CN100343958C - 带有用于提高浆液利用率的凹槽的研磨垫 - Google Patents

带有用于提高浆液利用率的凹槽的研磨垫 Download PDF

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Publication number
CN100343958C
CN100343958C CNB2004100929813A CN200410092981A CN100343958C CN 100343958 C CN100343958 C CN 100343958C CN B2004100929813 A CNB2004100929813 A CN B2004100929813A CN 200410092981 A CN200410092981 A CN 200410092981A CN 100343958 C CN100343958 C CN 100343958C
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China
Prior art keywords
groove
grinding
grooves
mixed
pad
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Expired - Lifetime
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CNB2004100929813A
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English (en)
Chinese (zh)
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CN1617308A (zh
Inventor
格雷戈里·P·马尔多奈伊
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ROHM AND HAAS ELECTRONIC MATER
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ROHM AND HAAS ELECTRONIC MATER
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Publication of CN1617308A publication Critical patent/CN1617308A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/921—Pad for lens shaping tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CNB2004100929813A 2003-11-13 2004-11-12 带有用于提高浆液利用率的凹槽的研磨垫 Expired - Lifetime CN100343958C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,186 US7018274B2 (en) 2003-11-13 2003-11-13 Polishing pad having slurry utilization enhancing grooves
US10/712,186 2003-11-13

Publications (2)

Publication Number Publication Date
CN1617308A CN1617308A (zh) 2005-05-18
CN100343958C true CN100343958C (zh) 2007-10-17

Family

ID=34435661

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100929813A Expired - Lifetime CN100343958C (zh) 2003-11-13 2004-11-12 带有用于提高浆液利用率的凹槽的研磨垫

Country Status (7)

Country Link
US (1) US7018274B2 (enExample)
EP (1) EP1533075B1 (enExample)
JP (1) JP4689241B2 (enExample)
KR (1) KR101157649B1 (enExample)
CN (1) CN100343958C (enExample)
DE (1) DE602004007597T2 (enExample)
TW (1) TWI339146B (enExample)

Families Citing this family (19)

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US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
WO2005030439A1 (ja) * 2003-09-26 2005-04-07 Shin-Etsu Handotai Co., Ltd. 研磨布及び研磨布の加工方法並びにそれを用いた基板の製造方法
US6958002B1 (en) * 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN102814725B (zh) * 2011-06-08 2015-11-25 无锡华润上华科技有限公司 一种化学机械研磨方法
JP6065208B2 (ja) * 2012-12-25 2017-01-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5919592B1 (ja) * 2015-02-23 2016-05-18 防衛装備庁長官 研磨装置
US9770092B2 (en) * 2015-08-20 2017-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Brush, back surface treatment assembly and method for cleaning substrate
CN105500183B (zh) * 2015-11-26 2018-08-10 上海集成电路研发中心有限公司 一种研磨垫及其使用周期检测方法
SE539716C2 (en) * 2016-06-15 2017-11-07 Valmet Oy Refine plate segment with pre-dam
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
KR102702996B1 (ko) * 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
GB2582639B (en) * 2019-03-29 2023-10-18 Zeeko Innovations Ltd Shaping apparatus, method and tool
CN113021181B (zh) * 2021-03-22 2023-05-30 万华化学集团电子材料有限公司 一种高去除速率、低划伤化学机械抛光垫及其应用
CN114619362B (zh) * 2022-04-07 2024-04-12 南京理工大学 一种球阀研磨盘装置
CN115922557B (zh) * 2023-03-09 2023-07-25 长鑫存储技术有限公司 一种抛光组件及抛光设备
DE102024109581A1 (de) * 2024-04-05 2025-10-09 Lapmaster Wolters Gmbh Läppscheibe für eine Läppmaschine, Läppmaschine und Verfahren zum Läppen eines Werkstücks mit einer Läppmaschine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1151342A (zh) * 1995-10-25 1997-06-11 日本电气株式会社 具有带槽和孔的抛光垫的抛光装置
US6159088A (en) * 1998-02-03 2000-12-12 Sony Corporation Polishing pad, polishing apparatus and polishing method
EP1114697A2 (en) * 1999-12-13 2001-07-11 Applied Materials, Inc. Apparatus and method for controlled delivery of slurry to a region of a polishing device
CN1449322A (zh) * 2000-06-29 2003-10-15 国际商业机器公司 带槽的抛光垫及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT374206B (de) * 1982-11-15 1984-03-26 Hirsch Kurt Verfahren und vorrichtung zum vorschaeumen von kunststoffen
US5093651A (en) * 1990-10-11 1992-03-03 Thomas Edward M Intelligent smoke detector
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6093651A (en) 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6139402A (en) * 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
JPH11267961A (ja) * 1998-03-23 1999-10-05 Sony Corp 研磨パッド、研磨装置および研磨方法
JP2000033553A (ja) * 1998-05-11 2000-02-02 Sony Corp 研磨パッドおよび研磨方法
JP2000000755A (ja) * 1998-06-16 2000-01-07 Sony Corp 研磨パッド及び研磨方法
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
US6110832A (en) * 1999-04-28 2000-08-29 International Business Machines Corporation Method and apparatus for slurry polishing
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1151342A (zh) * 1995-10-25 1997-06-11 日本电气株式会社 具有带槽和孔的抛光垫的抛光装置
US6159088A (en) * 1998-02-03 2000-12-12 Sony Corporation Polishing pad, polishing apparatus and polishing method
EP1114697A2 (en) * 1999-12-13 2001-07-11 Applied Materials, Inc. Apparatus and method for controlled delivery of slurry to a region of a polishing device
CN1449322A (zh) * 2000-06-29 2003-10-15 国际商业机器公司 带槽的抛光垫及其使用方法

Also Published As

Publication number Publication date
DE602004007597T2 (de) 2008-04-17
DE602004007597D1 (de) 2007-08-30
TW200529978A (en) 2005-09-16
JP2005150745A (ja) 2005-06-09
CN1617308A (zh) 2005-05-18
US20050107009A1 (en) 2005-05-19
KR101157649B1 (ko) 2012-06-18
KR20050046599A (ko) 2005-05-18
JP4689241B2 (ja) 2011-05-25
EP1533075A1 (en) 2005-05-25
US7018274B2 (en) 2006-03-28
EP1533075B1 (en) 2007-07-18
TWI339146B (en) 2011-03-21

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Granted publication date: 20071017