JP2005251803A5 - - Google Patents

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Publication number
JP2005251803A5
JP2005251803A5 JP2004056618A JP2004056618A JP2005251803A5 JP 2005251803 A5 JP2005251803 A5 JP 2005251803A5 JP 2004056618 A JP2004056618 A JP 2004056618A JP 2004056618 A JP2004056618 A JP 2004056618A JP 2005251803 A5 JP2005251803 A5 JP 2005251803A5
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JP
Japan
Prior art keywords
plasma processing
processing apparatus
perforated plate
plasma
active species
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004056618A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005251803A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004056618A priority Critical patent/JP2005251803A/ja
Priority claimed from JP2004056618A external-priority patent/JP2005251803A/ja
Priority to TW094105927A priority patent/TWI257130B/zh
Priority to US11/064,975 priority patent/US20050194097A1/en
Priority to KR1020050016322A priority patent/KR100712172B1/ko
Priority to CN2005100518242A priority patent/CN100407380C/zh
Publication of JP2005251803A publication Critical patent/JP2005251803A/ja
Publication of JP2005251803A5 publication Critical patent/JP2005251803A5/ja
Withdrawn legal-status Critical Current

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JP2004056618A 2004-03-01 2004-03-01 プラズマ処理装置およびその設計方法 Withdrawn JP2005251803A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004056618A JP2005251803A (ja) 2004-03-01 2004-03-01 プラズマ処理装置およびその設計方法
TW094105927A TWI257130B (en) 2004-03-01 2005-02-25 Plasma processing apparatus and method of designing the same
US11/064,975 US20050194097A1 (en) 2004-03-01 2005-02-25 Plasma processing apparatus and method of designing the same
KR1020050016322A KR100712172B1 (ko) 2004-03-01 2005-02-28 플라스마 처리장치 및 그의 설계방법
CN2005100518242A CN100407380C (zh) 2004-03-01 2005-03-01 等离子体处理设备以及设计等离子体处理设备的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004056618A JP2005251803A (ja) 2004-03-01 2004-03-01 プラズマ処理装置およびその設計方法

Publications (2)

Publication Number Publication Date
JP2005251803A JP2005251803A (ja) 2005-09-15
JP2005251803A5 true JP2005251803A5 (fr) 2007-04-19

Family

ID=34908925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004056618A Withdrawn JP2005251803A (ja) 2004-03-01 2004-03-01 プラズマ処理装置およびその設計方法

Country Status (5)

Country Link
US (1) US20050194097A1 (fr)
JP (1) JP2005251803A (fr)
KR (1) KR100712172B1 (fr)
CN (1) CN100407380C (fr)
TW (1) TWI257130B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088199A (ja) * 2005-09-22 2007-04-05 Canon Inc 処理装置
CN100405537C (zh) * 2005-12-07 2008-07-23 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体反应装置
EP2044608B1 (fr) 2006-07-20 2012-05-02 SPP Process Technology Systems UK Limited Sources d'ions
JP2009545101A (ja) * 2006-07-20 2009-12-17 アビザ テクノロジー リミティド プラズマ源
US8425741B2 (en) * 2006-07-20 2013-04-23 Aviza Technology Limited Ion deposition apparatus having rotatable carousel for supporting a plurality of targets
GB0616131D0 (en) * 2006-08-14 2006-09-20 Oxford Instr Plasma Technology Surface processing apparatus
KR101682155B1 (ko) * 2015-04-20 2016-12-02 주식회사 유진테크 기판 처리 장치
JP7097809B2 (ja) * 2018-12-28 2022-07-08 東京エレクトロン株式会社 ガス導入構造、処理装置及び処理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01149964A (ja) * 1987-12-04 1989-06-13 Furukawa Electric Co Ltd:The プラズマｃｖｄ装置用シャワー電極
JPH07101685B2 (ja) * 1989-01-26 1995-11-01 富士通株式会社 マイクロ波プラズマ処理装置
US5487875A (en) * 1991-11-05 1996-01-30 Canon Kabushiki Kaisha Microwave introducing device provided with an endless circular waveguide and plasma treating apparatus provided with said device
JP2886752B2 (ja) * 1991-11-05 1999-04-26 キヤノン株式会社 無端環状導波管を有するマイクロ波導入装置及び該装置を備えたプラズマ処理装置
JPH06204181A (ja) * 1992-12-29 1994-07-22 Ibiden Co Ltd プラズマエッチング用電極板
JPH0845910A (ja) * 1994-07-29 1996-02-16 Nippon Steel Corp プラズマ処理装置
US5891350A (en) * 1994-12-15 1999-04-06 Applied Materials, Inc. Adjusting DC bias voltage in plasma chambers
US5976261A (en) * 1996-07-11 1999-11-02 Cvc Products, Inc. Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment
JPH11350143A (ja) * 1998-06-02 1999-12-21 Toshiba Corp 成膜装置
JP2000058294A (ja) * 1998-08-07 2000-02-25 Furontekku:Kk プラズマ処理装置
US6331754B1 (en) * 1999-05-13 2001-12-18 Tokyo Electron Limited Inductively-coupled-plasma-processing apparatus
JP2001023955A (ja) * 1999-07-07 2001-01-26 Mitsubishi Electric Corp プラズマ処理装置
JP3889280B2 (ja) 2002-01-07 2007-03-07 忠弘 大見 プラズマ処理装置

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