JP2005183904A5 - - Google Patents

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Publication number
JP2005183904A5
JP2005183904A5 JP2004096963A JP2004096963A JP2005183904A5 JP 2005183904 A5 JP2005183904 A5 JP 2005183904A5 JP 2004096963 A JP2004096963 A JP 2004096963A JP 2004096963 A JP2004096963 A JP 2004096963A JP 2005183904 A5 JP2005183904 A5 JP 2005183904A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004096963A
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JP2005183904A (ja
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Publication of JP2005183904A publication Critical patent/JP2005183904A/ja
Publication of JP2005183904A5 publication Critical patent/JP2005183904A5/ja
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JP2004096963A 2003-12-22 2004-03-29 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 Pending JP2005183904A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53226403P 2003-12-22 2003-12-22

Publications (2)

Publication Number Publication Date
JP2005183904A JP2005183904A (ja) 2005-07-07
JP2005183904A5 true JP2005183904A5 (ja) 2007-05-10

Family

ID=34794223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096963A Pending JP2005183904A (ja) 2003-12-22 2004-03-29 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品

Country Status (5)

Country Link
US (1) US20050133572A1 (ja)
JP (1) JP2005183904A (ja)
KR (1) KR20050063689A (ja)
CN (1) CN100469222C (ja)
TW (1) TWI254392B (ja)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031034A1 (de) * 2003-06-25 2005-02-10 Behr Gmbh & Co. Kg Flussmittel zum Löten von Metallbauteilen
JP4069867B2 (ja) * 2004-01-05 2008-04-02 セイコーエプソン株式会社 部材の接合方法
US20060196579A1 (en) * 2005-03-07 2006-09-07 Skipor Andrew F High energy soldering composition and method of soldering
KR100610273B1 (ko) * 2005-04-19 2006-08-09 삼성전기주식회사 플립칩 방법
US7326636B2 (en) * 2005-05-24 2008-02-05 Agilent Technologies, Inc. Method and circuit structure employing a photo-imaged solder mask
US7615476B2 (en) * 2005-06-30 2009-11-10 Intel Corporation Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
KR100719905B1 (ko) * 2005-12-29 2007-05-18 삼성전자주식회사 Ｓｎ-Ｂｉ계 솔더 합금 및 이를 이용한 반도체 소자
KR100796983B1 (ko) 2006-11-21 2008-01-22 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5016975B2 (ja) * 2007-03-05 2012-09-05 株式会社東芝 半導体装置の製造方法
KR100834515B1 (ko) 2007-03-07 2008-06-02 삼성전기주식회사 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법
US20090065555A1 (en) * 2007-09-12 2009-03-12 Stephen Leslie Buchwalter Electrical interconnect forming method
US20090108442A1 (en) * 2007-10-25 2009-04-30 International Business Machines Corporation Self-assembled stress relief interface
KR101009110B1 (ko) * 2008-11-12 2011-01-18 삼성전기주식회사 매립 솔더 범프를 갖는 인쇄회로기판 및 그 제조방법
JP5238598B2 (ja) * 2009-04-30 2013-07-17 昭和電工株式会社 回路基板の製造方法
KR101077359B1 (ko) 2009-09-23 2011-10-26 삼성전기주식회사 방열회로기판 및 그 제조방법
US8507325B2 (en) * 2010-01-28 2013-08-13 International Business Machines Corporation Co-axial restraint for connectors within flip-chip packages
JP5658898B2 (ja) * 2010-03-29 2015-01-28 株式会社日立製作所 ウェハ接合半導体装置の製造方法
KR101740483B1 (ko) * 2011-05-02 2017-06-08 삼성전자 주식회사 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지
JP2012019244A (ja) * 2011-10-24 2012-01-26 Fujitsu Ltd 半導体装置、回路配線基板及び半導体装置の製造方法
KR101940237B1 (ko) * 2012-06-14 2019-01-18 한국전자통신연구원 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
CN103028869A (zh) * 2012-12-13 2013-04-10 深圳市唯特偶新材料股份有限公司 一种低银高润湿焊锡膏及其制备方法
US9617189B2 (en) * 2013-08-30 2017-04-11 Ut-Battelle, Llc Apparatus and method for materials processing utilizing a rotating magnetic field
EP3242769A4 (en) * 2015-01-09 2018-06-13 University of Massachusetts Preparation and application of pb-free nanosolder
CN104979319B (zh) * 2015-06-16 2018-11-16 江苏师范大学 一种实现3d封装芯片互连的记忆焊点
US10886250B2 (en) * 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
CN105161483A (zh) * 2015-08-06 2015-12-16 江苏师范大学 一种3D芯片堆叠的含Yb、纳米Cu的互连材料
CN105177387B (zh) * 2015-08-06 2017-03-15 江苏师范大学 一种3D芯片堆叠的含Eu、纳米Au的互连材料
US10597767B2 (en) * 2016-02-22 2020-03-24 Roswell Biotechnologies, Inc. Nanoparticle fabrication
US10265806B2 (en) * 2016-10-04 2019-04-23 General Electric Company System and method for sealing internal channels defined in a component
TWI822659B (zh) 2016-10-27 2023-11-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
KR102409913B1 (ko) * 2017-12-06 2022-06-16 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
US20210229222A1 (en) * 2018-06-26 2021-07-29 Showa Denko Materials Co., Ltd. Solder particles and method for producing solder particles

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557767A (en) * 1983-10-31 1985-12-10 Scm Corporation Fusible powdered metal paste
JPS63238994A (ja) * 1987-03-25 1988-10-05 Tdk Corp 半田組成物
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5294242A (en) * 1991-09-30 1994-03-15 Air Products And Chemicals Method for making metal powders
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5382300A (en) * 1994-03-22 1995-01-17 At&T Corp. Solder paste mixture
US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
JPH11514300A (ja) * 1995-10-06 1999-12-07 ブラウン ユニバーシティ リサーチ ファウンデーション はんだ付けの方法及び配合物
US6205264B1 (en) * 1998-04-14 2001-03-20 Lucent Technologies Inc. Optical assembly with improved dimensional stability
US6136689A (en) * 1998-08-14 2000-10-24 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
JP4564113B2 (ja) * 1998-11-30 2010-10-20 株式会社東芝 微粒子膜形成方法
GB9929521D0 (en) * 1999-12-15 2000-02-09 Secr Defence Bonded products and methods of fabrication therefor
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
US6613123B2 (en) * 2000-05-24 2003-09-02 Stephen F. Corbin Variable melting point solders and brazes
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
JP2003166007A (ja) * 2001-03-28 2003-06-13 Tamura Kaken Co Ltd 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
JP2003059958A (ja) * 2001-08-15 2003-02-28 Sony Corp マイクロバンプの形成方法
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7416108B2 (en) * 2002-01-24 2008-08-26 Siemens Power Generation, Inc. High strength diffusion brazing utilizing nano-powders
CN1152769C (zh) * 2002-07-24 2004-06-09 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法
EP1626614B1 (en) * 2003-05-16 2013-08-28 Harima Chemicals, Inc. Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film
US7017795B2 (en) * 2003-11-03 2006-03-28 Indium Corporation Of America Solder pastes for providing high elasticity, low rigidity solder joints
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute

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