JP3298630B2 - Pressurizing method and pressurizing apparatus, and inspection method and apparatus using them - Google Patents

Pressurizing method and pressurizing apparatus, and inspection method and apparatus using them

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Publication number
JP3298630B2
JP3298630B2 JP30882499A JP30882499A JP3298630B2 JP 3298630 B2 JP3298630 B2 JP 3298630B2 JP 30882499 A JP30882499 A JP 30882499A JP 30882499 A JP30882499 A JP 30882499A JP 3298630 B2 JP3298630 B2 JP 3298630B2
Authority
JP
Japan
Prior art keywords
pressurizing
jig
pressurized
pressing
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30882499A
Other languages
Japanese (ja)
Other versions
JP2001124680A (en
Inventor
好孝 京極
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP30882499A priority Critical patent/JP3298630B2/en
Publication of JP2001124680A publication Critical patent/JP2001124680A/en
Application granted granted Critical
Publication of JP3298630B2 publication Critical patent/JP3298630B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101Chamber
    • H01L2224/7511High pressure chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7925Means for applying energy, e.g. heating means
    • H01L2224/793Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/79301Pressing head
    • H01L2224/79314Auxiliary members on the pressing surface
    • H01L2224/79317Removable auxiliary member
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119Arrangement of the bump connectors prior to mounting
    • H01L2224/81191Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812Applying energy for connecting
    • H01L2224/81201Compression bonding
    • H01L2224/81209Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体素子等の被
加圧物を加圧するための加圧方法及び加圧装置に関す
る。また、本発明は、上記加圧方法及び加圧装置を用い
た半導体素子等の被検査物の検査方法及び検査装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressurizing method and a pressurizing device for pressurizing a pressurized object such as a semiconductor element. The present invention also relates to a method and an apparatus for inspecting an object to be inspected, such as a semiconductor device, using the above-described method and apparatus.

【0002】[0002]

【従来の技術】袋状の加圧治具に被加圧物を入れて袋内
を減圧することは良く知られた被加圧物の加圧方法であ
るが、これまでは最大圧力が袋の外側の圧力になるとい
う制約のため、積極的に利用されることは少なかった。
しかし、この加圧方法には被加圧物の加圧面全体に均等
な圧力をかけられるというメリットがある。これを利用
して、片当たり等により容易に破壊してしまう被加圧物
の加圧に使用されるようになった。例えば、図16のよ
うにシリコンウエハ上に形成したCSPの検査、或いは
KGDを目的としたウエハの検査などである。
2. Description of the Related Art It is a well-known method of pressurizing an object to be pressurized by putting the object to be pressurized in a bag-shaped pressurizing jig and depressurizing the inside of the bag. Due to the constraints of the pressure outside the, it was rarely actively used.
However, this pressurizing method has an advantage that a uniform pressure can be applied to the entire pressurized surface of the object to be pressurized. Utilizing this, it has come to be used for pressurizing an object to be pressurized, which is easily broken due to one-sided contact or the like. For example, inspection of a CSP formed on a silicon wafer as shown in FIG. 16 or inspection of a wafer for the purpose of KGD is performed.

【0003】図16のウエハの一括検査装置10(特開
平10−223704号)は、ウエハWを吸着保持して
搬送するアーム11と、ウエハWを搬出入する搬出入口
を有し且つ密閉及び移動可能なチャンバー12と、リン
グ状の位置調整機構13と、ウエハWの全ての電極に一
括して電気的に接触する突起端子を内面に有するコンタ
クタ14と、このコンタクタ14の外周に沿ってウエハ
Wを支持するOリング15と、コンタクタ14で囲まれ
た密閉空間16内の圧力を減圧する排気手段と、コンタ
クタ14外面の接続端子と電気的に導通するテストヘッ
ド18とを備えたものである。
A wafer batch inspection apparatus 10 shown in FIG. 16 (JP-A-10-223704) has an arm 11 for sucking and holding a wafer W and transporting the wafer W, and a loading / unloading port for loading / unloading the wafer W. A possible chamber 12, a ring-shaped position adjusting mechanism 13, a contactor 14 having on its inner surface a protruding terminal that electrically contacts all the electrodes of the wafer W at once, and a wafer W along the outer periphery of the contactor 14 , An exhaust means for reducing the pressure in a sealed space 16 surrounded by the contactor 14, and a test head 18 electrically connected to a connection terminal on the outer surface of the contactor 14.

