JP2005164411A - Inspection method of ic socket and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method of an IC socket and a semiconductor device capable of grasping accurately the accumulated number of times of use of each IC socket respectively. <P>SOLUTION: This IC socket 100 to be mounted on an IC package 50 when inspecting an electric characteristic of the IC package 50 includes a socket body where the IC package 50 is to be mounted; a probe pin 20 for drawing a ball electrode 52 to the outside of the socket body in contact with the ball electrode 52 of the IC package 50 mounted on the socket body; and a memory element 30 for storing the accumulated number of times of contact between the probe pin 20 and the ball electrode 52. The memory element is provided on the socket body. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC socket and a method for inspecting a semiconductor device, and in particular, when inspecting the electrical characteristics of a semiconductor device sealed with a resin package or the like (hereinafter referred to as an IC package) using an IC handler or the like. The present invention relates to a technique for electrically relaying the IC handler and the IC package.

Mass-produced IC packages are subjected to electrical property tests (measurement inspections), burn-in tests (inspections under specified temperature and voltage conditions), etc., in accordance with the package state before being shipped as products. The At that time, an IC socket is widely used as a relay part for connecting an external terminal of the IC package to a terminal such as an IC handler or a tester.
For example, in Patent Document 1, a BGA (Ball Grid Array) type or CSP (Chip Size Package) type IC package is placed on a socket base with its external terminals facing down. Then, a pusher is applied to the opposite side of the external package forming surface of the IC package, and the IC package is pressed against the socket base by the pusher. Thereby, the external terminal of the IC package and the socket terminal of the IC socket are electrically connected.

Such IC sockets vary in size, position of socket terminals, number of socket terminals, and the like for each type of IC package. Further, since the socket terminal of the IC socket comes into contact with the external terminal of the IC package, the socket terminal is gradually worn out. When the IC socket is used several thousand to several tens of thousands of times and the wear of the socket terminal reaches a certain level, it is no longer possible to electrically connect the socket terminal and the external terminal of the IC package. Need to be replaced with a new one. Patent Document 2 describes an IC handler with a life detection function having a function of detecting the life of such an IC socket.
JP 2002-156407 A Japanese Utility Model Publication No. 7-5076

  By the way, in Patent Document 2, an operator or the like sets the number of IC socket lifetimes for each type of socket and attaches a new IC socket to the IC handler. When the IC socket usage count (actual measurement count) reaches the set lifetime count, an alarm or the like is automatically generated from the IC handler to notify the operator of the end of the lifetime. Here, in a so-called low-volume, mass-production type semiconductor manufacturing line that produces and tests small-volume IC packages in large quantities, it is common to use a dedicated IC handler for each type of IC package. After attaching a new IC socket to the IC handler, there was almost no opportunity to remove the IC socket from the IC handler until the end of its life, and it was possible to accurately count the number of times the IC socket was used on the IC handler side. .

  However, in a so-called high-mix low-volume production type semiconductor manufacturing line in which a large variety of IC packages are produced and tested in a small amount, it is common to test several types of IC packages with a single IC handler. For this reason, the IC socket corresponding to one IC package is often removed from the IC handler and the IC socket corresponding to another IC package is attached to this IC handler before the life of the IC socket comes to an end.

In this way, once a new IC socket is removed from the IC handler before the end of its life, the IC socket and the number of uses counted on the IC handler side will not be linked. In the production type semiconductor manufacturing line, there is a problem that it is difficult to accurately grasp the cumulative number of uses for each IC socket.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC socket and a method for inspecting a semiconductor device, which can solve such a problem and can accurately grasp the cumulative number of times each IC socket is used.

  In order to solve the above-described problem, a first IC socket according to the present invention is an IC socket that is attached to a semiconductor device when inspecting the electrical characteristics of the semiconductor device sealed with a package, A socket body for mounting the semiconductor device; a probe terminal that contacts an external terminal of the semiconductor device mounted on the socket body and pulls the external terminal out of the socket body; and the probe terminal and the external Storage means for storing the cumulative number of contacts with the terminal, wherein the storage means is provided in the socket body.

