JP2005328032A5 - - Google Patents
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- Publication number
- JP2005328032A5 JP2005328032A5 JP2005045617A JP2005045617A JP2005328032A5 JP 2005328032 A5 JP2005328032 A5 JP 2005328032A5 JP 2005045617 A JP2005045617 A JP 2005045617A JP 2005045617 A JP2005045617 A JP 2005045617A JP 2005328032 A5 JP2005328032 A5 JP 2005328032A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005045617A JP4006447B2 (ja) | 2004-04-16 | 2005-02-22 | 半導体装置およびプリント回路板 |
US11/094,136 US7349224B2 (en) | 2004-04-16 | 2005-03-31 | Semiconductor device and printed circuit board |
US11/960,161 US7495928B2 (en) | 2004-04-16 | 2007-12-19 | Semiconductor device and printed circuit board |
US12/255,789 US7839652B2 (en) | 2004-04-16 | 2008-10-22 | Semiconductor device and printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004121434 | 2004-04-16 | ||
JP2005045617A JP4006447B2 (ja) | 2004-04-16 | 2005-02-22 | 半導体装置およびプリント回路板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005328032A JP2005328032A (ja) | 2005-11-24 |
JP2005328032A5 true JP2005328032A5 (ja) | 2006-09-14 |
JP4006447B2 JP4006447B2 (ja) | 2007-11-14 |
Family
ID=35095448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005045617A Expired - Fee Related JP4006447B2 (ja) | 2004-04-16 | 2005-02-22 | 半導体装置およびプリント回路板 |
Country Status (2)
Country | Link |
---|---|
US (3) | US7349224B2 (ja) |
JP (1) | JP4006447B2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100541655B1 (ko) * | 2004-01-07 | 2006-01-11 | 삼성전자주식회사 | 패키지 회로기판 및 이를 이용한 패키지 |
US9545009B2 (en) * | 2007-05-23 | 2017-01-10 | Spectra Logic, Corporation | Passive alterable electrical component |
US8830690B2 (en) * | 2008-09-25 | 2014-09-09 | International Business Machines Corporation | Minimizing plating stub reflections in a chip package using capacitance |
US8213185B2 (en) | 2008-10-08 | 2012-07-03 | Panasonic Corporation | Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate |
US8110500B2 (en) * | 2008-10-21 | 2012-02-07 | International Business Machines Corporation | Mitigation of plating stub resonance by controlling surface roughness |
CN101877935B (zh) * | 2009-04-29 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 主板布局布线方法及利用该方法布局布线的主板 |
US20110103030A1 (en) * | 2009-11-02 | 2011-05-05 | International Business Machines Corporation | Packages and Methods for Mitigating Plating Stub Effects |
US8102042B2 (en) * | 2009-12-03 | 2012-01-24 | International Business Machines Corporation | Reducing plating stub reflections in a chip package using resistive coupling |
JP5534025B2 (ja) * | 2010-11-10 | 2014-06-25 | 富士通株式会社 | 半導体パッケージの端子の割り付け方法、半導体パッケージの端子の割り付け支援装置、半導体パッケージ、および、半導体パッケージの端子の割り付け方法を実行するプログラム |
US8402406B2 (en) | 2010-12-28 | 2013-03-19 | International Business Machines Corporation | Controlling plating stub reflections in a chip package |
US9538637B2 (en) * | 2011-06-29 | 2017-01-03 | Finisar Corporation | Multichannel RF feedthroughs |
KR20130016875A (ko) * | 2011-08-09 | 2013-02-19 | 현대자동차주식회사 | 하이브리드 차량 |
DE102012215021A1 (de) * | 2012-08-23 | 2014-02-27 | Robert Bosch Gmbh | Leiterplattenkontaktierung |
JP6091239B2 (ja) * | 2013-02-13 | 2017-03-08 | キヤノン株式会社 | プリント回路板、プリント配線板および電子機器 |
US20140326489A1 (en) * | 2013-05-03 | 2014-11-06 | Dell Products L.P. | Systems and methods for decreasing stub resonance of plating for circuit boards |
KR102198858B1 (ko) | 2014-07-24 | 2021-01-05 | 삼성전자 주식회사 | 인터포저 기판을 갖는 반도체 패키지 적층 구조체 |
JP6438792B2 (ja) * | 2015-02-17 | 2018-12-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9748168B2 (en) * | 2015-10-29 | 2017-08-29 | Nxp Usa, Inc. | Substrate with routing |
JP6372511B2 (ja) * | 2016-04-01 | 2018-08-15 | 住友大阪セメント株式会社 | 光変調器 |
CN106973487A (zh) * | 2017-04-27 | 2017-07-21 | 晶晨半导体(上海)有限公司 | 一种双层印制电路板及电子设备 |
KR20200025543A (ko) * | 2018-08-30 | 2020-03-10 | 삼성전자주식회사 | 패키지 볼을 갖는 반도체 패키지를 포함하는 전자 소자 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3437477B2 (ja) * | 1999-02-10 | 2003-08-18 | シャープ株式会社 | 配線基板および半導体装置 |
JP2001110927A (ja) | 1999-10-04 | 2001-04-20 | Matsushita Electronics Industry Corp | 半導体装置 |
JP3429718B2 (ja) * | 1999-10-28 | 2003-07-22 | 新光電気工業株式会社 | 表面実装用基板及び表面実装構造 |
JP3745276B2 (ja) | 2001-01-17 | 2006-02-15 | キヤノン株式会社 | 多層プリント配線板 |
US6812580B1 (en) * | 2003-06-09 | 2004-11-02 | Freescale Semiconductor, Inc. | Semiconductor package having optimized wire bond positioning |
JP4533173B2 (ja) * | 2004-02-24 | 2010-09-01 | キヤノン株式会社 | 半導体集積回路装置 |
-
2005
- 2005-02-22 JP JP2005045617A patent/JP4006447B2/ja not_active Expired - Fee Related
- 2005-03-31 US US11/094,136 patent/US7349224B2/en not_active Expired - Fee Related
-
2007
- 2007-12-19 US US11/960,161 patent/US7495928B2/en not_active Expired - Fee Related
-
2008
- 2008-10-22 US US12/255,789 patent/US7839652B2/en not_active Expired - Fee Related
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