KR101868347B1 - Testing apparatus for semiconductor package - Google Patents

Testing apparatus for semiconductor package Download PDF

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Publication number
KR101868347B1
KR101868347B1 KR1020170122512A KR20170122512A KR101868347B1 KR 101868347 B1 KR101868347 B1 KR 101868347B1 KR 1020170122512 A KR1020170122512 A KR 1020170122512A KR 20170122512 A KR20170122512 A KR 20170122512A KR 101868347 B1 KR101868347 B1 KR 101868347B1
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KR
South Korea
Prior art keywords
housing
semiconductor package
temperature
tray
heating block
Prior art date
Application number
KR1020170122512A
Other languages
Korean (ko)
Inventor
김성식
Original Assignee
김성식
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Filing date
Publication date
Application filed by 김성식 filed Critical 김성식
Priority to KR1020170122512A priority Critical patent/KR101868347B1/en
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Publication of KR101868347B1 publication Critical patent/KR101868347B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

Abstract

The present invention relates to an apparatus to test a semiconductor package, comprising a tray on which a semiconductor package is mounted; a housing placed on the upper part of the tray to face the semiconductor package and being in contact with the tray; a heating block placed in the housing and receiving external power to be heated; and a temperature sensor placed in the housing to be disposed between the heating block and the semiconductor package and configured to measure the temperature of the semiconductor package. According to the present invention, the heating block to heat the semiconductor package is embedded in the housing, thereby providing an advantage of easily performing a test for a high temperature environment without additional equipment. Moreover, the temperature of the semiconductor package is measured by using the temperature sensor mounted inside the housing, thereby providing an advantage of realizing an accurate temperature condition with respect to the temperature of the semiconductor package without depending on indirect measurement of the temperature of a surrounding environment.

Description

[0001] TESTING APPARATUS FOR SEMICONDUCTOR PACKAGE [0002]

Embodiments relate to a testing apparatus for a semiconductor package and more particularly to a technique for enabling heating based on the temperature of a semiconductor package by embedding a temperature sensor in a housing of a testing apparatus will be.

In the manufacture of electronic components such as integrated circuit devices, devices are assembled in units of packaged integrated circuit devices (hereinafter, referred to as "semiconductor packages") and tests for electrical performance, thermal stress, and the like are performed. The completed semiconductor package should be able to ensure normal operation not only at room temperature but also at a certain low temperature or a certain high temperature. Therefore, when the semiconductor package does not operate at a certain low or high temperature or operates abnormally, such a semiconductor package is classified as defective.

In order to conduct a test on a completed semiconductor package or a semiconductor package determined to be defective, it is necessary to heat or cool the semiconductor package to a desired temperature. As a conventional technique for such a test, Japanese Patent Application Laid-Open No. 10-2008-0096068 discloses a method for manufacturing a semiconductor device, which uses a plurality of peltier blocks for controlling the temperature, To thereby control the heating temperature of the semiconductor package.

However, in the case of the prior art including the patent document 10-2008-0096068, the temperature of the semiconductor package is indirectly measured by measuring the temperature of the heating means, instead of directly measuring the temperature of the semiconductor package, . Therefore, according to the related art, there is a disadvantage that the reliability of the analysis result is low because the semiconductor package is subjected to the completeness test or analysis in a state in which the temperature of the semiconductor package can not be guaranteed to reach the desired temperature accurately.

Korean Patent Publication No. 10-2008-0096068

Accordingly, the present invention provides a test apparatus for heating a semiconductor package, wherein the temperature is measured using a temperature sensor mounted in a housing of the test apparatus, thereby performing heating based on the temperature of the semiconductor package itself The present invention has been made in view of the above problems.

The apparatus for testing a semiconductor package according to an exemplary embodiment includes: a tray on which a semiconductor package is mounted; A housing disposed on the tray to face the semiconductor package and in contact with the tray; A heating block located in the housing and heated by external power; And a temperature sensor positioned within the housing to be disposed between the heating block and the semiconductor package, the temperature sensor configured to measure the temperature of the semiconductor package.

In one embodiment, the housing is made of a thermally conductive material and is heated by the heating block in contact with the heating block.

In one embodiment, the housing includes a through hole formed in a lower surface of the housing, and an insertion groove formed in the housing and connected to the through hole to receive the temperature sensor and the heating block.

In one embodiment, the temperature sensor is further configured to measure the surface temperature of the semiconductor package below the housing in a non-contact manner through the through-hole.