【0004】[0004]

【発明が解決しようとする課題】しかし、前述した加圧
方法は、前記デメリット(最大圧力が頭打ちになるこ
と)のため、より高加圧を要するケースではこれまで使
用されていないのも事実である。例えば、前記の半導体
デバイスの検査治具は、DRAM、SDRAM、Ram
busDRAM等のメモリのように、検査端子数の少な
いCSPやウエハで使用されているだけである。また、
より高い圧力をかけるためには、減圧する際の真空度を
上げる必要があり、設備投資にコストがかかる上、時間
がかかるというデメリットがあった。これらの理由で検
査するチップのピン数が多くなった場合、検査に必要な
加圧をかけられない、時間がかかる、抵抗値が安定しな
いという不具合があった。
However, the above-described pressurizing method has not been used in cases requiring higher pressurization because of the above-mentioned disadvantage (maximum pressure reaches a plateau). is there. For example, the inspection jig of the semiconductor device is a DRAM, an SDRAM, a Ram,
It is only used for CSPs and wafers with a small number of test terminals, such as memories such as bus DRAMs. Also,
In order to apply a higher pressure, it is necessary to increase the degree of vacuum at the time of depressurization, which has the disadvantage of increasing the capital investment and time. When the number of pins of the chip to be inspected increases for these reasons, there are disadvantages in that the pressure required for the inspection cannot be applied, it takes time, and the resistance value is not stable.

【0005】本発明は、上述した事情に鑑みてなされた
もので、加圧治具の内部に被加圧物を入れて加圧治具内
を減圧する被加圧物の加圧手段であって、加圧治具内を
減圧するだけの方法より高圧力で被加圧物を加圧するこ
とができる加圧手段を提供することを目的とする。
The present invention has been made in view of the above circumstances, and is a means for pressurizing an object to be pressurized by putting the object to be pressurized inside the pressing jig and depressurizing the inside of the pressing jig. It is another object of the present invention to provide a pressurizing means capable of pressurizing an object to be pressurized at a higher pressure than a method of merely reducing the pressure in a pressurizing jig.

【0006】[0006]

【課題を解決するための手段】本発明は、前記目的を達
成するため、下記(1)〜(8)に示す被加圧物の加圧
方法及び加圧装置並びに被検査物の検査方法及び検査装
置を提供する。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method and apparatus for pressurizing an object to be pressurized, a method for inspecting an object to be inspected, and a method for inspecting an object to be inspected as described in the following (1) to (8). An inspection device is provided.

【0007】(1)一部又は全部が変形可能で吸排気可
能な開口部を持つ加圧治具の内部に被加圧物を入れ、該
加圧治具の内部を減圧することにより前記被加圧物を加
圧するとともに、前記加圧治具を、加圧治具の外側にあ
る流体を加圧する手段及び加圧治具の外側に流体を充填
する手段の一方又は両方の手段によって加圧することを
特徴とする被加圧物の加圧方法。
(1) An object to be pressurized is placed inside a pressurizing jig having an opening part that can be partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to reduce the pressure. The pressurized object is pressurized, and the pressurizing jig is pressurized by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. A method for pressurizing an object to be pressurized.

【0008】(2)一部又は全部が変形可能で吸排気可
能な開口部を持つ第1の加圧治具の内部に被加圧物を入
れるとともに、一部又は全部が変形可能で吸排気可能な
開口部を持つ第2の加圧治具の内部に前記第1の加圧治
具を入れ、前記第1の加圧治具の内部を減圧することに
より前記被加圧物を加圧するとともに、前記第1の加圧
治具を、第1の加圧治具と第2の加圧治具との間にある
流体を加圧する手段及び第1の加圧治具と第2の加圧治
具との間に流体を充填する手段の一方又は両方の手段に
よって加圧することを特徴とする被加圧物の加圧方法。
(2) An object to be pressurized is put into a first pressurizing jig having an opening part which is partially or entirely deformable and capable of sucking and discharging, and is partially or entirely deformable and sucking and discharging. The first pressurizing jig is placed inside a second pressurizing jig having a possible opening, and the object to be pressurized is pressurized by reducing the pressure inside the first pressurizing jig. Means for pressurizing the fluid between the first pressing jig and the second pressing jig and the first pressing jig and the second pressing jig; A method for pressurizing an object to be pressurized, characterized in that pressure is applied by one or both of means for filling a fluid with a pressure jig.

【0009】(3)一部又は全部が変形可能で吸排気可
能な開口部を持つ加圧治具の内部に被加圧物を入れ、該
加圧治具の内部を減圧することにより前記被加圧物を加
圧するとともに、前記加圧治具を、加圧治具の外側にあ
る流体を加圧する手段及び加圧治具の外側に流体を充填
する手段の一方又は両方の手段によって加圧することを
特徴とする被加圧物の加圧装置。
(3) An object to be pressurized is placed inside a pressurizing jig having an opening part capable of being partially or entirely deformable and capable of sucking and exhausting air, and the inside of the pressurizing jig is depressurized to reduce the pressure. The pressurized object is pressurized, and the pressurizing jig is pressurized by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. A pressurizing device for an object to be pressurized.

