JP4203827B2 - Air turn roller device - Google Patents

Description

  The present invention relates to an air turn roller device suitable for use in transporting a semiconductor device tape such as a TAB (Tape Automated Bonding) tape on which a semiconductor chip is mounted.

  In general, there is an increasing demand for miniaturization of a semiconductor device. For this reason, a semiconductor device of a chip size package (hereinafter referred to as CSP) in which the outer dimensions of the semiconductor device are reduced to almost the outer dimensions of a semiconductor element is used. ing.

  In this CSP semiconductor device, a semiconductor element is fixed on a semiconductor device tape, which is a material of the substrate, with an adhesive or the like, and an electrode formed on the peripheral portion of the semiconductor element and an electrode formed on the peripheral portion of the substrate are provided. Solder brazing of electrodes connected by wire bonding such as gold wires, or arrayed electrodes formed on a tape for semiconductor devices and solder balls formed in an array on the back side of the semiconductor element There have been proposed CSP semiconductor devices having various configurations such as an electrical connection configuration.

  Further, in the manufacture of semiconductor devices, a plurality of wiring patterns such as wiring, electrodes, beam leads, and through holes are repeatedly patterned on a long semiconductor device tape corresponding to one chip. A method of manufacturing a large number of semiconductor devices at one time by mounting a semiconductor element corresponding to the above, and then cutting each chip is proposed.

  The tape for a semiconductor device used in this way is obtained by etching a copper conductive film formed on the surface of a long sheet-like base material having flexibility such as a polyimide base material by an etching technique or pressing. A plurality of wiring patterns such as predetermined wiring, electrodes, beam leads, and through holes corresponding to the above are repeated.

  In addition, in this tape for a semiconductor device, small rectangular through holes for inserting feeding claws for feeding operations are arranged at predetermined intervals at both ends in the longitudinal direction that are outside the range of the wiring pattern corresponding to each chip. Drill into.

  Some of these tapes for semiconductor devices are formed in a predetermined size such as 35 mm, 48 mm, 70 mm or 96 mm.

  Further, the semiconductor device tape configured as described above is used for manufacturing a semiconductor device after a pattern is formed and a pattern defect such as disconnection or chipping is inspected with an inspection device.

  In this inspection apparatus, a wiring pattern on the surface of a semiconductor device tape is read as image data by an image reading device such as a CCD, and a defect such as a pattern width, a disconnection of a wiring pattern, or a short circuit is detected based on the read image data. Perform an inspection.

  In this inspection apparatus, a transport path is formed by a transport means using a plurality of transport rollers between a winding unit for pulling out a semiconductor device tape and a winding unit for winding the semiconductor device tape. A scanner unit including an image reading device, a marking unit for marking corresponding to a defective portion, and the like are sequentially arranged on the road (for example, see Patent Document 1).

  Further, in this inspection apparatus, it is required to prevent the outer peripheral surface of the transfer roller from coming into contact with the wiring pattern formed on the surface of the semiconductor device tape to cause damage.

  For this reason, in this inspection apparatus, the conveyance roller is brought into contact only with the portion provided with the rows of small rectangular through holes at both ends in the longitudinal direction that are outside the range of the wiring pattern on both sides in the width direction on the outer peripheral surface thereof. It is conceivable to form a so-called stepped roller in which a rolling contact surface portion is formed and a relief recess that is one step lower is formed in a portion between the rolling contact surface portions on both sides in the width direction on the outer peripheral surface of the conveying roller.

  When transporting a tape for a semiconductor device, which is a long and flexible strip-shaped sheet member, using the stepped roller configured as described above, the semiconductor device tape is wound around a transport roller. Only the portion provided with the rows of small rectangular through holes at both ends in the longitudinal direction of the tape for the semiconductor device is in contact with the rolling contact surface portion of the outer periphery of the transport roller, and the wiring pattern portion of the tape for the semiconductor device is floated inside Since it can convey in the state which is not in contact with the outer peripheral surface of the roller for conveyance, it can prevent that a wiring pattern part is damaged.

