JP2005223310A - 低蒸気圧化学物質用のパージ可能なコンテナ - Google Patents
低蒸気圧化学物質用のパージ可能なコンテナ Download PDFInfo
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- JP2005223310A JP2005223310A JP2004277751A JP2004277751A JP2005223310A JP 2005223310 A JP2005223310 A JP 2005223310A JP 2004277751 A JP2004277751 A JP 2004277751A JP 2004277751 A JP2004277751 A JP 2004277751A JP 2005223310 A JP2005223310 A JP 2005223310A
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- MNWRORMXBIWXCI-UHFFFAOYSA-N tetrakis(dimethylamido)titanium Chemical compound CN(C)[Ti](N(C)C)(N(C)C)N(C)C MNWRORMXBIWXCI-UHFFFAOYSA-N 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 14
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- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
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- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
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- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- QAMFBRUWYYMMGJ-UHFFFAOYSA-N hexafluoroacetylacetone Chemical compound FC(F)(F)C(=O)CC(=O)C(F)(F)F QAMFBRUWYYMMGJ-UHFFFAOYSA-N 0.000 description 1
- NDJGGFVLWCNXSH-UHFFFAOYSA-N hydroxy(trimethoxy)silane Chemical compound CO[Si](O)(OC)OC NDJGGFVLWCNXSH-UHFFFAOYSA-N 0.000 description 1
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- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- OGHBATFHNDZKSO-UHFFFAOYSA-N propan-2-olate Chemical compound CC(C)[O-] OGHBATFHNDZKSO-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- YZYKZHPNRDIPFA-UHFFFAOYSA-N tris(trimethylsilyl) borate Chemical compound C[Si](C)(C)OB(O[Si](C)(C)C)O[Si](C)(C)C YZYKZHPNRDIPFA-UHFFFAOYSA-N 0.000 description 1
- QJMMCGKXBZVAEI-UHFFFAOYSA-N tris(trimethylsilyl) phosphate Chemical compound C[Si](C)(C)OP(=O)(O[Si](C)(C)C)O[Si](C)(C)C QJMMCGKXBZVAEI-UHFFFAOYSA-N 0.000 description 1
- -1 vent exhaust Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C13/00—Details of vessels or of the filling or discharging of vessels
- F17C13/04—Arrangement or mounting of valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4402—Reduction of impurities in the source gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2221/00—Handled fluid, in particular type of fluid
- F17C2221/05—Ultrapure fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
- F17C2223/0146—Two-phase
- F17C2223/0153—Liquefied gas, e.g. LPG, GPL
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/03—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the pressure level
- F17C2223/033—Small pressure, e.g. for liquefied gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/04—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by other properties of handled fluid before transfer
- F17C2223/042—Localisation of the removal point
- F17C2223/043—Localisation of the removal point in the gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/04—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by other properties of handled fluid before transfer
- F17C2223/042—Localisation of the removal point
- F17C2223/046—Localisation of the removal point in the liquid
- F17C2223/047—Localisation of the removal point in the liquid with a dip tube
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