【0010】(4)一部又は全部が変形可能で吸排気可
能な開口部を持つ第1の加圧治具の内部に被加圧物を入
れるとともに、一部又は全部が変形可能で吸排気可能な
開口部を持つ第2の加圧治具の内部に前記第1の加圧治
具を入れ、前記第1の加圧治具の内部を減圧することに
より前記被加圧物を加圧するとともに、前記第1の加圧
治具を、第1の加圧治具と第2の加圧治具との間にある
流体を加圧する手段及び第1の加圧治具と第2の加圧治
具との間に流体を充填する手段の一方又は両方の手段に
よって加圧することを特徴とする被加圧物の加圧装置。
(4) An object to be pressurized is put into a first pressurizing jig having an opening part which can be partially or entirely deformable and capable of sucking and discharging, and a part or all of which is deformable and sucking and discharging. The first pressurizing jig is placed inside a second pressurizing jig having a possible opening, and the object to be pressurized is pressurized by reducing the pressure inside the first pressurizing jig. Means for pressurizing the fluid between the first pressing jig and the second pressing jig and the first pressing jig and the second pressing jig; A pressurizing device for an object to be pressurized, wherein pressurization is performed by one or both of means for filling a fluid with a pressure jig.

【0011】(5)一部又は全部が変形可能で吸排気可
能な開口部を持つ加圧治具の内部に被検査物を入れ、該
加圧治具の内部を減圧することにより前記被検査物を加
圧するとともに、前記加圧治具を、加圧治具の外側にあ
る流体を加圧する手段及び加圧治具の外側に流体を充填
する手段の一方又は両方の手段によって加圧することに
より被検査物の検査を行うことを特徴とする被検査物の
検査方法。
(5) An object to be inspected is placed inside a pressurizing jig having an opening part which can be partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to thereby perform the test. By pressurizing the object, the pressurizing jig is pressurized by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. An inspection method for an object to be inspected, comprising inspecting the object to be inspected.

【0012】(6)一部又は全部が変形可能で吸排気可
能な開口部を持つ第1の加圧治具の内部に被検査物を入
れるとともに、一部又は全部が変形可能で吸排気可能な
開口部を持つ第2の加圧治具の内部に前記第1の加圧治
具を入れ、前記第1の加圧治具の内部を減圧することに
より前記被検査物を加圧するとともに、前記第1の加圧
治具を、第1の加圧治具と第2の加圧治具との間にある
流体を加圧する手段及び第1の加圧治具と第2の加圧治
具との間に流体を充填する手段の一方又は両方の手段に
よって加圧することにより被検査物の検査を行うことを
特徴とする被検査物の検査方法。
(6) The inspection object is placed inside the first pressurizing jig having an opening part which is partially or entirely deformable and capable of sucking and discharging, and partly or entirely deformable and capable of sucking and discharging. The first pressing jig is placed inside a second pressing jig having an appropriate opening, and the inside of the first pressing jig is depressurized to pressurize the inspection object. Means for pressurizing a fluid between the first pressing jig and the second pressing jig, and a first pressing jig and a second pressing jig; A method for inspecting an object to be inspected, wherein the inspection of the object to be inspected is performed by applying pressure by one or both of means for filling a fluid with the tool.

【0013】(7)一部又は全部が変形可能で吸排気可
能な開口部を持つ加圧治具の内部に被検査物を入れ、該
加圧治具の内部を減圧することにより前記被検査物を加
圧するとともに、前記加圧治具を、加圧治具の外側にあ
る流体を加圧する手段及び加圧治具の外側に流体を充填
する手段の一方又は両方の手段によって加圧することに
より被検査物の検査を行うことを特徴とする被検査物の
検査装置。
(7) An object to be inspected is placed in a pressurizing jig having an opening which is partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to thereby perform the test. By pressurizing the object, the pressurizing jig is pressurized by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. An inspection device for inspecting an inspection object, wherein the inspection device inspects the inspection object.

【0014】(8)一部又は全部が変形可能で吸排気可
能な開口部を持つ第1の加圧治具の内部に被検査物を入
れるとともに、一部又は全部が変形可能で吸排気可能な
開口部を持つ第2の加圧治具の内部に前記第1の加圧治
具を入れ、前記第1の加圧治具の内部を減圧することに
より前記被検査物を加圧するとともに、前記第1の加圧
治具を、第1の加圧治具と第2の加圧治具との間にある
流体を加圧する手段及び第1の加圧治具と第2の加圧治
具との間に流体を充填する手段の一方又は両方の手段に
よって加圧することにより被検査物の検査を行うことを
特徴とする被検査物の検査装置。
(8) An object to be inspected is placed inside a first pressurizing jig having an opening part which is partially or entirely deformable and capable of sucking and discharging, and is partially or entirely deformable and capable of sucking and discharging. The first pressing jig is placed inside a second pressing jig having an appropriate opening, and the inside of the first pressing jig is depressurized to pressurize the inspection object. Means for pressurizing a fluid between the first pressing jig and the second pressing jig, and a first pressing jig and a second pressing jig; An inspection device for an object to be inspected, wherein the inspection of the object to be inspected is performed by applying a pressure by one or both of means for filling a fluid with the tool.

