JP2005310878A - Sheet separator and sheet separating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To minimize a separation region when separating a sheet region located outside a paste region formed by cutting a sheet to be pasted to an adherend. <P>SOLUTION: In a sheet basic material S, a die-bonding sheet DS is stacked on one surface of a base sheet BS. The material S is cut into the planar shape of a semiconductor wafer to form the paste region A1, and at the same time, the separation region A2 is formed at a position adjacent to the paste region A1 on the upstream side of the sheet feeding direction D. The separation region A2 is to be separated by a sheet separator 17. The sheet separator 17 is equipped with a separation head 33 which can be moved back and forth in the sheet widthwise direction which crosses the sheet feeding direction D. A tape T for separation is so installed on the separation head 33 as to go around the head. The tape T for separation is heat-bonded to the separation region A2 via a heat block 42, and then is wound up to separate the separation region A2 from the base sheet BS. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and in particular, when affixing a paste region formed by cutting a sticking laminated sheet provided on a surface of a base sheet to an adherend such as a semiconductor wafer. The present invention relates to a sheet peeling apparatus and a peeling method suitable for partially peeling a laminated sheet positioned on the outer peripheral side of the pasting region.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) on which a circuit surface is formed is divided into chips, and then each chip is picked up and bonded (die bonding) to a lead frame. This die bonding is performed by cutting and sticking the heat-sensitive adhesive die bonding sheet laminated on one surface of the base sheet to the semiconductor wafer in the wafer processing step.

  Such a sheet sticking device is disclosed in, for example, Patent Document 1 already proposed by the present applicant. The sheet sticking apparatus disclosed in the document forms a sticking table that supports a wafer, a die bonding sheet is cut according to the planar shape of the wafer, and a sticking area that is stuck to the wafer is formed. Cutting means for cutting the die bonding sheet in the width direction at a predetermined distance upstream, first peeling means for peeling the remaining area of the die bonding sheet that forms the outer peripheral area surrounding the sticking area, and the sticking area on the wafer A press roll for pressing and sticking, and a second peeling means for peeling the base sheet are included.

JP 2002-367931 A

  However, in the configuration disclosed in Patent Document 1, since the die bonding sheet on the outer peripheral side excluding the pasting region is peeled by the first peeling means, the outer size of the die bonding sheet region to be peeled is In addition to an increase in the size and complexity of the peeling structure, there are disadvantages in that the movement area of the device required for peeling becomes large and the positional relationship with other devices becomes complicated. Such inconvenience becomes more apparent as the wafer size increases.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose thereof is to apply a laminated sheet for sticking provided on the surface of the base sheet to a sticking area according to the planar shape of the adherend. When the laminated sheet surrounding the outside of the pasting area is peeled off, the peeling area is minimized and the peeling apparatus is simplified, and the moving area of the apparatus necessary for peeling is reduced. It is providing the sheet peeling apparatus and peeling method which can be performed.

In order to achieve the above object, the present invention uses a sheet base material including a laminated sheet for sticking provided on one surface of a belt-like base sheet, and adheres the laminated sheet in the process of feeding out the sheet base material. In the sheet peeling apparatus provided with a peeling means for forming a peeling area by cutting into a planar shape of the above, and forming a peeling area on the outer peripheral side of the sticking area to peel the peeling area from the base sheet.
The peeling area is an area adjacent to the upstream side or the downstream side along the feeding direction of the sticking area, and the peeling area is peeled off by the peeling means.

  The peeling means includes a peeling head that supports the peeling tape so as to be able to rotate in a width direction crossing a feeding direction of the sheet base material, and attaches the peeling tape to the peeling area to rotate the peeling tape. By making it carry out, it is comprised so that the said peeling area may peel from the said base sheet.

  Further, the peeling head further includes a heat block that can be moved up and down, and adopts a configuration in which the peeling tape is thermally bonded to the peeling region by the heat block.

  Furthermore, the said heat block can be arrange | positioned in the multiple places along the width direction of the said peeling area | region.

  The laminated sheet may be a heat-sensitive adhesive die bonding sheet that is attached to a semiconductor wafer.

