JP2005209645A5 - - Google Patents

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Publication number
JP2005209645A5
JP2005209645A5 JP2004376827A JP2004376827A JP2005209645A5 JP 2005209645 A5 JP2005209645 A5 JP 2005209645A5 JP 2004376827 A JP2004376827 A JP 2004376827A JP 2004376827 A JP2004376827 A JP 2004376827A JP 2005209645 A5 JP2005209645 A5 JP 2005209645A5
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JP
Japan
Prior art keywords
electron beam
sample
optical system
sample surface
observation
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JP2004376827A
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English (en)
Japanese (ja)
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JP4384022B2 (ja
JP2005209645A (ja
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Priority to JP2004376827A priority Critical patent/JP4384022B2/ja
Priority claimed from JP2004376827A external-priority patent/JP4384022B2/ja
Publication of JP2005209645A publication Critical patent/JP2005209645A/ja
Publication of JP2005209645A5 publication Critical patent/JP2005209645A5/ja
Application granted granted Critical
Publication of JP4384022B2 publication Critical patent/JP4384022B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004376827A 2003-12-25 2004-12-27 詳細観察の機能を備えた電子線装置、及びその電子線装置による試料の検査並びに試料観察方法 Expired - Lifetime JP4384022B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004376827A JP4384022B2 (ja) 2003-12-25 2004-12-27 詳細観察の機能を備えた電子線装置、及びその電子線装置による試料の検査並びに試料観察方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003429926 2003-12-25
JP2004376827A JP4384022B2 (ja) 2003-12-25 2004-12-27 詳細観察の機能を備えた電子線装置、及びその電子線装置による試料の検査並びに試料観察方法

Publications (3)

Publication Number Publication Date
JP2005209645A JP2005209645A (ja) 2005-08-04
JP2005209645A5 true JP2005209645A5 (enrdf_load_stackoverflow) 2007-04-26
JP4384022B2 JP4384022B2 (ja) 2009-12-16

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ID=34914124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004376827A Expired - Lifetime JP4384022B2 (ja) 2003-12-25 2004-12-27 詳細観察の機能を備えた電子線装置、及びその電子線装置による試料の検査並びに試料観察方法

Country Status (1)

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JP (1) JP4384022B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4603448B2 (ja) * 2005-08-31 2010-12-22 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
JP2007087639A (ja) * 2005-09-20 2007-04-05 Ebara Corp 電子線装置及びパターン評価方法
JP2007248360A (ja) * 2006-03-17 2007-09-27 Jeol Ltd 荷電粒子ビーム検査方法および装置
JP5525128B2 (ja) * 2007-11-29 2014-06-18 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置及び試料観察方法
WO2009152046A1 (en) 2008-06-11 2009-12-17 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof

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