In one embodiment, the temperature sensor is further configured to measure the surface temperature by detecting infrared radiation emitted from the semiconductor package.

In one embodiment, the temperature sensor is configured to further measure the temperature of the heating block.

The testing apparatus of the semiconductor package according to an embodiment further includes a heat insulating envelope surrounding the outer surface of the housing.

The apparatus for testing a semiconductor package according to an embodiment further includes a temperature controller electrically connected to the temperature sensor and the heating block, configured to receive a temperature measurement value of the temperature sensor and to apply power to the heating block do.

In one embodiment, the temperature controller is further configured to adjust the magnitude of the power applied to the heating block such that the temperature measurement of the temperature sensor reaches a predetermined set value.

The apparatus for testing a semiconductor package according to an embodiment further includes a fixing unit coupled to the housing and fixed to the tray with the housing positioned on the tray.

A test apparatus for a semiconductor package according to the present invention is characterized in that a heating block for heating a semiconductor package is built in a housing of a test apparatus, There is an advantage to be able to do.

In addition, since the semiconductor package testing apparatus according to the present invention is configured to measure the temperature of the semiconductor package using the temperature sensor mounted in the housing, it is possible to measure the temperature of the semiconductor package itself It is possible to realize a more accurate temperature condition based on the temperature of the substrate.

1 is a perspective view of a tray on which a semiconductor package is mounted in a testing apparatus of a semiconductor package according to an embodiment.
2A and 2B are perspective views of a heating unit of a testing apparatus for a semiconductor package according to an embodiment.
3 is a cross-sectional view of a heating unit and a tray of a testing apparatus of a semiconductor package according to an embodiment.
4 is a photograph of a test apparatus for a semiconductor package according to an embodiment.
5 is a configuration diagram of a semiconductor package including a testing apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Where reference in the specification to "above " another part, it may be directly on the other part or be accompanied by another part therebetween. In contrast, when a section is referred to as being "directly above" another section, no other section is involved.

Herein, the terms first, second and third, etc. are used to describe various parts, components, regions, layers and / or sections, but are not limited thereto. These terms are only used to distinguish any moiety, element, region, layer or section from another moiety, moiety, region, layer or section. Thus, a first portion, component, region, layer or section described below may be referred to as a second portion, component, region, layer or section without departing from the scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms as used herein include plural forms as long as the phrases do not expressly express the opposite meaning thereto. Means that a particular feature, region, integer, step, operation, element and / or component is specified and that the presence or absence of other features, regions, integers, steps, operations, elements, and / It does not exclude addition.

The term " below ", "above ", and the like, which denote relative space in this specification, can be used to more easily describe the relationship to other parts of a part shown in the drawings. These terms are intended to include other meanings or acts of the apparatus in use, as well as intended meanings in the drawings. For example, when inverting a device in the figures, certain parts that are described as being "below" other parts are described as being "above " other parts. Thus, an exemplary term "below" includes both up and down directions. The device can be rotated by 90 degrees or rotated at different angles, and terms indicating relative space are interpreted accordingly.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Commonly used predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.

1 is a perspective view of a tray on which a semiconductor package is mounted in a testing apparatus of a semiconductor package according to an embodiment.

Referring to FIG. 1, a tray 1 of a testing apparatus for a semiconductor package according to the present embodiment includes at least one seating groove 10. Each seating groove 10 is a portion on which a housing of a heating section described later is placed. The tray 1 may include a plurality of the seating grooves 10 to test a plurality of semiconductor packages at the same time. A depression (100) is formed on the bottom surface of each seating groove (10), and the semiconductor package corresponding to the test object can be mounted in the depression (100).

In this specification, the semiconductor package refers to an apparatus which is an object to be analyzed for performance or badness by heating to a specific temperature by using a testing apparatus, for example, an integrated circuit (IC) including one or more semiconductor elements, ) Refers to a device in which a packaging process such as wire bonding of terminals for electrical connection after mounting a chip on a substrate and molding for protecting the device is performed.

The tray 1 mounts such a semiconductor package and conveys heat to the semiconductor package by being heated through contact with the housing of the heating section. For this purpose, the tray 1 is at least partly made of a material having thermal conductivity, such as metal. For example, the portion of the seating groove 10 which is in contact with the housing of the heating unit in the tray 1 may be made of a thermally conductive material such as a metal.

