JP2012127786A - Lighting system and flaw detection device - Google Patents

Lighting system and flaw detection device Download PDF

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JP2012127786A
JP2012127786A JP2010279220A JP2010279220A JP2012127786A JP 2012127786 A JP2012127786 A JP 2012127786A JP 2010279220 A JP2010279220 A JP 2010279220A JP 2010279220 A JP2010279220 A JP 2010279220A JP 2012127786 A JP2012127786 A JP 2012127786A
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led
copper foil
optical axis
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angle
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Takeshi Yoshikawa
武史 吉川
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Kokusai Gijutsu Kaihatsu Co Ltd
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Kokusai Gijutsu Kaihatsu Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a flaw detection device and a lighting system suppressing the lowering of peripheral light quantity even if using a photographic lens with short focal length.SOLUTION: A plurality of LEDs 20B including both the longitudinal ends of an LED array 21 are fixed at an angle facing the longitudinal central side, or the direction facing the optical axis direction of a photographic lens 16, and LEDs 20A including the longitudinal center of the LED array 21 face the photographic lens 16 as they are without forming an angle. Hence the optical axis of the LED 20 faces the optical center direction of the photographic lens 16 at the periphery of both the longitudinal ends of the LED array 21, the illumination light quantity can be secured across the entire visual field of a CCD camera 14 without any deficiency in the peripheral light quantity (in this case, illumination light quantity in both the width-directional ends of copper foil 50).

Description

本発明は照明装置および欠陥検査装置に関し、特に長尺帯状をなした被検査物の表面を反射光で検査する欠陥検査装置およびこれに用いられる反射照明装置に関する。   The present invention relates to an illumination device and a defect inspection device, and more particularly to a defect inspection device that inspects a surface of an inspection object having a long strip shape with reflected light and a reflective illumination device used therefor.

従来より、工場の生産ライン上で長尺帯状の製品または材料の表面について異常の有無を検査するために、被検査物の表面に照明光を照射し、被検査物の表面反射による反射光をCCDカメラ等の撮像手段で撮像、得られた画像データをコンピュータで画像処理して解析し、異常の有無を検出する欠陥検査装置が存在する。   Conventionally, in order to inspect the surface of a long strip product or material on the production line of a factory for the presence of an abnormality, the surface of the object to be inspected is irradiated with illumination light, and the reflected light due to the surface reflection of the object to be inspected There is a defect inspection apparatus that detects the presence / absence of an abnormality by performing image processing with a computer and analyzing image data obtained and captured by an imaging means such as a CCD camera.

例えば、半導体装置の外形寸法をほぼ半導体素子の外形寸法にまで小型化したチップサイズパッケージ(CSP)において、ポリイミド基材等の基材の表面に蒸着などにより銅箔などの導電膜を形成した後、通常のエッチング技術を用いてCSP用の配線、電極、ビームリード及びスルーホールなどのパターンを複数繰り返してパタンニングした長尺状のテープについて、テープ上に形成された複数のパターンのうち欠陥のあるパターンを検出し、欠陥のないパターンと区別できるようにする欠陥検査装置が提案されている(例えば、特許文献1参照)。   For example, in a chip size package (CSP) in which the outer dimensions of a semiconductor device are reduced to the outer dimensions of a semiconductor element, a conductive film such as a copper foil is formed on the surface of a substrate such as a polyimide substrate by vapor deposition or the like. For a long tape patterned by repeating a plurality of patterns such as CSP wiring, electrodes, beam leads, and through holes using a normal etching technique, a defect of a plurality of patterns formed on the tape There has been proposed a defect inspection apparatus that detects a certain pattern and can distinguish it from a pattern having no defect (see, for example, Patent Document 1).

上記特許文献1の例では、テープ上をCCDカメラ等で走査撮影し異常の有無を検出する。このときCCDカメラのレンズは焦点距離が短い(ワイド)ほど画角が広くなるため、テープの搬送面とCCDカメラとを接近して配置することができるので、装置全体を小型化することができる。   In the example of the above-mentioned patent document 1, the presence or absence of abnormality is detected by scanning and photographing on the tape with a CCD camera or the like. At this time, since the angle of view of the lens of the CCD camera becomes wider as the focal length is shorter (wide), the tape transport surface and the CCD camera can be arranged closer to each other, so that the entire apparatus can be miniaturized. .

特開平11−013096号公報Japanese Patent Laid-Open No. 11-013096

しかしながら、撮影時にテープを照明する光源としてLEDアレイ等の指向性のあるものを使用した場合、走査幅方向の周縁部近傍はCCDカメラの光軸に対してLEDの照射角度が大きくなるため十分な光量が確保できず、光量不足となる虞があった。   However, when a directional light source such as an LED array is used as the light source for illuminating the tape at the time of photographing, the vicinity of the peripheral portion in the scanning width direction is sufficient because the irradiation angle of the LED is large with respect to the optical axis of the CCD camera. There was a possibility that the amount of light could not be secured and the amount of light was insufficient.

