TW202244507A - Probe systems and methods of forming an integrated circuit die - Google Patents

Abstract

A probe system including a chamber and a probe pin partially positioned within the chamber. The chamber includes a fluid inlet configured to allow a fluid to flow into the chamber, and one or more openings formed at a bottom part of the chamber. The probe pin includes a tip portion extending from the chamber along a first direction, wherein the one or more openings are arranged to allow the fluid to be ejected therethrough to provide a fluid curtain on a side surface of the tip portion.

Description

Probe system and method for forming integrated circuit die

This specification relates generally to an apparatus for testing semiconductor devices, and more particularly to a probe card with a micro-curtain purge air system.

For high voltage probes, use purge air to help reduce wafer arcing. The use of conventional purge air wiring is not manufacturable due to reasons such as the head-to-wafer spacing in the field of probe cards commonly referred to by those skilled in the art as vertical probe cards. Additionally, the open environment makes the pressurized gas (also an arc arrester) a challenge.

A probe system includes a chamber and a probe pin partially positioned within the chamber. The chamber includes a fluid inlet configured to allow a fluid to flow into the chamber, and one or more openings formed in a bottom portion of the chamber. The probe pin includes a tip portion extending from the chamber in a first direction, wherein the one or more openings are configured to allow the fluid to exit therethrough to provide a tip portion on a side surface of the tip portion. Fluid curtain.

Cross References to Related Applications This application claims priority to U.S. Provisional Patent Application No. 63/164,194, filed March 22, 2021, which is incorporated herein by reference.

This specification relates to a probe card with a micro-curtain purge air system.

1 is a cross-sectional view of an example of a probe card or a probe assembly used in a probe system 100 according to a first embodiment of the present specification. The probe system 100 includes: a printed circuit board 102 having a central opening 104; an interposer 106 positioned at least partially within the central opening 104; a chamber 108 having a fluid inlet 110 through which the fluid inlet 110 configured to allow a fluid to flow into the chamber 108 ; and one or more openings 112 formed at a bottom portion 114 of the chamber 108 . Fluid inlet 110 may be a separate component from chamber 108 or may be integrated with chamber 108 . The fluid may be a gas, such as compressed dry air or N ₂ , or may be a material that is liquid when entering the chamber and undergoes a phase change to a gas in the chamber 108 . In one example, the liquid preferably provides high dielectric strength and does not leave a residue on a wafer being tested by the probe system 100 . The fluid includes, but is not limited to, one of the following materials, such as natural and synthetic hydrocarbon-based oils, silicone fluids, perfluoropolyether fluorinated fluids (Galden fluids), synthetic and natural esters, and nanodielectrically modified fluids and gases Medium and liquid N ₂ , Ar, SF ₆ or similar combinations thereof. In another example, the fluid can be mixed with gas and liquid. Probe system 100 further includes probe pins 116 partially positioned within chamber 108 . Interposer 106 includes conductive traces 107 configured to couple a first end 118 of each probe pin 116 to printed circuit board 102 . A tip portion 120 of a probe pin 116 opposite to the first end 118 extends from the cavity 108 along a first direction 119 . In one example, tip portion 120 extends from chamber 108 through a channel 121 having a diameter just large enough to allow tip portion 120 to pass through. One or more openings 112 are configured to horizontally surround probe pins 116 to allow fluid to exit therethrough for a wafer or a die being tested on a side surface of tip portion 120 and below chamber 108 . A fluid curtain is provided on one of the top surfaces of the pellet. In a preferred embodiment, the chamber 108 is sealed except for the fluid inlet 110 and the one or more openings 112 . In one example, fluid inlet 110 is configured to threadably engage a fluid tube. However, any other fluid transfer connection capable of transferring fluid into chamber 108 is suitable.

2A and 2B are respective enlarged bottom plan views of a portion of the chamber 108 in the dashed box of FIG. 1 according to a first embodiment of the present specification. In one example, as shown in FIG. 2A , each probe pin 116 is surrounded by a C-shaped opening 112 . In another example, as shown in FIG. 2B , the probe pin 116 is surrounded by two or more arcuate openings 112 separated by tie bars 122 .

