JP2017062164A - Semiconductor inspection device and method for inspecting electronic device - Google Patents

Semiconductor inspection device and method for inspecting electronic device Download PDF

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JP2017062164A
JP2017062164A JP2015187338A JP2015187338A JP2017062164A JP 2017062164 A JP2017062164 A JP 2017062164A JP 2015187338 A JP2015187338 A JP 2015187338A JP 2015187338 A JP2015187338 A JP 2015187338A JP 2017062164 A JP2017062164 A JP 2017062164A
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contactor
heat insulating
electronic device
dry air
cooling device
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鈴木　栄一
Eiichi Suzuki
栄一 鈴木
功造 飯島
Kozo Iijima
功造 飯島
修一 横田
Shuichi Yokota
修一 横田
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Ablic Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a compact semiconductor inspection device in which no dew condensation occurs in a measurement at low temperature.SOLUTION: A heat insulation part is provided in the periphery of, and apart from, a cooling device 105 and a contactor 104, and a space between the heat insulation part and the cooling device 105 and contactor 104 constitutes a dry air passage in which dry air flows. The heat insulation part is of a three-layer laminate structure, composed of, in order from the inside, a first heat insulation layer 106, a heater 107, and a second heat insulation layer 108, the heat insulation part having a second opening 109 below the cooling device 105 that constitutes a dry air supply port, and having a first opening 102 above the contactor 104 that constitutes a dry air exhaust port.SELECTED DRAWING: Figure 1

Description

本発明は、半導体検査装置、特には結露防止付き半導体検査装置およびそれを用いた電子デバイスの検査方法に関する。   The present invention relates to a semiconductor inspection apparatus, in particular, a semiconductor inspection apparatus with condensation prevention and an electronic device inspection method using the same.

電子デバイスの特性を確認するために温度特性を検査するが、特に低温時の電気的特性を検査する場合、電子デバイスを規定の温度まで冷却した状態で電気的特性の検査を実施する。この場合、冷却する際に電子デバイスや測定部が外気に触れると結露が発生してしまい、リーク電流等により正しい検査結果が得られない。電子デバイスや測定部に結露が発生するのを防止するため、一般には電子デバイスの周辺に密閉空間を形成し外気を遮断する必要がある。（例えば、特許文献１参照）   In order to confirm the characteristics of the electronic device, the temperature characteristics are inspected. In particular, when the electrical characteristics at a low temperature are inspected, the electrical characteristics are inspected with the electronic device cooled to a specified temperature. In this case, when the electronic device or the measurement unit comes into contact with the outside air during cooling, condensation occurs, and a correct test result cannot be obtained due to leakage current or the like. In order to prevent condensation on the electronic device and the measurement unit, it is generally necessary to form a sealed space around the electronic device to block outside air. (For example, see Patent Document 1)

特開２０００−３５４５８号公報JP 2000-35458 A

しかしながら、測定部全体を密閉する機構では必然的に装置が大型となってしまう。また、汎用性に乏しく装置が高価になってしまうという問題もある。さらに、測定部を密閉しているため電子デバイスを測定部に移動させる前に湿度緩衝用の空間で待機させる必要があるためスループットが低下してしまうという問題がある。
本発明は上記問題解決を鑑みなされたもので、結露防止機能を有するにもかかわらず、小型でスループットの低下しない半導体検査装置の提供を課題とする。 However, a mechanism that seals the entire measurement unit inevitably increases the size of the apparatus. There is also a problem that the apparatus becomes expensive due to poor versatility. Furthermore, since the measurement unit is hermetically sealed, it is necessary to wait in the humidity buffering space before the electronic device is moved to the measurement unit.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor inspection apparatus that is small in size and does not reduce throughput despite having a dew condensation prevention function.

