JP2005172576A - Pusher and semi-conductor inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pusher and a semi-conductor inspection apparatus which can support various types of semi-conductor device having different outside dimensions. <P>SOLUTION: When inspecting electrical characteristics of an IC package 60 by mounting on the bottom of the concave part of an IC socket 10, a pusher 50 presses the top surface of the IC package to come into contact with a ball electrode 62 and a contact pin 12 of the IC socket 10. The pusher 50 comprises a balloon 20 which is located above the concave part of the IC socket 10 and in which a certain amount of air is filled. The balloon 20 changes its form according to the outer shape of the IC package 60, therefore the pusher can support various types of of semi-conductor device having different outside dimensions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pusher and a semiconductor inspection device, and more particularly, when a semiconductor device sealed with a resin package or the like (hereinafter referred to as an “IC package”) is placed on an IC socket to inspect its electrical characteristics. The present invention relates to a technique for pressing an upper surface of an IC package to connect an external terminal thereof and a contact pin of an IC socket.

  Mass-produced IC packages are subjected to electrical property tests (measurement inspections), burn-in tests (inspections under specified temperature and voltage conditions), etc., in accordance with the package state before being shipped as products. The At this time, the IC package is placed on an IC socket attached to the IC handler. Then, the IC package is pressed against the IC socket by a pusher provided in the IC handler. Thereby, the external terminal of the IC package and the probe pin of the IC socket are electrically connected (for example, refer to Patent Documents 1 and 2).

FIG. 3 is a conceptual diagram showing a configuration example of an IC handler 300 according to a conventional example. The IC handler 300 includes an IC socket 310, a socket mounting base 305 for mounting the IC socket 310, a pusher 350, and the like.
The IC socket 310 accommodates the IC package 60 when an electrical characteristic test, a burn-in test or the like (hereinafter referred to as “probe inspection”) is performed on, for example, a BGA (Ball Grid Array) type IC package 60. The ball electrode 62 is pulled out of the IC socket 310. As shown in FIG. 3, the IC socket 310 is provided with a recess corresponding to the outer dimension of the IC package 60, and the IC package 60 is fixed in the horizontal direction by the inner wall surface of the recess. A plurality of contact pins 312 are attached in the center of the bottom surface of the recess, and the tips of the contact pins 312 slightly protrude from the bottom surface of the recess.

  On the other hand, the pusher 350 presses the upper surface of the IC package 60 placed on the IC socket 310 with its tip, and fixes the IC package 60 from the vertical direction. The pusher 350 is provided above the concave portion of the IC socket 310 and is movable in the vertical direction as indicated by an arrow in FIG. The tip of the pusher 350 corresponds to the recess of the IC socket 310 and the shape and size of the IC package 60 accommodated in the recess. That is, the tip of the pusher 350 is formed in a shape and size that can enter the recess of the IC socket 310 and cover almost the entire upper surface of the IC package 60 placed in the recess.

When such a pusher 350 is vertically lowered from above the IC package 60, the tip portion thereof enters the recess of the IC socket 310, and presses the entire upper surface of the IC package 60 substantially uniformly. By this pressing, the IC package 60 is fixed from the vertical direction, and the ball electrode 62 and the contact pin 312 are sufficiently in contact with each other.
JP 2002-156407 A Japanese Patent Laid-Open No. 6-18614

By the way, according to the IC handler 300 according to the conventional example, the front end portion of the pusher 350 is formed in a shape and size corresponding to the IC package 60 or the like in order to press almost the entire upper surface of the IC package 60 substantially uniformly. It was.
However, the external dimensions of this type of IC package 60 (hereinafter referred to as “external dimensions”) vary from one product type to another, and in particular, a so-called multi-product type in which many types of IC packages 60 are produced and inspected in small quantities. In a low-mix production line, many types of IC packages 60 having different external dimensions flow through the production process and the inspection process.