Figures 3A-3D show example cross-sectional views of opening 112 taken from line A-A' of Figure 2A or Figure 2B according to a first embodiment of the present specification. Each opening 112 has a first inner wall 124 close to the tip portion 120 and a second inner wall 126 away from the probe pin 116 . As shown in FIG. 3A , in one example, both the first inner wall 124 and the second inner wall 126 are parallel to the probe pins 116 . As shown in FIGS. 3B-3D , in other examples, a distance between an upper end of at least one of the first inner wall 124 and the second inner wall 126 is greater than that of the first inner wall 124 and the second inner wall 126 A distance between the lower ends of at least one of them to force the ejected fluid to flow toward the tip portion 120.

Figure 4A depicts fluid flow around tip portion 120 formed through opening 112 of Figure 3A, and Figure 4B depicts fluid flow around tip portion 120 formed through opening 112 of Figures 3B-3D of the present specification. During probe testing, the tip portion 120 contacts a pad 132 of a device 134 . As shown in FIG. 4A , fluid flow 136 is along a side surface of tip portion 120 , and as shown in FIG. 4B , fluid flow 138 is toward tip portion 120 .

5A-5C show bottom plan views of examples of openings 112 of chamber 108 of probe system 100 of FIG. 1 according to implementations of the present specification. As shown in FIGS. 5A and 5B , in one example, one or more openings 112 are configured to surround a plurality of probe pins 116 . In FIG. 5C , additional openings 140 are formed between adjacent probe pins 116 .

FIG. 6 is a top plan view of the probe system 100 of FIG. 1 according to an embodiment of the present specification. The interposer 106 is positioned at least partially within the central opening 104 of the printed circuit board 102 . The fluid inlet 110 of the chamber 108 extends through the interposer 106 .

7 is a cross-sectional view of an example of a probe card or a probe assembly used in a probe system 200 according to a second embodiment of the present specification. The probe system 200 is substantially similar to the probe system 100 of FIG. 1 , except that the tip portions 220 of the probe pins 216 extend from the chamber 208 in a first direction 219 through an opening 212 formed in the bottom of the chamber 208 outside. The diameter of the opening 212 is larger than that of the probe pin 216 to provide a gap 225 between an inner wall 226 of the opening 212 and the probe pin 216 . Gap 225 is configured to allow fluid to exit therethrough to provide a fluid curtain on a side surface of tip portion 220 and a top surface of a wafer or a die under test under chamber 208 .

8A is a bottom plan view of an example of an opening 212 at the bottom of the chamber 208 of FIG. 7 according to a second embodiment of the present specification. Fig. 8B is a three-dimensional cross-sectional view of the opening taken from line B-B' of Fig. 8A according to the second embodiment of the present specification. In a preferred embodiment, the probe pin 216 is positioned horizontally at the center of the opening 212 .

9A and 9B show example cross-sectional views of opening 212 taken from line BB' of FIG. 8A according to a second implementation of the present specification. As shown in FIG. 9A , in one example, inner sidewall 226 is parallel to probe pin 216 , and as shown in FIG. 9B , in another example, opening 212 tapers along first direction 219 so that A diameter at an upper end is greater than a diameter at a lower end of the opening 212 to force the ejected fluid toward the tip portion 220 .

10-12 are cross-sectional views of alternative examples of a probe system. Although FIGS. 10-12 show examples of different combinations of the printed circuit board 102 , interposer 106 and chamber 108 of FIG. 1 , these configurations are independent of the opening 112 at the bottom of the chamber 108 . The opening 212 of FIG. 7 may also be applied to any of the probe systems of FIGS. 10-12 . As shown in Figures 1 and 7, a probe system comprising a chamber with an opening in a bottom portion is not limited to the combination of printed circuit board, interposer and chamber shown in Figures 1 and 10-12.

Referring to FIG. 10 , in probe system 300 , sidewall 350 of chamber 308 extends through interposer 306 and/or printed circuit board 302 such that a top portion 352 of chamber 308 is disposed above interposer 306 . Similar to probe system 100 of FIG. 1 , probe system 300 includes probe pins 316 coupled to traces 307 of interposer 306 . Each probe pin 316 has a tip portion 320 extending from the cavity 308 . The chamber 308 includes one or more openings 312 formed at a bottom portion of the chamber 308 . One or more openings 312 may be configured as one or more openings 112 of FIG. 1 , or as one or more openings 212 of FIG. 7 .