上記課題を解決するために以下のような手段を用いた。
まず、電子デバイスの電気特性を検査する半導体検査装置において、上部に凹部を有し、前記凹部に前記電子デバイスを収納して電気特性を測定するコンタクタと、前記コンタクタを介して前記電子デバイスを冷却するための冷却装置と、前記コンタクタおよび前記冷却装置を囲むように、離間して設けられ断熱部と、前記コンタクタ側に前記断熱部を開口して設けられ、ドライエアを排気する第１開口部と、前記冷却装置側に前記断熱部を開口して設けられ、前記ドライエアを供給する第２開口部と、前記コンタクタおよび前記冷却装置と前記断熱部との間に設けられた空間に前記ドライエアを流すためのドライエア通路とを備えることを特徴とする半導体検査装置とした。 In order to solve the above problems, the following means were used.
First, in a semiconductor inspection apparatus for inspecting electrical characteristics of an electronic device, a contactor that has a recess in the upper part, houses the electronic device in the recess and measures electrical characteristics, and cools the electronic device through the contactor A cooling device for carrying out the operation, a heat insulating portion provided so as to surround the contactor and the cooling device, and a first opening for opening the heat insulating portion on the contactor side and exhausting dry air The heat insulating portion is opened on the cooling device side, and the dry air is allowed to flow through a second opening for supplying the dry air, and a space provided between the contactor, the cooling device, and the heat insulating portion. And a dry air passage for the semiconductor inspection apparatus.

また、電子デバイスの低温における電気特性を検査する方法であって、冷却装置に接して設けられたコンタクタを冷却する工程と、前記冷却装置および前記コンタクタと離間して設けられた断熱部との間の空間にドライエアを流す工程と、コレットを用いて前記コンタクタの凹部に前記電子デバイスを搬入する工程と、前記電子デバイスを所定の温度まで冷却する工程と、冷却された前記電子デバイスの電気特性を測定する工程と、前記コレットを用いて前記電子デバイスを搬出する工程と、からなることを特徴とする電子デバイスの検査方法を用いることとした。   Further, it is a method for inspecting electrical characteristics of an electronic device at a low temperature between a step of cooling a contactor provided in contact with a cooling device and a heat insulating portion provided apart from the cooling device and the contactor. A step of flowing dry air through the space, a step of bringing the electronic device into a concave portion of the contactor using a collet, a step of cooling the electronic device to a predetermined temperature, and electrical characteristics of the cooled electronic device. The method for inspecting an electronic device is characterized by comprising a step of measuring and a step of unloading the electronic device using the collet.

本発明によれば、電子デバイス、および、コンタクタを密閉しドライエアを充満することなく結露を防止しながら低温時の電気的特性検査が可能となるため、電子デバイス、および、コンタクタの密閉機構が不要となり装置の小型化が可能となる。
また、湿度緩衝用の空間も不要となるため電子デバイスを移動するための待機時間がなく、ロータリー式ハンドラを用いることで更なるスループットの向上が見込める。 According to the present invention, since the electronic device and the contactor can be sealed and electrical characteristics can be inspected at low temperatures while preventing condensation without being filled with dry air, the electronic device and the contactor sealing mechanism are not required. Thus, the device can be miniaturized.
Further, since a space for buffering humidity is not required, there is no waiting time for moving the electronic device, and further improvement in throughput can be expected by using a rotary handler.

本発明の実施例における冷却手段を備えたロータリー式半導体検査装置の断面図である。It is sectional drawing of the rotary type semiconductor inspection apparatus provided with the cooling means in the Example of this invention.

図１を参照し、本発明の実施の形態を説明する。図１は本発明の実施例における冷却手段を備えたロータリー式半導体検査装置の構成を説明する半導体検査装置の断面図である。ロータリー式半導体検査装置とはロータリー式ハンドラと組み合わせることにより、検査を行うポイントに電子デバイスを自動的に搬送して設置し、連続的に検査ができる装置である。   An embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view of a semiconductor inspection apparatus for explaining the configuration of a rotary semiconductor inspection apparatus provided with a cooling means in an embodiment of the present invention. A rotary semiconductor inspection apparatus is an apparatus that can be continuously inspected by automatically transporting and installing an electronic device at a point to be inspected by combining with a rotary handler.

図１に示すように本発明の実施形態に関する半導体検査装置は、冷却装置１０５と、冷却装置１０５の上に接触して設けられたコンタクタ１０４を有する。コンタクタの上部には凹部１１０が設けられ、この中に配置された測定端子が電子デバイス１０３と接触して電子デバイスの電気特性を測定できるというものである。冷却装置１０５にはペルチェ素子を用いても良い。   As shown in FIG. 1, the semiconductor inspection apparatus according to the embodiment of the present invention includes a cooling device 105 and a contactor 104 provided in contact with the cooling device 105. A concave portion 110 is provided in the upper part of the contactor, and a measurement terminal arranged in the concave portion 110 comes into contact with the electronic device 103 to measure the electrical characteristics of the electronic device. A Peltier element may be used for the cooling device 105.