Further, the present invention uses a sheet base material including a laminated sheet for sticking provided on one surface of a belt-like base sheet, and cuts the laminated sheet into a planar shape of an adherend in the process of feeding out the sheet base material. In the sheet peeling method of forming a pasting area and forming a peeling area on the outer peripheral side of the pasting area and peeling the peeling area from the base sheet,
Using the predetermined peeling tape, the peeling tape is thermally bonded to the peeling area,
Then, the method of peeling the said peeling area | region from a base sheet by winding up the said peeling tape is taken.

  According to the present invention, since the peeling area is not the entire outer periphery of the pasting area, but only the portion formed on the upstream side or the downstream side along the feeding direction, the peeling structure can be simply configured compared to the conventional peeling structure. can do. At this time, the peeling region is formed in a piece shape along the width direction of the laminated sheet. Therefore, peeling can be realized by using a peeling head that can be separated and approached along the width direction. A structure that hardly causes interference can be employed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic plan view of a sheet sticking apparatus to which a sheet peeling apparatus according to the present invention is applied. In this figure, a sheet sticking apparatus 10 is an apparatus that uses a semiconductor wafer W as an adherend, and is configured as an apparatus for the sheet base material S shown in FIG. Here, as shown in FIG. 3 in which the sheet base material S is inverted upside down (front and back), the base sheet BS is continuous with a strip shape and the upper surface side (lower surface side in FIG. 3) is peeled off. The heat-sensitive adhesive die bonding sheet DS constituting the laminated sheet for sticking provided on one surface of the base sheet BS and the base sheet BS interacting with each other to sandwich the die bonding sheet DS, and the base The sheet BS is composed of a cover sheet PS made of substantially the same sheet. Here, in the die bonding sheet DS, a closed-loop pasting area A1 formed by cutting the die bonding sheet DS corresponding to the outer size of the wafer W is pasted on the wafer W and adjacent to the pasting area A1. A strip-shaped peeling region A2 formed by cutting the upstream region in the feeding direction is peeled off.

  As shown in FIGS. 1, 4 to 6, the sheet sticking device 10 positions the wafer W, the wafer W storage means 11, the transfer means 12 for taking out and transferring the wafers W one by one, and the wafer W. Alignment means 13, cutting means 15 for cutting the die bonding sheet DS, first peeling means 17 for peeling the peeling area A2 formed by this cutting, and affixing area A1 to the wafer W after alignment processing And a second peeling means 20 for peeling the base sheet BS from the sticking area A1 after sticking the sticking area A1 to the wafer W.

  As shown in FIG. 6, the storage means 11 includes two stages of upper and lower carriers 22, a drive motor 23 that moves the carriers 22 up and down, and a ball screw shaft 24. The carriers 22 are accommodated in multiple stages along the vertical direction in a state where a predetermined interval is formed between the wafers. The vertical position of the carrier 22 is provided so that it can be detected by a sensor (not shown), and the position, number of sheets, etc. of the wafer W can be detected.

  The conveying means 12 is constituted by a robot having an articulated arm 25. The robot body 26 is provided so that it can be moved up and down, and the arm 25 is provided so as to be rotatable in the horizontal direction, whereby the wafer W is taken out from the carrier 22 one by one, and the alignment means 13 is provided with the wafer W. Is moved between a position for transferring the image and a common processing position to be described later. Further, an adsorption hole 25A is provided on the tip side of the arm 25, and the wafer W is adsorbed and supported at the center position by the adsorption hole 25A. The arm 25 is configured to have a function of inverting the surface of the attracted wafer W.

  The alignment means 13 includes an alignment table 27 and a sensor 28. The alignment table 27 includes a rotating portion 27A that can rotate in a substantially horizontal plane, and the sensor 28 detects the position of the orientation flat W1 formed on the wafer W and positions the wafer W. .

  As shown in FIGS. 4 and 7, the cutting means 15 is located above the sheet base S that is fed to a substantially horizontal position, and the axial direction is the feeding direction of the sheet base S (the direction of arrow D in FIG. 4). A cutting force applying roller 29 arranged in substantially the same direction, a cutting table 30 arranged below the sheet substrate S, a cutting blade 31 provided on the upper surface side of the cutting table 30, and a cutting table And a drive device 32 (see FIG. 5) for moving the 30 up and down. The cutting force application roller 29 is supported by a cooling plate 105 described later. In this embodiment, a virtual vertical line C (see FIG. 4) passing through the approximate center of the cutting table 30 is set as a work center that is approximately the center of the common processing position. Further, the cutting means 15 is provided such that the position shown in FIG. 4 is a standby position, and the cutting means 15 is raised along the straight line C to a position directly below the sheet base material S.

