JP2005320095A - Inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device capable of smoothly conveying a tape. <P>SOLUTION: A direction-changing guide 26 of CSP tape 16 has a hollow pipe structure and a circular guide surface 26A. Compression air from a compressor is fed to the inside through a pipe 82 and air is jetted from a large number of fine holes 62 formed on the guide surface 26A toward the outside of the guide surface 26A to form an air layer between the CSP tape and the guide surface 26A. In the inspection device, since the guide 26 or the like guides the CSP tape 16 at non-contact, resistance at the conveyance is less and it can be conveyed with no problem even if the CSP tape 16 is thin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus, and more particularly to an inspection apparatus that inspects a tape on which a pattern such as a wiring is formed.

  In recent years, there has been an increasing demand for miniaturization of semiconductor devices. For this reason, a semiconductor device of a chip size package (hereinafter referred to as CSP) in which the outer dimensions of the semiconductor device are almost reduced to the outer dimensions of the semiconductor element is proposed. Has been.

  As this CSP semiconductor device, for example, a semiconductor element is bonded to a substrate having an outer dimension slightly larger than the outer dimension of the semiconductor element with an adhesive or the like, and an electrode formed on the peripheral portion of the semiconductor element and the peripheral portion of the substrate A structure in which the electrodes formed on the substrate are electrically connected with a gold wire or the like, a substrate formed to have the outer dimensions of the semiconductor element and having an array of electrodes on the surface, and an array on the back side of the semiconductor element There have been proposed CSP semiconductor devices having various configurations, such as a configuration in which solder balls formed on are fused and electrically connected.

  In the manufacture of such a CSP semiconductor device, a large amount of CSP tape is used at once using a CSP tape in which a plurality of patterns such as wiring, electrodes, beam leads, and through holes formed corresponding to one chip are patterned repeatedly. A method for manufacturing a package has been proposed.

In this CSP tape, a conductive film such as a copper foil is formed on the surface of a base material such as a polyimide base material by vapor deposition or the like, and then a CSP wiring, an electrode, a beam lead, a through hole, etc. are used by using a normal etching technique. In manufacturing the CSP tape, which is a long tape patterned by repeating a plurality of patterns, pattern defects such as disconnection or chipping in the wiring after pattern formation are detected by, for example, an inspection apparatus as shown in Patent Document 1. I am inspecting.

  In the detection of the pattern defect, the pattern on the surface of the CSP tape is read as an image by an image reading device such as a CCD, and the defect is detected based on the read image.

The inspection device is equipped with an unwinding unit for unwinding the CSP tape, a scanner unit equipped with an image reading device, a marking unit for marking a defective portion, a winding unit for winding up the CSP tape, etc. A conveying means comprising a plurality of rollers is provided between the feeding unit and the winding unit.
JP 2000-309457 A

  In the inspection apparatus, the CSP tape is wound around a plurality of guide rollers provided in the conveying means, and the conveying direction is variously changed.

  The guide roller is rotatably supported on the shaft through a bearing. However, since the number of the guide roller is large, it becomes a resistance for transporting the CSP tape, and when the CSP tape is very thin, it causes a transport failure such as jamming. It may occur or the tape may be damaged.

  In view of the above, an object of the present invention is to provide an inspection apparatus capable of smoothly transporting a tape.

  The inspection apparatus according to claim 1, wherein a transport unit that transports a tape on which a pattern is formed, a photographing unit that photographs the tape transported by the transport unit, and a defect in a pattern by performing image processing on the photographed image Defect detecting means for detecting the gas, and the transport means has a non-contact tape guide that guides the tape in a non-contact manner by ejecting gas from a guide surface that guides the tape. .

  Next, the operation of the inspection apparatus according to claim 1 will be described.

  In the inspection apparatus according to the first aspect, the tape on which the pattern is formed is conveyed by the conveying unit, and the tape conveyed by the conveying unit is photographed by the photographing unit.