そのため本発明は、焦点距離の短い撮像レンズを使用しても周辺光量の低下を抑える欠陥検査装置および照明装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a defect inspection device and an illumination device that suppress a decrease in peripheral light amount even when an imaging lens having a short focal length is used.

請求項1に記載の照明装置は、撮像光学系を備えた撮像装置と組み合わされ、前記撮像光学系の光軸と交差する方向に延設される照明装置であって、指向性をもつ光源を直線状に配列し、配列方向両端を含む複数の光源の光軸を、配列方向中央に向けたことを特徴とする。   The illuminating device according to claim 1 is an illuminating device which is combined with an imaging device including an imaging optical system and extends in a direction intersecting with an optical axis of the imaging optical system, and has a directional light source. The optical axes of a plurality of light sources arranged in a straight line and including both ends in the arrangement direction are directed to the center in the arrangement direction.

上記の発明では、照明装置の配列方向(=長手方向)両端を含む複数の光源の光軸を、長手方向中央に向けたことによって、撮像光学系の写野周縁部における光量低下を抑えることができる。   In the above invention, the optical axis of the plurality of light sources including both ends in the arrangement direction (= longitudinal direction) of the illuminating device is directed to the center in the longitudinal direction, thereby suppressing a decrease in the amount of light at the field periphery of the imaging optical system. it can.

請求項2に記載の欠陥検査装置は、表面を反射面として帯状に搬送される長尺ベルト状の被検査物を検査する欠陥検査装置であって、搬送される前記被検査物の表面を搬送幅方向にわたって撮像する撮像手段と、前記被検査物の搬送方向上流側または下流側から前記被検査物を搬送幅方向にわたって照明し前記反射面で反射させる請求項1に記載の照明装置と、前記撮像手段で撮像された画像を解析し、前記被検査物の表面の異常の有無を検出する解析手段と、を備えたことを特徴とする。   The defect inspection apparatus according to claim 2 is a defect inspection apparatus for inspecting a long belt-shaped inspection object conveyed in a strip shape with the surface as a reflection surface, and conveys the surface of the inspection object to be conveyed 2. The illumination device according to claim 1, wherein the illumination unit illuminates the inspection object from the upstream side or the downstream side in the conveyance direction of the inspection object and reflects the reflection surface by the reflection surface. Analyzing the image picked up by the image pickup means, and detecting the presence or absence of abnormality of the surface of the object to be inspected.

上記の発明では、照明装置の長手方向両端を含む複数の光源の光軸を、長手方向中央に向けたことによって、搬送幅方向両端部を照明し撮像手段に入射する被検査物の光量が増加するので、撮像された画像の写野周縁部における光量低下を抑えることができる。   In the above invention, the light axes of a plurality of light sources including both ends in the longitudinal direction of the illumination device are directed toward the center in the longitudinal direction, so that the amount of light of the object to be inspected that illuminates both ends in the transport width direction and enters the imaging means Therefore, it is possible to suppress a decrease in the amount of light at the peripheral edge of the field of the captured image.

本発明によれば、焦点距離の短い撮像レンズを使用しても周辺光量の低下を抑える欠陥検査装置および照明装置とすることができる。   ADVANTAGE OF THE INVENTION According to this invention, it can be set as the defect inspection apparatus and illuminating device which suppress the fall of a peripheral light quantity, even if it uses an imaging lens with a short focal distance.

本発明の第1実施形態に係る欠陥検査装置を示す概念図である。It is a conceptual diagram which shows the defect inspection apparatus which concerns on 1st Embodiment of this invention. 本発明の第1実施形態に係る欠陥検査装置の一部を示す拡大斜視図である。It is an expansion perspective view which shows a part of defect inspection apparatus which concerns on 1st Embodiment of this invention. 図2に示す照明装置の構造を示す概念図である。It is a conceptual diagram which shows the structure of the illuminating device shown in FIG. 図2に示す照明装置の構造を示す概念図である。It is a conceptual diagram which shows the structure of the illuminating device shown in FIG. 本発明に係るLEDの加工法および治具を示す概念図である。It is a conceptual diagram which shows the processing method and jig | tool of LED which concern on this invention. 本発明の第2実施形態に係る欠陥検査装置の一部を示す概念図である。It is a conceptual diagram which shows a part of defect inspection apparatus which concerns on 2nd Embodiment of this invention. 本発明の第3実施形態に係る照明装置の構造を示す概念図である。It is a conceptual diagram which shows the structure of the illuminating device which concerns on 3rd Embodiment of this invention. 従来の欠陥検査装置を示す概念図である。It is a conceptual diagram which shows the conventional defect inspection apparatus. 従来の欠陥検査装置を示す概念図である。It is a conceptual diagram which shows the conventional defect inspection apparatus.