However, when a semiconductor device tape is transported using a stepped roller in an inspection device, when the semiconductor device tape becomes thin, the central portion of the tape in the width direction of the semiconductor device is bent into the lower recessed portion and enters. There is a problem that a so-called half-fold may be generated which causes a wrinkle in the wiring pattern portion.
JP 2000-309457 A

  In view of the above, the present invention newly provides an air turn roller device configured to be capable of transporting a semiconductor device tape without causing breakage or damage to a wiring pattern portion in the semiconductor device tape. For the purpose.

The air turn roller device according to claim 1 of the present invention conveys the semiconductor device tape by rotating the strip-shaped semiconductor device tape wound around a predetermined range of a cylindrical rotating roller. In the air turn roller device used for rolling, a rolling contact step portion formed in a step shape so as to be in contact with the outer peripheral guide surface portion of the rotating roller at both ends in the width direction of the tape for the semiconductor device, and the outer periphery of the rotating roller In the intermediate portion in the width direction of the guide surface portion, a relief recess formed as an outer peripheral surface that is one step lower, the air supply port formed in the escape recess portion of the rotary roller, and the side surface of the rotary roller are closed, a semi-sealing means arranged to make a cavity inside the rotating rollers, Ri by the be injected from the air supply port to the air the air in the cavity inside the rotating rollers Side direction sides is characterized by having a, and air blower for float rolling contact tape with for the semiconductor device from the relief recesses in the rolling Seddan unit.

The air turn roller device according to claim 2 of the present invention conveys the semiconductor device tape by rotating the long belt-like tape for a semiconductor device wound around a predetermined range of a cylindrical rotating roller. In the air turn roller device used for rolling, a rolling contact step portion formed in a step shape so as to be in contact with the outer peripheral guide surface portion of the rotating roller at both ends in the width direction of the tape for the semiconductor device, and the outer periphery of the rotating roller An escape recess formed as a lower outer peripheral surface in the intermediate portion in the width direction of the guide surface portion, an air supply port formed in the escape recess portion of the rotating roller, and an opening on one side surface of the rotating roller and end plates for closing the, closing the opening of the other side of said rotating rollers, supporting end face having a vent hole leading to the cavity with make a cavity inside the rotating rollers If the provided support end-face member, the longitudinal sides by jetting from the air supply port from said vent holes by air the air in the cavity inside the rotating rollers are rolling contact with the rolling Seddan portion And an air supply fan for raising the tape for a semiconductor device from the escape recess.

An air turn roller device according to a third aspect of the present invention conveys the tape for a semiconductor device by rotating the tape for a semiconductor device in a long band around a predetermined range of a cylindrical rotating roller. In the air turn roller device used for rolling, a rolling contact step portion formed in a step shape so as to be in contact with the outer peripheral guide surface portion of the rotating roller at both ends in the width direction of the tape for the semiconductor device, and the outer periphery of the rotating roller A clearance recess formed as an outer peripheral surface that is one step lower at the intermediate portion in the width direction of the guide surface portion, an air supply port formed in the clearance recess portion of the rotating roller, and one side surface of the rotating roller are blocked. An end face plate, a support end face member for closing that closes the other side surface of the rotating roller and forms a cavity inside the rotating roller; and An air guide member arranged in a predetermined range where the tape for the semiconductor device is not wound around the periphery, and is attached to the outside of the air guide member, and air is supplied into the cavity of the rotating roller and injected from the air supply port. I Ri long-side direction sides to be is characterized by having a, and air blower for float rolling contact tape with for the semiconductor device from the relief recesses in the rolling Seddan unit.

  By configuring as described above, the air supply fan is driven to supply air into the inside of the cavity of the rotating roller and sprayed from the air supply port, so that both sides in the longitudinal direction of the tape for the semiconductor device are formed on the rotating roller. Rotating rollers while blowing air toward the intermediate portion in the width direction of the tape for a semiconductor device wound in a state of rolling contact with each rolling contact step, and maintaining the state where the tape for a semiconductor device is lifted from the recess Rotates and conveys the semiconductor device tape, so that the wiring pattern portion formed on the semiconductor device tape can be conveyed without causing breakage or damage.