2A and 2B are perspective views of a heating unit of a testing apparatus for a semiconductor package according to an embodiment, wherein FIG. 2A shows a configuration in which a tray 1 on which a semiconductor package is mounted is opened, FIG. And shows the arrangement in which the heating section 2 is placed on the tray 1.

In one embodiment, the heating section 2 includes a housing 20 made of a thermally conductive material and a heat-insulating envelope 21 surrounding the outer surface of the housing 20. For example, the housing 20 may be made of a material that is relatively thermally conductive, such as copper (Cu) or other metal. On the other hand, the heat insulating shell 21 may be made of a material having relatively low thermal conductivity such as synthetic resin.

In one embodiment, the heating portion 2 further includes a body portion 22 surrounding the surface of the heat insulating shell 21. [ The body portion 22 may be made of metal, synthetic resin, or other suitable material as a portion forming the body of the heating portion 2. [

Meanwhile, a heating block heated by electric power and a temperature sensor for measuring the temperature of the semiconductor package are built in the housing 20, which will be described later in detail with reference to FIG.

One or more leads 3 and 4 are passed from the outside through the housing 20, the thermal insulation sheath 21 and the body portion 22 for electrical connection with the heating block and the temperature sensor built in the housing 20, (20).

The heating section 2 is disposed so as to close or open the tray 1 by the heating section 2 in order to selectively heat the semiconductor package mounted on the tray 1. [ For example, the heating unit 2 may be configured to be opened and closed on the tray 1 by using a hinge member 5 in a state of being attached to a substrate such as a printed circuit board.

In one embodiment, the heating portion 2 further includes a fixing portion 23 coupled to one region of the body portion 22. [ At this time, the fixing portion 23 is coupled to the tray 1 in a configuration in which the fixing portion 23 is coupled to the opposite side of the hinge member 5 and the tray 1 is covered with the heating portion 2. This will be described later in detail with reference to FIG.

In the arrangement in which the heating section 2 covers the tray 1, each heating section 2 is disposed at the upper part of each seating groove 10 of the tray 1. At this time, the housing 20 of the heating unit 2 includes a protrusion 200 formed in one region, and the protrusion 200 faces the depression 100 of the bottom surface of the mounting recess 10, 100). Thus, the protrusion 200 of the housing 20 is disposed opposite the surface of the semiconductor package mounted on the depression 100.

In one embodiment, a dial member 24 is further disposed on one surface of the heating unit 2, and the housing 20 can be moved up and down by rotating the dial member 24. [ This is used to adjust the distance between the lower end of the housing 20 and the surface of the semiconductor package depending on the thickness of the semiconductor package to be tested.

3 is a cross-sectional view of a heating unit and a tray of a testing apparatus of a semiconductor package according to an embodiment.

Referring to FIG. 3, in the testing apparatus of the semiconductor package according to the present embodiment, a lower end of the housing 20 of the heating unit is formed in the through hole 210, and the insertion hole 210, which is connected to the through hole 210, (28) is formed. The heating block 30 and the temperature sensor 40 may be disposed in the insertion groove 28.

The heating block 30 is a part which receives electric power from the outside through the lead 3 (see FIG. 2A) and generates heat by the applied electric power. For example, the heating block 30 may be formed of a heating body such as copper (Cu) that generates heat by electrical resistance, or may include one or a plurality of such heating bodies.

When the heating block 30 is heated with electric power, the housing 20 in contact with the heating block 30 is heated. The semiconductor package mounted on the tray can be heated by transferring heat to the tray 20 (see Fig. 1) at the lower end of the housing 20 by the heated housing 20.

The temperature sensor 40 is disposed in the insertion groove 28 of the housing 20 so as to be positioned between the heating block 30 and the through hole 210. [ A semiconductor package mounted on the tray 1 (see FIG. 2A) is disposed under the through hole 210 of the heating part, and the temperature sensor 40 is disposed on the surface of the lower semiconductor package in a non- And is configured to measure temperature. For example, the temperature sensor 40 may be an infrared sensor for measuring the surface temperature of the semiconductor package using the wavelength of infrared rays radiated from the semiconductor package, but is not limited thereto.

The temperature measurement value of the semiconductor package measured by the temperature sensor 40 is transmitted to the outside through the lead 4 (see FIG. 2A). In the temperature controller described later with reference to FIG. 5, the temperature measurement value of the temperature sensor 40 The power applied to the heating block 30 can be adjusted. Thus, accurate temperature conditions can be achieved using temperatures measured directly from the semiconductor package, rather than through another separate member.

