JP2005183904A - 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 - Google Patents

電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 Download PDF

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Publication number
JP2005183904A
JP2005183904A JP2004096963A JP2004096963A JP2005183904A JP 2005183904 A JP2005183904 A JP 2005183904A JP 2004096963 A JP2004096963 A JP 2004096963A JP 2004096963 A JP2004096963 A JP 2004096963A JP 2005183904 A JP2005183904 A JP 2005183904A
Authority
JP
Japan
Prior art keywords
solder paste
solder
contact pads
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004096963A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005183904A5 (https=
Inventor
Nathaniel E Brese
ナサニエル・イー・ブレス
Michael P Toben
マイケル・ピー・トーベン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of JP2005183904A publication Critical patent/JP2005183904A/ja
Publication of JP2005183904A5 publication Critical patent/JP2005183904A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2004096963A 2003-12-22 2004-03-29 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 Pending JP2005183904A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53226403P 2003-12-22 2003-12-22

Publications (2)

Publication Number Publication Date
JP2005183904A true JP2005183904A (ja) 2005-07-07
JP2005183904A5 JP2005183904A5 (https=) 2007-05-10

Family

ID=34794223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096963A Pending JP2005183904A (ja) 2003-12-22 2004-03-29 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品

Country Status (5)

Country Link
US (1) US20050133572A1 (https=)
JP (1) JP2005183904A (https=)
KR (1) KR20050063689A (https=)
CN (1) CN100469222C (https=)
TW (1) TWI254392B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008252053A (ja) * 2007-03-05 2008-10-16 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2010118633A (ja) * 2008-11-12 2010-05-27 Samsung Electro-Mechanics Co Ltd 埋込み型ソルダーバンプを持つプリント基板及びその製造方法
JP2012019244A (ja) * 2011-10-24 2012-01-26 Fujitsu Ltd 半導体装置、回路配線基板及び半導体装置の製造方法