  The cutting blade 31 includes a first cutting blade 31A provided in an endless shape (closed loop) corresponding to the outer shape of the wafer W, and the feeding direction D of the sheet base S from the first cutting blade 31A. The second cutting blade 31B that cuts the die bonding sheet DS in the width direction at a position away from the upstream side and the first cutting blade 31A are continuous to the second cutting blade 31B and downstream in the feeding direction. It consists of third cutting blades 31C and 31C that form a pair of left and right disposed substantially parallel to the second cutting blade 31B. The first cutting blade 31A is arranged such that a linear portion corresponding to the orientation flat W1 of the wafer W is positioned on the upstream side in the feeding direction D and extends in the width direction across the sheet base material S. Here, a pasting area A1 is formed by the first cutting blade 31A, a part including the straight portion of the first cutting blade 31A (a part on the upstream side in the feeding direction), and the second and third cutting blades. A separation region A2 is formed by 31B and 31C.

  As shown in FIG. 7B, the cutting blade 31 is provided in a shape in which the upper end portion is the apex of a substantially isosceles triangle in the cross-sectional shape, and the upper surface side of the cutting table 30 is etched. It is formed integrally with the cutting table 30 by processing. Therefore, as shown in FIG. 7C, even if the first cutting blade 31A has an endless shape, there is no seam seen when a single blade is bent into an endless shape. It becomes. In addition, the third cutting blades 31C and 31C are continuous with the first cutting blade 31A in a seamless state. In the present invention, by providing the third cutting blade 31C, the pasting area A1 is formed on the wafer W only by peeling the partially formed peeling area A2 without peeling the entire outer peripheral area except the pasting area A1. It can be pasted.

  The first peeling means 17 is a device for peeling the peeling area A2. As shown in FIGS. 1, 8, and 9, the first peeling means 17 includes a peeling head 33 that supports the peeling tape T so as to be able to rotate in the width direction across the feeding direction of the sheet substrate S. The peeling tape supply unit 34, the peeling tape winding unit 35, and the peeling head base 36 are configured. The peeling head 33 is arranged in a pair of front and rear in FIG. 9 so that the upper part is open and the case 37 is rotatably provided in the case 37 and the axial direction is along the feeding direction D of the sheet base material S. The upper guide rollers 38, 38, a bracket 39 positioned between the upper guide rollers 38, 38, a cylinder 40 that supports the bracket 39 so as to be movable up and down, and the inner side of the upper guide rollers 38, 38 are provided. And a pair of front and rear heat blocks 42, 42 that can be moved up and down together with the bracket 39. When the heat blocks 42, 42 are raised, they are hung between the upper guide rollers 38, 38. The surface position of the peeling tape T is raised, and the peeling tape T is brought into contact with the peeling area A2, so that the heat bonding portion 41 (FIG. 1) See) adapted to be formed in the width direction two places area of the sheet substrate S.

  The peeling tape supply unit 34 sandwiches the peeling tape T between the tape holding roller 44, the driving roller 45 provided between the tape holding roller 44 and the peeling head 33, and the driving roller 45. The pinch roller 46 and a motor M that applies a rotational driving force to the driving roller 45 are configured. On the other hand, the tape winding unit 35 includes a plurality of rollers 49 to 53 provided between a winding roller 48 that is rotationally driven in a winding direction by a motor (not shown) and an upper guide roller 38 of the peeling head 33. It is comprised by. Further, the peeling head base 36 includes a vertical elevating mechanism 57 including a guide rail 55 that guides the frame F that supports the tape holding roller 44 and the peeling head 33 in the vertical direction and a cylinder 56 that raises and lowers the frame F up and down. The uniaxial robot mechanism 58 moves the frame F in the front-rear direction (left-right direction in FIG. 8) and moves the peeling head 33 forward and backward with respect to the work center C.

  When the peeling head 33 is in a non-operating position, the die bonding sheet is positioned at a position lower than the surface of the die bonding sheet DS in the sheet base material S and waits backward to peel off the peeling area A2. It advances to the lower surface side of DS and raises the heat block 42 to the surface of peeling area A2.