Referring to FIG. 11 , in the probe system 400 , the entire chamber 408 including the fluid inlet 410 is disposed below the printed circuit board 402 . Similar to probe system 100 of FIG. 1 , probe system 400 includes probe pins 416 coupled to traces 407 of interposer 406 . Each probe pin 416 has a tip portion 420 extending from the cavity 408 . The chamber 408 includes one or more openings 412 formed at a bottom portion of the chamber 408 . The one or more openings 412 may be configured as one or more openings 112 of FIG. 1 , or as one or more openings 212 of FIG. 7 .

Referring to FIG. 12 , probe system 500 includes an interposer 506 positioned between a printed circuit board 502 and a chamber 508 . Interposer 506 includes traces 507 configured to couple probe pins 516 to printed circuit board 502 . Fluid inlet 510 extends through interposer 506 and printed circuit board 502 . Similar to probe system 100 of FIG. 1 , each probe pin 516 has a tip portion 520 extending from chamber 508 . The chamber 508 includes one or more openings 512 formed at a bottom portion of the chamber 508 . The one or more openings 512 may be configured as one or more openings 112 as in FIG. 1 , or as one or more openings 212 as in FIG. 7 .

FIG. 13 shows a flow 600 for forming an integrated circuit die according to a third embodiment of the present specification.

At step 602 , a semiconductor wafer 604 including two or more integrated circuit dies 606 is provided. In another example, an assembly (not shown) comprising one of two or more unencapsulated die is provided. The assembly may include one or more unencapsulated die mounted on an array of leadframes or an array of substrates. Die pads are exposed for probe testing.

At step 608 , semiconductor wafer 604 is positioned on a carrier 609 and IC die 606 is tested by a probe system 610 . In one example, the probe system includes a chamber 612 including a fluid inlet 614 adapted to engage a fluid tube 616 to allow a fluid to flow into the chamber 612 . The chamber 612 further includes one or more openings 618 formed at a bottom portion of the chamber 612, and a tip portion 622 partially positioned within the chamber 612 and having a tip portion 622 extending from the chamber 612 along a first direction 623 One of the probe pins 620 . One or more openings 618 surround the probe pins 620 to allow fluid to exit through the one or more openings 618 to a wafer or a die being tested on a side surface of the tip portion 622 and below the chamber 612 A fluid curtain is provided on one of the top surfaces.

In another example, referring to FIG. 7 , probe pin 620 has a tip portion 622 extending from chamber 612 through an opening formed in the bottom of chamber 612 , such as opening 212 of FIG. 7 . A gap between the tip portion 622 and an inner wall of the opening 618 allows fluid to be ejected from the chamber 612 to between a wafer or a die being tested on a side surface of the tip portion 622 and below the chamber 612. A fluid curtain is provided on a top surface.

At step 624 , the semiconductor wafer 604 is singulated to separate the integrated circuit dies 606 from each other.

At step 626 , the IC die 606 is assembled to form a semiconductor device 628 . In FIG. 13, semiconductor device 628 is a ball grid array (BGA) package, however, other types of packages such as dual in-line package (DIP), quad planar package (QFP), quad planar no-leads (QFN) package) is also applicable.

In this specification, the term "coupled" may encompass a connection, communication, or signal path that achieves a functional relationship consistent with this specification. For example, if device A generates a signal to control device B to perform an action, then: (a) in a first instance, device A is coupled to device B by a direct connection; or (b) in a second instance, If intermediary element C does not change the functional relationship between device A and device B, then device A is coupled to device B through intermediary element C, so that device B is controlled by device A via the control signal generated by device A.

In the examples described, modifications are possible, and other examples are possible within the scope of the claimed invention.

100: Probe system 102: Printed circuit board 104: Center opening 106: Intermediary layer 107: Conductive trace 108: chamber 110: fluid inlet 112: opening 114: Bottom part 116: Probe pin 118: first end 119: First Direction 120: tip part 121: channel 122: tie rod 124: the first inner wall 126: Second inner wall 132: Pad 134: device 136: Fluid flow 138: Fluid flow 140: extra opening 200: probe system 208: chamber 212: opening 216: Probe pin 219: First direction 220: tip part 225: Gap 226: inner wall 300: probe system 302: Printed circuit board 306: intermediary layer 307:Trace 308: chamber 312: opening 316: Probe pin 320: tip part 350: side wall 352:top part 400: Probe system 402: Printed Circuit Board 406: intermediary layer 407: Trace 408: chamber 410: Fluid inlet 412: opening 416: Probe pin 420: tip part 500: probe system 502: Printed circuit board 506: intermediary layer 507:Trace 508: chamber 510: fluid inlet 512: opening 516: Probe pin 520: tip part 600: process 602: Step 604: Semiconductor wafer 606: Integrated Circuit Die 608: Step 609: carrier 610: Probe system 612: chamber 614: Fluid inlet 616: Fluid Tube 618: opening 620: Probe pin 622: tip part 624: step 626: step 628: Semiconductor devices