According to the first IC socket of the present invention, the cumulative number of contacts between the probe terminal of the IC socket and the external terminal of the semiconductor device (that is, the cumulative number of times the IC socket is used) can be directly carried with the IC socket. For example, even in a high-mix low-volume production type semiconductor manufacturing line, it is possible to accurately grasp the cumulative number of times each IC socket is used.
According to a second IC socket of the present invention, in the first IC socket described above, the storage means is a memory element, and the memory element is detachably attached to the socket body. It is. Here, the memory element is a non-volatile memory such as a flash memory, for example.

According to the second IC socket of the present invention, since the memory element can be detached from the socket body, it is possible to remove the memory element from the IC socket that has reached the end of its life and replace the memory element with a new IC socket. Since the memory element can be reused regardless of the life of the IC socket, the IC socket can be made inexpensive.
According to a third IC socket of the present invention, in the second IC socket described above, a battery for supplying power to the memory element is provided, and the battery is detachably attached to the socket body. To do. According to the third IC socket of the present invention, the length of the power supply wiring can be reduced as compared with the case where the power is obtained from the outside such as an IC handler. It is possible to suppress noise that occurs.

  A fourth IC socket according to the present invention includes a display device that obtains power from the battery and displays the number of contacts stored in the memory element in the third IC socket described above, and the display device includes the display device described above. It is characterized in that it is detachably attached to the socket body. The fourth IC socket according to the present invention is convenient because the cumulative number of times of use of the IC socket can be viewed at any time.

  According to a fifth IC socket of the present invention, in the first to fourth IC sockets described above, the socket body includes a base member, a plurality of spring members provided on the base member, and the plurality of the plurality of spring members. A plate member provided above the base member via a spring member and provided with a recess for receiving the semiconductor device and fixing its position; and a first contact provided on the lower surface of the plate member A terminal and a second contact terminal provided at a position facing the first contact terminal of the base member, and an opening through the plate member is provided at a position corresponding to the external terminal on the bottom surface of the recess. And the probe terminal is fixed to the base member, and the tip of the probe terminal is gently passed through the opening of the plate member, When the said tip and said external terminals of the child in contact, is characterized in that the first contact terminal and the second contact terminal is in contact.

  According to the fifth IC socket of the present invention, the semiconductor device housed in the concave portion of the plate member is pressed against the base member side against the biasing force of the spring member, whereby the external terminal of the semiconductor device and the IC The probe terminal of the socket can be brought into contact. The contact between the probe terminal and the external terminal can be detected by the contact between the first contact terminal and the second contact terminal. For example, if a predetermined voltage is applied between the first and second contact terminals, the contact can be easily detected by conduction between the contact terminals.

  A method for inspecting a semiconductor device according to the present invention is characterized in that the electrical characteristics of the semiconductor device are inspected using any one of the first to fifth IC sockets described above. . According to the semiconductor device inspection method of the present invention, since the first to fifth IC sockets described above are used, for example, in the high-mix low-volume production type semiconductor manufacturing line, the cumulative number of times of use of each IC socket is determined. Each can be accurately grasped. Thereby, the reliability of a test | inspection can be improved.

Hereinafter, an inspection method for an IC socket and a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings.
(1) 1st Embodiment FIG. 1: is sectional drawing which shows the structural example of the IC socket 100 which concerns on 1st Embodiment of this invention. The IC socket 100 is used, for example, when a BGA (BGA) type IC package 50 is subjected to an electrical characteristic test (measurement inspection), a burn-in test (inspection under a predetermined temperature and voltage condition), and the like. The package 50 is accommodated and the ball electrode 52 is drawn out of the IC socket 100. The IC socket 100 is for electrically connecting the extracted ball electrode 52 to an IC handler (not shown) or the like. As shown in FIG. 1, the IC socket 100 includes an IC socket base 12, a plate 14, a plurality of springs 16, a pair of electrode plates 18a and 18b, a plurality of probe pins 20, an IC handler, and the like. Power supply terminals 22a and 22b for obtaining power from an external power supply (not shown) provided in the memory, a memory element 30 attached to the IC socket base 12, and the like.

