is a block diagram of a mark position correcting apparatus.
As shown in FIG. 1, this mounting apparatus is mounted from a component supply unit 1 that supplies mounted components, an XY table (movable table) 3 that holds a substrate 2 and is movable in the XY directions, and a component supply unit 1. A mounting head 4 that takes out components and mounts them on the substrate 2 and an XY robot (mounting robot) 5 that moves the mounting head 4 in the XY directions are provided. A CCD camera 6 as an imaging apparatus is attached. Further, the XY robot 5 includes a longitudinal rail 8 spanned between a pair of transverse rails 7 along the Y direction so as to be movable in the Y direction, and a ball screw shaft and nut built in the transverse rail 7, a drive motor. The traverse rail 8 is moved by a traverse drive device (not shown) composed of the above. The mounting head 4 is moved in the X direction by a longitudinal drive device (not shown) including a ball screw shaft, a nut, a drive motor and the like built in the longitudinal rail 8. The robot actuating device 9 for operating the transverse drive device and the longitudinal drive device is operated based on the NC program by the control device (FIG. 2) 10 and moves the mounting head 4 by manually operating the operation panel. be able to.
[0015]
As shown in FIG. 2, the mark position correcting unit 11 provided in the control apparatus 10 of the mounting apparatus stores an NC program in which the mounting position of the electronic component and the mark position serving as the mounting reference are described. NC program storage means 12, mark position extraction means 13 for extracting all mark positions in the NC program, and the robot actuator 9 is driven based on the mark position 4 extracted by the mark position extraction means 13 for mounting. The camera 6 provided in the head 4 is sequentially moved to the mark position, and the camera movement command means (imaging device movement command means) 14 for imaging the mark M on the substrate 2 and the image captured by the camera 6 are processed and marked. The image processing unit (image processing calculation means) 15 for recognizing the mark, and when the mark is not recognized on the image, the operator recognizes the mark by a buzzer or a screen display. Annunciation means 17 for notifying that the image cannot be recognized, and a correction posture signal for calculating a deviation amount between the mark position of the image selected by the image processing means 15 and the mark position on the NC program, and correcting the mark position on the NC program. An output deviation amount calculation unit (image processing calculation means) 16 is provided. As shown in FIG. 3, the deviation amount calculation unit 16 has an image (field of view) center O captured by the camera 6 as a mark position on the NC program, so that the imaging mark M is positioned at the image center O. What is necessary is just to obtain | require direction deviation | shift amount (DELTA) x and (DELTA) y.
[0016]
Next, a mark position correcting method will be described with reference to the flowchart of FIG.
First, an NC program is taken out from the NC program storage means 2, and a mark extraction process for extracting all mark positions is performed by the mark position extraction means 2 (STEP 1).
[0017]
Next, an operation signal is output to the robot actuator 9 so that the camera 6 moves to the extracted mark position, the mounting head 4 is moved (STEP 2), and the camera 6 is operated to mark the mark M on the substrate 2 An imaging process is performed. (STEP3)
Further, the image picked up by the camera 6 is processed by the image processing unit 15 to recognize the mark (STEP 4). At this time, if the mark M is not present in the imaging screen (field of view), the notification means 17 is activated to notify the operator. The operator manually operates the robot actuator 9 to perform a manual correction process for moving the camera 6 (STEP 5). Then, the process returns to (STEP 3). At this time, the mark position correcting unit 11 temporarily suspends the automatic mark position checking operation.
[0018]
When the presence of the mark M is confirmed in the image, a deviation amount calculating step is performed by the deviation amount calculation unit 16 to calculate how much the position should be shifted in order to make the recognized mark the center O position of the image. It is carried out (STEP 6). Further, a mark position correction process is performed in which a mark position correction signal is output from the deviation amount calculation means 16 to the NC program storage means 12 and reflected (STEP 7).
[0019]
That is, if the captured image is as shown in FIG. 3, the mark position of the NC program may be changed by the shift amounts ΔX and ΔY so that the mark M is positioned at the center O of the image. If the data comes to the center of the field of view, even if there is a shift in the substrate 2 in the mounting operation process, the possibility that the mark M will be out of the field of view of the camera 6 and the mark M will fail to be recognized is greatly increased. Get smaller.
[0020]
Further, the above (STEP 2) to (STEP 7) are repeated for all the mark positions in the NC program obtained in step 1.
According to the above embodiment, the NC program recognizes the mark position by the camera 6 and calculates and corrects the deviation amount for all the mark positions on the NC program so that the mark M becomes the center O of the image. Since the mark position is corrected, it is possible to accurately recognize the mark that is the mounting reference of the mounted component in the mounting operation, and a smooth mounting operation is possible. Therefore, when the position of the mark M designated in advance by the NC program is not so much deviated from the actual mark position on the substrate 2, the NC program can be corrected almost automatically to the optimum position. Even if there is a mark that is largely deviated from the mark position specified in advance by the NC program and the mark position on the actual board, it is only necessary to manually teach only the mark that is largely deviated. Can greatly reduce the labor. In the mounting operation, the possibility that the mark M will be out of the field of view of the camera 6 due to the displacement of the substrate 2 and the recognition of the mark M will be extremely reduced, and component mounting can be performed smoothly. it can.
[0021]
In the above embodiment, the camera 6 is moved by the XY robot 5 via the mounting head 4, but the XY table 3 is moved by the table moving device, or the XY robot 5 and the XY table 3 are moved relative to each other. Thus, the imaging position may be changed.
[0022]
【The invention's effect】
As described above, according to the first or third aspect of the present invention, all the marks specified by the NC program are photographed by the board image pickup device, and the mark position on the NC program is corrected from the mark position. Therefore, the mark position on the NC program can be corrected to an accurate and optimum position corresponding to the actual mark position on the board, and the positions of all the marks on the board are not recognized, so the number of man-hours can be reduced. It can be corrected in time and work errors can be reduced.
[0023]
According to the mark position correcting method described in claim 2, even if a mark exists that is largely deviated from the mark position designated in advance by the NC program and the actual mark position on the substrate, only the mark that is largely deviated is present. It only has to be taught manually, and the labor of the data creator can be greatly reduced.
[Brief description of the drawings]
FIG. 1 is an overall perspective view showing an embodiment of an electronic component mounting apparatus according to the present invention.
FIG. 2 is a configuration diagram showing a position correction unit of a control device in the electronic component mounting apparatus.
FIG. 3 is a flowchart illustrating a position correction method by the control device.
FIG. 4 is an explanatory view illustrating an image obtained by a camera of the electronic component mounting apparatus and illustrating calculation of a shift amount.
[Explanation of symbols]
2 Substrate 3 XY Table 4 Mounting Head 5 XY Robot 6 CCD Camera 9 XY Robot Actuator 10 Controller 11 Mark Position Correction Unit 12 NC Program Storage Unit 13 Mark Position Detection Unit 14 Camera Movement Command Unit 15 Image Processing Unit 16 Deviation Calculation Part