【0015】[0015]

【発明の実施の形態】以下に、本発明の実施の形態を説
明するが、本発明はこれらに限定されるものではない。
図1は本発明の実施例の一例である。被加圧物1は変形
可能で吸排気可能な開口部を持つ加圧治具2(第1の加
圧治具)の内部に入っている。さらに前記加圧治具2
は、外側から圧力がかけられるよう、吸排気可能な開口
部を持つ加圧治具3(第2の加圧治具)に入れられてい
る(図1左)。前記加圧治具2の内部を減圧し、且つ前
記加圧治具3の内部を加圧した状態が図1右である。内
部を減圧され外側から加圧された前記加圧治具2は、被
加圧物1の加圧面4に接触して加圧治具となっている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below, but the present invention is not limited to these embodiments.
FIG. 1 is an example of an embodiment of the present invention. The object to be pressurized 1 is inside a pressurizing jig 2 (first pressurizing jig) having an opening capable of being deformed and capable of sucking and discharging. Further, the pressing jig 2
Is placed in a pressing jig 3 (second pressing jig) having an opening through which air can be sucked and exhausted so that pressure can be applied from the outside (FIG. 1 left). A state in which the inside of the pressing jig 2 is depressurized and the inside of the pressing jig 3 is pressurized is shown in FIG. The pressurizing jig 2 whose inside is decompressed and pressurized from the outside contacts the pressurizing surface 4 of the object 1 to be pressurized and serves as a pressurizing jig.

【0016】図1では加圧治具2全体が変形している
が、全体が変形する必要はない。その一例を図2,3に
示す。図2は加圧治具2が、図3の剛体の中空管5の両
底面に変形可能な物質6を貼ったもので、減圧すると変
形可能な物質が収縮して被加圧物1に圧力がかかるよう
になっている。
In FIG. 1, the entire pressing jig 2 is deformed, but it is not necessary that the entire pressing jig be deformed. An example is shown in FIGS. FIG. 2 shows a pressing jig 2 in which a deformable substance 6 is adhered to both bottom surfaces of a rigid hollow tube 5 shown in FIG. Pressure is applied.

【0017】図4は、図5のように剛体7を変形可能な
物質6で吸排気用の開口部を残して密封したものを使用
した一例である。このように、被加圧物1の加圧面4を
剛体が加圧しても良い。
FIG. 4 shows an example in which a rigid body 7 is sealed with a deformable substance 6 leaving an opening for intake and exhaust, as shown in FIG. As described above, the rigid body may press the pressing surface 4 of the object 1 to be pressed.

【0018】また、加圧治具2の内部に被加圧物以外の
物質を入れても良い。その一例を図6に示す。図6では
加圧面4に平行な剛体8を前記加圧治具2の内部に被加
圧物と同梱している。前記加圧治具2の内部が減圧され
た際、図6右のように、前記剛体8は収縮する加圧治具
2に押されて被加圧物1の加圧面4を加圧する。もちろ
ん、このことは同梱される物質を剛体に特定するもので
はない。
A substance other than the object to be pressurized may be put in the pressurizing jig 2. An example is shown in FIG. In FIG. 6, a rigid body 8 parallel to the pressing surface 4 is enclosed inside the pressing jig 2 together with the object to be pressed. When the inside of the pressing jig 2 is depressurized, the rigid body 8 is pressed by the contracting pressing jig 2 to press the pressing surface 4 of the object 1 as shown in the right side of FIG. Of course, this does not specify the enclosed substance as rigid.

【0019】実施例の一例である図1、2,4,6にお
いて、加圧治具2の給排気口と外部へ繋がる中空管が一
体化しているが、必ずしもその必要はなく、図7のよう
に給排気可能な開口部があればよい。図7では、加圧治
具2の一部に開口している穴があり,これが前記の給排
気可能な開口部9になる。図7では、前記開口部9に、
それとは分離していて外部と繋がっている中空管10を
接触あるいは接続させることにより排気を行う。この
際、前記中空管10と前記開口部9とが接触する部分
に、リーク防止のためにシリコーン樹脂、ゴム等の弾性
体17を挟むのが望ましい。
In FIGS. 1, 2, 4 and 6, which are an example of the embodiment, the supply / exhaust port of the pressurizing jig 2 and the hollow tube connected to the outside are integrated, but this is not always necessary. It suffices if there is an opening for air supply and exhaust as shown in FIG. In FIG. 7, there is a hole opened in a part of the pressurizing jig 2, and this is the above-mentioned opening 9 for supplying and discharging air. In FIG. 7, the opening 9
Evacuation is performed by contacting or connecting a hollow tube 10 that is separated and connected to the outside. At this time, it is desirable that an elastic body 17 such as a silicone resin or rubber be sandwiched between the hollow tube 10 and the opening 9 to prevent leakage.