  As shown in FIGS. 4 and 5, the sticking means 19 includes a feeding device 60 for the sheet base material S, a winding device 61 for winding the cover sheet PS of the sheet base material S, and a sticking for supporting the wafer W. The table 62 includes a pressing device 63 that presses the pasting area A1 of the die bonding sheet DS against the back surface of the wafer W.

  The feeding device 60 includes a support roller 65 that supports the sheet substrate S wound in a roll shape, an upstream drive roller 66 that imparts a feeding output to the sheet substrate S, and the drive roller 66. A pinch roller 67 that sandwiches the sheet substrate S therebetween, two guide rollers 68 and 69 disposed between the drive roller 66 and the support roller 65, and a sheet base disposed below the axial position of the pinch roller 67. The position adjustment roller 70 is configured to hold the material S at a preset height position. The cover sheet PS winding device 61 includes a winding roller 72, a winding drive roller 73, and two guide rollers 74 and 75. The sheet base S is peeled off at the position of the pinch roller 67 and wound around the winding roller 72 in a state where the cover sheet PS is peeled off. Accordingly, the sheet base material S that has passed through the position of the pinch roller 67 is fed out in the direction of passing through the work center C in a state of two layers of the base sheet BS and the die bonding sheet DS.

  10 and 11, the pasting table 62 includes a table main body 77, a cylinder 78 that moves the table main body 77 up and down, an intermediate table 79 that supports the cylinder 78, and the intermediate A base table 80 for supporting the table 79, guide rails 81 and 82 for moving the intermediate table 79 and the base table 80 along the feeding direction D of the sheet base S, and an intermediate table along the guide rails 81 and 82 79 and a cylinder device (not shown) for applying a driving force to the base table 80. Here, a heating device 84 is provided on the lower surface side of the table main body 77 as shown in FIG. The heating device 84 is a device that controls the table main body 77 to a predetermined temperature in order to attach the application region A1 to the wafer W, and the temperature can be arbitrarily variably set according to the characteristics of the die bonding sheet DS. It has become.

  As shown in FIG. 11, the table body 77 has a closed loop convex ring portion along the outer edge of the wafer W when the wafer W is supported so that the surface (circuit formation surface) of the table W is on the lower surface side. 86, and a concave space inside the convex ring portion 86 forms an adsorption space 87 for the wafer W. An adsorption hole 87A is formed at the bottom of the adsorption space 87, and the adsorption hole 87A is connected to a decompression pump (not shown). The table main body 77 in this embodiment is formed of an elastic member, for example, rubber, as a molding material, and the convex width W2 (see FIG. 11) of the convex ring portion 86 is set to about 2 mm. The wafer W can be sucked and supported in a state where the outer peripheral edge of the portion substantially coincides with the outer peripheral edge of the wafer W. Therefore, even if the bumps are formed on the surface of the wafer W up to the region near the outer peripheral edge of the wafer W, the wafer W can be supported without interfering with the bumps. In addition, the convex part height H of the convex ring part 86 is set to a height substantially corresponding to the height of the bump, and is set to about 0.45 mm in this embodiment. Therefore, when the wafer W is sucked and supported, the lower end of the bump is substantially in contact with the bottom of the sucking space 87, and even if the sucking force is applied, the elasticity of the table body 77 absorbs this, so There is no damage. The protrusion width W2 and the height H can be set according to the corresponding wafer W.

  As shown in FIGS. 4 and 5, the pressing device 63 that interacts with the sticking table 62 includes a fixing roller 89 and a press roller 90. The fixing roller 89 and the press roller 90 are positioned on the upper surface side of the base sheet BS and can be moved up and down. The press roller 90 is configured as a heater built-in type, and the length of the base sheet BS. It is provided so as to be movable along the direction (feeding direction D), and by this movement, affixing pressure can be applied while keeping the affixing area A1 at a predetermined temperature so that the affixing area A1 can be affixed to the surface of the wafer W. Yes.

  The second peeling means 20 includes a cooling device 93 that supports the cutting force imparting roller 29 described above, a peeling table 94 that is located below the sheet base material S below the cooling device 93, and a sheet base. A pair of peeling rollers 96, 97 for peeling the base sheet BS of the material S from the sticking area A1, a guide roller 98 for guiding the base sheet BS peeled by the peeling rollers 96, 97, and a driving roller rotated by the motor M1 99, a pinch roller 100 that sandwiches the sheet material S, a guide roller 101, and a winding roller 102 that winds up the base sheet BS. Here, the upstream side drive roller 66 and the downstream side drive roller 99 are controlled to keep the sheet base material S at a predetermined tension.