  Among these, the plate 14 is provided with a recess 15 for accommodating the IC package 50 on the upper surface thereof. The inner peripheral shape of the recess 15 substantially matches the outer peripheral shape of the IC package 50 and gradually narrows from the upper surface of the plate 14 to the bottom surface thereof. Further, in the vicinity of the bottom surface of the plate 14, the size of the inner periphery of the recess 15 is substantially the same as the size of the outer periphery of the IC package 50.

  With this shape, when the IC package 50 is placed in the recess 15 with the ball electrode 52 of the IC package 50 facing the bottom surface of the recess 15, the IC package 50 is guided to the inner peripheral wall of the recess 15. Positioned on its bottom surface. A plurality of through holes 13 extending from the bottom surface to the lower surface of the plate 14 are provided on the bottom surface of the recess 15. The positions where these through holes 13 are formed correspond to the positions of the ball electrodes 52 of the IC package 50 in a state where they are positioned in the recess 15. The plate 14 is made of an insulating material such as synthetic resin.

  The IC socket base 12 supports the plate 14 from the lower side thereof via a plurality of springs 16. The plate 14 is made of an insulating material such as synthetic resin. Probe pins are fixed to the IC socket base 12 at positions facing the through holes 13, respectively. The tips of these probe pins 20 are gently passed through the through holes 13, respectively.

  As shown in FIG. 1, in a state where no pressure is applied to the spring 16 (non-pressed state), a gap of about 1 to 3 [mm] is secured between the IC socket base 12 and the plate 14, for example. The tip of the probe pin 20 is hidden in the through hole 13 on the bottom surface of the recess 15. Further, when a pressing force is applied to the spring 16 to bring the plate 14 closer to the IC socket base 12 side, the tip of the probe pin is, for example, 0.5 to 1 [max. mm].

  The pair of electrode plates 18 a and 18 b are provided on the upper surface of the IC socket base 12 and the lower surface of the plate 14, respectively. As shown in FIG. 1, these electrode plates 18a and 18b do not contact each other in a non-pressed state, and a gap of, for example, about 1 to 2 [mm] is secured between the electrode plates 18a and 18b in the non-pressed state. ing. Further, when a pressing force is applied to the spring 16 to bring the plate 14 closer to the IC socket base 12 side, the electrode plates 18a and 18b come into contact with each other.

  The power terminals 22a and 22b are provided separately, for example, on the plate 14 and the IC socket base 12, and one power terminal 22a is electrically connected to one electrode plate 18a, and the other power terminal 22b is connected to the other power terminal 22b. Each is electrically connected to the electrode plate 18b. The memory element 30 is composed of a nonvolatile memory capable of writing, reading, and erasing, such as a flash memory. The memory element 30 is provided with an input terminal and an output terminal (not shown) for inputting and outputting electrical signals.

  In the IC socket 100 shown in FIG. 1, wiring (not shown) is provided between the memory element 30 and the electrode plates 18a and 18b, and the power supply terminals 22a and 22b and the memory element 30 are connected via the wiring. Yes. In the IC socket 100, when the electrode plates 18a and 18b are in contact with each other, power is supplied to the memory element 30, and information can be written, read, and erased.

Next, a method for inspecting the electrical characteristics of the IC package 50 using the IC socket 100 will be described.
First, the IC socket 100 shown in FIG. 1 is attached to a socket mounting base of an IC handler (not shown). Further, the probe pin of the IC socket 100 attached to the socket mount is connected to a corresponding terminal on the IC handler side. Further, the power terminals 22a and 22b of the IC socket 100 are connected to an external power source provided in the IC handler. Thereafter, the IC socket 100 remains attached to the socket mount until the type of the IC package 50 to be tested is changed.

  Next, the IC package 50 is placed in the recess 15 with the ball electrode 52 side of the IC package 50 facing the recess 15 of the IC socket 100. Here, even if the IC package 50 is slightly displaced with respect to the concave portion 15, the IC package 50 is guided to a predetermined position by the inner peripheral wall of the concave portion 15, and the ball electrode 52 of the IC package 50 has the concave portion 15. Comes on the bottom through-hole 13. The IC package 50 is placed in the recess 15 by an IC handler transport system (not shown).