  According to the air turn roller device of the present invention, there is an effect that the semiconductor device tape can be transported without causing the wiring pattern portion in the semiconductor device tape to bend or damage.

  Hereinafter, a first embodiment relating to an air turn roller device of the present invention will be described with reference to FIGS. 1 to 4.

  1 and 2 are an overall schematic front view and an overall schematic side view of an inspection apparatus for inspecting a defect of a tape for a semiconductor device provided with an air turn roller device according to the first embodiment. 10 is the main body of the inspection apparatus.

  On the front surface of the inspection apparatus 10 are an unwinding unit 12 for supplying a long strip-shaped semiconductor device tape 16 to be inspected, and a winding unit 14 for collecting the inspected semiconductor device tape 16. And place.

  The unwinding unit 12 includes an unwinding-side reel shaft 22 that rotatably holds a tape reel 20 on which a tape 16 for a semiconductor device on which a large number of package patterns are repeatedly formed is wound.

  The take-up unit 14 includes a take-up reel shaft 18 on which a tape reel 24 for taking up the inspected semiconductor device tape 16 is rotatably loaded.

  On the front surface of the inspection apparatus 10, a transport path for transporting the semiconductor device tape 16 from the unwinding unit 12 to the winding unit 14 is formed. Guide 26 for changing the transport direction, a short dancer 28 for adjusting the tape tension on the supply side, a first feed roller 30 and a second feed roller 32 for the scanner unit, and a long dancer for adjusting the tape tension in the middle of the transport path 34, the first guide roller 36 and the second guide roller 38 for the marking unit, the short dancer 40 for adjusting the tape tension on the winding side, and the guide 42 for changing the transport direction of the semiconductor device tape 16 are arranged in this order. .

  In this inspection apparatus 10, in order to constitute a scanner unit, the first feed roller 30 and the second feed roller 32 are horizontally arranged with a predetermined interval therebetween, and the first feed roller 30 and the second feed roller are arranged. A levitation stage 44 is arranged between

  The scanner unit 16 is configured such that the semiconductor device tape 16 passes over the guide surface of the flying stage 44 located at a predetermined height above the first feed roller 30 and moves to the second feed roller 32. .

  Although not shown, the levitation stage 44 has a hollow structure, and the compressed air is supplied to the interior of the levitation stage 44 to eject the air from the pores formed in the guide surface toward the back surface of the semiconductor device tape 16. The semiconductor device tape 16 is configured to move in a non-contact manner.

  Above the center of the guide surface of the levitation stage 44, an image reading unit comprising a camera unit 46 having a focus unit is installed.

  In this scanner unit, the first feed roller 30 and the second feed roller 32 are rotated to pass the semiconductor device tape 16 over the floating stage 44 while transporting the semiconductor device tape 16 in one direction at a constant speed. The circuit pattern formed on the semiconductor device tape 16 is photographed by the camera unit 46.

  In this scanner unit, image information captured by the camera unit 46 is transmitted to a control device (not shown) to perform image processing, and if there is a defect in the wiring pattern as compared with image processing information of an appropriate pattern, this is detected. Note that image information taken by the camera unit 46 is displayed on the monitor 48.

  Since the inspection apparatus 10 constitutes a marking unit (a punch unit in the inspection apparatus 10), a package pattern detected as having a defect between the first guide roller 36 and the second guide roller 38. A punch unit 50 is provided for punching a punch hole at a predetermined position.

  In the inspection device 10 configured as described above, the long dancer 34 (the same applies to the short dancer 28 and the short dancer 40 if necessary) is configured by an air turn roller device.

  As shown in FIG. 3, the long dancer 34 as an air turn roller device is configured by rotatably mounting a rotating roller 56 on a fixed shaft 52 via a ball bearing 54.