  The cooling device 93 functions as a temperature adjusting device that lowers the temperature relative to the temperature when the pasting area A1 is pasted on the wafer W. The cooling device 93 includes a cooling plate 105 whose lower surface is configured as an adsorption surface, and a temperature adjustment unit 106 provided on the cooling plate 105, and a rail 107 disposed behind the sheet base material S in the width direction. Is supported so as to be movable up and down via a lift cylinder 108 and is movable in the width direction of the sheet base S via a cylinder 109 disposed behind the rail 107. The cooling device 93 is provided so as to move up and down with the substantially center of the cooling plate 105 set on the work center C.

  As shown in FIG. 4, the peeling table 94 maintains a retracted position on the downstream side in the feeding direction of the sheet base material S when not operating, and moves until the center is located at the work center C when operating. It is provided as follows. The peeling table 94 is provided such that the upper surface side has substantially the same structure as the table main body 77 of the sticking table 62, and is configured to suck and support the wafer W positioned on the peeling table 94. In addition, the peeling table 94 is provided so that raising / lowering is possible via the raising / lowering mechanism 110, as FIG. 5 shows.

  The peeling rollers 96 and 97 are provided so as to be movable toward the upstream side in the feeding direction of the base sheet BS in a state in which the base sheet BS passes between them. In the adsorbed state, the peeling rollers 96 and 97 move to the right side in FIG. 12 so that the base sheet BS is peeled from the pasting area A1 while leaving the pasting area A1 on the surface of the wafer W, and the winding roller 99 sequentially. It is configured to wind up. At this time, the die bonding sheet DS is wound together with the base sheet BS except for the above-described peeling area A2 and the pasting area A1.

  Next, the overall operation of the sheet sticking apparatus 10 will be described with reference to FIGS.

  As an initial setting, the sheet substrate S is pulled out, the cover sheet PS is peeled off from the die bonding sheet DS, and the lead end of the cover sheet PS is fixed to the winding roller 72. Then, the lead end of the sheet base material S after the cover sheet PS is peeled off is fixed to the winding roller 102 constituting the second peeling means 20.

  Before starting the operation of the apparatus, the sticking table 62 and the peeling table 94 are in a standby position indicated by solid lines in FIG. 4, and the cooling device 93 is in a standby position above the sheet substrate S in the work center C and is cut. The table 30 of the means 15 is at the lower standby position of the sheet base material S in the work center C.

  When the power supply (not shown) is turned on, the transfer means 12 operates to suck and take out one wafer W from the carrier 22 of the storage means 11 and transfer it onto the alignment table 27. The alignment table 27 rotates the wafer W in a plane, detects the orientation flat W1 with the sensor 28, and determines the position or orientation of the wafer W.

  When the center of the table main body 77 in the pasting table 62 moves to the work center C, the aligned wafer W is transferred via the transfer means 12, and then the table main body 77 moves to the standby position, and the standby The wafer W is heated at the position for a predetermined time.

  As shown in FIG. 13, while the wafer W is being heated at the standby position, the table 30 of the cutting means 15 is raised, and the cutting blade 31 is placed on the lower surface of the sheet substrate S (die bonding sheet DS). It rises to the position where it touches. At the same time, the cooling device 93 moves forward via the cylinder 109, descends via the elevating cylinder 108, and the cutting force application roller 29 supported on the rear lower surface side of the cooling device 93 is placed on the upper surface of the sheet substrate S. Move to a position that touches the front edge of the side. In this state, when the entire cooling device 93 is moved rearward substantially horizontally by the cylinder 109, that is, when it is moved in the width direction crossing the feeding direction of the sheet base material S, the cutting blade 31 and the cutting force application roller 29 are moved. The sheet substrate S in the region sandwiched between the cutting blades is cut (half cut), and the cutting lines corresponding to the first to third cutting blades 31A, 31B, 31C constituting the cutting blade 31 are die bonding sheets. DS is formed (see FIG. 3). Thereby, in the area | region of die-bonding sheet | seat DS, the sticking area | region A1 corresponding to the planar shape of the wafer W and the strip | belt-shaped peeling area | region A2 adjacent to this back direction side of this are formed.