For this reason, in particular, in the high-mix low-volume production type line, it is necessary to prepare a plurality of types of tip portions of the pusher 350 according to the type of the IC package 60 to be inspected. Each time the type of the IC package 60 to be inspected changes, the tip of the pusher 350 must be replaced with an appropriate type, which is troublesome.
SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above problems, and an object thereof is to provide a pusher and a semiconductor inspection apparatus that can cope with a plurality of types of semiconductor devices having different external dimensions with a single type of pusher.

  In order to solve the above-described problems, a first pusher according to the present invention is configured to mount a semiconductor device sealed with a package on a predetermined portion of an IC socket and inspect the electrical characteristics of the semiconductor device. A pusher that presses the upper surface to connect the external terminal and a contact pin of the IC socket, and includes a bag body disposed above the predetermined portion of the IC socket, and a predetermined flow is provided in the bag body. It is characterized by the introduction of animals.

  Here, the fluid is, for example, a gas such as air or nitrogen, water, an aqueous solution obtained by dissolving a predetermined substance in water, a gel-like liquid, or particles such as beads. Moreover, a bag body can hold | maintain said fluid in the state without a leak on the inner side. This bag body has the property of causing a change in shape and volume due to an external force while holding the above fluid in a leak-free state inside, and recovering the original state again when the force is removed. (That is, elastically deformed). As an example of such a bag body, a balloon (that is, a balloon) made of a stretchable synthetic rubber or the like can be given.

According to the first pusher of the present invention, when the upper surface of the semiconductor device placed on the IC socket is pressed by the bag body, the bag body is deformed according to the outer shape of the semiconductor device. Therefore, it is possible to deal with a plurality of types of semiconductor devices having different external dimensions with one type of pusher, and the versatility of the pusher can be improved.
Further, the second pusher according to the present invention is the above-described first pusher, wherein the fluid is introduced into the bag body, and the introduced fluid is discharged from the bag body, It is characterized by comprising. According to the second pusher of the present invention, the amount of fluid introduced into the bag can be arbitrarily changed, and the pressing force applied to the semiconductor device can be adjusted by the amount of fluid. .

  A first semiconductor inspection apparatus according to the present invention includes either the first pusher or the second pusher and the IC socket. Here, the semiconductor inspection device is, for example, an IC tester used in an inspection process, an IC handler that is connected to the IC tester and automatically classifies the semiconductor device according to a signal from the IC tester. According to the first semiconductor inspection apparatus of the present invention, since either one of the first pusher or the second pusher is provided, a plurality of types of semiconductor devices having different external dimensions with one type of pusher are provided. And the versatility of the pusher can be improved.

  A second semiconductor inspection apparatus according to the present invention is the above-described first semiconductor inspection apparatus, comprising an elevating operation means for elevating and lowering the pusher above the semiconductor device placed on the IC socket. It is characterized by. According to the second semiconductor inspection device of the present invention, the pressing force applied from the bag body to the upper surface of the semiconductor device can be adjusted by the lifting and lowering operation of the pusher. Therefore, for example, the amount of air fed into the bag can be kept low, and the time required for air feeding can be shortened. Moreover, since the bag can be moved away from the IC socket when the semiconductor device is attached to or detached from the IC socket, the semiconductor device can be easily attached or detached.

Hereinafter, a pusher and a semiconductor inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
(1) First Embodiment FIG. 1 is a conceptual diagram illustrating a configuration example of an IC handler 100 according to a first embodiment of the present invention. The IC handler 100 is a device used by being connected to an IC tester (not shown), and includes an IC socket 10, a socket mounting base 5 for mounting the IC socket 10, a pusher 50, and the like.

  Among these, the IC socket 10 accommodates the IC package 60 and pulls the ball electrode 62 out of the IC socket 10 when, for example, performing a probe test on the BGA type IC package 60. As shown in FIG. 1, the IC socket 10 is provided with a recess corresponding to the outer dimension of the IC package 60, and the IC package 60 is fixed in the horizontal direction by the inner wall surface of the recess. A plurality of contact pins 12 are attached in the center of the bottom surface of the recess, and the tips of the contact pins 12 slightly protrude from the bottom surface of the recess. The IC socket 10 is made of an insulating material such as synthetic resin.