Claims (3)

When an electronic component is mounted on the substrate by operating a mounting robot of the electronic component mounting apparatus and / or a movable table holding the substrate by an NC program,
A mark position extraction step for extracting all mark positions in the NC program for mounting electronic components;
A mark imaging step of imaging the mark by moving the field of view of the imaging device to all the extracted mark positions;
A deviation amount calculating step of calculating a deviation amount between the mark position of the captured image and the mark position on the NC program corresponding to the captured image;
And a mark position correcting step of correcting the NC program by correcting the mark position on the NC program so that the mark position of the captured image matches the mark position on the NC program based on the calculated deviation amount. A method for correcting a mark position of a program in an electronic component mounting apparatus. 2. The program mark in the electronic component mounting apparatus according to claim 1, further comprising a manual correction step of manually changing the field of view of the image pickup device and picking up an image of the mark on the board when the mark is not recognized on the image. Position correction method. An NC program mark position correcting device for mounting an electronic component on the board by operating a mounting table of the electronic component mounting apparatus and / or a movable table for holding the board by an NC program,
NC program storage means for storing NC programs for mounting electronic components;
Mark position extraction means for extracting all mark positions in the NC program of the NC program storage means;
An imaging device movement command means for moving the imaging device or / and the substrate, arranging the field of view of the imaging device at all the extracted mark positions, and imaging the mark on the substrate;
A mark is recognized from an image captured by the imaging device, a deviation amount between the mark position and the mark position on the NC program corresponding to the captured image is calculated, and the mark position of the captured image and the NC program are calculated. An apparatus for correcting a mark position of a program in an electronic component mounting apparatus, comprising: image processing calculation means for correcting the NC program by correcting the mark position on the NC program so that the upper mark position matches.

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