  The captured image is subjected to image processing by the defect detection means to detect a pattern defect.

  Since the non-contact tape guide of the transport means ejects gas from the guide surface and guides the tape in a non-contact manner, resistance during transport can be reduced.

  According to a second aspect of the present invention, in the inspection apparatus according to the first aspect, the non-contact tape guide is formed of a porous member having at least a guide surface that transmits air.

  Next, the operation of the inspection apparatus according to claim 2 will be described.

  In the non-contact tape guide according to the second aspect, air can be ejected from the entire guide surface formed of the porous member.

  Therefore, by using a porous member for the guide surface, manufacturing becomes easier than forming a large number of pores on the guide surface.

  According to a third aspect of the present invention, in the inspection apparatus according to the first or second aspect, the photographing unit that photographs the tape by the photographing unit includes a first drive roller on the upstream side in the transport direction, the first First driving means for driving one driving roller, second driving roller on the downstream side in the conveying direction, second driving means for driving the second driving roller, the first driving roller and the second driving roller A non-contact tape guide for a photographing unit having a convex guide surface disposed between the drive roller and curved in the tape transport direction, and the convex guide surface of the tape disposed along the convex guide surface And a control means for controlling the first drive means and the second drive means on the basis of the measurement value from the measurement means.

  Next, the operation of the inspection apparatus according to claim 3 will be described.

  In the photographing unit, the tape is conveyed with a driving force obtained by the first driving roller and the second driving roller.

  The tape is photographed between the first drive roller and the second drive roller. At the time of photographing, the distance from the photographing means to the tape is important for focusing.

  In the inspection apparatus according to claim 2, the measuring means measures the flying height of the tape from the guide surface, and the flying height is set to a preset value (that is, a preset distance from the imaging means to the tape). The control means can control the first drive means for driving the first drive roller and the second drive means for driving the second drive roller.

  That is, the tape tension between the first drive roller and the second drive roller can be controlled.

  For example, the flying height can be decreased by increasing the tension, and the flying height can be increased by decreasing the tension.

  As described above, according to the inspection apparatus of the present invention, it is possible to reduce the resistance at the time of conveyance, and to have an excellent effect that it can be conveyed without any problem even when the tape is thin.

[First Embodiment]
Hereinafter, an inspection apparatus 10 according to a first embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the inspection apparatus 10 of this embodiment includes an unwinding unit 12, a winding unit 14, and the like.
(Unwinding unit)
The unwinding unit 12 winds together the CSP tape 16 on which a large number of package patterns are repeatedly formed and the spacer tape 18, and holds the CSP roll 20 formed in a roll shape together with the unwinding reel shaft 22 and the CSP tape 16. An unwinding-side spacer shaft 24 that winds and holds the pulled-out spacer tape 18 is provided.

A guide 26 for changing the transport direction of the CSP tape 16 is disposed on the delivery side of the CSP roll 20.
(Winding unit)
The winding unit 14 includes a winding-side spacer shaft 28 that holds the spacer tape 18 formed in a roll shape, and a winding-side reel shaft 30 that winds the spacer tape 18 and the inspected CSP tape 16 together. ing.

  A guide 32 for changing the transport direction of the CSP tape 16 is disposed on the tape winding side of the winding side reel shaft 30.

Between the unwinding unit 12 and the winding unit 14, a short dancer 34, a first feed roller 36, a first presser roller 38, a second presser roller 40, a second presser roller 40 that form a transport path for the CSP tape 16 are provided. Two feed rollers 42, a long dancer 44, a guide 46, a guide 48, a guide 50, a guide 52, and a short dancer 54 are arranged in this order.
(Scanner unit)
The first feed roller 36 and the second feed roller 42 are horizontally disposed with a space therebetween, and a table 56 is disposed between the first feed roller 36 and the second feed roller 42. ing.