  On the other hand, the pusher 50 presses the upper surface of the IC package 60 placed on the IC socket 10 to fix the IC package 60 from the vertical direction. As shown in FIG. 1, the pusher 50 includes a balloon 20, an air inlet / outlet part 30, and an air nozzle 25 having one end inserted into the balloon 20 and the other end connected to the air inlet / outlet part 30. Etc.

  The balloon 20 shown in FIG. 1 is a balloon, and can hold air inside without leaking. The balloon 20 has a property of causing a change in shape and volume due to an external force while holding air inside without leaking, and restoring the original state when the force is removed. (I.e. elastic deformation). The balloon 20 is made of, for example, a stretchable synthetic rubber. Moreover, the air in / out part 30 sends air into the balloon 20 through the air nozzle 25 or forcibly exhausts the air in the balloon 20 through the air nozzle 25. The air feeding / exiting unit 30 can send air into the balloon and exhaust the air at an arbitrary timing.

In FIG. 1, a balloon 20 indicated by a two-dot chain line shows a state in which air is exhausted to the outside and contracted. Further, the balloon 20 indicated by a solid line shows a state where air has been sent by the air sending / receiving unit 30 and inflated. In the IC handler 100, the balloon 20 is disposed above the concave portion of the IC socket 10.
When the IC package 60 is probed using such an IC handler 100, first, the IC socket 10 is attached to the socket mounting base 5. Next, the IC package 60 is placed in the recess of the IC socket 10 with the ball electrode 62 of the IC package 60 facing the bottom surface of the recess. Here, even if the IC package 60 is slightly displaced and inserted into the recess, the IC package 60 is guided onto the bottom surface of the recess by the inner wall of the recess. When the IC package 60 is placed on the bottom surface of the recess, the IC package 60 is fixed from the horizontal direction by the inner wall of the recess.

  Next, a predetermined amount of air is sent into the balloon 20 from the air inlet / outlet part 30 through the air nozzle 25. Then, the balloon 20 is inflated by a predetermined size by the sent air, and the upper surface of the IC package 60 is pressed. With this pressing, the balloon 20 is deformed according to the outer shape of the IC package 60, so that the pusher 50 can press almost the entire upper surface of the IC package 60 substantially uniformly.

  By the way, the relationship between the amount of air sent into the balloon 20 and the pressing force applied to the IC package 60 by this air feed is examined for each type of IC package 60 having different external dimensions. And according to the kind of IC package 60, the quantity of the air sent in into the balloon 20 is preset. Thus, by determining the amount of air sent into the balloon 20 according to the type of the IC package 60, the pressing force applied to the upper surface of the IC package 60 does not depend on the type (outside dimension). Can be made substantially uniform. Thereby, the ball electrode 62 of the IC package 60 and the contact pin 12 of the IC socket 10 can be connected with high reproducibility.

  Next, a predetermined inspection signal is transmitted and received between the IC package 60 and an IC tester (not shown), and the IC package 60 is probe-inspected. The time required for this probe inspection varies depending on the type of IC package (device) and the test mode, but in many cases, it is about several to several tens of seconds per IC package. The air flow is blocked between the air inlet / outlet part 30 and the inside of the balloon 20 for several to several tens of seconds during which this probe inspection is performed, and the balloon 20 is in an inflated state as shown by the solid line in FIG. Let it be maintained.

  Next, after the probe inspection is completed, the flow of air is released between the air sending / receiving unit 30 and the inside of the balloon 20, and the air inside the balloon 20 is exhausted outside through the air nozzle 25. Thereby, the balloon 20 is contracted and separated from the upper surface of the IC package 60. The discharge of the air may be left to the contraction force (that is, natural exhaust) of the balloon 20, but the balloon 20 can be contracted quickly by forcibly exhausting the air through the air inlet / outlet part 30, for example. Therefore, it is possible to take out the IC package 60 from the IC socket 10 earlier than in the case of natural exhaust.

