JP2005167079A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2005167079A
JP2005167079A JP2003405983A JP2003405983A JP2005167079A JP 2005167079 A JP2005167079 A JP 2005167079A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2005167079 A JP2005167079 A JP 2005167079A
Authority
JP
Japan
Prior art keywords
light
led element
emitting device
phosphor
silica particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003405983A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005167079A5 (enExample
Inventor
Masahito Kawamura
雅人 河村
Atsushi Tsuzuki
敦 都築
Toshio Yamaguchi
寿夫 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2003405983A priority Critical patent/JP2005167079A/ja
Publication of JP2005167079A publication Critical patent/JP2005167079A/ja
Publication of JP2005167079A5 publication Critical patent/JP2005167079A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2003405983A 2003-12-04 2003-12-04 発光装置 Withdrawn JP2005167079A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003405983A JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003405983A JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Publications (2)

Publication Number Publication Date
JP2005167079A true JP2005167079A (ja) 2005-06-23
JP2005167079A5 JP2005167079A5 (enExample) 2006-10-12

Family

ID=34728494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003405983A Withdrawn JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Country Status (1)

Country Link
JP (1) JP2005167079A (enExample)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693463B1 (ko) * 2005-10-21 2007-03-12 한국광기술원 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드
WO2007077869A1 (ja) * 2006-01-04 2007-07-12 Rohm Co., Ltd. 薄型発光ダイオードランプとその製造方法
JP2007184310A (ja) * 2005-12-29 2007-07-19 Citizen Electronics Co Ltd 発光装置
JP2007184330A (ja) * 2006-01-04 2007-07-19 Rohm Co Ltd 発光装置及びその製造方法
KR100807015B1 (ko) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 발광 장치
JP2008103688A (ja) * 2006-09-01 2008-05-01 Cree Inc 発光ダイオード内の蛍光体の位置
KR100849782B1 (ko) 2007-02-12 2008-07-31 삼성전기주식회사 Ｌｅｄ 패키지의 제조방법
JP2009111140A (ja) * 2007-10-30 2009-05-21 Sanyo Electric Co Ltd 発光装置及びその製造方法
JP2010519775A (ja) * 2007-02-28 2010-06-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ケーシングボディを有するオプトエレクトロニクス装置
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置
WO2012029695A1 (ja) * 2010-08-31 2012-03-08 日亜化学工業株式会社 発光装置とその製造方法
JP2012178598A (ja) * 2012-05-14 2012-09-13 Nichia Chem Ind Ltd 発光装置
JP2013026590A (ja) * 2011-07-26 2013-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2013110227A (ja) * 2011-11-18 2013-06-06 Nichia Chem Ind Ltd 発光装置および発光装置の製造方法
US8487337B2 (en) 2006-04-24 2013-07-16 Cree, Inc. Side view surface mount LED
US8617909B2 (en) 2004-07-02 2013-12-31 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US8858004B2 (en) 2005-12-22 2014-10-14 Cree, Inc. Lighting device
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US8901585B2 (en) 2003-05-01 2014-12-02 Cree, Inc. Multiple component solid state white light
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US9391249B2 (en) 2014-10-10 2016-07-12 Lg Electronics Inc. Light emitting device package and method of fabricating the same
US9666772B2 (en) 2003-04-30 2017-05-30 Cree, Inc. High powered light emitter packages with compact optics
US9954148B2 (en) 2014-10-24 2018-04-24 Citizen Electronics Co., Ltd. Light-emitting apparatus with optical element and method of manufacturing the same
KR101937111B1 (ko) 2018-12-12 2019-01-09 (주)솔라루체 Led 패키지
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED
CN114038982A (zh) * 2021-11-25 2022-02-11 盐城东山精密制造有限公司 一种高对比度哑光粉配比led发光源元件封裝材料