  As shown in FIG. 2, the upper surface of the table 56 is a guide surface 56A, and is curved in a convex shape upward.

  The top portion of the guide surface 56 </ b> A is located above a virtual surface connecting the upper end of the first feed roller 36 and the upper end of the second feed roller 42.

  The table 56 has a hollow structure, and compressed air from the compressor 60 is supplied to the inside via a pipe 58.

  The table 56 has a large number of pores 62 communicating with the internal space and the guide surface 56A in the tape transport direction and the tape width direction, and air is ejected from the pores 62 to the outside of the guide surface 56A. A thin air layer is formed between the CSP tape 16 and the guide surface 56A.

  The first presser roller 38 and the second presser roller 40 are driven rollers that freely rotate, and abut against the upper surface of the CSP tape 16 to limit the upward movement of the CSP tape 16.

  An image reading unit including a lens 64 and a CCD line sensor 66 is disposed above the center of the table 56.

  In the CCD line sensor 66, pixels are arranged in the width direction of the CSP tape 16 (direction perpendicular to the transport direction).

  The CSP tape 16 is stretched between a first feed roller 36 and a second feed roller 42, and the first feed roller 36 and the second feed roller 42 rotate to feed in a constant direction in one direction. The circuit pattern formed on the tape is photographed by the image reading unit when passing over the table 56.

  The image information from the CCD line sensor 66 is sent to a first computer 68 (see FIG. 1) that performs image processing. The first computer 68 performs image processing based on the image information from the CCD line sensor 66. Detect pattern defects.

  Note that images and the like are displayed on the monitor 69.

  As shown in FIG. 2, an illuminating device (line light source) 70 is disposed obliquely above the table 56 so as to irradiate the tape surface with illumination light.

  As shown in FIGS. 2 and 3, a laser distance meter 76 for measuring the flying height of the CSP tape 16 from the guide surface 56 </ b> A is disposed above the table 56.

  As shown in FIG. 1, the first feed roller 36 is rotated by a first servo motor 72, and the second feed roller 42 is rotated by a second servo motor 74.

The first servo motor 72, the second servo motor 74, and the laser distance meter 76 are connected to the second computer 78, and the first servo motor 72 is set so that the flying height of the CSP tape 16 is constant. And the second servo motor 74 (that is, the tension of the CSP tape 16 between the first feed roller 36 and the second feed roller 42 is controlled).
(Marking unit)
Between the guide 48 and the guide 50, a marking unit 80 is provided for marking at a predetermined position of the package pattern detected as having a defect.

  The structure of the guide 26 will be described.

  As shown in FIG. 4, the guide 26 has a hollow pipe structure that is long in the width direction of the CSP tape 16 (the front and back of the drawing), and has an arcuate guide surface 26A.

  Compressed air from a compressor 60 (not shown in FIG. 4) is supplied to the inside via a pipe 82.

  The guide 26 has a large number of pores 62 communicating with the internal space and the guide surface 26A. Air is ejected from the pores 62 toward the outside of the guide surface 26A, and the CSP tape 16 and the guide surface 26A. An air layer is formed between the two.

The short dancer 34, the long dancer 44, the guide 46, the guide 48, the guide 50, the guide 52, and the short dancer 54 have the same structure as the guide 26, and an air layer is formed between the CSP tape 16 and the guide surface. To do.
(Function)
Next, the operation of the inspection apparatus 10 of this embodiment will be described.

  The CSP tape 16 drawn from the CSP roll is conveyed in a non-contact state in a curved state on the guide surface 56A of the table 56 by the first feed roller 36 and the second feed roller 42.

  At this time, since the CSP tape 16 is curved in the transport direction, the curved top portion of the CSP tape 16 is straight in the width direction (in the direction of the arrow in FIG. 3) and parallel to the CCD line sensor 66. Further, since the flying height of the CSP tape 16 from the guide surface 56 </ b> A is controlled, the reflected light from the CSP tape 16 forms an appropriate image on the CCD line sensor 66.