以下、実施形態を挙げ、本発明の実施の形態について説明する。ここで、第2実施形態以下では、既に説明した構成要素と同様のものには同じ符号を付して、その説明を省略する。   Hereinafter, embodiments will be described and embodiments of the present invention will be described. Here, in the second and subsequent embodiments, the same components as those already described are denoted by the same reference numerals, and the description thereof is omitted.

<第1実施形態>
図1〜図3は、本願発明の第1の実施形態に係る欠陥検査装置を示した概念図および斜視図である。
<First Embodiment>
1 to 3 are a conceptual view and a perspective view showing a defect inspection apparatus according to a first embodiment of the present invention.

<全体構成> <Overall configuration>

この実施の形態の欠陥検査装置では、例として銅などの金属薄膜を圧延加工しテープ状の金属箔とした被検査物である銅箔50の表面をCCDカメラで撮像し、解析手段で解析することにより被検査物である銅箔50の表面における異常の有無を検出する。銅箔50は、長尺テープ状に巻き取られてロール状に形成された銅箔ロールとして欠陥検査装置に取り付けられている。   In the defect inspection apparatus of this embodiment, as an example, the surface of the copper foil 50, which is an inspection object formed by rolling a metal thin film such as copper into a tape-shaped metal foil, is imaged with a CCD camera and analyzed by an analysis means. Thus, it is detected whether there is an abnormality on the surface of the copper foil 50 that is the inspection object. The copper foil 50 is attached to a defect inspection apparatus as a copper foil roll wound into a long tape shape and formed into a roll shape.

本実施の形態の欠陥検査装置10は、主として筐体60に供給側銅箔ロール52と、搬送ローラ48と、テンションローラ46と、巻き取り側銅箔ロール54と、照明装置12と、撮影手段としてのCCDカメラ14と、欠陥検出手段としてのコンピュータ40と、制御部42とから構成されている。   The defect inspection apparatus 10 according to the present embodiment mainly includes a supply side copper foil roll 52, a conveyance roller 48, a tension roller 46, a winding side copper foil roll 54, an illumination device 12, and an imaging unit. As a CCD camera 14, a computer 40 as defect detection means, and a control unit 42.

図1に示されるように欠陥検査装置10には、銅箔50が図示しないモータなどの駆動手段で駆動される搬送ローラ48にて供給側銅箔ロール52から引き出され、一対のテンションローラ46の間を所定の張力を維持しながら搬送される。銅箔50は巻き取り側の搬送ローラ48で更に搬送され、巻き取り側銅箔ロール54に巻き取られる。   As shown in FIG. 1, in the defect inspection apparatus 10, the copper foil 50 is drawn from the supply-side copper foil roll 52 by a transport roller 48 driven by a driving means such as a motor (not shown), and the pair of tension rollers 46. It is conveyed while maintaining a predetermined tension between them. The copper foil 50 is further transported by the winding-side transport roller 48 and wound on the winding-side copper foil roll 54.

このとき、供給側銅箔ロール52および巻き取り側銅箔ロール54は図示しないモータ等の駆動手段で回転駆動され、かつ搬送ローラ48による搬送速度に影響することを防ぐため、搬送ローラ48にテンションが掛からないよう適度な弛みを維持しながら供給/巻き取りを行う。この制御は例えばテンションローラ46、あるいは張力検出用に設けられたローラの回転軸位置の変動等で検出してもよい。   At this time, the supply-side copper foil roll 52 and the winding-side copper foil roll 54 are rotated by driving means such as a motor (not shown), and in order to prevent the conveyance speed by the conveyance roller 48 from being affected, Feeding / winding is performed while maintaining moderate slack so as not to be applied. This control may be detected by, for example, a change in the rotation axis position of the tension roller 46 or a roller provided for tension detection.

銅箔50はテンションローラ46の間を所定の速度で搬送され、照明装置12により照明される。照明装置12は図2、図3に示すように、例えばLED20を直線状に配列したLEDアレイ21からなり、図中矢印S方向に搬送中の銅箔50に対して照明光を照射する。CCDカメラ14は、照明装置12により照明された位置の銅箔50を撮影し、撮影画像は画像信号としてコンピュータ40に出力する。   The copper foil 50 is conveyed between the tension rollers 46 at a predetermined speed and illuminated by the illumination device 12. As shown in FIGS. 2 and 3, the illuminating device 12 includes, for example, an LED array 21 in which LEDs 20 are arranged in a straight line, and irradiates the illuminating light to the copper foil 50 being conveyed in the direction of arrow S in the figure. The CCD camera 14 images the copper foil 50 at the position illuminated by the illumination device 12 and outputs the captured image to the computer 40 as an image signal.