  The rotating roller 56 has an outer peripheral guide surface portion 62 constituting an outer peripheral surface for rolling contact with the semiconductor device tape 16 by a plurality of ribs 60 extending in a radial direction from a central shaft portion 58 supported by the ball bearing 54. Are integrally formed so as to support.

  As shown in FIGS. 3 and 4, the rotating roller 56 is configured as a stepped roller, and flange end portions 64 are formed at both ends in the width direction of the outer peripheral guide surface portion 62, respectively, and the first rolling rollers are respectively formed inside them. A contact step portion 66 is formed, a second contact portion 68 is formed on the inner side of each first contact portion 66, and a second contact portion 68 is formed on the inner side of each second contact portion 68. A third rolling contact step portion 70 constituting a rolling contact surface lowered by one step is formed, and a relief recess 72 which is a lower outer peripheral surface is formed between the two third rolling contact step portions 70.

  Further, twelve air supply ports 74, which are through-holes having a diameter of about 20 mm, are formed in the rotary roller 56 at equal intervals in the escape recess 72 portion. The air supply port 74 may be configured by forming one or more groove-shaped through holes in the escape recess 72 portion.

  The rotating roller 56 is provided with an end face plate 76 for closing one side surface of the rotating roller 56 as a semi-sealing means for suppressing air from leaking from the side surface portion and creating a cavity inside. This end face plate 76 is formed in a disk shape that is slightly smaller than the circular opening on the side surface of the rotating roller 56, and its outer peripheral edge is positioned in the vicinity of the inner side face of the rotating roller 56 and rotates with the outer peripheral edge of the end face plate 76. It is formed so that air can be prevented from leaking from between the inner surface of the roller 56.

  The end face plate 76 is arranged by inserting and fixing a through-hole drilled in the central portion thereof to the fixed shaft 52. The end face plate 76 may be configured integrally with the rotating roller 56 so as to close the space between the central shaft portion 58 and the outer peripheral guide surface portion 62 of the rotating roller 56.

  In addition, a support end surface member 78 is provided as a semi-sealing means for suppressing air from leaking to the other side surface portion (the portion on the free end portion side of the fixed shaft 52) of the rotating roller 56 to create a cavity therein. And the attachment end face member 80 are attached. Further, an air supply fan 82 is attached to the attachment end face member 80.

  The support end surface member 78 is attached by inserting a distal end portion in which a screw groove of the fixed shaft 52 is formed into a through hole formed in a circular concave portion at the center thereof, and fixing with a nut 84. A cylindrical ring portion 78A is integrally formed on the outer periphery of the support end surface member 78, and the periphery of the ring portion 78A is located in the vicinity of the inner side surface of the rotating roller 56 so that the inner portion of the ring portion 78A and the rotating roller 56 is inside. It is configured so that air can be prevented from leaking from between the side surfaces.

  Further, as shown in FIGS. 4 and 5, a plurality of ventilation holes 86 that are circular through holes are formed at equal intervals in the flat portion of the support end surface member 78 so as to be dispersed on average. The mounting end surface member 80 is arranged on the flat surface portion of the support end surface member 78 so as to be overlapped and fastened with a screw 88. An air supply fan 82 is attached to the attachment end face member 80 with a screw 90 so as to cover an opening portion drilled in the center thereof.

  The air supply fan 82 has a function of supplying outside air to the inside of the rotary roller 56 through the opening portion of the attachment end surface member 80 and the vent hole 86 of the support end surface member 78.

  The long dancer 34 as an air turn roller device configured as described above is supported by the support mechanism of the inspection apparatus 10 so as to descend downward with a predetermined load, and the tape 16 for semiconductor device is kept constant in tape tension. Used to transport.

  That is, in the inspection apparatus 10 to which the long dancer 34 is attached, the rotation roller 56 is fixed by the transporting operation of the semiconductor device tape 16 by transporting the semiconductor device tape 16 in a state of being wound around the long dancer 34 about a half turn. While rotating around the shaft 52, the fluctuation of the tape tension applied to the semiconductor device tape 16 is absorbed by the up and down movement of the long dancer 34.