  The first computer 68 performs image processing based on image information from the CCD line sensor 66 to detect a pattern defect, and if a defect is detected, the marking unit 80 corresponds to the defective pattern. Marking is performed at a predetermined location.

  Furthermore, in the inspection apparatus 10 of the present embodiment, the guide 26, the short dancer 34, the long dancer 44, the guide 46, the guide 48, the guide 50, the guide 52, the short dancer 54, and the like guide the CSP tape 16 in a non-contact manner. The thin CSP tape 16 can be optimally conveyed with little resistance during conveyance.

In the present embodiment, the laser distance meter 76 for measuring the flying height of the CSP tape 16 from the guide surface 56A is used. However, the present invention is not limited to this. For example, the first feed roller 36 and the first It is also possible to provide a dancer portion between the two feed rollers 42, detect the tape flying height based on the position of this dancer, and adjust the tape flying height by feedback control.
[Second Embodiment]
Hereinafter, an inspection apparatus 10 according to a second embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment, and the description is abbreviate | omitted.

  As shown in FIGS. 5 and 6, in the inspection apparatus 10 of the present embodiment, a first presser guide 84 and a second presser guide 86 are used instead of the first presser roller 38 and the second presser roller 40. And a third presser guide 88 are provided.

  The first presser guide 84, the second presser guide 86, and the third presser guide 88 are different in shape from the guide 26 described above, but have the same function, and the compressor 60 (not shown in FIGS. 5 and 6). Air) is ejected toward the CSP tape 16 from the pores 90 opened in the curved guide surfaces 84A, 86A, 88A, and an air layer is provided between the CSP tape 16 and in a non-contact manner. To guide.

In the present embodiment, it is possible to further reduce the resistance during conveyance compared to the first embodiment.
[Third Embodiment]
Hereinafter, an inspection apparatus 10 according to a third embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same structure as embodiment mentioned above, and the description is abbreviate | omitted.

  As shown in FIG. 7, in the inspection apparatus 10 of the present embodiment, instead of the illumination device (line light source) 70, an illumination device (line light source) 92 composed of a lamp 92A and a cover glass 92B that are long in the tape width direction is a table. 56 is buried.

  In this embodiment, the illumination device 92 illuminates the CSP tape 16 from the back side, and the CCD line sensor 66 reads the light that has passed through the CSP tape 16.

By adopting such a configuration, the shape of a through hole or the like can be detected with high accuracy.
[Fourth Embodiment]
Hereinafter, an inspection apparatus 10 according to a second embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same structure as embodiment mentioned above, and the description is abbreviate | omitted.

  As shown in FIG. 8, the table 56 of the present embodiment is formed of an upper case 94 and a porous member 96 that closes the opening of the case 94.

  The porous member 96 here is a member that allows air to pass therethrough, and has innumerable holes and passages formed therein.

  As the porous member 96, for example, fine particles (for example, spheres) such as countless metals, ceramics, glass, and synthetic resins, which are solidified so that air can permeate, can be used. It may be.

  In addition, as what hardened the metal particle, a sintered metal can be used, for example.

In this embodiment, air can be uniformly ejected from the entire guide surface.
[Fifth Embodiment]
Hereinafter, an inspection apparatus 10 according to a fifth embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same structure as embodiment mentioned above, and the description is abbreviate | omitted.

  As shown in FIG. 9, in the present embodiment, the top of the guide surface 56 </ b> A of the table 56 is formed in a flat shape, and a CCD area sensor 98 is arranged in place of the CCD line sensor 66 in the image reading unit. Yes.

  In addition, linear guides 100 are arranged on both sides of the planar portion of the guide surface 56 </ b> A at the top of the table 56.

  The guide 100 is configured to eject air from pores (not shown) opened on the lower surface, and is connected to the compressor 60 via a pipe 58 similarly to the table 56.