コンピュータ40は、CCDカメラ14から出力された画像信号を処理して銅箔50表面が均一の平面であるかを常時検知し続ける。銅箔50の表面に異常があれば(表面が均一の平面でないとコンピュータ40で判定されれば)異常を検出すると共に、テンションローラ46の回転数などの位置情報に基づいて、銅箔50の移動量(即ち、銅箔50の幅方向の位置及び銅箔50の搬送長さ方向の移動量)を演算し、制御部42に出力する。   The computer 40 continues to detect whether the surface of the copper foil 50 is a uniform plane by processing the image signal output from the CCD camera 14. If there is an abnormality on the surface of the copper foil 50 (if it is determined by the computer 40 that the surface is not a uniform plane), the abnormality is detected and the copper foil 50 The movement amount (that is, the position of the copper foil 50 in the width direction and the movement amount of the copper foil 50 in the conveyance length direction) is calculated and output to the control unit 42.

制御部42は、コンピュータ40により欠陥ありと判断された箇所に対し、その位置情報を図示しない記録手段に異常箇所の位置情報として記録する。あるいは異常を検知した時点で作業者に警告を与え、対応作業を促す。   The control unit 42 records the position information of the part determined to be defective by the computer 40 as the position information of the abnormal part in a recording unit (not shown). Alternatively, when an abnormality is detected, a warning is given to the worker and a corresponding work is urged.

<照明装置>
図3に示すように、照明装置12より発せられた照明光は銅箔50の表面で反射され、CCDカメラ14で撮像され、画像は画像信号としてコンピュータ40に出力される。CCDカメラ14は撮影レンズ16とラインCCDセンサ18とで構成されている。
<Lighting device>
As shown in FIG. 3, the illumination light emitted from the illumination device 12 is reflected by the surface of the copper foil 50, picked up by the CCD camera 14, and the image is output to the computer 40 as an image signal. The CCD camera 14 includes a photographic lens 16 and a line CCD sensor 18.

このとき、図3(B)に示すように銅箔50の搬送方向(図中矢印S方向)上流側からLEDアレイ21である照明装置12で照射された光は、それぞれのLED20において光軸20L方向に指向性をもっている。   At this time, as shown in FIG. 3B, the light emitted from the illumination device 12 which is the LED array 21 from the upstream side in the transport direction of the copper foil 50 (the direction of arrow S in the figure) is the optical axis 20L in each LED 20. Has directionality in the direction.

すなわち図3(A)(C)に示すように、光源となるLED20を直線状に配列したLEDアレイ21の、長さ方向(銅箔50の搬送幅方向)両端部のLED20Bでは光軸20LB、長さ方向中央部のLED20Aでは光軸20LAに沿った方向に光を照射する。これは所謂砲弾型LEDが先端部に集光レンズ構造を備え、光束を収束させているためであって、被検査物(銅箔50)の照度を高めるため光束に指向性を持たせている。   That is, as shown in FIGS. 3A and 3C, in the LED 20B at both ends in the length direction (conveying width direction of the copper foil 50) of the LED array 21 in which the LEDs 20 serving as light sources are linearly arranged, the optical axis 20LB, The LED 20A at the center in the length direction irradiates light in a direction along the optical axis 20LA. This is because a so-called bullet-type LED has a condensing lens structure at the tip and converges the light beam, and directs the light beam to increase the illuminance of the object to be inspected (copper foil 50). .

このとき図4に示すようにLEDアレイ21は、スペーサ24および基板26に固定されたLED20の角度を長手方向両端と中央とで変えることにより、LED20より照射される光を図3(A)のように撮影レンズ16の画角θ1に略合致させる構成とされている。   At this time, as shown in FIG. 4, the LED array 21 changes the angle of the LED 20 fixed to the spacer 24 and the substrate 26 between the longitudinal ends and the center, thereby changing the light emitted from the LED 20 of FIG. Thus, the configuration is such that it substantially matches the angle of view θ1 of the photographic lens 16.