  When the cutting is completed, the cutting blade applying roller 29 returns to the initial standby position together with the cooling device 93, while the table 30 of the cutting means 15 also returns to the standby position.

  Next, as shown in FIGS. 14 to 17, the first peeling means 17 is actuated to move the peeling head 33 from the standby position directly below the peeling area A <b> 2, and the cooling plate 105 of the cooling device 93 is the base sheet. Adsorb the upper surface of BS. Then, the heat block 42 is raised and the peeling tape T is partially heated and bonded to the peeling area A2 of the die bonding sheet DS. After the peeling tape T is heated and bonded to the peeling area A2 in this way, the peeling head 33 descends and the peeling tape T is wound up, so that the sticking on the die bonding sheet DS is performed as shown in FIG. A certain amount of the rear area in the feeding direction adjacent to the area A1 is peeled off, and the peeling head 33 returns to the rear standby position after the peeling is finished.

  The wafer W heated in the standby position in the state where the peeling area A2 has been peeled off is transferred to the work center C position while being placed on the pasting table 62 as shown in FIG. When the table main body 77 is raised (see FIG. 18A), the fixing roller 89 and the press roller 90 constituting the pressing device 63 are lowered to the upper surface position of the base sheet BS (see FIG. 18B). The fixing roller 89 is fixed in a state where a downward pressing force is applied to the base sheet BS, while the press roller 90 moves downstream in the feeding direction while rotating (see FIG. 18C). After applying the pressing force to the base sheet BS and pasting the pasting area A1 on the surface of the wafer W, the base sheet BS slightly rises and returns to the upstream side in the feeding direction. The sheet base S during the pasting operation is controlled to be maintained at a predetermined tension by the upstream drive roller 66 and the downstream drive roller 99 described above.

  When the pasting area A1 is pasted, the cooling device 93 descends and sucks the wafer W with the sheet base material S interposed therebetween, and the table main body 77 releases the sucking and descends to return to the standby position. However, at this time, since the wafer W is bonded to the bonding area A1 of the die bonding sheet DS, the wafer W is left on the lower surface side of the die bonding sheet DS. The sheet S is cooled to the set temperature.

  Then, on the lower surface side of the wafer W adhered to the lower surface of the die bonding sheet DS and remaining on the work center, the peeling table 94 constituting the second peeling means 20 moves from the standby position to the work center C position and rises. To do. When the wafer W is adsorbed by the peeling table 94, the base sheet BS is peeled from the pasting area A1 while the peeling rollers 96 and 97 move toward the upstream side in the feeding direction of the base sheet BS, as shown in FIG. Then, the paper is sequentially taken up by the take-up roller 102-. At this time, in the die bonding sheet DS, the remaining area from which the pasting area A1 and the peeling area A2 are removed is wound together with the base sheet BS.

  Next, the transport unit 12 sucks the upper surface side of the wafer W, and stores the wafer W in the carrier 22 of the storage unit 11 while reversing the wafer W, and the series of steps of sheet pasting is completed.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, the first peeling means 17 is not limited to the illustrated configuration example, and it is sufficient if the peeling region A2 can be peeled off. Specifically, the peeling region A2 can be peeled off at an acute angle via a peel plate. Further, the length along the feeding direction of the peeling area A2 is the length from the middle along the feeding direction of the sticking area A1 to a position away from the rear end of the sticking area A1 by a predetermined distance upstream in the feeding direction. I just need it.

  Further, although the peeling area A2 is formed on the upstream side in the feeding direction of the pasting area A1, the press roller 90 moves from the downstream side in the feeding direction toward the upstream side to stick the pasting area A1 to the wafer W. The peeling region A2 is formed on the downstream side in the feeding direction. This is because if the die bonding sheet DS exists in the region surrounding the pasting start side of the pasting region A1, there is a strong tendency for re-adhesion to occur even if the cutting blade 31 is used for cutting. This is because the experiments revealed that the re-adhesion does not occur even if the die bonding sheet DS surrounding the pasting end side of the region A1 is not peeled off. As shown in FIG. 18B, such a tendency is that, in the initial stage of the sticking operation in which the press roller 90 is lowered, the upstream edge in the feeding direction of the wafer W and the sticking area A1 is in contact with each other. It is estimated that this is due to the relatively long time. That is, in the present invention, when the application is performed while applying a pressing force from one end side to the other end side of the wafer W along the surface of the application region A1, the separation region is provided in the region on the application start side of the pressing force. If A2 is formed and peeled off, the re-adhesion problem does not occur, and it is sufficient to peel off a minimum area.