【0020】また、実施例の一例である図1,2,4,
6では、前記加圧治具3の吸排気管11内に前記中空管
10が設けられているが、これは吸排気管10,11の
場所を限定するものではない。例えば図7のように2つ
の吸排気管10,11が別々の場所に設けられていても
良い。
FIGS. 1, 2, 4 and 5 show an example of the embodiment.
In 6, the hollow pipe 10 is provided in the intake / exhaust pipe 11 of the pressurizing jig 3, but this does not limit the location of the intake / exhaust pipes 10,11. For example, as shown in FIG. 7, two intake and exhaust pipes 10 and 11 may be provided at different places.

【0021】さらに、実施例の一例である図1,2,
4,6,7では、被加圧物1を包む前記加圧治具2を囲
む加圧治具3が、前記加圧治具2と同様の形状をしてい
るが、これに限定されるものではない。その一例とし
て、図8のように、剛体の中空管30を両底面からピス
トン18で加圧するという構造19も考えられる。
Further, FIGS.
In 4, 6, and 7, the pressing jig 3 surrounding the pressing jig 2 surrounding the object 1 to be pressed has the same shape as the pressing jig 2, but is not limited thereto. Not something. As one example, as shown in FIG. 8, a structure 19 in which a rigid hollow tube 30 is pressurized by pistons 18 from both bottom surfaces is also conceivable.

【0022】加えて、これまでの図1〜8では、加圧治
具2とそれを囲むもの(例えば上述の説明では袋状の物
質3や図8の構造19など)との間に充填している物質
12は気体を前提として説明しているが、図9,10の
ようにこれは液体でもゲル状物質20でも良い。但し、
取り扱いの点では大気が容易である。
In addition, in FIGS. 1 to 8 described above, the space between the pressing jig 2 and its surroundings (for example, the bag-like substance 3 or the structure 19 in FIG. 8 in the above description) is filled. Although the substance 12 has been described on the assumption that it is a gas, it may be a liquid or a gel-like substance 20 as shown in FIGS. However,
The atmosphere is easy to handle.

【0023】加圧治具2を加圧する方法及び構造とし
て、加圧治具2とそれを囲むものとの間の充填物を例え
ばピストンやポンプのようなもので加圧する他に、図
9,10のように水圧を使うことも可能である。図9右
のように加圧治具2を減圧後に液体或いはゲル状物質2
0を充填することにより加圧できる。この場合、図10
のように充填する物質の高さを変化させることにより圧
力の制御が可能である。もちろん、前記水圧による方法
とピストン或いはポンプ等で加圧する方法とを組み合わ
せても良い。
As a method and a structure for pressurizing the pressing jig 2, in addition to pressurizing the filling between the pressing jig 2 and the surroundings thereof with, for example, a piston or a pump, FIG. It is also possible to use water pressure as in 10. After the pressure jig 2 is depressurized as shown in FIG.
Pressurization can be performed by filling 0. In this case, FIG.
The pressure can be controlled by changing the height of the material to be filled as in the above. Of course, the method using the hydraulic pressure and the method using the piston or the pump for pressurization may be combined.

【0024】図1から9では、加圧治具2は袋状になっ
ているが、図11のような構造も可能であり、加圧治具
2を袋状に限定するものではない。図11では、加圧治
具2と加圧治具3が一体化している。図11では、図1
の袋状の加圧治具2と加圧治具3が一体化しているが、
図3や図5の加圧治具2と加圧治具3が一体化しても良
い。
In FIGS. 1 to 9, the pressing jig 2 has a bag shape, but the structure shown in FIG. 11 is also possible, and the pressing jig 2 is not limited to a bag shape. In FIG. 11, the pressing jig 2 and the pressing jig 3 are integrated. In FIG. 11, FIG.
Although the bag-shaped pressing jig 2 and the pressing jig 3 are integrated,
The pressing jig 2 and the pressing jig 3 shown in FIGS. 3 and 5 may be integrated.

【0025】次に、本発明を半導体素子の検査に適用し
た例を示す。図12はCSPに適用した例である。CS
P13を外部の検査装置と結線された検査治具14にC
SPのBGA23と検査治具14の電極パッド24が接
触するよう位置決めして搭載した後、図12の加圧治具
2中に入れる(図12左)。その後加圧治具2を減圧
し、且つ加圧治具3を加圧することによってCSP13
は加圧治具2により圧力を受け検査治具14と安定した
接触をとることが可能になる(図12右)。図12は半
導体素子としてCSPを選んだ例であるが、QFPのよ
うなモールドされた素子(図は割愛)でもよい。
Next, an example in which the present invention is applied to the inspection of a semiconductor device will be described. FIG. 12 shows an example applied to a CSP. CS
P13 is connected to an inspection jig 14 connected to an external inspection device.
After the BGA 23 of the SP and the electrode pad 24 of the inspection jig 14 are positioned and mounted so as to be in contact with each other, they are put into the pressing jig 2 of FIG. 12 (left of FIG. 12). Thereafter, the pressure of the pressing jig 2 is reduced, and the pressure of the pressing jig 3 is increased.
Can be stably contacted with the inspection jig 14 by receiving pressure from the pressing jig 2 (FIG. 12, right). FIG. 12 shows an example in which a CSP is selected as a semiconductor element, but a molded element such as QFP (illustration omitted) may be used.