  As described above, according to the IC handler 100 according to the first embodiment of the present invention, when the upper surface of the IC package 60 fixed from the horizontal direction by the IC socket 10 is pressed with the balloon 20, the balloon 20 becomes the IC package. It deforms according to the external shape of 60. Therefore, it is possible to deal with a plurality of types of IC packages 60 having different outer dimensions with one type of pusher 50, and the versatility of the pusher can be improved.

In the first embodiment, the IC package 60 corresponds to the semiconductor device of the present invention, and the ball electrode 62 corresponds to the external terminal of the semiconductor device of the present invention. The IC socket 10 corresponds to the IC socket of the present invention, and the concave portion of the IC socket 10 corresponds to a predetermined part of the IC socket of the present invention. Furthermore, the contact pin 12 corresponds to the contact pin of the present invention, and the balloon 20 corresponds to the balloon of the present invention. The air introduced into the balloon 20 corresponds to the predetermined fluid of the present invention, and the air nozzle 25 and the air inlet / outlet portion 30 correspond to the fluid guide / discharge means of the present invention. Further, the pusher 50 corresponds to the pusher of the present invention, and the IC handler 100 corresponds to the semiconductor inspection apparatus of the present invention.
(2) Second Embodiment FIG. 2 is a conceptual diagram showing a configuration example of an IC handler 200 according to a second embodiment of the present invention. The IC handler 200 is different from the IC handler 100 described in the first embodiment in that an elevating operation means for elevating the pusher 50 is provided. Other configurations are the same as those of the IC handler 100 described in the first embodiment. Accordingly, in FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 2, the IC handler 200 includes an elevating mechanism 40 that moves the pusher 50 up and down (that is, moves in the vertical direction) above the concave portion of the IC socket 10. According to such a configuration, the pressing force applied from the balloon 20 to the upper surface of the IC package 60 can be adjusted by the lifting / lowering operation of the pusher 50. Therefore, for example, the amount of air sent into the balloon 20 can be kept low, and the time required for sending air can be shortened. Moreover, since the balloon 20 can be moved away from the IC socket 10 when the IC package 60 is attached to or detached from the IC socket 10, the IC package 60 can be easily attached or detached. In the second embodiment, the lifting mechanism 40 corresponds to the lifting operation means of the present invention, and the IC handler 200 corresponds to the semiconductor inspection apparatus of the present invention.

  In the first and second embodiments, the case where air is used as an example of the fluid has been described. However, the fluid of the present invention is not limited to this. The fluid of the present invention may be, for example, a gas such as nitrogen, water, an aqueous solution obtained by dissolving a predetermined substance in water, a gel-like liquid, or particles such as beads. In particular, when water, an aqueous solution, a gel-like liquid, or the like is used, the upper surface of the IC package 60 can be pressed by its own weight, which is convenient for fixing the IC package 60 from the vertical direction.

The figure which shows the structural example of IC handler 100 which concerns on 1st Embodiment. The figure which shows the structural example of IC handler 200 which concerns on 2nd Embodiment. The figure which shows the structural example of IC handler 300 which concerns on a prior art example.

Explanation of symbols

  5 Mounting base, 10 IC socket, 12 Contact pin, 20 Balloon, 25 Air nozzle, 30 Air in / out part, 50 Pusher, 60 IC package, 62 Ball electrode, 100, 200 IC handler

Claims (4)

When a semiconductor device sealed with a package is placed on a predetermined part of an IC socket and its electrical characteristics are inspected, the upper surface of the semiconductor device is pressed to connect the external terminal and the contact pin of the IC socket. A pusher,
A pusher comprising a bag body disposed above the predetermined portion of the IC socket, wherein a predetermined fluid is introduced into the bag body.   2. The pusher according to claim 1, further comprising a fluid guide / discharge unit configured to introduce the fluid into the bag and to discharge the introduced fluid from the bag.   A semiconductor inspection apparatus comprising the pusher according to claim 1 or 2 and the IC socket.   4. The semiconductor inspection apparatus according to claim 3, further comprising an elevating operation means for elevating the pusher above the semiconductor device placed on the IC socket.

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