- F17C2227/04—Methods for emptying or filling
- F17C2227/044—Methods for emptying or filling by purging
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2260/00—Purposes of gas storage and gas handling
- F17C2260/04—Reducing risks and environmental impact
- F17C2260/044—Avoiding pollution or contamination
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2270/00—Applications
- F17C2270/05—Applications for industrial use
- F17C2270/0518—Semiconductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2931—Diverse fluid containing pressure systems
- Y10T137/3115—Gas pressure storage over or displacement of liquid
- Y10T137/3127—With gas maintenance or application
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Valve Housings (AREA)
- Multiple-Way Valves (AREA)
- Packages (AREA)
Abstract
【解決手段】二つの口と、2つのダイヤフラム弁を有する第1の締切り弁であって、各弁が弁座側とダイヤフラム側を有し、各弁座側が他方の弁座側に面し、そして分配導管の第1の端部に接続されていて、一方のダイヤフラム側は第1の口に接続され、他方のダイヤフラム側はベント又は真空に接続されている第1の締切り弁と、プッシュガス導管及び第2の口に接続されている第2の弁とを有するコンテナ。
【選択図】 図1A
Description
11、13 コンテナ10の口
14、20 ダイヤフラム締切り弁アセンブリ
15 浸漬管
24、116 デッドスペースの少ないコネクタ
75、77、85、87、114、120、124 ダイヤフラム弁
Claims (10)
- 高純度化学物質の送給装置のための低蒸気圧、高純度の化学物質用のパージ可能なコンテナであって、
(a)当該低蒸気圧、高純度の化学物質を受け入れ又は分配することができる少なくとも2つの口(11、13)を有する、所定量の当該低蒸気圧、高純度化学物質を収容するためのコンテナ(10)、
(b)第1(75)及び第2(77)のダイヤフラム弁を有する第1のダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラム(74a)を有し且つ弁座側(78a)とダイヤフラム側(88)とを有し、各ダイヤフラム弁(75)の弁座側(78a)は他方のダイヤフラム(74)の他方の弁座側(78)と並べて配置され、また各ダイヤフラム弁(75、77)の各弁座側は低蒸気圧、高純度の化学物質を当該高純度化学物質送給装置の導管(16)と連通させるよう配置されていて、そして当該第1のダイヤフラム弁(75)の当該ダイヤフラム側(88)は当該少なくとも2つの口のうちの第1のもの(13)に連通し、当該第2のダイヤフラム弁(77)の当該ダイヤフラム側は、真空源、又はベント源からなる群より選ばれる機能を果たすことができる導管(18)に連通するよう配置されている、第1のダイヤフラム締切り弁アセンブル(14)、
(c)プッシュガス源、真空源、低蒸気圧、高純度化学物質の分配からなる群より選ばれる機能を果たすことができる導管(118)に連通する第2の弁手段(114)、及び、
(d)当該コンテナ(10)に連通しており、且つ、当該コンテナ(10)に対する真空源、当該コンテナ(10)へのプッシュガスの送給、及び当該コンテナ(10)からのプッシュガスでの低蒸気圧、高純度の化学物質の分配からなる群より選ばれる機能を果たすことができる、上記第2の口(11)、
を含む、低蒸気圧、高純度化学物質用のパージ可能なコンテナ(10)。 - 前記第2のダイヤフラム弁の前記弁座側が、濡れた表面から残留する低揮発性化学物質を当該コンテナの口又はベント/真空口を通しベント又は真空へパージするのに使用される高圧パージガスの源のための導管に連通する、請求項1記載のコンテナ。
- 前記第2の弁手段(114)が真空源(122)のための導管(118)に連通する、請求項2記載のコンテナ。
- 前記第2の弁手段(114)が低蒸気圧、高純度の化学物質の分配のための導管(118)に連通する、請求項1記載のコンテナ。
- 前記第2のダイヤフラム弁(77)の前記ダイヤフラム側が真空源のための導管(18)に連通する、請求項1記載のコンテナ。
- 前記第2のダイヤラム弁(77)の前記ダイヤフラム側がベント源のための導管(18)に連通する、請求項1記載のコンテナ。
- 前記第二の弁手段(114)がパージガスのための導管(126)に連通する、請求項5記載のコンテナ。
- 高純度化学物質の送給装置のための低蒸気圧、高純度の化学物質用のパージ可能なコンテナであって、
(a)当該低蒸気圧、高純度の化学物質を受け入れ又は分配することができる少なくとも2つの口(410、412)を有する、所定量の当該低蒸気圧、高純度化学物質を収容するためのコンテナ(400)、
(b)第1(MV3)及び第2(AV4)のダイヤフラム弁を有する第1のダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラムを有し且つ弁座側とダイヤフラム側とを有し、各ダイヤフラム弁の弁座側は他方のダイヤフラム弁の他方の弁座側と並べて配置され、また各ダイヤフラム弁の各弁座側は低蒸気圧、高純度の化学物質を当該高純度化学物質送給装置の導管と連通させるよう配置されていて、そして当該第1のダイヤフラム弁(MV3)の当該ダイヤフラム側は当該少なくとも2つの口のうちの第1のもの(412)に連通し、当該第2のダイヤフラム弁(AV4)の当該ダイヤフラム側は、真空源、又はベント源からなる群より選ばれる機能を果たすことができる導管(434)に連通するよう配置されている、第1のダイヤフラム締切り弁アセンブル(442)、
(c)2つのダイヤフラム弁(MV1、AV2)を有するもう一つのダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラムを有し且つ弁座側とダイヤフラム側とを有し、各ダイヤフラム弁の弁座側は他方のダイヤフラム弁の他方の弁座側と並べて配置され、また各ダイヤフラム弁の各弁座側は第2の導管と連通しており、そして当該2つのダイヤフラム弁のうちの一方のもの(MV1)の当該ダイヤフラム側は当該少なくとも2つの口のうちの第2のもの(410)に連通し、当該2つのダイヤフラム弁のうちの他方のもの(AV2)の当該ダイヤフラム側は真空源、又はベント源からなる群より選ばれる機能を果たすことができる導管(434)に連通している、もう一つのダイヤフラム締切り弁アセンブリ(418)、及び、