  Further, a vacuum pump 102 is connected to the table 56 of this embodiment via a pipe 104.

  Note that an electromagnetic valve 106 and an electromagnetic valve 108 are attached to the pipe 58, and an electromagnetic valve 110 is attached to the pipe 104.

  In this embodiment, when the CSP tape 16 is transported, air is ejected from the table 56 and the guide 100 to separate the CSP tape 16 from the table 56 and the guide 100. And the solenoid valve 108 is closed, the supply of air to the table 56 and the guide 100 is stopped, and the solenoid valve 110 is opened.

  When the inside of the table 56 communicates with the vacuum pump 102, the pores 62 suck in air, the CSP tape 16 is adsorbed by the flat portion of the guide surface 56 A, and the flat surface of the CSP tape 16 with respect to the CCD area sensor 98 in the image reading unit. It is possible to bring out the nature and focus on the whole surface.

It is a side view showing a schematic structure of an inspection device concerning a 1st embodiment. It is an expanded sectional view of the conveyance direction of an image reading part. It is a perspective view near a table. It is sectional drawing of a guide. It is an expanded sectional view of the conveyance direction of the image reading part which concerns on 2nd Embodiment. FIG. 6 is an enlarged cross-sectional view in a direction perpendicular to a conveyance direction of an image reading unit according to a second embodiment. It is an expanded sectional view of the conveyance direction of the image reading part which concerns on 3rd Embodiment. It is an expanded sectional view of the conveyance direction of the image reading part which concerns on 4th Embodiment. It is a perspective view of the table vicinity of the image reading part which concerns on 5th Embodiment.

Explanation of symbols

10 Inspection equipment 16 CSP tape (tape)
26 Guide (conveying means, non-contact tape guide)
32 Guide (conveying means, non-contact tape guide)
34 Short dancer (conveying means, non-contact tape guide)
36 First feed roller (conveying means, first drive roller)
38 First presser roller (conveying means)
40 Second presser roller (conveying means)
42 Second feed roller (conveying means, second drive roller)
44 Long dancer (transportation means)
46 Guide (conveying means, non-contact tape guide)
48 Guide (conveying means, non-contact tape guide)
50 guide (conveying means, non-contact tape guide)
52 Guide (conveying means, non-contact tape guide)
54 Short dancer (conveying means, non-contact tape guide)
56 table (conveying means, non-contact tape guide)
56A Guide surface (convex guide surface)
64 lenses (imaging means, defect detection means)
66 CCD line sensor (imaging means, “defect detection means”)
68 First computer (defect detection means)
72 1st servomotor (1st drive means)
74 Second servo motor (second driving means)
76 Laser distance meter (measuring means)
78 Second computer (control means)
96 Porous member

Claims (3)

A conveying means for conveying the tape on which the pattern is formed;
Photographing means for photographing the tape conveyed by the conveying means;
A defect detection means for detecting a defect in the pattern by performing image processing on the captured image;
With
The inspection apparatus according to claim 1, wherein the transport unit includes a non-contact tape guide that ejects gas from a guide surface that guides the tape and guides the tape in a non-contact manner.   The inspection apparatus according to claim 1, wherein the non-contact tape guide is formed of a porous member having at least a guide surface that allows air to pass therethrough.   The photographing unit for photographing the tape by the photographing means includes a first drive roller on the upstream side in the transport direction, a first drive means for driving the first drive roller, and a second drive roller on the downstream side in the transport direction. A second driving means for driving the second driving roller, and an imaging having a convex guide surface that is disposed between the first driving roller and the second driving roller and is curved in the tape transport direction. A non-contact tape guide for a part, a measuring means for measuring a floating amount of the tape arranged along the convex guide surface from the convex guide surface, and the first value based on a measured value from the measuring means The inspection apparatus according to claim 1, further comprising: a driving unit configured to control the second driving unit.

Images