すなわちLEDアレイ21の長手方向両端を含む複数個のLED20Bは長手方向中央側を向く角度、つまり撮影レンズ16の光軸方向を向く方向に固定され、LEDアレイ21の長手方向中央を含むLED20Aはそのまま角度をつけずに撮影レンズ16に対向している。ただし実際には図3(B)に示すように、LED20より照射される光は銅箔50の表面で反射されCCDカメラ14側で受光する。   That is, the plurality of LEDs 20B including both ends of the LED array 21 in the longitudinal direction are fixed at an angle facing the center in the longitudinal direction, that is, a direction facing the optical axis direction of the photographing lens 16, and the LED 20A including the center in the longitudinal direction of the LED array 21 is left as it is. It faces the taking lens 16 without an angle. However, actually, as shown in FIG. 3B, the light emitted from the LED 20 is reflected by the surface of the copper foil 50 and received by the CCD camera 14 side.

このとき図4に示すように、LED20Bはスペーサ24および基板26より飛び出した脚22部分が撮影レンズ16の光軸方向を向く方向に所定の角度で折り曲げられ、光軸20LBもまた同様に所定の角度で長手方向中央を向いている。すなわち脚22部分が途中で折り曲げられているのでLED20Bの先頭部分は脚22が折り曲げられた方向(=長手方向中央を向く方向)に向いている。あるいは脚22を折り曲げる替わりにスペーサ24および基板26に設けられLED20が挿入される穴を斜め方向に設け、挿入されるLED20Bの光軸20LBが長手方向中央を向くようにしてもよい。   At this time, as shown in FIG. 4, the LED 20B is bent at a predetermined angle in the direction in which the leg 22 protruding from the spacer 24 and the substrate 26 faces the optical axis direction of the photographing lens 16, and the optical axis 20LB is also predetermined. It faces the longitudinal center at an angle. That is, since the leg 22 portion is bent halfway, the leading portion of the LED 20B is oriented in the direction in which the leg 22 is bent (= the direction facing the center in the longitudinal direction). Alternatively, instead of bending the leg 22, a hole provided in the spacer 24 and the substrate 26 into which the LED 20 is inserted may be provided in an oblique direction so that the optical axis 20LB of the inserted LED 20B faces the center in the longitudinal direction.

<効果>
図8に示すように従来の欠陥検査装置において、ラインCCDセンサ118と組み合わされる撮影レンズ116は焦点距離が十分に長く、画角θ101は狭いため、照明装置に用いられるLED120の光軸120Lは、長手方向両端部においても撮影レンズ116の方向から大きく外れることがなく、結果として銅箔50などの被検査物の幅方向両端部においても照明光量が不足することはない。
<Effect>
As shown in FIG. 8, in the conventional defect inspection apparatus, the photographic lens 116 combined with the line CCD sensor 118 has a sufficiently long focal length and a narrow angle of view θ101. Therefore, the optical axis 120L of the LED 120 used in the illumination apparatus is Even at both ends in the longitudinal direction, it does not deviate greatly from the direction of the photographing lens 116, and as a result, the amount of illumination light does not become insufficient at both ends in the width direction of the inspection object such as the copper foil 50.

これに対して、図9に示すように欠陥検査装置全体を小型化する目的で撮影レンズ116よりも焦点距離の短い撮影レンズ117を用いた場合、撮影レンズ117の光軸方向に装置全体の寸法を縮小することができる。   On the other hand, as shown in FIG. 9, when the photographing lens 117 having a shorter focal length than the photographing lens 116 is used for the purpose of downsizing the entire defect inspection apparatus, the dimensions of the whole apparatus in the optical axis direction of the photographing lens 117 are used. Can be reduced.

しかし、撮影レンズ117は撮影レンズ116よりも画角θ102が大きいため、銅箔50などの被検査物の幅方向両端部において、LED120の光軸120Lは撮影レンズ117の方向から外れ、LED120の指向性によって照明光量が不足する虞がある。照明光量の低下は検出精度の低下などの影響を生じる可能性があるので、これを補正する必要が生じる。   However, since the photographic lens 117 has a larger angle of view θ102 than the photographic lens 116, the optical axis 120L of the LED 120 deviates from the direction of the photographic lens 117 at both ends in the width direction of the inspection object such as the copper foil 50. Depending on the nature, the amount of illumination light may be insufficient. Since a decrease in the amount of illumination light may cause an influence such as a decrease in detection accuracy, it is necessary to correct this.

そこで本願発明では図3(A)に示すように、LEDアレイ21の長手方向両端を含む、複数のLED20において光軸を長手方向中央側(撮影レンズ16の光学的中心側)に向ける配置とした。   Therefore, in the present invention, as shown in FIG. 3 (A), the plurality of LEDs 20 including both ends in the longitudinal direction of the LED array 21 are arranged such that the optical axis is directed to the longitudinal center side (optical center side of the photographing lens 16). .