  Next, the pusher of the IC handler is moved downward and applied to the upper surface of the IC package 50 to press the IC package 50 toward the plate 14 side. Then, the plate 14 together with the IC package 50 is pressed downward against the urging force of the spring 16, and the probe pin comes out from the inside of the through hole 13 and contacts the ball electrode 52 of the IC package 50.

  Further, at the same time when the ball electrode 52 and the probe pin are in contact, the electrode plate 18 a on the lower surface of the plate 14 and the electrode plate 18 b on the upper surface of the IC socket base 12 are in contact. Therefore, power is supplied from the power terminals 22a and 22b to the memory element 30 through the electrode plates 18a and 18b. Then, with the ball electrode 52 and the probe pin 20 in contact with each other, the electrical characteristics of the IC package 50 are inspected (hereinafter, this inspection is referred to as probe inspection).

  Although the time required for this probe inspection varies depending on the type of device and the test mode, in many cases, it is about several to several tens of seconds per IC package. The electrode plates 18a and 18b remain in contact with each other for about several to several tens of seconds during which the probe inspection is performed. Therefore, the number of contacts between the electrode plates 18a and 18b (that is, the number of conductions between the external terminals) is equal to the number of contacts between the ball electrode 52 and the probe pin, and the number of contacts between the electrode plates 18a and 18b is the IC socket 100. It can be regarded as the number of times used. Therefore, the IC handler side or the memory element 30 is provided with a counting circuit for counting the number of times of contact between the electrode plates 18a and 18b.

  In this example, the counting circuit is provided on the IC handler side, for example, and the number of contacts counted by the counting circuit is stored in the memory element 30 via an input terminal (not shown) of the memory element 30. The Further, since the memory element 30 is non-volatile, even when the power is turned off at a constant interval every time the measurement of the IC package 50 is completed, information regarding the number of contacts between the electrode plates 18a and 18b can be maintained with high reliability. Is possible.

  As described above, according to the IC socket 100 according to the present invention, the cumulative number of times of contact between the probe pin of the IC socket 100 and the ball electrode 52 of the IC package 50 (that is, the cumulative number of times of use of the IC socket 100) is calculated. Since the IC socket 100 can be directly carried along with the IC handler 100, the accumulated number of use times of each IC socket 100 can be accurately grasped even in a high-mix low-volume production type semiconductor manufacturing line in which the IC socket 100 is often removed from the IC handler. Thereby, the reliability of the probe inspection can be improved.

In the first embodiment, the IC socket base 12 corresponds to the base member of the present invention, and the spring 16 corresponds to the spring member of the present invention. The plate 14 corresponds to the plate member of the present invention, and the probe pin 20 corresponds to the probe terminal of the present invention. Furthermore, the electrode plate 18a corresponds to the first contact terminal of the present invention, and the electrode plate 18b corresponds to the second contact terminal of the present invention. Moreover, the recessed part 15 respond | corresponds to the recessed part of this invention, and the through-hole 13 respond | corresponds to the opening part which penetrates the plate member of this invention. Further, the IC package 50 corresponds to the semiconductor device of the present invention, and the ball electrode 52 corresponds to the external terminal of the semiconductor device of the present invention. In the first embodiment, the IC socket base 12, the spring 16, the plate 14, and the electrode plates 18a and 18b constitute the socket body of the present invention.
(2) Second Embodiment FIG. 2 is a cross-sectional view showing a configuration example of an IC socket 200 according to a second embodiment of the present invention. The IC socket 200 is different from the IC socket 100 described in the first embodiment in that the power supplied to the memory element 30 is provided not in the IC handler or the like but in the IC socket itself. Accordingly, in FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 2, the IC socket 200 is provided with an internal power source such as a battery 40 in a detachable manner on the plate 14 side. Then, when the electrode plate 18a on the lower surface of the plate 14 and the electrode plate 18b on the upper surface of the IC socket base 12 come into contact with each other, power is supplied from the battery 40 to the memory element 30 via the electrode plates 18a and 18b. The The power supply wiring from the battery 40 to the memory element 30 via the electrode plates 18a and 18b is routed so as to pass through a position as far as possible from the probe pin.