  As illustrated in FIG. 5, the semiconductor device tape 16 conveyed using the long dancer 34 has small rectangular through holes 92 for hooking conveyance nails on both sides in the longitudinal direction at predetermined intervals. Open and drilled in a row. In this semiconductor device tape 16, both side portions in the longitudinal direction where the small rectangular through holes 92 are formed are cut off in a later processing step to complete the semiconductor device, so that the semiconductor device tape 16 is rotated to both sides in the longitudinal direction of the semiconductor device tape 16. Even if the roller 56 rolls, the wiring pattern on the surface of the semiconductor device tape is not damaged.

  Therefore, in this long dancer 34, the semiconductor device tape 16 is transported by rolling contact only to both sides in the longitudinal direction of the semiconductor device tape 16. That is, in this long dancer 34, for example, both the longitudinal direction both sides of the semiconductor device tape 16 are rolled on the first rolling contact step portion 66 with respect to the semiconductor device tape 16 having a large width size, or the intermediate width. With respect to the semiconductor device tape 16 of the size, the both sides in the longitudinal direction of the semiconductor device tape 16 are rolled on the second rolling contact step portion 68, or the semiconductor device tape 16 of a small width size, The both sides in the longitudinal direction of the tape 16 for a semiconductor device are rolled on the third rolling contact step 70 and conveyed.

  Further, in this long dancer 34, the outside air is supplied to the internal cavity of the rotating roller 56 by the air supply fan 82, and the first rolling contact step 66 or the second rotation step on the both sides from the air supply port 74 of the outer peripheral guide surface portion 62. By spraying toward the intermediate portion in the width direction of the tape 16 for semiconductor device in which both sides in the longitudinal direction are in rolling contact with the contact step portion 68 or the third rolling contact step portion 70, the intermediate portion in the width direction of the tape 16 for semiconductor device is provided. The state where the part escapes from the recessed part 72 by a predetermined distance is maintained.

  Therefore, in this long dancer 34, the width direction middle part of the semiconductor device tape 16 wound around the outer peripheral guide surface portion 62 is pressed by the air blown from the air supply port 74, and the width direction center of the semiconductor device tape 16 is pressed. Since the portion does not bend and enter the escape recess 72 side which is one step lower, it is possible to prevent so-called middle breakage that causes wrinkles in the wiring pattern portion.

  Further, in the long dancer 34, when the semiconductor device tape 16 is wound around the outer peripheral guide surface portion 62 by about a half turn, air leaks from the air supply port 74 in a range where the semiconductor device tape 16 is not wound. In order to prevent the air pressure applied to the semiconductor device tape 16 from being lowered, as shown by an imaginary line in FIG. 4, it corresponds to the range where the semiconductor device tape 16 of the outer peripheral guide surface portion 62 is not wound. A cover member 94 may be disposed.

  The cover member 94 is formed with an arcuate surface 94 </ b> A corresponding to the outer peripheral surface of the relief recess 72. Further, the cover member 94 is attached to the long dancer 34 by the support frame member 95.

  The support frame member 95 is arranged such that one free end portion of a frame body formed in an inverted U-shape is fixed to the fixed shaft 52 and the other free end portion is fixed to the attachment end surface member 80. A cover member 94 is attached to the support frame member 95 at a position directly above the outer peripheral guide surface portion 62, and the arc surface 94 A of the cover member 94 is disposed adjacent to the escape recess 72. When configured in this way, air leakage can be suppressed by closing the air supply port 74 in the range where the semiconductor device tape 16 of the rotating roller 56 is not wound with the support frame member 95.

  Next, the operation and operation of the inspection apparatus 10 configured as described above will be described. In this inspection apparatus 10, the semiconductor device tape 16 pulled out from the tape reel 20 is conveyed in a curved and non-contact manner on the guide surface of the floating stage 44 by the guide 26, the short dancer 28, and the first feed roller 30. To do.