In one embodiment, the temperature sensor 40 is configured to further measure the temperature of the heating block 30. The temperature of the heating block 30 measured by the temperature sensor 40 can be transferred to the temperature controller as well as the temperature of the semiconductor package.

In one embodiment, the heating section further includes a fixing section 23 which functions to fix the heating section in combination with the tray 1. [ For example, the fixing portion 23 includes a protruding portion 232 protruding inward from the lower end of the fixing portion 23, and the protruding portion 232 covers the upper portion of the tray 1, 1) so that the heating portion is coupled to the tray 1. Further, in one embodiment, the fixing portion 23 further includes a grip portion 231 protruding outward so that the user can grasp it by hand and raise or lower the heating portion.

In one embodiment, the heating portion of the testing device further comprises a dial member 24. [ The housing 20 is moved up and down while the pusher bundle 27 at the lower end of the dial member 24 is moved upward and downward by the rotation of the dial member 24. [ The housing 20 is inserted into the insertion groove 28 in which the heating block 30 and the temperature sensor 40 are located and the inner lid 25 covering the top of the heating block 30 and / And an outer lid 26 which covers the insertion groove 28 from the outside and on which the pushing pack 27 can be positioned.

4 is a photograph of a test apparatus for a semiconductor package according to an embodiment.

4, a temperature sensor 40 and a heating block 30 are sequentially disposed from below in the insertion groove of the housing 20 and the heat insulating shell 21 and the body portion 22 are provided outside the housing 20, . The surface temperature of the semiconductor package can be measured using the temperature sensor 40 built in the housing 20 while heating the semiconductor package mounted on the tray 1 by using the heating unit configured as described above. The use of the test apparatus configured as described above has the advantage that a more accurate temperature condition can be realized based on the temperature of the semiconductor package itself without depending on indirectly measuring the temperature of the surrounding environment as in the prior art.

5 is a configuration diagram of a semiconductor package including a testing apparatus according to an embodiment of the present invention.

Referring to FIG. 5, the semiconductor package testing apparatus according to the present embodiment includes the heating unit 2 described above with reference to FIGS. 2 to 4, the heating block 30 of the heating unit 2, And a temperature controller 50 electrically connected to the temperature controller 50. The tray 1 (see FIG. 2A) on which the semiconductor package is mounted is inserted below the heating section 2 and the operation of the semiconductor package at a specific temperature is performed while heating the semiconductor package and measuring the temperature by the heating section 2 Can be tested.

The temperature controller 50 is configured to receive a temperature sensor 40 measurement and to control the power applied to the heating block 30 so that the measured value reaches a set point. For example, the thermostat 50 may reduce the magnitude of the power applied to the heating block 30 if the measured value is greater than the set value, and increase the power applied to the heating block 30 if the measured value is less than the set value As shown in FIG.

In one embodiment, the temperature regulator 50 includes a first display portion 510 for displaying a temperature measurement of the semiconductor package measured by the temperature sensor 40. Further, the temperature of the semiconductor package and the temperature of the heating block 30 measured by the temperature sensor 40 may be further displayed on the first display portion 510. [

In one embodiment, the temperature controller 50 further includes one or more function buttons 530 and 540 for raising or lowering the set temperature by the user and a second display portion 520 for displaying the temperature set values set by the user do.

In one embodiment, the testing device of the semiconductor package further includes a voltage regulator 60. The voltage regulator 60 is electrically connected to the semiconductor package heated by the heating unit 2 to control the power applied to the semiconductor package. For example, the voltage regulator 60 can turn on / off the voltage applied to the semiconductor device included in the semiconductor package or adjust the magnitude of the voltage applied to each electrical terminal of the semiconductor device . In addition, the voltage regulator 60 may include one or more function buttons for enabling the user to perform the adjustment.

According to the semiconductor package testing apparatus according to the embodiments of the present invention described above, when performing the heating test of the semiconductor package at various temperatures, accurate temperature can be achieved based on the temperature of the semiconductor package itself. For example, the temperature range that can be implemented by the testing apparatus according to one embodiment may be from 0 to 135 degrees Celsius, but is not limited thereto.