これにより、撮影レンズ16として従来よりも単焦点のレンズを使用した場合でも、LEDアレイ21の長手方向両端近傍でLED20の光軸は撮影レンズ16の光学的中心方向を向くことになるため、周辺光量(この場合は銅箔50の幅方向両端部の照明光量)が不足することなく、CCDカメラ14の視野全域に亘って照明光量を確保することができる。   As a result, even when a single-focus lens is used as the photographing lens 16 in the past, the optical axis of the LED 20 is directed toward the optical center of the photographing lens 16 in the vicinity of both ends of the LED array 21 in the longitudinal direction. The illumination light quantity can be secured over the entire visual field of the CCD camera 14 without the light quantity (in this case, the illumination light quantity at both ends in the width direction of the copper foil 50) being insufficient.

<LED加工>
図5には、本願発明に係るLED20の、足曲げ加工方法の一例が示されている。
<LED processing>
FIG. 5 shows an example of a leg bending method of the LED 20 according to the present invention.

図5(A)〜(C)に示すように、LED20の光軸20Lを所定の方向とするために脚22を所定の角度で曲げるには、目測ではなく治具30のように専用の工具を使用することが望ましい。   As shown in FIGS. 5A to 5C, in order to bend the leg 22 at a predetermined angle so that the optical axis 20L of the LED 20 is in a predetermined direction, a dedicated tool such as a jig 30 is used instead of a visual measurement. It is desirable to use

治具30はベースブロック32、アングルブロック34、押さえ板36、圧着プレート38からなる。ベースブロック32の裏側(LED20の脚22が位置する側)は空隙31が設けられており、LED20の脚22に触れることができる。アングルブロック34の、ベースブロック32と接する側は斜面34Aが設けられており、LED20の脚22を斜面34Aに沿って曲げることで、所望の角度に揃えて曲げることができる。   The jig 30 includes a base block 32, an angle block 34, a pressing plate 36, and a pressure bonding plate 38. A gap 31 is provided on the back side of the base block 32 (the side where the leg 22 of the LED 20 is located) so that the leg 22 of the LED 20 can be touched. The side of the angle block 34 that contacts the base block 32 is provided with a slope 34A, and the leg 22 of the LED 20 can be bent at a desired angle by bending the leg 22 along the slope 34A.

先ず図5(A)のようにベースブロック32とアングルブロック34とを図示しないピンで位置決めする。これは両者をネジ33でネジ止めする構成であってもよい。このときベースブロック32とアングルブロック34との間は密着せず、LED20の脚22が挟まる程度の隙間が空いている。   First, as shown in FIG. 5A, the base block 32 and the angle block 34 are positioned by pins (not shown). This may be configured to be screwed with screws 33. At this time, the base block 32 and the angle block 34 are not in close contact with each other, and there is a gap enough to sandwich the leg 22 of the LED 20.

次にLED20をベースブロック32とアングルブロック34との隙間に挿入し、押さえ板36でLED20の頭を押さえ付け、位置決めする。この際、図5(B)に示すように複数本のLED20を同時に加工することで作業効率が向上する。   Next, the LED 20 is inserted into the gap between the base block 32 and the angle block 34, and the head of the LED 20 is pressed by the pressing plate 36 and positioned. At this time, as shown in FIG. 5B, working efficiency is improved by processing a plurality of LEDs 20 simultaneously.

さらにLED20の脚22をアングルブロック34の斜面34Aに沿って曲げる。最後に圧着プレート38をネジ39でアングルブロック34に締結する。アングルブロック34、押さえ板36を外してLED20を取り出すと脚22は斜面34Aの角度すなわち図5(C)のθ2で曲げられている。   Further, the leg 22 of the LED 20 is bent along the slope 34 </ b> A of the angle block 34. Finally, the crimping plate 38 is fastened to the angle block 34 with screws 39. When the angle block 34 and the pressing plate 36 are removed and the LED 20 is taken out, the leg 22 is bent at an angle of the inclined surface 34A, that is, θ2 in FIG.

このとき斜面34Aの上に垂直部分34Bを設けておくことで、脚22の根本にLED20の頭から真っ直ぐに突き出した垂直部分22Bを確保することができる。この垂直部分22Bの長さはLED20を固定するスペーサ24や基板26の厚さ等に応じて適宜調整することもできる。   At this time, by providing the vertical portion 34B on the slope 34A, it is possible to secure the vertical portion 22B protruding straight from the head of the LED 20 at the base of the leg 22. The length of the vertical portion 22B can be appropriately adjusted according to the thickness of the spacer 24 and the substrate 26 for fixing the LED 20.

<第2実施形態>
図6は、本願発明の第2の実施形態に係る欠陥検査装置の一部を示した概念図である。
Second Embodiment
FIG. 6 is a conceptual diagram showing a part of a defect inspection apparatus according to the second embodiment of the present invention.

