JP2005263987A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005263987A5 JP2005263987A5 JP2004078976A JP2004078976A JP2005263987A5 JP 2005263987 A5 JP2005263987 A5 JP 2005263987A5 JP 2004078976 A JP2004078976 A JP 2004078976A JP 2004078976 A JP2004078976 A JP 2004078976A JP 2005263987 A5 JP2005263987 A5 JP 2005263987A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- acrylic acid
- photosensitizer
- weight
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 12
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 10
- 239000003504 photosensitizing agent Substances 0.000 claims description 8
- -1 4,4′-diaminobenzophenone compound Chemical class 0.000 claims description 5
- 241001655798 Taku Species 0.000 claims description 4
- 239000007870 radical polymerization initiator Substances 0.000 claims description 4
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical class NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000000466 oxiranyl group Chemical group 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 125000001730 thiiranyl group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004078976A JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004078976A JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005263987A JP2005263987A (ja) | 2005-09-29 |
| JP2005263987A5 true JP2005263987A5 (OSRAM) | 2007-02-15 |
| JP4241452B2 JP4241452B2 (ja) | 2009-03-18 |
Family
ID=35088862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004078976A Expired - Lifetime JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4241452B2 (OSRAM) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007178473A (ja) * | 2005-12-27 | 2007-07-12 | Mitsui Chemicals Inc | 液晶滴下工法用シール剤およびそれを用いた液晶表示パネルの製造方法 |
| CN101914349B (zh) * | 2006-09-07 | 2014-03-19 | 三井化学株式会社 | 液晶密封剂、液晶显示面板的制造方法以及液晶显示面板 |
| WO2008029544A1 (fr) | 2006-09-08 | 2008-03-13 | Sharp Kabushiki Kaisha | Composant à semiconducteur, son procédé de fabrication et composant électronique |
| JP5522938B2 (ja) * | 2006-09-22 | 2014-06-18 | ヘンケル コーポレイション | 液晶ディスプレイパネルの製造方法 |
| JP5060544B2 (ja) * | 2007-02-20 | 2012-10-31 | 三井化学株式会社 | 液晶シール用硬化性樹脂組成物および、これを使用した液晶表示パネルの製造方法 |
| KR101109906B1 (ko) | 2007-02-20 | 2012-02-08 | 미쓰이 가가쿠 가부시키가이샤 | 액정 밀봉용 경화성 수지 조성물 및 이를 사용한 액정 표시 패널의 제조 방법 |
| JP2008231347A (ja) * | 2007-03-23 | 2008-10-02 | Jsr Corp | 硬化性組成物、液晶シール剤及び液晶表示素子 |
| JP5287012B2 (ja) * | 2008-02-25 | 2013-09-11 | Ｊｓｒ株式会社 | 硬化性組成物、液晶シール剤及び液晶表示素子 |
| JP2010181483A (ja) * | 2009-02-03 | 2010-08-19 | Citizen Finetech Miyota Co Ltd | 液晶表示装置 |
| JP5152868B2 (ja) * | 2009-06-11 | 2013-02-27 | 日本化薬株式会社 | 可視光硬化性液晶シール剤及びそれを用いた液晶表示セル |
| KR101845646B1 (ko) | 2010-12-09 | 2018-04-04 | 교리쯔 가가꾸 산교 가부시키가이샤 | 광 중합 개시제에 적합한 화합물, 광 중합 개시제 및 광경화성 수지 조성물 |
| CN104334344B (zh) * | 2012-01-13 | 2016-10-19 | 日本化药株式会社 | 光学构件及用于制造该光学构件的紫外线固化型胶粘剂 |
| KR102010799B1 (ko) * | 2012-01-13 | 2019-08-14 | 닛뽄 가야쿠 가부시키가이샤 | 광학 부재 및 그 제조에 사용하는 자외선 경화형 접착제 |
| JP5901741B2 (ja) | 2012-03-21 | 2016-04-13 | 日本化薬株式会社 | 光学部材及びその製造に用いる紫外線硬化型接着剤 |
| JP6639874B2 (ja) * | 2014-11-12 | 2020-02-05 | デクセリアルズ株式会社 | 光硬化系異方性導電接着剤、接続体の製造方法及び電子部品の接続方法 |
| CN109642145B (zh) * | 2016-08-26 | 2022-01-07 | 夏普株式会社 | 密封材料组成物、液晶单元以及液晶单元的制造方法 |
| WO2018038016A1 (ja) * | 2016-08-26 | 2018-03-01 | シャープ株式会社 | シール材組成物、液晶セル、及び液晶セルの製造方法 |
| WO2018225543A1 (ja) * | 2017-06-06 | 2018-12-13 | 日本化薬株式会社 | 化合物及びそれを用いた光硬化性組成物 |
-
2004
- 2004-03-18 JP JP2004078976A patent/JP4241452B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005263987A5 (OSRAM) | ||
| TWI672335B (zh) | 樹脂組成物、接著劑及密封劑 | |
| JP5886758B2 (ja) | 光重合開始剤に適した化合物、光重合開始剤及び光硬化性樹脂組成物 | |
| JP2009051954A (ja) | 光および加熱硬化性組成物とその硬化物 | |
| KR102469861B1 (ko) | 메르캅토-관능 규소화합물을 포함하는 반응성 조성물 | |
| TWI808784B (zh) | 樹脂組成物、接著劑、密封劑、壩劑（ｄａｍ ａｇｅｎｔ）及半導體裝置 | |
| WO2002092718A1 (fr) | Composition de resine durcissable, mastics et matieres pour soudage en bout destines aux afficheurs | |
| JP2005320418A (ja) | 紫外線硬化型オルガノポリシロキサン組成物 | |
| TW201927735A (zh) | 含有不飽和雙鍵之化合物、使用其之氧吸收劑、及樹脂組成物 | |
| JP6015667B2 (ja) | 二液型硬化性樹脂組成物 | |
| BRPI0510524A (pt) | composição de resina de michael curável por uv, para um substrato plástico, método de usar a mesma, substrato, e, dispositivo | |
| JP7266881B2 (ja) | 光硬化性および熱硬化性を有する樹脂組成物およびその硬化物、接着剤、半導体装置、ならびに電子部品 | |
| EP3187514B1 (en) | Polymerizable monomer, curable composition and resin member | |
| CN104870503A (zh) | 双组分固化性树脂组合物 | |
| JPH10147745A (ja) | 光及び熱硬化性組成物 | |
| JP6467946B2 (ja) | 硬化性樹脂組成物 | |
| KR20090072957A (ko) | 경화성 조성물, 액정 표시 소자용 밀봉제 및 액정 표시 소자 | |
| JP2021018431A (ja) | 液晶シール剤用組成物及びその利用 | |
| GB2500029A (en) | Dual UV/heat curable epoxy compositions | |
| JP2010053330A (ja) | 硬化性組成物、液晶シール剤及び液晶表示素子 | |
| JP6672789B2 (ja) | 光硬化性組成物 | |
| JP6902198B2 (ja) | 嫌気硬化性組成物 | |
| KR102821975B1 (ko) | 접착제 조성물, 광학 부품, 전자 부품, 및 전자 모듈 | |
| JP7649113B2 (ja) | 接着剤組成物、光学部品、電子部品、及び、電子モジュール | |
| KR100990015B1 (ko) | 액정 표시 소자용 밀봉제 및 액정 표시 소자 |