冷却装置１０５およびコンタクタ１０４の周囲には、これらと離間して設けられた断熱部が設けられ、この断熱部と冷却装置１０５およびコンタクタ１０４との間の空間はドライエアが流れるドライエア通路となっている。断熱部は３層の積層構造で内側から第１断熱層１０６、ヒーター１０７、第２断熱層１０８という構成である。断熱部は冷却装置１０５の下方にドライエア供給口となる第２開口部１０９を有し、コンタクタ１０４の上方に第１開口部１０２を有している。第１開口部１０２はドライエアの系外への排気口になるとともに、第１開口部１０２の上方に待機して図示されている、電子デバイス１０３を移動するためのコレット１０１の上下動作における通路にもなる。   Around the cooling device 105 and the contactor 104, there is provided a heat insulating portion provided apart from these, and a space between the heat insulating portion and the cooling device 105 and the contactor 104 is a dry air passage through which dry air flows. . The heat insulating part has a three-layer laminated structure, and has a structure of a first heat insulating layer 106, a heater 107, and a second heat insulating layer 108 from the inside. The heat insulating portion has a second opening 109 serving as a dry air supply port below the cooling device 105, and a first opening 102 above the contactor 104. The first opening 102 serves as an exhaust port for the dry air to the outside of the system, and is a passage in the up-and-down operation of the collet 101 for moving the electronic device 103 that is illustrated above the first opening 102 while waiting. Also become.

冷却装置１０５とコンタクタ１０４とは、断熱部内部に固定される。固定には、例えば断熱材により形成された支持体１１２を用いることができる、冷却装置１０５と第１断熱層１０６に支持体を配置して固定することができる。
半導体検査装置は小型であるのでどこにでも設置が可能であるが、例えば、ドライエア発生装置１２０の上に設置することも可能である。 The cooling device 105 and the contactor 104 are fixed inside the heat insulating portion. For the fixing, for example, a support 112 formed of a heat insulating material can be used. The support can be arranged and fixed to the cooling device 105 and the first heat insulating layer 106.
Since the semiconductor inspection apparatus is small, it can be installed anywhere. For example, it can be installed on the dry air generator 120.

上記構成を有する半導体検査装置の動作について次に説明する。
コンタクタ１０４は冷却装置１０５により冷却され、電子デバイス１０３はコレット１０１により冷却されたコンタクタ１０４上部に設けられた凹部１１０へ搬送され、熱伝導により所定の温度まで冷却される。そして、冷却された電子デバイス１０３の電気特性を測定する。測定後の電子デバイス１０３は、コレット１０１によりコンタクタ１０４より搬出される。これにより電気特性検査の１サイクルが完了する。同時に次の新しい電子デバイス１０３がコレット１０１によりコンタクタ１０４の凹部１１０へ搬送され、これが所定の温度まで冷却されれば次のサイクルの測定をすることになる。 Next, the operation of the semiconductor inspection apparatus having the above configuration will be described.
The contactor 104 is cooled by the cooling device 105, and the electronic device 103 is conveyed to the concave portion 110 provided on the contactor 104 and cooled by the collet 101, and is cooled to a predetermined temperature by heat conduction. Then, the electrical characteristics of the cooled electronic device 103 are measured. The electronic device 103 after measurement is carried out of the contactor 104 by the collet 101. This completes one cycle of electrical property inspection. At the same time, the next new electronic device 103 is transferred to the concave portion 110 of the contactor 104 by the collet 101, and if it is cooled to a predetermined temperature, the next cycle is measured.

コンタクタ１０４は上部が円錐形状になっており、第１開口部１０２から排気されるドライエアを、コンタクタ１０４及びコレット１０１が保持する電子デバイス１０３を包み込むようにドライエアの層を形成することで、外気を測定部から隔離し、電子デバイス１０３とコンタクタ１０４の結露を防止することができる。   The contactor 104 has a conical shape at the top, and a dry air layer is formed so as to wrap the dry air exhausted from the first opening 102 so as to enclose the electronic device 103 held by the contactor 104 and the collet 101. It is possible to prevent condensation of the electronic device 103 and the contactor 104 by separating from the measurement unit.