In addition, the test apparatus for semiconductor packages according to the embodiments of the present invention can be used interchangeably with existing semiconductor process equipment. By moving the housing position according to the thickness of the semiconductor package to be tested, the thickness is reduced by about 30% Or a semiconductor package with a thickness increased by about 30%.

While the invention has been shown and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. However, it should be understood that such modifications are within the technical scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: Tray 10: seat groove
2: heating section 20: housing
21: heat-insulating shell 22:
23: Fixing portion 24: Dial member
25: inner cover 26: outer cover
27: press bundle 30: heating block
40: Temperature sensor 50: Temperature controller
60: voltage regulator

Claims (10)

1. A tray comprising at least one seating groove formed with a depression on which a semiconductor package is mounted, the seating groove comprising: a tray made of a thermally conductive material;
A housing disposed on the tray so as to cover the tray, the housing including a protrusion disposed opposite to the semiconductor package mounted on the depression, the housing contacting the seating groove of the tray;
A heat insulating housing surrounding the outer surface of the housing;
A heating block positioned in the housing and heated by external power;
A temperature sensor positioned within the housing to be disposed between the heating block and the semiconductor package, the temperature sensor configured to measure the temperature of each of the semiconductor package and the heating block; And
And a temperature controller electrically connected to the temperature sensor and the heating block by a conductor passing through the insulating shell and the housing to receive a temperature measurement value of the temperature sensor and to apply power to the heating block However,
The housing includes:
And is configured to transmit heat to the seating groove of the tray by being heated by the heating block in contact with the heating block,
A through hole formed in a lower surface of the housing and an insertion groove formed in the housing and connected to the through hole to receive the temperature sensor and the heating block,
The semiconductor package mounted on the depression of the tray is disposed under the through hole of the housing,
Wherein the temperature sensor is further configured to measure a surface temperature of the semiconductor package under the housing in a non-contact manner through the through hole. delete delete delete The method according to claim 1,
Wherein the temperature sensor is further configured to measure the surface temperature by detecting infrared radiation emitted from the semiconductor package. delete delete delete The method according to claim 1,
Wherein the temperature controller is further configured to adjust a magnitude of power applied to the heating block such that a temperature measurement value of the temperature sensor reaches a preset set value. The method according to claim 1,
And a fixing unit coupled to the housing, the fixing unit being fixed to the tray while the housing is positioned on the tray.
KR1020170122512A 2017-09-22 2017-09-22 Testing apparatus for semiconductor package KR101868347B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112255472A (en) * 2019-07-02 2021-01-22 细美事有限公司 Semiconductor package testing device
KR102604826B1 (en) * 2022-10-18 2023-11-22 큐알티 주식회사 A semiconductor device evaluation system implementing a stable acceleration environment, and a semiconductor device evaluation method using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070027524A (en) * 2004-02-27 2007-03-09 웰스-씨티아이, 엘엘씨. Burn-in testing apparatus and method
JP2008116220A (en) * 2006-11-01 2008-05-22 Syswave Corp Apparatus for testing semiconductor
KR20080096068A (en) 2007-04-26 2008-10-30 삼성전자주식회사 Testing apparatus of semiconductor device and adjusting method of temperature for testing the semiconductor device
JP4514787B2 (en) * 2005-05-17 2010-07-28 株式会社アドバンテスト Electronic component testing apparatus and temperature control method in electronic component testing apparatus
KR20120047598A (en) * 2010-11-04 2012-05-14 삼성전자주식회사 Digital photographing apparatus and control method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070027524A (en) * 2004-02-27 2007-03-09 웰스-씨티아이, 엘엘씨. Burn-in testing apparatus and method
JP4514787B2 (en) * 2005-05-17 2010-07-28 株式会社アドバンテスト Electronic component testing apparatus and temperature control method in electronic component testing apparatus
JP2008116220A (en) * 2006-11-01 2008-05-22 Syswave Corp Apparatus for testing semiconductor
KR20080096068A (en) 2007-04-26 2008-10-30 삼성전자주식회사 Testing apparatus of semiconductor device and adjusting method of temperature for testing the semiconductor device
KR20120047598A (en) * 2010-11-04 2012-05-14 삼성전자주식회사 Digital photographing apparatus and control method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112255472A (en) * 2019-07-02 2021-01-22 细美事有限公司 Semiconductor package testing device
KR102604826B1 (en) * 2022-10-18 2023-11-22 큐알티 주식회사 A semiconductor device evaluation system implementing a stable acceleration environment, and a semiconductor device evaluation method using the same

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