JP2005150745A5 - - Google Patents

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Publication number
JP2005150745A5
JP2005150745A5 JP2004330015A JP2004330015A JP2005150745A5 JP 2005150745 A5 JP2005150745 A5 JP 2005150745A5 JP 2004330015 A JP2004330015 A JP 2004330015A JP 2004330015 A JP2004330015 A JP 2004330015A JP 2005150745 A5 JP2005150745 A5 JP 2005150745A5
Authority
JP
Japan
Prior art keywords
polishing
grooves
groove
polishing pad
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004330015A
Other languages
English (en)
Japanese (ja)
Other versions
JP4689241B2 (ja
JP2005150745A (ja
Filing date
Publication date
Priority claimed from US10/712,186 external-priority patent/US7018274B2/en
Application filed filed Critical
Publication of JP2005150745A publication Critical patent/JP2005150745A/ja
Publication of JP2005150745A5 publication Critical patent/JP2005150745A5/ja
Application granted granted Critical
Publication of JP4689241B2 publication Critical patent/JP4689241B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004330015A 2003-11-13 2004-11-15 スラリー利用度を高める溝を有する研磨パッド Expired - Lifetime JP4689241B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,186 US7018274B2 (en) 2003-11-13 2003-11-13 Polishing pad having slurry utilization enhancing grooves
US10/712,186 2003-11-13

Publications (3)

Publication Number Publication Date
JP2005150745A JP2005150745A (ja) 2005-06-09
JP2005150745A5 true JP2005150745A5 (enExample) 2007-12-06
JP4689241B2 JP4689241B2 (ja) 2011-05-25

Family

ID=34435661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004330015A Expired - Lifetime JP4689241B2 (ja) 2003-11-13 2004-11-15 スラリー利用度を高める溝を有する研磨パッド

Country Status (7)

Country Link
US (1) US7018274B2 (enExample)
EP (1) EP1533075B1 (enExample)
JP (1) JP4689241B2 (enExample)
KR (1) KR101157649B1 (enExample)
CN (1) CN100343958C (enExample)
DE (1) DE602004007597T2 (enExample)
TW (1) TWI339146B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US7591713B2 (en) * 2003-09-26 2009-09-22 Shin-Etsu Handotai Co., Ltd. Polishing pad, method for processing polishing pad, and method for producing substrate using it
US6958002B1 (en) * 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN102814725B (zh) * 2011-06-08 2015-11-25 无锡华润上华科技有限公司 一种化学机械研磨方法
JP6065208B2 (ja) * 2012-12-25 2017-01-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5919592B1 (ja) * 2015-02-23 2016-05-18 防衛装備庁長官 研磨装置
US9770092B2 (en) * 2015-08-20 2017-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Brush, back surface treatment assembly and method for cleaning substrate
CN105500183B (zh) * 2015-11-26 2018-08-10 上海集成电路研发中心有限公司 一种研磨垫及其使用周期检测方法
SE539716C2 (en) * 2016-06-15 2017-11-07 Valmet Oy Refine plate segment with pre-dam
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
KR102702996B1 (ko) * 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
GB2582639B (en) * 2019-03-29 2023-10-18 Zeeko Innovations Ltd Shaping apparatus, method and tool
CN113021181B (zh) * 2021-03-22 2023-05-30 万华化学集团电子材料有限公司 一种高去除速率、低划伤化学机械抛光垫及其应用
CN114619362B (zh) * 2022-04-07 2024-04-12 南京理工大学 一种球阀研磨盘装置
CN115922557B (zh) * 2023-03-09 2023-07-25 长鑫存储技术有限公司 一种抛光组件及抛光设备
DE102024109581A1 (de) * 2024-04-05 2025-10-09 Lapmaster Wolters Gmbh Läppscheibe für eine Läppmaschine, Läppmaschine und Verfahren zum Läppen eines Werkstücks mit einer Läppmaschine

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT374206B (de) * 1982-11-15 1984-03-26 Hirsch Kurt Verfahren und vorrichtung zum vorschaeumen von kunststoffen
US5093651A (en) * 1990-10-11 1992-03-03 Thomas Edward M Intelligent smoke detector
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6139402A (en) * 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
JPH11216663A (ja) * 1998-02-03 1999-08-10 Sony Corp 研磨パッド、研磨装置および研磨方法
JPH11267961A (ja) * 1998-03-23 1999-10-05 Sony Corp 研磨パッド、研磨装置および研磨方法
JP2000033553A (ja) * 1998-05-11 2000-02-02 Sony Corp 研磨パッドおよび研磨方法
JP2000000755A (ja) * 1998-06-16 2000-01-07 Sony Corp 研磨パッド及び研磨方法
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
US6110832A (en) * 1999-04-28 2000-08-29 International Business Machines Corporation Method and apparatus for slurry polishing
US20020068516A1 (en) 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use

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