Fig. 1 is a cross-sectional view of an example of a probe system according to a first embodiment of the present specification.

2A and 2B show exemplary bottom plan views of an opening of a chamber of the probe system of FIG. 1 according to a first implementation of the present specification.

3A-3D show exemplary cross-sectional views of openings taken from line AA' of FIGS. 2A and 2B according to a first embodiment of the present description.

4A and 4B depict air flow around the tip portion of a pin formed by the opening of FIGS. 3A-3D of the present specification.

5A-5C show bottom plan views of alternative examples of a portion of a chamber according to implementations of the present specification.

6 is a top plan view of a chamber of the probe system of FIG. 1 according to an embodiment of the present specification.

Fig. 7 is a cross-sectional view of an example of a probe system according to a second embodiment of the present specification.

8A is an exemplary bottom plan view of an opening of a chamber of the probe system of FIG. 7 according to a second embodiment of the present specification.

Fig. 8B is a three-dimensional cross-sectional view of the opening taken from line B-B' of Fig. 8A according to the second embodiment of the present specification.

9A and 9B show cross-sectional views of the opening taken from line BB' of FIG. 8A according to a second embodiment of the present description.

10-12 are cross-sectional views of an example of a probe system according to the present specification.

FIG. 13 shows a flow of forming a semiconductor device according to a third embodiment of the present specification.

100: Probe system

102: Printed circuit board

104: Center opening

106: Intermediary layer

107: Conductive trace

108: chamber

110: fluid inlet

112: opening

114: Bottom part

116: Probe pin

118: first end

119: First Direction

120: tip part

121: channel

Claims (19)