冷却装置１０５などの低温部は第１断熱層１０６により外気より断熱されるが、第１断熱層１０６のみの場合、熱伝導により時間経過とともに第１断熱層１０６の温度が低下し、第１断熱層１０６表面が結露してしまう。そのため、外気温よりも充分に高い温度で定温制御したヒーター１０７で第１断熱層１０６を囲み加熱することで結露を防止できる。   The low temperature part such as the cooling device 105 is insulated from the outside air by the first heat insulating layer 106, but in the case of only the first heat insulating layer 106, the temperature of the first heat insulating layer 106 decreases with time due to heat conduction, and the first heat insulating layer 106 The surface of the layer 106 is condensed. Therefore, dew condensation can be prevented by surrounding and heating the first heat insulating layer 106 with the heater 107 that is controlled at a temperature sufficiently higher than the outside air temperature.

一方、第１断熱層１０６と冷却装置１０５などの低温部の間にはドライエアの通路があるため、第１断熱層１０６からは充分に断熱される。加えて、このような構成にすることで、冷却装置１０５などの冷却部は外気より完全に断熱されるため、気温の変化に影響されにくくなる。作業者への安全性を考慮し、ヒーター１０７を露出させないために第２断熱層１０８がある。これにより、ロータリー式ハンドラを用いても、電子デバイス１０３、および、コンタクタ１０４を密閉しドライエアを充満するための空間を設けることなく、結露せず電子デバイス１０３の低温における電気的特性検査が可能となる。そのため、電子デバイス１０３、および、コンタクタ１０４の密閉機構が不要となり装置の小型化が可能となる。また、湿度緩衝用の空間も不要となるため電子デバイスを移動するための待機時間がなく、ロータリー式ハンドラを用いることで更なるスループットの向上が見込める。加えて、上記説明の構成では、温度特性検査における外気温変化の影響を減少させることができる。   On the other hand, since there is a dry air passage between the first heat insulating layer 106 and the low temperature part such as the cooling device 105, the first heat insulating layer 106 is sufficiently insulated. In addition, by adopting such a configuration, the cooling unit such as the cooling device 105 is completely insulated from the outside air, so that it is less susceptible to changes in the temperature. In consideration of safety for workers, the second heat insulating layer 108 is provided so as not to expose the heater 107. As a result, even if a rotary handler is used, the electronic device 103 and the contactor 104 can be sealed and a space for filling with dry air can be provided, and electrical characteristics inspection of the electronic device 103 at a low temperature can be performed without condensation. Become. Therefore, the electronic device 103 and the sealing mechanism of the contactor 104 are not required, and the apparatus can be downsized. Further, since a space for buffering humidity is not required, there is no waiting time for moving the electronic device, and further improvement in throughput can be expected by using a rotary handler. In addition, with the configuration described above, it is possible to reduce the influence of changes in the outside air temperature in the temperature characteristic inspection.

本発明は、温度センサーＩＣなどを測定するために、温度特性測定装置を有する半導体検査装置に広く利用することが出来る。   The present invention can be widely used in a semiconductor inspection apparatus having a temperature characteristic measuring apparatus for measuring a temperature sensor IC or the like.

１０１ コレット
１０２ 第１開口部
１０３ 電子デバイス
１０４ コンタクタ
１０５ 冷却装置
１０６ 第１断熱層
１０７ ヒーター
１０８ 第２断熱層
１０９ 第２開口部
１１０ 凹部
１１２ 支持体
１２０ ドライエア発生装置 DESCRIPTION OF SYMBOLS 101 Collet 102 1st opening part 103 Electronic device 104 Contactor 105 Cooling device 106 1st heat insulation layer 107 Heater 108 2nd heat insulation layer 109 2nd opening part 110 Recessed part 112 Support body 120 Dry air generator

Claims (5)