【0026】また、図13,14のようにウエハ25に
形成された半導体素子を一括して検査することも可能で
ある。図14はウエハ上の端子と検査治具14に形成さ
れた電極バンプ25とが接触するよう位置決めにピン2
1を用いた例である。図14の構造では加圧治具2によ
り位置決め治具22が加圧され、加圧された治具22が
被加圧物1を加圧する構造になっている。このためピン
21が加圧時に最後まで刺さってしまって加圧が止まら
ないよう間隙26を設けるのが望ましい。図12と同様
にベアチップも検査可能である(図は割愛)。また、図
15のように加圧治具2中に検査機能を持つもの15
(検査機能部)を入れて外部への配線の引き出しを無く
しても良い。この場合、検査機能を持つもの15は、加
圧時に一緒に加圧されるのを避けるために金属等の変形
しにくい筐体に入れておいたり、あるいは加圧治具2が
当たらない部分等に設置したりする必要がある。
It is also possible to inspect the semiconductor elements formed on the wafer 25 as shown in FIGS. FIG. 14 shows the positioning of the pins 2 so that the terminals on the wafer come into contact with the electrode bumps 25 formed on the inspection jig 14.
This is an example using No. 1. In the structure of FIG. 14, the positioning jig 22 is pressed by the pressing jig 2, and the pressed jig 22 presses the object 1. For this reason, it is desirable to provide the gap 26 so that the pin 21 does not stick to the end at the time of pressurization and the pressurization does not stop. Bare chips can be inspected similarly to FIG. 12 (the figure is omitted). In addition, as shown in FIG.
(Inspection function unit) may be inserted to eliminate the drawing of the wiring to the outside. In this case, the device 15 having the inspection function is placed in a case such as metal which is hardly deformed in order to avoid being pressed together at the time of pressing, or a portion where the pressing jig 2 does not hit. Or need to be installed in

【0027】図11から15では、加圧機構は前述の加
圧機構のうち図1の機構で行っているが、前述の全ての
加圧機構が適用可能である(繰り返しのため図は割
愛)。
In FIGS. 11 to 15, the pressurizing mechanism is the same as the pressurizing mechanism shown in FIG. 1, but all the above-mentioned pressurizing mechanisms can be applied. .

【0028】[0028]

【発明の効果】本発明の効果は、第1に、袋内を減圧す
るだけの方法より高加圧にできることである。袋の外側
からも加圧するため、従来よりも高加圧にすることが可
能である。そのため、これまで高加圧を必要としていた
ものにも対応できる。例えば、ロジックLSIのような
端子数の多い半導体デバイスの検査では、従来方法では
加圧が低くて抵抗値が安定しなかったが、本発明により
検査端子の接触圧が増して、検査の品質が向上する。第
2に、検査時間の短縮である。従来の袋内の減圧の際に
同時に周りの圧力を上げることによって、より短い時間
で所定の圧力に達するからである。
First, the effect of the present invention is that the pressure can be increased to a higher level than the method of merely reducing the pressure in the bag. Since the pressure is applied also from the outside of the bag, it is possible to make the pressure higher than before. For this reason, it is possible to cope with those that required high pressurization. For example, in the inspection of a semiconductor device having a large number of terminals such as a logic LSI, the resistance is not stable due to low pressure in the conventional method. However, according to the present invention, the contact pressure of the inspection terminal is increased and the inspection quality is reduced. improves. Second, the inspection time is shortened. This is because a predetermined pressure is reached in a shorter time by simultaneously increasing the surrounding pressure when the pressure inside the conventional bag is reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例の一例を示す図である。FIG. 1 is a diagram showing an example of an embodiment of the present invention.

【図2】本発明の実施例の一例を示す図である。FIG. 2 is a diagram showing an example of an embodiment of the present invention.

【図3】加圧治具の一例を示す図である。FIG. 3 is a diagram illustrating an example of a pressing jig.

【図4】本発明の実施例の一例を示す図である。FIG. 4 is a diagram showing an example of an embodiment of the present invention.

【図5】加圧治具の一例を示す図である。FIG. 5 is a diagram illustrating an example of a pressing jig.

【図6】本発明の実施例の一例を示す図である。FIG. 6 is a diagram showing an example of an embodiment of the present invention.

【図7】本発明の実施例の一例を示す図である。FIG. 7 is a diagram showing an example of an embodiment of the present invention.

【図8】本発明の実施例の一例を示す図である。FIG. 8 is a diagram showing an example of an embodiment of the present invention.

【図9】本発明の実施例の一例を示す図である。FIG. 9 is a diagram showing an example of an embodiment of the present invention.

【図10】本発明の実施例の一例を示す図である。FIG. 10 is a diagram showing an example of an embodiment of the present invention.