(d)当該コンテナ(400)に連通しており、且つ、当該第1のコンテナへのプッシュガスの送給、真空源、及び当該コンテナ(400)からのプッシュガスでの低蒸気圧、高純度の化学物質の分配からなる群より選ばれる機能を果たすことができる、上記第二の口(410)、
を含む、低蒸気圧、高純度化学物質用のパージ可能なコンテナ(400)。 - 高純度化学物質の送給装置のための低蒸気圧、高純度の化学物質用のパージ可能なコンテナであって、
(a)当該低蒸気圧、高純度の化学物質をそれぞれ受け入れ及び分配することができる少なくとも2つの口(410、412)を有する、所定量の当該低蒸気圧、高純度化学物質を収容するためのコンテナ(400)、
(b)第1(MV3)及び第2(AV4)のダイヤフラム弁を有する第1のダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラムを有し且つ弁座側とダイヤフラム側とを有し、各ダイヤフラム弁の弁座側は他方のダイヤフラム弁の他方の弁座側と並べて配置され、また各ダイヤフラム弁の各弁座側は低蒸気圧、高純度の化学物質を当該高純度化学物質送給装置の分配導管(446)と連通させるよう配置されていて、そして当該第1のダイヤフラム弁(MV3)の当該ダイヤフラム側は当該少なくとも2つの口のうちの第1のもの(412)及び浸漬管(414)に連通し、当該第2のダイヤフラム弁(AV4)の当該ダイヤフラム側は、ベント又は真空源の機能を果たすことができる導管(434)に連通するよう配置されている、第1のダイヤフラム締切り弁アセンブル(442)、
(c)プッシュガス源及び/又は真空源に連通するよう配置されている第2の弁手段(418)、及び、
(d)当該コンテナ(400)に連通しており、且つ、当該コンテナ(400)へプッシュガスを送給し及び/又はそれに真空を適用することができる、上記第二の口(410)、
を含む、低蒸気圧、高純度化学物質用のパージ可能なコンテナ(400)。 - 高純度化学物質の送給装置のための低蒸気圧、高純度の化学物質用のパージ可能なコンテナであって、
(a)当該低蒸気圧、高純度の化学物質をそれぞれ受け入れ及び分配することができる少なくとも2つの口(410、412)を有する、所定量の当該低蒸気圧、高純度化学物質を収容するためのコンテナ(400)、
(b)第1(MV3)及び第2(AV4)のダイヤフラム弁を有する第1のダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラムを有し且つ弁座側とダイヤフラム側とを有し、各ダイヤフラム弁の弁座側は他方のダイヤフラム弁の他方の弁座側と並べて配置され、また各ダイヤフラム弁の各弁座側はバブリングガスのための導管(446)と連通するよう配置されていて、そして当該第1のダイヤフラム弁の当該ダイヤフラム側は当該少なくとも2つの口のうちの第1のもの(412)に連通しており、当該第2のダイヤフラム弁(AV4)の当該ダイヤフラム側はベント又は真空源(434)に連通するよう配置されている、第1のダイヤフラム締切り弁アセンブル(442)、
(c)2つのダイヤフラム弁(MV1、AV2)を有するもう一つのダイヤフラム締切り弁アセンブリであって、各ダイヤフラム弁がダイヤフラムを有し且つ弁座側とダイヤフラム側とを有し、各ダイヤフラム弁の弁座側は他方のダイヤフラム弁の他方の弁座側と並べて配置され、また各ダイヤフラム弁の各弁座側は第2の導管と連通するように配置されており、そして当該2つのダイヤフラム弁のうちの一方のもの(MV1)の当該ダイヤフラム側は当該少なくとも2つの口のうちの第2のもの(410)に連通しており、当該2つのダイヤフラム弁のうちの他方のもの(AV2)の当該ダイヤフラム側はベント又は真空源(434)と連通するよう配置されている、もう一つのダイヤフラム締切り弁アセンブリ(418)、及び、
(d)当該コンテナ(400)に連通しており、且つ、当該コンテナ(400)からプッシュガスでもって低蒸気圧、高純度の化学物質を分配することができる、上記第二の口(410)、
を含む、低蒸気圧、高純度化学物質用のパージ可能なコンテナ(400)。
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US10/669,942 US6966348B2 (en) | 2002-05-23 | 2003-09-24 | Purgeable container for low vapor pressure chemicals |
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US (1) | US6966348B2 (ja) |
EP (1) | EP1519101B1 (ja) |
JP (1) | JP4246680B2 (ja) |
KR (1) | KR100638697B1 (ja) |
CN (1) | CN100415587C (ja) |
SG (1) | SG110186A1 (ja) |
TW (1) | TWI257461B (ja) |
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- 2004-09-21 TW TW93128626A patent/TWI257461B/zh active
- 2004-09-21 EP EP20040022387 patent/EP1519101B1/en not_active Expired - Lifetime
- 2004-09-24 JP JP2004277751A patent/JP4246680B2/ja not_active Expired - Fee Related
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JP2009519596A (ja) * | 2005-12-13 | 2009-05-14 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 低蒸気圧の前駆体のための溶媒としてのアルキルシラン |
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CN1618682A (zh) | 2005-05-25 |
EP1519101A2 (en) | 2005-03-30 |
KR20050030235A (ko) | 2005-03-29 |
EP1519101A3 (en) | 2007-02-21 |
SG110186A1 (en) | 2005-04-28 |
US6966348B2 (en) | 2005-11-22 |
JP4246680B2 (ja) | 2009-04-02 |
TW200519315A (en) | 2005-06-16 |
TWI257461B (en) | 2006-07-01 |
US20050051234A1 (en) | 2005-03-10 |
EP1519101B1 (en) | 2014-12-03 |
CN100415587C (zh) | 2008-09-03 |
KR100638697B1 (ko) | 2006-10-30 |
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