電子デバイスの電気特性を検査する半導体検査装置において、
上部に凹部を有し、前記凹部に前記電子デバイスを収納して電気特性を測定するコンタクタと、
前記コンタクタを介して前記電子デバイスを冷却するための冷却装置と、
前記コンタクタおよび前記冷却装置を囲んで、離間して設けられた断熱部と、
前記断熱部の前記コンタクタ側に開口して設けられた、ドライエアを排気する第１開口部と、
前記断熱部の前記冷却装置側に開口して設けられた、前記ドライエアを供給する第２開口部と、
前記コンタクタおよび前記冷却装置と前記断熱部との間に設けられた、前記ドライエアを流すためのドライエア通路と、
前記コンタクタと前記冷却装置を前記断熱部に固定するために、前記ドライエア通路の一部に設けられた支持体と、
を備えることを特徴とする半導体検査装置。 In semiconductor inspection equipment that inspects the electrical characteristics of electronic devices,
A contactor that has a recess in the upper part and houses the electronic device in the recess to measure electrical characteristics;
A cooling device for cooling the electronic device via the contactor;
Surrounding the contactor and the cooling device, a heat insulating portion provided separately,
A first opening for exhausting dry air provided on the contactor side of the heat insulating part;
A second opening for supplying the dry air, provided to be opened on the cooling device side of the heat insulating part;
A dry air passage for flowing the dry air, provided between the contactor and the cooling device and the heat insulating portion;
A support provided in a part of the dry air passage for fixing the contactor and the cooling device to the heat insulating portion;
A semiconductor inspection apparatus comprising: 前記断熱部が第１断熱層とヒーターと第２断熱層からなる３層構造であることを特徴とする請求項１記載の半導体検査装置。   The semiconductor inspection apparatus according to claim 1, wherein the heat insulating portion has a three-layer structure including a first heat insulating layer, a heater, and a second heat insulating layer. 前記冷却装置がペルチェ素子であることを特徴とする請求項１または請求項２記載の半導体検査装置   3. The semiconductor inspection apparatus according to claim 1, wherein the cooling device is a Peltier element. 電子デバイスの低温における電気特性を検査する方法であって、
冷却装置に接して設けられたコンタクタを冷却する工程と、
前記冷却装置および前記コンタクタと離間して設けられた断熱部との間の空間にドライエアを流す工程と、
コレットを用いて前記コンタクタの凹部に前記電子デバイスを搬入する工程と、
前記電子デバイスを所定の温度まで冷却する工程と、
冷却された前記電子デバイスの電気特性を測定する工程と、
前記コレットを用いて前記電子デバイスを搬出する工程と、からなることを特徴とする電子デバイスの検査方法。 A method for inspecting electrical characteristics of electronic devices at low temperatures,
Cooling the contactor provided in contact with the cooling device;
Flowing dry air through a space between the cooling device and the contactor and a heat insulating part provided apart from the contactor;
Carrying the electronic device into the concave portion of the contactor using a collet;
Cooling the electronic device to a predetermined temperature;
Measuring the electrical properties of the cooled electronic device;
And a step of unloading the electronic device using the collet. 前記断熱部は第１断熱層とヒーターと第２断熱層とからなり、前記ヒーターを外気温よりも充分に高い温度に定温制御する工程をさらに有することを特徴とする請求項４記載の電子デバイスの検査方法。   The electronic device according to claim 4, wherein the heat insulating portion includes a first heat insulating layer, a heater, and a second heat insulating layer, and further includes a step of controlling the temperature of the heater to a temperature sufficiently higher than an outside air temperature. Inspection method.
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JPH07209373A (en) * 1993-11-30 1995-08-11 Nec Corp Cooling tester
JPH11176547A (en) * 1997-12-12 1999-07-02 Yokowo Co Ltd Socket for ball grid alley
JP2000101000A (en) * 1998-09-18 2000-04-07 Hitachi Ltd Electronic equipment
JP2003315406A (en) * 2002-04-23 2003-11-06 Fujitsu Ltd Low temperature test apparatus for semiconductor device using electronic cooling element
JP2005164411A (en) * 2003-12-03 2005-06-23 Seiko Epson Corp Inspection method of ic socket and semiconductor device
JP2007163193A (en) * 2005-12-12 2007-06-28 Sumitomo Electric Ind Ltd Inspection device for temperature characteristics
US20090153171A1 (en) * 2007-12-13 2009-06-18 Sang-Sik Lee Apparatus for testing objects under controlled conditions

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07209373A (en) * 1993-11-30 1995-08-11 Nec Corp Cooling tester
JPH11176547A (en) * 1997-12-12 1999-07-02 Yokowo Co Ltd Socket for ball grid alley
JP2000101000A (en) * 1998-09-18 2000-04-07 Hitachi Ltd Electronic equipment
JP2003315406A (en) * 2002-04-23 2003-11-06 Fujitsu Ltd Low temperature test apparatus for semiconductor device using electronic cooling element
JP2005164411A (en) * 2003-12-03 2005-06-23 Seiko Epson Corp Inspection method of ic socket and semiconductor device
JP2007163193A (en) * 2005-12-12 2007-06-28 Sumitomo Electric Ind Ltd Inspection device for temperature characteristics
US20090153171A1 (en) * 2007-12-13 2009-06-18 Sang-Sik Lee Apparatus for testing objects under controlled conditions

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