【図11】本発明の実施例の一例を示す図である。FIG. 11 is a diagram showing an example of an embodiment of the present invention.

【図12】本発明の実施例の一例を示す図である。FIG. 12 is a diagram showing an example of an embodiment of the present invention.

【図13】本発明の実施例の一例を示す図である。FIG. 13 is a diagram showing an example of an embodiment of the present invention.

【図14】本発明の実施例の一例を示す図である。FIG. 14 is a diagram showing an example of an embodiment of the present invention.

【図15】本発明の実施例の一例を示す図である。FIG. 15 is a diagram showing an example of an embodiment of the present invention.

【図16】従来のウエハの検査治具の一例を示す図であ
る。
FIG. 16 is a view showing an example of a conventional wafer inspection jig.

【符号の説明】[Explanation of symbols]

1 被加圧物 2 加圧治具 3 加圧治具 4 加圧面 5 剛体の中空管 6 変形可能な物質 7 剛体 8 剛体 9 開口部 10 中空管 11 吸排気管 DESCRIPTION OF SYMBOLS 1 Pressed object 2 Pressing jig 3 Pressing jig 4 Pressing surface 5 Rigid hollow tube 6 Deformable substance 7 Rigid body 8 Rigid body 9 Opening 10 Hollow tube 11 Intake / exhaust tube

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G01N 3/08 H01L 21/66 JICSTファイル(JOIS)──────────────────────────────────────────────────続 き Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) G01N 3/08 H01L 21/66 JICST file (JOIS)

