JP2005229098A5 - - Google Patents

Download PDF

Info

Publication number
JP2005229098A5
JP2005229098A5 JP2004345436A JP2004345436A JP2005229098A5 JP 2005229098 A5 JP2005229098 A5 JP 2005229098A5 JP 2004345436 A JP2004345436 A JP 2004345436A JP 2004345436 A JP2004345436 A JP 2004345436A JP 2005229098 A5 JP2005229098 A5 JP 2005229098A5
Authority
JP
Japan
Prior art keywords
antenna
substrate
thin film
integrated circuit
film integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004345436A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005229098A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004345436A priority Critical patent/JP2005229098A/ja
Priority claimed from JP2004345436A external-priority patent/JP2005229098A/ja
Publication of JP2005229098A publication Critical patent/JP2005229098A/ja
Publication of JP2005229098A5 publication Critical patent/JP2005229098A5/ja
Withdrawn legal-status Critical Current

Links

JP2004345436A 2003-12-12 2004-11-30 半導体装置及び半導体装置の作製方法 Withdrawn JP2005229098A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004345436A JP2005229098A (ja) 2003-12-12 2004-11-30 半導体装置及び半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003414848 2003-12-12
JP2004009529 2004-01-16
JP2004345436A JP2005229098A (ja) 2003-12-12 2004-11-30 半導体装置及び半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012125846A Division JP2012212893A (ja) 2003-12-12 2012-06-01 半導体装置および無線タグ

Publications (2)

Publication Number Publication Date
JP2005229098A JP2005229098A (ja) 2005-08-25
JP2005229098A5 true JP2005229098A5 (zh) 2007-12-06

Family

ID=35003515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004345436A Withdrawn JP2005229098A (ja) 2003-12-12 2004-11-30 半導体装置及び半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP2005229098A (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7768405B2 (en) * 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
JP5121183B2 (ja) * 2005-08-31 2013-01-16 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
WO2007063786A1 (en) 2005-11-29 2007-06-07 Semiconductor Energy Laboratory Co., Ltd. Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
KR101319468B1 (ko) 2005-12-02 2013-10-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법
JP5132135B2 (ja) * 2005-12-02 2013-01-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
BRPI0710714A2 (pt) * 2006-04-28 2011-08-23 Ask Sa suporte de dispositivo de identificação por radiofrequência, livrete de identidade, processos de fabricação de um suporte de dispositivo de identificação por radiofrequência, de fabricação de um suporte de dispositivo de identificação por radiofrequência e de fabricação de um livrete de identidade, dispositivo rfid, e, cartão com chip
JP5023640B2 (ja) * 2006-09-27 2012-09-12 富士ゼロックス株式会社 接続構造、画像表示装置及び画像表示システム
EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2019425A1 (en) 2007-07-27 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5248240B2 (ja) 2007-08-30 2013-07-31 株式会社半導体エネルギー研究所 半導体装置
JP4524719B2 (ja) * 2008-10-17 2010-08-18 コニカミノルタエムジー株式会社 アレイ型超音波振動子
JP5457741B2 (ja) 2009-07-01 2014-04-02 富士通株式会社 Ｒｆｉｄタグ
JP2011221006A (ja) * 2010-03-23 2011-11-04 Tokyo Electron Ltd ウェハ型温度検知センサおよびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
JP2970411B2 (ja) * 1993-08-04 1999-11-02 株式会社日立製作所 半導体装置
JPH11167612A (ja) * 1997-12-02 1999-06-22 Hitachi Ltd 無線ｉｃカード
JP2000020665A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
JP4244446B2 (ja) * 1999-06-09 2009-03-25 コニカミノルタホールディングス株式会社 情報表示装置及びその駆動方法
US6478229B1 (en) * 2000-03-14 2002-11-12 Harvey Epstein Packaging tape with radio frequency identification technology
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード
JP2003142666A (ja) * 2001-07-24 2003-05-16 Seiko Epson Corp 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、ｉｃカード、及び電子機器
JP4682478B2 (ja) * 2001-08-07 2011-05-11 株式会社デンソー 非接触型ｉｃカードの通信システム，ｉｃカード及びｉｃカードリーダ
JP2003123047A (ja) * 2001-10-15 2003-04-25 Sharp Corp 半導体装置及びその製造方法
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP3927829B2 (ja) * 2002-01-30 2007-06-13 トッパン・フォームズ株式会社 導電回路を有する情報隠蔽用シート
JP4118706B2 (ja) * 2003-02-25 2008-07-16 株式会社半導体エネルギー研究所 液晶表示装置の作製方法

Similar Documents

Publication Publication Date Title
JP2005229098A5 (zh)
JP2008046649A5 (zh)
TW200615625A (en) Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
TW200612230A (en) Flat display panel and assembly process thereof
US10903127B2 (en) Film for a package substrate
JP2017129982A5 (zh)
JP2008242499A5 (zh)
JP2003107520A5 (zh)
RU2009143007A (ru) Дисплей
EP4235768A3 (en) Integrated structures with antenna elements and ic chips employing edge contact connections
SG170099A1 (en) Integrated circuit package system with warp-free chip
TW200915946A (en) COF package and tape substrate used therein
JP2016018002A (ja) 液晶表示装置の導電テープ取付構造、液晶表示装置及びその製造方法
TW200603352A (en) Semiconductor device
JP2005252243A5 (zh)
DK1775769T3 (da) Effekthalvledermodul
JP6434274B2 (ja) 半導体装置
CN107197595A (zh) 一种印制电路板及其焊接设计
TW200723495A (en) Chip package structure
TW200636939A (en) Semiconductor device package, method of manufacturing the same, and semiconductor device
TWI257023B (en) Liquid crystal display device
JP2002311451A (ja) 電極駆動装置及び電子機器
CN105611714B (zh) 柔性印刷电路板及显示装置
JP2005268282A (ja) 半導体チップの実装体及びこれを用いた表示装置
JP2009117501A5 (zh)