JP2005158966A - 配線基板 - Google Patents
配線基板 Download PDFInfo
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- JP2005158966A JP2005158966A JP2003394568A JP2003394568A JP2005158966A JP 2005158966 A JP2005158966 A JP 2005158966A JP 2003394568 A JP2003394568 A JP 2003394568A JP 2003394568 A JP2003394568 A JP 2003394568A JP 2005158966 A JP2005158966 A JP 2005158966A
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Abstract
【解決手段】 信号用の配線導体4a1の並行部の間に端部を有するとともに端部から並行部に沿って一方に延びるように形成された接地用または電源用の第1の導体層4b1の端部が、絶縁層1bを挟んで対向する接地用または電源用の第2の導体層4b2に貫通導体4bpを介して電気的に接続されている。
【選択図】 図2
Description
4a1:信号用の配線導体
4b1:接地または電源用の第1の導体層
4b2:接地または電源用の第2の導体層
4bp:貫通導体
Claims (2)
- 絶縁層と、該絶縁層の一方の主面に複数配設された信号用の配線導体と、前記一方の主面に、前記複数の配線導体のうち2本が並行して形成された並行部の間に端部を有するとともに該端部から前記並行部に沿って一方に延びるように形成された接地用または電源用の第1の導体層とを具備しており、前記絶縁層の他方の主面に、少なくとも前記端部に対向する接地用または電源用の第2の導体層が形成されているとともに、該第2の導体層と前記端部とが貫通導体を介して電気的に接続されていることを特徴とする配線基板。
- 前記第1の導体層は、前記並行部の周囲を囲むように形成されていることを特徴とする請求項1記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003394568A JP4349891B2 (ja) | 2003-11-25 | 2003-11-25 | 配線基板および電子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003394568A JP4349891B2 (ja) | 2003-11-25 | 2003-11-25 | 配線基板および電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005158966A true JP2005158966A (ja) | 2005-06-16 |
JP4349891B2 JP4349891B2 (ja) | 2009-10-21 |
Family
ID=34720599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003394568A Expired - Fee Related JP4349891B2 (ja) | 2003-11-25 | 2003-11-25 | 配線基板および電子装置 |
Country Status (1)
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JP (1) | JP4349891B2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11214577A (ja) * | 1998-01-20 | 1999-08-06 | Sumitomo Metal Electronics Devices Inc | 高周波用icパッケージ |
JP2001177012A (ja) * | 1999-10-07 | 2001-06-29 | Kyocera Corp | 高周波用配線基板 |
JP2001339170A (ja) * | 2000-05-30 | 2001-12-07 | Kyocera Corp | 多層配線基板 |
JP2002252298A (ja) * | 2001-02-26 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 配線基板及びそれを用いた半導体装置 |
JP2004087810A (ja) * | 2002-08-27 | 2004-03-18 | Ngk Spark Plug Co Ltd | 多層プリント配線基板 |
-
2003
- 2003-11-25 JP JP2003394568A patent/JP4349891B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11214577A (ja) * | 1998-01-20 | 1999-08-06 | Sumitomo Metal Electronics Devices Inc | 高周波用icパッケージ |
JP2001177012A (ja) * | 1999-10-07 | 2001-06-29 | Kyocera Corp | 高周波用配線基板 |
JP2001339170A (ja) * | 2000-05-30 | 2001-12-07 | Kyocera Corp | 多層配線基板 |
JP2002252298A (ja) * | 2001-02-26 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 配線基板及びそれを用いた半導体装置 |
JP2004087810A (ja) * | 2002-08-27 | 2004-03-18 | Ngk Spark Plug Co Ltd | 多層プリント配線基板 |
Also Published As
Publication number | Publication date |
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JP4349891B2 (ja) | 2009-10-21 |
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