  Moreover, in the said embodiment, although the to-be-adhered body was made into the wafer W, plate-shaped bodies other than a wafer can also be made into an to-be-adhered body.

  Further, the sheet substrate S is not limited to the one provided with the die bonding sheet DS, and may be any heat-sensitive adhesive sheet, for example, a heat-sensitive adhesive protective sheet for protecting the surface of the adherend. There may be. Moreover, the sheet | seat for protective film formation disclosed in Unexamined-Japanese-Patent No. 2002-280329, and a dry resist film may be sufficient.

The schematic plan view which shows the whole structure of the sheet sticking apparatus which concerns on this embodiment. Sectional drawing of a sheet | seat base material. The schematic perspective view which looked at the change of the processing state with respect to a sheet base material from the lower surface side. The schematic perspective view which shows the whole structure of the said apparatus. The schematic front view which follows the AA line of FIG. The schematic left view of FIG. (A) is a schematic perspective view which shows the table of a cutting | disconnection means, (B) is an expanded sectional view which follows the BB line of FIG.6 (C), (C) is a partial expanded plan view of FIG.6 (A). The schematic side view of a 1st peeling means. The principal part schematic plan view of a 1st peeling means. The schematic perspective view of the sticking table which comprises a sticking means. Operation | movement explanatory drawing which shows the state which affixes a die bonding sheet | seat on a wafer. Operation | movement explanatory drawing which shows the state which peels a base sheet. (A) thru | or (C) is operation | movement explanatory drawing which shows the state which cut | disconnects a die bonding sheet | seat. Operation | movement explanatory drawing which shows the initial stage which peels a peeling area | region. Operation | movement explanatory drawing which shows the state which heat-bonds the tape for peeling to the said peeling area | region. Operation | movement explanatory drawing which shows the state which peels the said peeling area | region. The top view which looked at the sheet base material after peeling the said peeling area | region from the lower surface side. Operation | movement explanatory drawing which shows the state which affixes a die bonding sheet | seat on a wafer in detail.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 17 1st peeling means 19 Sticking means 33 peeling head 42 Heat block A1 sticking area A2 peeling area W Semiconductor wafer (adherence body)
S sheet substrate T peeling tape BS base sheet DS die bonding sheet PS cover sheet

Claims (6)

Using a sheet base material including a laminated sheet for pasting provided on one side of a belt-like base sheet, the laminated sheet is cut into a planar shape of an adherend in the process of feeding out the sheet base material to form a pasting area In addition, in a sheet peeling apparatus including a peeling unit that forms a peeling area on the outer peripheral side of the pasting area and peels the peeling area from the base sheet.
The peeling area is an area adjacent to the upstream side or the downstream side along the feeding direction of the pasting area, and the peeling area is peeled off by the peeling means. The peeling means includes a peeling head that supports the peeling tape so as to be able to rotate in a width direction crossing a feeding direction of the sheet base material, and attaches the peeling tape to the peeling area to rotate the peeling tape. The sheet peeling apparatus according to claim 1, wherein the peeling region is peeled from the base sheet by causing the sheet peeling. The sheet peeling apparatus according to claim 2, wherein the peeling head further includes a heat block that can be moved up and down, and the peeling tape is thermally bonded to the peeling region by the heat block. 4. The sheet peeling apparatus according to claim 3, wherein the heat block is arranged at a plurality of locations along the width direction of the peeling area. The sheet peeling apparatus according to claim 1, 2, 3, or 4, wherein the laminated sheet is a heat-sensitive adhesive die bonding sheet attached to a semiconductor wafer. Using a sheet base material including a laminated sheet for pasting provided on one side of a belt-like base sheet, the laminated sheet is cut into a planar shape of an adherend in the process of feeding out the sheet base material to form a pasting area In the sheet peeling method of forming a peeling region on the outer peripheral side of the pasting region and peeling the peeling region from the base sheet,
Using the predetermined peeling tape, the peeling tape is thermally bonded to the peeling area,
Thereafter, the peeling region is peeled from the base sheet by winding up the peeling tape.

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