  At this time, the semiconductor device tape 16 on the guide surface of the levitation stage 44 is curved in the transport direction, straight in the width direction, and parallel to the camera unit 46. Furthermore, since the flying height of the semiconductor device tape 16 from the guide surface of the flying stage 44 is controlled, the camera unit 46 can be appropriately focused and photographed.

  Image information captured by the camera unit 46 is transmitted to a control device (not shown). The control device detects image defects by performing image processing based on the transmitted image information.

  When the control device detects a defect, the control device drives and controls the punch unit 50 to punch holes at predetermined positions corresponding to the defective pattern to perform marking.

  The inspection apparatus 10 includes a short dancer 28, a long dancer 34, a short dancer 40, and the like configured by an air turn roller device, and guides the semiconductor device tape 16 in a non-contact manner, thereby reducing resistance during conveyance. The thin semiconductor device tape 16 can be conveyed optimally.

  Next, 2nd Embodiment regarding the air turn roller apparatus of this invention is described, referring FIG.

  In the air turn roller device according to the second embodiment, the air guide member 96 is disposed so as to cover a predetermined range where the semiconductor device tape 16 is not wound around the outer periphery of the rotating roller 56, and the outside of the air guide member 96. An air supply fan 82 is arranged in the configuration.

  For this reason, in the air turn roller device according to the second embodiment, the end face plate 76 is disposed on one side surface of the rotating roller 56 to suppress air leakage, and the supporting end surface member 78 for closing is provided on the other side surface ( Here, it is configured so as to suppress air leakage by arranging a disc-like shape not provided with a ventilation hole 86. In the air turn roller device according to the second embodiment, the attachment end face member 80 for attaching the air supply fan 82 is omitted.

  The air guide member 96 used in the air turn roller device is formed in a rectangular cylindrical shape having a width approximately equal to the width of the escape recess 72 in the outer peripheral guide surface portion 62 and a length equal to or less than the diameter of the escape recess 72. The opening edge part (lower opening edge part in the figure) opposite to is formed in an arc shape along the outer peripheral surface of the escape recess 72.

  An air supply fan 82 is integrally attached to an opening portion (the upper opening portion in the figure) opposite to the escape recess 72 of the air guide member 96.

  The air supply fan 82 integrally provided with the air guide member 96 is installed by being attached to the fixed shaft 52, the closing support end surface member 78, etc. by a holding means such as a support member (not shown).

  In the air turn roller device according to the second embodiment configured as described above, the air sucked by the air feeding fan 82 is guided by the air guide member 96 and the air feeding port 74 in the escape recess 72 of the rotating roller 56 is provided. The air is fed into the cavity of the rotary roller 56 through. Thus, the air forcedly fed into the cavity of the rotating roller 56 is jetted from the air supply port 74 located in the range where the semiconductor device tape 16 is wound around the rotating roller 56, and both sides in the longitudinal direction. Is blown toward the intermediate portion in the width direction of the tape 16 for semiconductor device, which is in rolling contact with the outer peripheral guide surface portion 62 side, so that the intermediate portion in the width direction of the tape 16 for semiconductor device is lifted from the escape recess 72 by a predetermined distance. To maintain the same state.

  Therefore, in the long dancer 34 according to the second embodiment, the intermediate portion in the width direction of the tape 16 for semiconductor device wound around the outer peripheral guide surface portion 62 is pressed by the air blown out from the air supply port 74. Since the central portion in the width direction of the device tape 16 is not bent into the escape recess 72 side which is one step lower, it is possible to prevent so-called middle folding that causes wrinkles in the wiring pattern portion.

  Since the configuration, operation, and effects of the second embodiment other than those described above are the same as those of the first embodiment described above, description thereof is omitted.

  Further, the present invention is not limited to the above-described embodiment, and it is needless to say that various other configurations can be taken without departing from the gist of the present invention.