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1658157B1 (de) * 2003-06-25 2016-03-23 MAHLE Behr GmbH & Co. KG Flussmittel zum löten von metallbauteilen
JP4069867B2 (ja) * 2004-01-05 2008-04-02 セイコーエプソン株式会社 部材の接合方法
US20060196579A1 (en) * 2005-03-07 2006-09-07 Skipor Andrew F High energy soldering composition and method of soldering
KR100610273B1 (ko) * 2005-04-19 2006-08-09 삼성전기주식회사 플립칩 방법
US7326636B2 (en) * 2005-05-24 2008-02-05 Agilent Technologies, Inc. Method and circuit structure employing a photo-imaged solder mask
US7615476B2 (en) * 2005-06-30 2009-11-10 Intel Corporation Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
KR100719905B1 (ko) * 2005-12-29 2007-05-18 삼성전자주식회사 Ｓｎ-Ｂｉ계 솔더 합금 및 이를 이용한 반도체 소자
CN100556238C (zh) * 2006-05-23 2009-10-28 达方电子股份有限公司 焊接电子零件在基板上的方法
KR100796983B1 (ko) 2006-11-21 2008-01-22 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100834515B1 (ko) * 2007-03-07 2008-06-02 삼성전기주식회사 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법
US20090065555A1 (en) * 2007-09-12 2009-03-12 Stephen Leslie Buchwalter Electrical interconnect forming method
US20090108442A1 (en) * 2007-10-25 2009-04-30 International Business Machines Corporation Self-assembled stress relief interface
JP5238598B2 (ja) * 2009-04-30 2013-07-17 昭和電工株式会社 回路基板の製造方法
KR101077359B1 (ko) 2009-09-23 2011-10-26 삼성전기주식회사 방열회로기판 및 그 제조방법
US8507325B2 (en) * 2010-01-28 2013-08-13 International Business Machines Corporation Co-axial restraint for connectors within flip-chip packages
JP5658898B2 (ja) * 2010-03-29 2015-01-28 株式会社日立製作所 ウェハ接合半導体装置の製造方法
KR101740483B1 (ko) * 2011-05-02 2017-06-08 삼성전자 주식회사 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지
KR101940237B1 (ko) * 2012-06-14 2019-01-18 한국전자통신연구원 미세 피치 ｐｃｂ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
CN103028869A (zh) * 2012-12-13 2013-04-10 深圳市唯特偶新材料股份有限公司 一种低银高润湿焊锡膏及其制备方法
US9617189B2 (en) * 2013-08-30 2017-04-11 Ut-Battelle, Llc Apparatus and method for materials processing utilizing a rotating magnetic field
EP3242769A4 (en) * 2015-01-09 2018-06-13 University of Massachusetts Preparation and application of pb-free nanosolder
CN104979319B (zh) * 2015-06-16 2018-11-16 江苏师范大学 一种实现3d封装芯片互连的记忆焊点
US10886250B2 (en) * 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
CN105177387B (zh) * 2015-08-06 2017-03-15 江苏师范大学 一种3D芯片堆叠的含Eu、纳米Au的互连材料
CN105161483A (zh) * 2015-08-06 2015-12-16 江苏师范大学 一种3D芯片堆叠的含Yb、纳米Cu的互连材料
US10597767B2 (en) * 2016-02-22 2020-03-24 Roswell Biotechnologies, Inc. Nanoparticle fabrication
US10265806B2 (en) * 2016-10-04 2019-04-23 General Electric Company System and method for sealing internal channels defined in a component
TWI910033B (zh) * 2016-10-27 2025-12-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
KR102409913B1 (ko) * 2017-12-06 2022-06-16 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
KR20250046348A (ko) * 2018-06-26 2025-04-02 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
DE102018215672A1 (de) 2018-09-14 2020-03-19 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterplattenanordnung und Leiterplattenanordnung
CN116848631A (zh) 2020-12-30 2023-10-03 美商艾德亚半导体接合科技有限公司 具有导电特征的结构及其形成方法
KR102922752B1 (ko) * 2021-02-03 2026-02-03 가부시끼가이샤 레조낙 땜납 페이스트, 땜납 범프의 형성 방법 및 땜납 범프 부착 부재의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164531A (ja) * 1998-11-30 2000-06-16 Toshiba Corp 微粒子膜形成装置・形成方法、ならびに半導体装置およびその製造方法
JP2003059958A (ja) * 2001-08-15 2003-02-28 Sony Corp マイクロバンプの形成方法
WO2004103043A1 (ja) * 2003-05-16 2004-11-25 Harima Chemicals, Inc. 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557767A (en) * 1983-10-31 1985-12-10 Scm Corporation Fusible powdered metal paste
JPS63238994A (ja) * 1987-03-25 1988-10-05 Tdk Corp 半田組成物
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5294242A (en) * 1991-09-30 1994-03-15 Air Products And Chemicals Method for making metal powders
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5382300A (en) * 1994-03-22 1995-01-17 At&T Corp. Solder paste mixture
US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
WO1997012718A1 (en) * 1995-10-06 1997-04-10 Brown University Research Foundation Soldering methods and compositions
US6205264B1 (en) * 1998-04-14 2001-03-20 Lucent Technologies Inc. Optical assembly with improved dimensional stability
US6136689A (en) * 1998-08-14 2000-10-24 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
GB9929521D0 (en) * 1999-12-15 2000-02-09 Secr Defence Bonded products and methods of fabrication therefor
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
CA2410636A1 (en) * 2000-05-24 2001-11-29 Stephen F. Corbin Variable melting point solders and brazes
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
JP2003166007A (ja) * 2001-03-28 2003-06-13 Tamura Kaken Co Ltd 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7416108B2 (en) * 2002-01-24 2008-08-26 Siemens Power Generation, Inc. High strength diffusion brazing utilizing nano-powders
CN1152769C (zh) * 2002-07-24 2004-06-09 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法
US7017795B2 (en) * 2003-11-03 2006-03-28 Indium Corporation Of America Solder pastes for providing high elasticity, low rigidity solder joints
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164531A (ja) * 1998-11-30 2000-06-16 Toshiba Corp 微粒子膜形成装置・形成方法、ならびに半導体装置およびその製造方法
JP2003059958A (ja) * 2001-08-15 2003-02-28 Sony Corp マイクロバンプの形成方法
WO2004103043A1 (ja) * 2003-05-16 2004-11-25 Harima Chemicals, Inc. 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008252053A (ja) * 2007-03-05 2008-10-16 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2010118633A (ja) * 2008-11-12 2010-05-27 Samsung Electro-Mechanics Co Ltd 埋込み型ソルダーバンプを持つプリント基板及びその製造方法
US9021690B2 (en) 2008-11-12 2015-05-05 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board having buried solder bump
JP2012019244A (ja) * 2011-10-24 2012-01-26 Fujitsu Ltd 半導体装置、回路配線基板及び半導体装置の製造方法

Also Published As

Publication number Publication date
US20050133572A1 (en) 2005-06-23
CN1642392A (zh) 2005-07-20
CN100469222C (zh) 2009-03-11
KR20050063689A (ko) 2005-06-28
TW200527566A (en) 2005-08-16
TWI254392B (en) 2006-05-01

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