JP2005183904A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005183904A5 JP2005183904A5 JP2004096963A JP2004096963A JP2005183904A5 JP 2005183904 A5 JP2005183904 A5 JP 2005183904A5 JP 2004096963 A JP2004096963 A JP 2004096963A JP 2004096963 A JP2004096963 A JP 2004096963A JP 2005183904 A5 JP2005183904 A5 JP 2005183904A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53226403P | 2003-12-22 | 2003-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005183904A JP2005183904A (ja) | 2005-07-07 |
| JP2005183904A5 true JP2005183904A5 (enExample) | 2007-05-10 |
Family
ID=34794223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004096963A Pending JP2005183904A (ja) | 2003-12-22 | 2004-03-29 | 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050133572A1 (enExample) |
| JP (1) | JP2005183904A (enExample) |
| KR (1) | KR20050063689A (enExample) |
| CN (1) | CN100469222C (enExample) |
| TW (1) | TWI254392B (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004031034A1 (de) * | 2003-06-25 | 2005-02-10 | Behr Gmbh & Co. Kg | Flussmittel zum Löten von Metallbauteilen |
| JP4069867B2 (ja) * | 2004-01-05 | 2008-04-02 | セイコーエプソン株式会社 | 部材の接合方法 |
| US20060196579A1 (en) * | 2005-03-07 | 2006-09-07 | Skipor Andrew F | High energy soldering composition and method of soldering |
| KR100610273B1 (ko) * | 2005-04-19 | 2006-08-09 | 삼성전기주식회사 | 플립칩 방법 |
| US7326636B2 (en) * | 2005-05-24 | 2008-02-05 | Agilent Technologies, Inc. | Method and circuit structure employing a photo-imaged solder mask |
| US7615476B2 (en) * | 2005-06-30 | 2009-11-10 | Intel Corporation | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
| KR100719905B1 (ko) * | 2005-12-29 | 2007-05-18 | 삼성전자주식회사 | Ｓｎ-Ｂｉ계 솔더 합금 및 이를 이용한 반도체 소자 |
| CN100556238C (zh) * | 2006-05-23 | 2009-10-28 | 达方电子股份有限公司 | 焊接电子零件在基板上的方法 |
| KR100796983B1 (ko) | 2006-11-21 | 2008-01-22 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| JP5016975B2 (ja) * | 2007-03-05 | 2012-09-05 | 株式会社東芝 | 半導体装置の製造方法 |
| KR100834515B1 (ko) * | 2007-03-07 | 2008-06-02 | 삼성전기주식회사 | 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법 |
| US20090065555A1 (en) * | 2007-09-12 | 2009-03-12 | Stephen Leslie Buchwalter | Electrical interconnect forming method |
| US20090108442A1 (en) * | 2007-10-25 | 2009-04-30 | International Business Machines Corporation | Self-assembled stress relief interface |
| KR101009110B1 (ko) * | 2008-11-12 | 2011-01-18 | 삼성전기주식회사 | 매립 솔더 범프를 갖는 인쇄회로기판 및 그 제조방법 |
| JP5238598B2 (ja) * | 2009-04-30 | 2013-07-17 | 昭和電工株式会社 | 回路基板の製造方法 |
| KR101077359B1 (ko) | 2009-09-23 | 2011-10-26 | 삼성전기주식회사 | 방열회로기판 및 그 제조방법 |
| US8507325B2 (en) * | 2010-01-28 | 2013-08-13 | International Business Machines Corporation | Co-axial restraint for connectors within flip-chip packages |
| JP5658898B2 (ja) * | 2010-03-29 | 2015-01-28 | 株式会社日立製作所 | ウェハ接合半導体装置の製造方法 |
| KR101740483B1 (ko) * | 2011-05-02 | 2017-06-08 | 삼성전자 주식회사 | 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지 |
| JP2012019244A (ja) * | 2011-10-24 | 2012-01-26 | Fujitsu Ltd | 半導体装置、回路配線基板及び半導体装置の製造方法 |
| KR101940237B1 (ko) * | 2012-06-14 | 2019-01-18 | 한국전자통신연구원 | 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법 |
| CN103028869A (zh) * | 2012-12-13 | 2013-04-10 | 深圳市唯特偶新材料股份有限公司 | 一种低银高润湿焊锡膏及其制备方法 |
| US9617189B2 (en) * | 2013-08-30 | 2017-04-11 | Ut-Battelle, Llc | Apparatus and method for materials processing utilizing a rotating magnetic field |
| CN107848074A (zh) * | 2015-01-09 | 2018-03-27 | 马萨诸塞大学 | 无铅纳米焊料的制备和应用 |
| CN104979319B (zh) * | 2015-06-16 | 2018-11-16 | 江苏师范大学 | 一种实现3d封装芯片互连的记忆焊点 |
| US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| CN105177387B (zh) * | 2015-08-06 | 2017-03-15 | 江苏师范大学 | 一种3D芯片堆叠的含Eu、纳米Au的互连材料 |
| CN105161483A (zh) * | 2015-08-06 | 2015-12-16 | 江苏师范大学 | 一种3D芯片堆叠的含Yb、纳米Cu的互连材料 |
| US10597767B2 (en) * | 2016-02-22 | 2020-03-24 | Roswell Biotechnologies, Inc. | Nanoparticle fabrication |
| US10265806B2 (en) * | 2016-10-04 | 2019-04-23 | General Electric Company | System and method for sealing internal channels defined in a component |
| TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
| KR102409913B1 (ko) * | 2017-12-06 | 2022-06-16 | 삼성전자주식회사 | 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법 |
| KR102827173B1 (ko) * | 2018-06-26 | 2025-06-27 | 가부시끼가이샤 레조낙 | 이방성 도전 필름과 그 제조 방법 및 접속 구조체의 제조 방법 |
| KR102856173B1 (ko) | 2018-06-26 | 2025-09-04 | 가부시끼가이샤 레조낙 | 땜납 입자 |
| CN112313031A (zh) * | 2018-06-26 | 2021-02-02 | 昭和电工材料株式会社 | 焊料粒子及焊料粒子的制造方法 |
| DE102018215672A1 (de) * | 2018-09-14 | 2020-03-19 | Continental Automotive Gmbh | Verfahren zur Herstellung einer Leiterplattenanordnung und Leiterplattenanordnung |
| KR20230126736A (ko) | 2020-12-30 | 2023-08-30 | 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 | 전도성 특징부를 갖는 구조 및 그 형성방법 |
| JP7597131B2 (ja) * | 2021-02-03 | 2024-12-10 | 株式会社レゾナック | はんだペースト、はんだバンプの形成方法及びはんだバンプ付き部材の製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4557767A (en) * | 1983-10-31 | 1985-12-10 | Scm Corporation | Fusible powdered metal paste |
| JPS63238994A (ja) * | 1987-03-25 | 1988-10-05 | Tdk Corp | 半田組成物 |
| US5141568A (en) * | 1990-05-15 | 1992-08-25 | Hughes Aircraft Company | Water-soluble soldering paste |
| US5294242A (en) * | 1991-09-30 | 1994-03-15 | Air Products And Chemicals | Method for making metal powders |
| US5346118A (en) * | 1993-09-28 | 1994-09-13 | At&T Bell Laboratories | Surface mount solder assembly of leadless integrated circuit packages to substrates |
| US5382300A (en) * | 1994-03-22 | 1995-01-17 | At&T Corp. | Solder paste mixture |
| US5666643A (en) * | 1995-02-23 | 1997-09-09 | General Electric Company | High temperature braze material |
| JPH11514300A (ja) * | 1995-10-06 | 1999-12-07 | ブラウン ユニバーシティ リサーチ ファウンデーション | はんだ付けの方法及び配合物 |
| US6205264B1 (en) * | 1998-04-14 | 2001-03-20 | Lucent Technologies Inc. | Optical assembly with improved dimensional stability |
| US6136689A (en) * | 1998-08-14 | 2000-10-24 | Micron Technology, Inc. | Method of forming a micro solder ball for use in C4 bonding process |
| JP4564113B2 (ja) * | 1998-11-30 | 2010-10-20 | 株式会社東芝 | 微粒子膜形成方法 |
| GB9929521D0 (en) * | 1999-12-15 | 2000-02-09 | Secr Defence | Bonded products and methods of fabrication therefor |
| JP3423930B2 (ja) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | バンプ形成方法、電子部品、および半田ペースト |
| AU2001261952A1 (en) * | 2000-05-24 | 2001-12-03 | Stephen F. Corbin | Variable melting point solders and brazes |
| US6932519B2 (en) * | 2000-11-16 | 2005-08-23 | Shipley Company, L.L.C. | Optical device package |
| US6883977B2 (en) * | 2000-12-14 | 2005-04-26 | Shipley Company, L.L.C. | Optical device package for flip-chip mounting |
| JP2003166007A (ja) * | 2001-03-28 | 2003-06-13 | Tamura Kaken Co Ltd | 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物 |
| JP2002359426A (ja) * | 2001-06-01 | 2002-12-13 | Hitachi Ltd | 光モジュール及び光通信システム |
| JP2003059958A (ja) * | 2001-08-15 | 2003-02-28 | Sony Corp | マイクロバンプの形成方法 |
| US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
| US7416108B2 (en) * | 2002-01-24 | 2008-08-26 | Siemens Power Generation, Inc. | High strength diffusion brazing utilizing nano-powders |
| CN1152769C (zh) * | 2002-07-24 | 2004-06-09 | 北京工业大学 | 纳米颗粒增强的锡铅基复合钎料及其制备方法 |
| EP1626614B1 (en) * | 2003-05-16 | 2013-08-28 | Harima Chemicals, Inc. | Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film |
| US7017795B2 (en) * | 2003-11-03 | 2006-03-28 | Indium Corporation Of America | Solder pastes for providing high elasticity, low rigidity solder joints |
| US7331500B2 (en) * | 2004-06-25 | 2008-02-19 | Intel Corporation | Solder bumps formation using solder paste with shape retaining attribute |
-
2004
- 2004-03-29 JP JP2004096963A patent/JP2005183904A/ja active Pending
- 2004-12-15 TW TW093138886A patent/TWI254392B/zh not_active IP Right Cessation
- 2004-12-17 KR KR1020040107549A patent/KR20050063689A/ko not_active Ceased
- 2004-12-21 CN CNB2004100821391A patent/CN100469222C/zh not_active Expired - Fee Related
- 2004-12-22 US US11/022,235 patent/US20050133572A1/en not_active Abandoned