It is a front view which shows the inspection apparatus equipped with the air turn roller apparatus concerning 1st Embodiment of this invention. It is a right view which shows the inspection apparatus equipped with the air turn roller apparatus concerning 1st Embodiment of this invention. It is a fragmentary sectional view which shows the air turn roller apparatus concerning 1st Embodiment of this invention. It is a disassembled perspective view which shows the air turn roller apparatus concerning 1st Embodiment of this invention. It is a perspective view which shows the air turn roller apparatus concerning 1st Embodiment of this invention. It is sectional drawing which shows the air turn roller apparatus concerning 2nd Embodiment of this invention.

Explanation of symbols

10 Inspection Device 16 Semiconductor Device Tape 26 Guide 28 Short Dancer 30 First Feed Roller 32 Second Feed Roller 34 Long Dancer 36 Guide Roller 38 Guide Roller 40 Short Dancer 42 Guide 56 Rotating Roller 62 Outer Peripheral Guide Surface 66 First Roll Contact portion 68 Second rolling contact step 70 Third rolling contact step 72 Escape recess 74 Air supply port 76 End surface plate 78A Ring portion 78 Support end surface member 80 Mounting end surface member 82 Air supply fan 86 Vent hole 94 Cover member 94A arc Surface 95 Support frame member 96 Air guide member

Claims (3)

In the air turn roller device used to transport the semiconductor device tape by rotating the tape for a semiconductor device in a long band around a predetermined range of a cylindrical rotating roller,
A rolling contact step portion formed in a step shape so as to be in contact with the outer peripheral guide surface portion of the rotating roller at both ends in the width direction of the semiconductor device tape,
An escape recess formed as a lower outer peripheral surface at the intermediate portion in the width direction of the outer peripheral guide surface portion of the rotating roller;
An air supply port formed in the escape recess of the rotating roller;
Semi-sealing means arranged to block the side of the rotating roller and to form a cavity inside the rotating roller;
From said the cavity inside the rotating rollers and air the air escape the said semiconductor device tape length side direction sides Ri by the be injected is rolling contact with the rolling Seddan unit from the air supply port recess With an air supply fan to make it rise,
An air turn roller device comprising: In the air turn roller device used to transport the semiconductor device tape by rotating the tape for a semiconductor device in a long band around a predetermined range of a cylindrical rotating roller,
A rolling contact step portion formed in a step shape so as to be in contact with the outer peripheral guide surface portion of the rotating roller at both ends in the width direction of the semiconductor device tape,
An escape recess formed as a lower outer peripheral surface at the intermediate portion in the width direction of the outer peripheral guide surface portion of the rotating roller;
An air supply port formed in the escape recess of the rotating roller;
An end face plate that closes the opening on one side of the rotating roller;
A support end face member that closes an opening on the other side surface of the rotating roller, creates a cavity inside the rotating roller, and has a vent hole leading to the cavity;
Provided on the support end surface member, both sides in the longitudinal direction are brought into rolling contact with the rolling contact step portion by feeding air from the vent hole into the inside of the cavity of the rotating roller and spraying from the air feeding port. An air supply fan for lifting the tape for a semiconductor device from the escape recess;
An air turn roller device comprising: In the air turn roller device used to transport the semiconductor device tape by rotating the tape for a semiconductor device in a long band around a predetermined range of a cylindrical rotating roller,
A rolling contact step portion formed in a step shape so as to be in contact with the outer circumferential guide surface portion of the rotating roller at both ends in the width direction of the semiconductor device tape,
An escape recess formed as a lower outer peripheral surface at the intermediate portion in the width direction of the outer peripheral guide surface portion of the rotating roller;
An air supply port formed in the escape recess of the rotating roller;
An end face plate closing one side surface of the rotating roller;
A support end face member for closing, which is disposed so as to close the other side surface of the rotating roller and to form a cavity inside the rotating roller;
An air guide member disposed in a predetermined range in which the tape for the semiconductor device is not wound around the outer periphery of the rotating roller;
Wherein attached to the outside of the air guide member, the O Ri long-side direction sides to be injected from the air supply port to the air the air in the interior cavity of the rotating rollers are rolling contact with the rolling Seddan portion An air supply fan for lifting the semiconductor device tape from the escape recess;
An air turn roller device comprising:

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