図6に示すように、被検査物である銅箔50の搬送幅方向全域を1個のCCDカメラ14でカバーする替わりに、幅方向にわたって撮影範囲がオーバーラップするように複数個のCCDカメラ14を配置し、全体として銅箔50の表面を検査してもよい。   As shown in FIG. 6, instead of covering the entire conveyance width direction of the copper foil 50 as the inspection object with one CCD camera 14, a plurality of CCD cameras 14 so that the imaging ranges overlap in the width direction. And the surface of the copper foil 50 may be inspected as a whole.

すなわちCCDカメラ14の撮影範囲が被検査物の幅をカバーする大きさを備えている必要がないため、ラインCCDセンサ18および撮影レンズ16に小型のものを使用することができ、部品コストを低減することができる。   That is, since it is not necessary for the imaging range of the CCD camera 14 to be large enough to cover the width of the object to be inspected, it is possible to use a small size for the line CCD sensor 18 and the imaging lens 16, thereby reducing the component cost. can do.

また被検査物の搬送幅方向サイズが大きい場合も同様に複数個のCCDカメラ14を並べ、全幅をカバーするように配置することで、新規に大型のCCDカメラを用意する必要がないため、被検査物のサイズ変更に際して柔軟に対応することができる。   Similarly, when the size of the object to be inspected is large, by arranging a plurality of CCD cameras 14 so as to cover the entire width, it is not necessary to prepare a new large CCD camera. It is possible to flexibly cope with the change of the size of the inspection object.

<第3実施形態>
図7は、本願発明の第3の実施形態に係る照明装置の一部を示した概念図である。
<Third Embodiment>
FIG. 7 is a conceptual diagram showing a part of a lighting apparatus according to the third embodiment of the present invention.

図7に示すように、本実施形態に係る照明装置は、LEDアレイ21を構成する基板26あるいはスペーサ24をCCDカメラ14に対して凹面を形成するように長手方向両端部を曲げることで、光軸20LをCCDカメラ14方向に向ける構成とされている。   As shown in FIG. 7, the lighting device according to the present embodiment bends the both ends in the longitudinal direction so that the substrate 26 or the spacer 24 constituting the LED array 21 forms a concave surface with respect to the CCD camera 14. The shaft 20L is directed in the direction of the CCD camera 14.

これにより長手方向両端部のLED20Bの脚22を曲げて光軸20LBをCCDカメラ14方向に向けた構成と同様の効果が得られ、被検査物の幅方向両端部において周辺光量(幅方向両端部の照明光量)が不足することなく、CCDカメラ14の視野全域に亘って照明光量を確保することができる。   As a result, the same effect as that obtained by bending the legs 22 of the LEDs 20B at both ends in the longitudinal direction and directing the optical axis 20LB in the direction of the CCD camera 14 can be obtained. The amount of illumination light can be ensured over the entire field of view of the CCD camera 14.

このとき、LED20はLEDアレイ21を構成する基板26あるいはスペーサ24の曲面形状に従って光軸20Lの方向が決定されるため、LEDアレイ21の長手方向位置によってLED20の光軸20Lは段階的に変化し、より細かい光軸方向制御が可能となる。   At this time, since the direction of the optical axis 20L of the LED 20 is determined according to the curved surface shape of the substrate 26 or the spacer 24 constituting the LED array 21, the optical axis 20L of the LED 20 changes stepwise depending on the longitudinal position of the LED array 21. Finer control of the optical axis direction is possible.

またLEDアレイ21を構成する基板26あるいはスペーサ24の素材を可撓性あるいは可塑性のものとして、焦点距離の異なる撮影レンズ16に交換した際には、その画角θに合わせて基板26あるいはスペーサ24の形状を変化させる構成としてもよい。   Further, when the material of the substrate 26 or the spacer 24 constituting the LED array 21 is made flexible or plastic and is replaced with a photographing lens 16 having a different focal length, the substrate 26 or the spacer 24 is adjusted in accordance with the angle of view θ. It is good also as a structure which changes the shape.

以上、実施形態を挙げて本発明の実施の形態を説明したが、これらの実施形態は一例であり、要旨を逸脱しない範囲内で種々変更して実施できる。   The embodiments of the present invention have been described above with reference to the embodiments. However, these embodiments are merely examples, and various modifications can be made without departing from the scope of the invention.