According to such a configuration, the power supply terminals 22a and 22b (see FIG. 1) can be eliminated as compared with the case where power is obtained from the outside such as an IC handler. In addition, since the length of the wiring from the power source to the memory element 30 can be shortened, it is possible to reduce noise that occurs when the IC package 50 is inspected. In the second embodiment, the battery 40 corresponds to the battery of the present invention.
(3) Third Embodiment FIGS. 3A and 3B are cross-sectional views showing a configuration example of an IC socket 300 according to a third embodiment of the present invention. As shown in FIG. 3A, this IC socket 300 is provided with a battery 40 on the plate 14 side as with the IC socket 200 described in the second embodiment, and further displays the number of times the IC socket is used. 45 is provided on the side surface of the plate 14.

The liquid crystal monitor 45 obtains its power from the battery 40. According to such a configuration, as shown in FIG. 3B, the cumulative number of times the IC socket 300 is used can be confirmed at any time by visually checking the liquid crystal monitor 45 (displaying 99999 times as an example). Convenient. In the third embodiment, the liquid crystal monitor 45 corresponds to the display device of the present invention.
The memory element 30 and the liquid crystal monitor 45 described in the first to third embodiments may be removable from the C sockets 100, 200, and 300. In addition, the old data relating to the cumulative number of times of use stored in the memory element 30 is erased when the memory element 30 is removed from the IC sockets 100, 200, 300. According to such a configuration, even after the IC socket has reached the end of its life, the memory element 30 and the liquid crystal monitor 45 can be attached to a new IC socket and reused, so that the IC sockets 100, 200, and 300 are inexpensive. Can be.

Sectional drawing which shows the structural example of IC socket 100 which concerns on 1st Embodiment. Sectional drawing which shows the structural example of IC socket 200 which concerns on 2nd Embodiment. Sectional drawing which shows the structural example of IC socket 300 which concerns on 3rd Embodiment.

Explanation of symbols

  12 IC socket base, 13 through-hole, 14 plate, 15 recess, 16 spring, 18a, 18b electrode plate, 20 probe pin, 22a, 22b power supply terminal, 30 memory element, 40 battery, 45 LCD monitor, 50 IC package , 52 Ball electrode, 100, 200, 300 IC socket

Claims (6)

An IC socket attached to a semiconductor device when inspecting the electrical characteristics of the semiconductor device sealed with a package,
A socket body for mounting the semiconductor device;
A probe terminal that contacts the external terminal of the semiconductor device mounted on the socket body and pulls the external terminal out of the socket body;
An IC socket comprising storage means for storing the cumulative number of times of contact between the probe terminal and the external terminal, wherein the storage means is provided in the socket body. The storage means is a memory element;
2. The IC socket according to claim 1, wherein the memory element is detachably attached to the socket body. A battery for supplying power to the memory element;
3. The IC socket according to claim 2, wherein the battery is detachably attached to the socket body. A display device that obtains a power source from the battery and displays the number of contacts stored in the memory element;
The IC socket according to claim 3, wherein the display device is detachably attached to the socket body. The socket main body is provided with a base member, a plurality of spring members provided on the base member, and above the base member via the plurality of spring members, and houses the semiconductor device. A plate member having a recess for fixing the position, a first contact terminal provided on the lower surface of the plate member, and a second contact terminal provided at a position facing the first contact terminal of the base member And consist of
An opening that penetrates the plate member is provided at a position corresponding to the external terminal on the bottom surface of the recess, and the probe terminal is fixed to the base member, and the tip of the probe terminal is located on the plate member. It is gently passed through the opening,
The first contact terminal and the second contact terminal are in contact with each other when the tip of the probe terminal and the external terminal are in contact with each other. The IC socket as described.   6. An inspection method for a semiconductor device, comprising: using the IC socket according to claim 1 to inspect an electrical characteristic of the semiconductor device.

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