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9666772B2 (en) 2003-04-30 2017-05-30 Cree, Inc. High powered light emitter packages with compact optics
US8901585B2 (en) 2003-05-01 2014-12-02 Cree, Inc. Multiple component solid state white light
US10546978B2 (en) 2003-09-18 2020-01-28 Cree, Inc. Molded chip fabrication method and apparatus
US10164158B2 (en) 2003-09-18 2018-12-25 Cree, Inc. Molded chip fabrication method and apparatus
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US8617909B2 (en) 2004-07-02 2013-12-31 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
KR100807015B1 (ko) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 발광 장치
WO2007046664A1 (en) * 2005-10-21 2007-04-26 Korea Photonics Technology Institute Light diffusion type light emitting diode
JP2009512226A (ja) * 2005-10-21 2009-03-19 コリア フォトニクス テクノロジー インステチュート 光拡散型発光ダイオード
KR100693463B1 (ko) * 2005-10-21 2007-03-12 한국광기술원 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드
US8035122B2 (en) * 2005-10-21 2011-10-11 Korea Photonics Technology Institute Light diffusion type light emitting diode
US8858004B2 (en) 2005-12-22 2014-10-14 Cree, Inc. Lighting device
JP2007184310A (ja) * 2005-12-29 2007-07-19 Citizen Electronics Co Ltd 発光装置
US8004002B2 (en) 2006-01-04 2011-08-23 Rohm Co., Ltd. Thin-light emitting diode lamp, and method of manufacturing the same
JP2007184330A (ja) * 2006-01-04 2007-07-19 Rohm Co Ltd 発光装置及びその製造方法
US8405112B2 (en) 2006-01-04 2013-03-26 Rohm Co., Ltd. Thin-light emitting diode lamp, and method of manufacturing the same
WO2007077869A1 (ja) * 2006-01-04 2007-07-12 Rohm Co., Ltd. 薄型発光ダイオードランプとその製造方法
US8487337B2 (en) 2006-04-24 2013-07-16 Cree, Inc. Side view surface mount LED
JP2008103688A (ja) * 2006-09-01 2008-05-01 Cree Inc 発光ダイオード内の蛍光体の位置
US8425271B2 (en) 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
JP2012009905A (ja) * 2006-09-01 2012-01-12 Cree Inc 発光ダイオード内の蛍光体の位置
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
KR100849782B1 (ko) 2007-02-12 2008-07-31 삼성전기주식회사 Ｌｅｄ 패키지의 제조방법
JP2010519775A (ja) * 2007-02-28 2010-06-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ケーシングボディを有するオプトエレクトロニクス装置
US8723211B2 (en) 2007-02-28 2014-05-13 Osram Opto Semiconductors Gmbh Optoelectronic device with housing body
JP2009111140A (ja) * 2007-10-30 2009-05-21 Sanyo Electric Co Ltd 発光装置及びその製造方法
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
JP5861636B2 (ja) * 2010-08-31 2016-02-16 日亜化学工業株式会社 発光装置とその製造方法
US9295132B2 (en) 2010-08-31 2016-03-22 Nichia Corporation Light emitting device and method for manufacturing a light emitting device
WO2012029695A1 (ja) * 2010-08-31 2012-03-08 日亜化学工業株式会社 発光装置とその製造方法
US9466770B2 (en) 2010-08-31 2016-10-11 Nichia Corporation Light emitting device and method for manufacturing a light emitting device
TWI560908B (en) * 2010-08-31 2016-12-01 Nichia Corp Light emitting device and method of manufacturing the light emitting device
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
JP2013026590A (ja) * 2011-07-26 2013-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置
JP2013110227A (ja) * 2011-11-18 2013-06-06 Nichia Chem Ind Ltd 発光装置および発光装置の製造方法
JP2012178598A (ja) * 2012-05-14 2012-09-13 Nichia Chem Ind Ltd 発光装置
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED
US9391249B2 (en) 2014-10-10 2016-07-12 Lg Electronics Inc. Light emitting device package and method of fabricating the same
US9954148B2 (en) 2014-10-24 2018-04-24 Citizen Electronics Co., Ltd. Light-emitting apparatus with optical element and method of manufacturing the same
KR101937111B1 (ko) 2018-12-12 2019-01-09 (주)솔라루체 Led 패키지
CN114038982A (zh) * 2021-11-25 2022-02-11 盐城东山精密制造有限公司 一种高对比度哑光粉配比led发光源元件封裝材料
CN114038982B (zh) * 2021-11-25 2024-07-26 盐城东山精密制造有限公司 一种高对比度哑光粉配比led发光源元件封裝材料

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