例えば、本願発明は長尺ベルト状の銅箔表面を検査する欠陥検査装置に関するが、これに限定されず、例えば他の金属でも表面が鏡面仕上げであればよく、また前述のようにCSPテープ等の複合素材からなる製品に関しても、あるいは長尺ベルト上を搬送されるネジ等の小型定型物の異常検出など種々の応用が考えられる。また、照明装置単体としては接写や複写など照明光量の均一さが求められる用途一般に応用することができる。   For example, the present invention relates to a defect inspection apparatus for inspecting the surface of a long belt-like copper foil. However, the present invention is not limited to this. For example, the surface of any other metal may be mirror-finished. Various applications such as detection of abnormalities in small fixed objects such as screws conveyed on a long belt can also be considered for products made of these composite materials. Further, the illumination device alone can be applied to general uses such as close-up and copying where the illumination light quantity is required to be uniform.

10 欠陥検査装置
12 照明装置
14 カメラ
16 撮影レンズ
18 センサ
20L 光軸
21 LEDアレイ
22 脚
22B 垂直部分
24 スペーサ
26 基板
30 治具
40 コンピュータ
50 銅箔
θ 画角
DESCRIPTION OF SYMBOLS 10 Defect inspection apparatus 12 Illumination apparatus 14 Camera 16 Shooting lens 18 Sensor 20L Optical axis 21 LED array 22 Leg 22B Vertical part 24 Spacer 26 Substrate 30 Jig 40 Computer 50 Copper foil θ Field angle

Claims (2)

撮像光学系を備えた撮像装置と組み合わされ、前記撮像光学系の光軸と交差する方向に延設される照明装置であって、
指向性をもつ光源を直線状に配列し、配列方向両端を含む複数の光源の光軸を、配列方向中央に向けたことを特徴とする照明装置。
An illumination device combined with an imaging device including an imaging optical system and extending in a direction intersecting with the optical axis of the imaging optical system,
An illumination device, wherein light sources having directivity are arranged in a straight line, and optical axes of a plurality of light sources including both ends in the arrangement direction are directed to the center in the arrangement direction.
表面を反射面として帯状に搬送される長尺ベルト状の被検査物を検査する欠陥検査装置であって、
搬送される前記被検査物の表面を搬送幅方向にわたって撮像する撮像手段と、
前記被検査物の搬送方向上流側または下流側から前記被検査物を搬送幅方向にわたって照明し前記反射面で反射させる請求項1に記載の照明装置と、
前記撮像手段で撮像された画像を解析し、前記被検査物の表面の異常の有無を検出する解析手段と、
を備えた欠陥検査装置。
A defect inspection apparatus for inspecting a long belt-shaped inspection object conveyed in a band shape with the surface as a reflection surface,
Imaging means for imaging the surface of the object to be transported across the transport width direction;
The illumination device according to claim 1, wherein the inspection object is illuminated over the conveyance width direction from the upstream side or the downstream side in the conveyance direction of the inspection object and reflected by the reflection surface;
Analyzing the image picked up by the image pickup means, and detecting the presence or absence of abnormality of the surface of the inspection object;
Defect inspection device with
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013036948A (en) * 2011-08-11 2013-02-21 Futec Inc Defect inspection device
JP2017024222A (en) * 2015-07-17 2017-02-02 富士ゼロックス株式会社 Semiconductor element, substrate device, exposure device, image formation device, method for manufacturing semiconductor element, and method for manufacturing substrate device
KR20230019611A (en) * 2021-08-02 2023-02-09 에스티에스 주식회사 A Vision Apparatus for Inspecting a Metal foil and a Method with the Same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004191214A (en) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd Line lighting system, and inspection device using line lighting system
JP2010071720A (en) * 2008-09-17 2010-04-02 Nippon Steel Corp Device and method for inspecting defect of steel strip
JP2011242379A (en) * 2010-04-20 2011-12-01 Ricoh Co Ltd Image inspection device and image forming device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004191214A (en) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd Line lighting system, and inspection device using line lighting system
JP2010071720A (en) * 2008-09-17 2010-04-02 Nippon Steel Corp Device and method for inspecting defect of steel strip
JP2011242379A (en) * 2010-04-20 2011-12-01 Ricoh Co Ltd Image inspection device and image forming device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013036948A (en) * 2011-08-11 2013-02-21 Futec Inc Defect inspection device
JP2017024222A (en) * 2015-07-17 2017-02-02 富士ゼロックス株式会社 Semiconductor element, substrate device, exposure device, image formation device, method for manufacturing semiconductor element, and method for manufacturing substrate device
KR20230019611A (en) * 2021-08-02 2023-02-09 에스티에스 주식회사 A Vision Apparatus for Inspecting a Metal foil and a Method with the Same
KR102617146B1 (en) * 2021-08-02 2023-12-27 에스티에스 주식회사 A Vision Apparatus for Inspecting a Metal foil and a Method with the Same

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