A probe system comprising: a chamber comprising: a fluid inlet configured to allow a fluid to flow into the chamber; and one or more openings formed at a bottom portion of the chamber; and a probe pin partially positioned within the cavity and having a tip portion extending from the cavity in a first direction, wherein the one or more openings are configured to allow the fluid to exit therethrough for injection in the cavity A fluid curtain is provided on one side surface of the tip portion. The probe system according to claim 1, wherein the one or more openings include: a first opening, wherein the tip portion extends from the chamber through the first opening; and A set of second openings surrounding the first opening, wherein the set of second openings is configured to provide on the side surface of the tip portion when the fluid exits the chamber through the set of second openings The fluid curtain. The probe system of claim 1, comprising a plurality of probe pins partially positioned within the chamber and extending along the first direction, wherein the one or more openings include: a row of first openings, wherein tip portions of the plurality of probe pins respectively extend from the cavity through the row of first openings; and a set of second openings surrounding the row of first openings, wherein the set of second openings is configured so that when the fluid exits the chamber through the set of second openings, between the plurality of probe pins The fluid curtain is provided on the side surface of each of the tip portions. The probe system according to any one of claims 2 and 3, wherein each of the set of second openings includes a proximal inner wall and a distal inner wall, wherein between the distal inner wall and the tip portion a distance greater than a distance between the proximal inner wall and the tip portion, wherein at least one of the proximal inner wall and the distal inner wall extends vertically along the first direction and toward the tip The sections extend horizontally. The probe system of claim 1, wherein the one or more openings comprise an opening, wherein the tip portion extends from the chamber through the opening, wherein the probe system further comprises a side surface of the tip portion and A gap between an inner wall of the opening, wherein the gap is configured to provide the fluid curtain on the side surface of the tip portion as the fluid exits the chamber through the gap. The probe system according to claim 5, wherein a diameter of the opening is tapered along the first direction. As the probe system of claim 1, it further comprises: a printed circuit board; and An interposer configured to couple an end of the probe pin opposite the tip portion to the printed circuit board, wherein the cavity is positioned below the interposer. A method of forming an integrated circuit die, comprising: providing a semiconductor wafer or an assembly comprising one or more integrated circuit dies; testing the one or more integrated circuit dies using a probe system; and singulating the semiconductor wafer or the assembly to form an integrated circuit die; The probe system includes: a chamber comprising: a fluid inlet configured to allow a fluid to flow into the chamber; and one or more openings formed at a bottom portion of the chamber; and a probe pin partially positioned within the cavity and having a tip portion extending from the cavity in a first direction, wherein the one or more openings are configured to allow the fluid to exit therethrough for injection in the cavity A fluid curtain is provided on a side surface of the tip portion and on a top surface of the integrated circuit die under test under the chamber. The method of claim 8, wherein the one or more openings include: a first opening, wherein the tip portion extends from the chamber through the first opening; and a set of second openings surrounding the first opening, wherein the set of second openings is configured to provide on the side surface of the tip portion when the fluid exits the chamber through the set of second openings The fluid curtain. The method of claim 8, wherein the probe system includes a plurality of probe pins partially positioned within the chamber and extending along the first direction, wherein the one or more openings include: a row of first openings, wherein tip portions of the plurality of probe pins respectively extend from the cavity through the row of first openings; and a set of second openings surrounding the row of first openings, wherein the set of second openings is configured so that when the fluid exits the chamber through the set of second openings, between the plurality of probe pins The fluid curtain is provided on the side surface of each of the tip portions. The method of any one of claims 9 and 10, wherein each of the set of second openings includes a proximal inner wall and a distal inner wall, wherein a distance between the distal inner wall and the tip portion a distance greater than a distance between the proximal inner wall and the tip portion, wherein at least one of the proximal inner wall and the distal inner wall extends vertically along the first direction and is horizontal toward the tip portion extended. The method of claim 8, wherein the one or more openings comprise an opening, wherein the tip portion extends from the chamber through the opening, wherein the probe system further comprises a side surface disposed on the tip portion and the A gap between an inner wall of the opening, wherein the gap is configured to provide the fluid curtain on the side surface of the tip portion as the fluid exits the chamber through the gap. The method of claim 12, wherein a diameter of the opening tapers along the first direction. A method of forming a semiconductor device, comprising: providing a semiconductor wafer or an assembly comprising two or more integrated circuit dies; testing the two or more integrated circuit dies using a probe system; singulating the semiconductor wafer or the assembly to form an integrated circuit die; and packaging the integrated circuit die to form the semiconductor device; The probe system includes: a chamber comprising: a fluid inlet configured to allow a fluid to flow into the chamber; and one or more openings formed at a bottom portion of the chamber; and a probe pin partially positioned within the cavity and having a tip portion extending from the cavity in a first direction, wherein the one or more openings are configured to allow the fluid to exit therethrough for injection in the cavity A fluid curtain is provided on a side surface of the tip portion and on a top surface of the integrated circuit die under test under the chamber. The method of claim 14, wherein the one or more openings comprise: a first opening, wherein the tip portion extends from the chamber through the first opening; and a set of second openings surrounding the first opening, wherein the set of second openings is configured to provide on the side surface of the tip portion when the fluid exits the chamber through the set of second openings The fluid curtain. The method of claim 14, comprising a plurality of probe pins partially positioned within the chamber and extending along the first direction, wherein the one or more openings comprise: a row of first openings, wherein tip portions of the plurality of probe pins respectively extend from the cavity through the row of first openings; and a set of second openings surrounding the row of first openings, wherein the set of second openings is configured so that when the fluid exits the chamber through the set of second openings, between the plurality of probe pins The fluid curtain is provided on the side surface of each of the tip portions. The method of any one of claims 15 and 16, wherein each of the set of second openings includes a proximal inner wall and a distal inner wall, wherein a distance between the distal inner wall and the tip portion a distance greater than a distance between the proximal inner wall and the tip portion, wherein at least one of the proximal inner wall and the distal inner wall extends vertically along the first direction and is horizontal toward the tip portion extended. The method of claim 14, wherein the one or more openings comprise an opening, wherein the tip portion extends from the chamber through the opening, wherein the probe system further comprises a side surface disposed on the tip portion and the A gap between an inner wall of the opening, wherein the gap is configured to provide the fluid curtain on the side surface of the tip portion as the fluid exits the chamber through the gap. The method of claim 18, wherein a diameter of the opening tapers along the first direction.

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