Claims (8)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 一部又は全部が変形可能で吸排気可能な
開口部を持つ加圧治具の内部に被加圧物を入れ、該加圧
治具の内部を減圧することにより前記被加圧物を加圧す
るとともに、前記加圧治具を、加圧治具の外側にある流
体を加圧する手段及び加圧治具の外側に流体を充填する
手段の一方又は両方の手段によって加圧することを特徴
とする被加圧物の加圧方法。
An object to be pressurized is placed inside a pressurizing jig having an opening part which can be partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to reduce the pressure. Pressurizing the pressurized object and pressurizing the pressurizing jig by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. A method for pressurizing an object to be pressurized.
【請求項2】 一部又は全部が変形可能で吸排気可能な
開口部を持つ第1の加圧治具の内部に被加圧物を入れる
とともに、一部又は全部が変形可能で吸排気可能な開口
部を持つ第2の加圧治具の内部に前記第1の加圧治具を
入れ、前記第1の加圧治具の内部を減圧することにより
前記被加圧物を加圧するとともに、前記第1の加圧治具
を、第1の加圧治具と第2の加圧治具との間にある流体
を加圧する手段及び第1の加圧治具と第2の加圧治具と
の間に流体を充填する手段の一方又は両方の手段によっ
て加圧することを特徴とする被加圧物の加圧方法。
2. A pressurized object is placed inside a first pressurizing jig having an opening part capable of being partially or entirely deformable and capable of sucking and discharging, and partly or entirely deformable and capable of sucking and discharging. The first pressing jig is placed inside a second pressing jig having an appropriate opening, and the object to be pressed is pressed by reducing the pressure inside the first pressing jig. Means for pressurizing a fluid between the first pressurizing jig and the second pressurizing jig, and a first pressurizing jig and a second pressurizing jig. A method of pressurizing an object to be pressurized, characterized in that the object is pressurized by one or both of means for filling a fluid with a jig.
【請求項3】 一部又は全部が変形可能で吸排気可能な
開口部を持つ加圧治具の内部に被加圧物を入れ、該加圧
治具の内部を減圧することにより前記被加圧物を加圧す
るとともに、前記加圧治具を、加圧治具の外側にある流
体を加圧する手段及び加圧治具の外側に流体を充填する
手段の一方又は両方の手段によって加圧することを特徴
とする被加圧物の加圧装置。
3. An object to be pressurized is placed inside a pressurizing jig having an opening part which is partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to reduce the pressure. Pressurizing the pressurized object and pressurizing the pressurizing jig by one or both of means for pressurizing the fluid outside the pressurizing jig and means for filling the fluid outside the pressurizing jig. A pressurizing device for an object to be pressurized.
【請求項4】 一部又は全部が変形可能で吸排気可能な
開口部を持つ第1の加圧治具の内部に被加圧物を入れる
とともに、一部又は全部が変形可能で吸排気可能な開口
部を持つ第2の加圧治具の内部に前記第1の加圧治具を
入れ、前記第1の加圧治具の内部を減圧することにより
前記被加圧物を加圧するとともに、前記第1の加圧治具
を、第1の加圧治具と第2の加圧治具との間にある流体
を加圧する手段及び第1の加圧治具と第2の加圧治具と
の間に流体を充填する手段の一方又は両方の手段によっ
て加圧することを特徴とする被加圧物の加圧装置。
4. An object to be pressurized is inserted into a first pressurizing jig having an opening part capable of being partially or entirely deformable and capable of sucking and discharging, and partly or entirely deformable and capable of sucking and discharging. The first pressing jig is placed inside a second pressing jig having an appropriate opening, and the object to be pressed is pressed by reducing the pressure inside the first pressing jig. Means for pressurizing a fluid between the first pressurizing jig and the second pressurizing jig, and a first pressurizing jig and a second pressurizing jig. A pressurizing device for a pressurized object, wherein pressurization is performed by one or both of means for filling a fluid with a jig.
【請求項5】 一部又は全部が変形可能で吸排気可能な
開口部を持つ加圧治具の内部に被検査物を入れ、該加圧
治具の内部を減圧することにより前記被検査物を加圧す
るとともに、前記加圧治具を、加圧治具の外側にある流
体を加圧する手段及び加圧治具の外側に流体を充填する
手段の一方又は両方の手段によって加圧することにより
被検査物の検査を行うことを特徴とする被検査物の検査
方法。
5. An object to be inspected is placed in a pressurizing jig having an opening part which can be partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to thereby reduce the amount of the object to be inspected. And pressurizing the pressurizing jig by one or both of a means for pressurizing the fluid outside the pressurizing jig and a means for filling the fluid outside the pressurizing jig. An inspection method for an object to be inspected, wherein the inspection of the object is performed.
【請求項6】 一部又は全部が変形可能で吸排気可能な
開口部を持つ第1の加圧治具の内部に被検査物を入れる
とともに、一部又は全部が変形可能で吸排気可能な開口
部を持つ第2の加圧治具の内部に前記第1の加圧治具を
入れ、前記第1の加圧治具の内部を減圧することにより
前記被検査物を加圧するとともに、前記第1の加圧治具
を、第1の加圧治具と第2の加圧治具との間にある流体
を加圧する手段及び第1の加圧治具と第2の加圧治具と
の間に流体を充填する手段の一方又は両方の手段によっ
て加圧することにより被検査物の検査を行うことを特徴
とする被検査物の検査方法。
6. An object to be inspected is inserted into a first pressing jig having an opening part capable of being partially or entirely deformable and capable of sucking and discharging, and partly or entirely deformable and capable of sucking and discharging. The first pressurizing jig is placed inside a second pressurizing jig having an opening, and the inside of the first pressurizing jig is depressurized to pressurize the inspection object. Means for pressurizing a fluid between the first pressing jig and the second pressing jig, and a first pressing jig and a second pressing jig A test object is inspected by applying pressure by one or both of means for filling a fluid between the test object and the test object.
【請求項7】 一部又は全部が変形可能で吸排気可能な
開口部を持つ加圧治具の内部に被検査物を入れ、該加圧
治具の内部を減圧することにより前記被検査物を加圧す
るとともに、前記加圧治具を、加圧治具の外側にある流
体を加圧する手段及び加圧治具の外側に流体を充填する
手段の一方又は両方の手段によって加圧することにより
被検査物の検査を行うことを特徴とする被検査物の検査
装置。
7. An object to be inspected is placed inside a pressurizing jig having an opening part which can be partially or entirely deformable and capable of sucking and discharging, and the inside of the pressurizing jig is depressurized to thereby form the object to be inspected. And pressurizing the pressurizing jig by one or both of a means for pressurizing the fluid outside the pressurizing jig and a means for filling the fluid outside the pressurizing jig. An inspection device for inspecting an inspection object, which inspects the inspection object.
【請求項8】 一部又は全部が変形可能で吸排気可能な
開口部を持つ第1の加圧治具の内部に被検査物を入れる
とともに、一部又は全部が変形可能で吸排気可能な開口
部を持つ第2の加圧治具の内部に前記第1の加圧治具を
入れ、前記第1の加圧治具の内部を減圧することにより
前記被検査物を加圧するとともに、前記第1の加圧治具
を、第1の加圧治具と第2の加圧治具との間にある流体
を加圧する手段及び第1の加圧治具と第2の加圧治具と
の間に流体を充填する手段の一方又は両方の手段によっ
て加圧することにより被検査物の検査を行うことを特徴
とする被検査物の検査装置。
8. An object to be inspected is placed inside a first pressing jig having an opening part which is partially or entirely deformable and capable of sucking and discharging, and is partially or entirely deformable and capable of sucking and discharging. The first pressurizing jig is placed inside a second pressurizing jig having an opening, and the inside of the first pressurizing jig is depressurized to pressurize the inspection object. Means for pressurizing a fluid between the first pressing jig and the second pressing jig, and a first pressing jig and a second pressing jig An inspection apparatus for inspecting an inspection object by applying pressure by one or both of means for filling a fluid between the inspection apparatus and the inspection apparatus.
JP30882499A 1999-10-29 1999-10-29 Pressurizing method and pressurizing apparatus, and inspection method and apparatus using them Expired - Fee Related JP3298630B2 (en)

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