TWI339146B - Polishing pad having slurry utilization enhancing grooves and polishing method and polishing system using the same - Google Patents
Polishing pad having slurry utilization enhancing grooves and polishing method and polishing system using the same Download PDFInfo
- Publication number
- TWI339146B TWI339146B TW093133219A TW93133219A TWI339146B TW I339146 B TWI339146 B TW I339146B TW 093133219 A TW093133219 A TW 093133219A TW 93133219 A TW93133219 A TW 93133219A TW I339146 B TWI339146 B TW I339146B
- Authority
- TW
- Taiwan
- Prior art keywords
- grooves
- polishing
- grinding
- polishing pad
- groove
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 73
- 238000000034 method Methods 0.000 title claims description 8
- 239000002002 slurry Substances 0.000 title description 34
- 230000002708 enhancing effect Effects 0.000 title 1
- 238000000227 grinding Methods 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 230000000737 periodic effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 5
- 241001494479 Pecora Species 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 40
- 239000000463 material Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000013626 chemical specie Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/712,186 US7018274B2 (en) | 2003-11-13 | 2003-11-13 | Polishing pad having slurry utilization enhancing grooves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200529978A TW200529978A (en) | 2005-09-16 |
| TWI339146B true TWI339146B (en) | 2011-03-21 |
Family
ID=34435661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093133219A TWI339146B (en) | 2003-11-13 | 2004-11-01 | Polishing pad having slurry utilization enhancing grooves and polishing method and polishing system using the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7018274B2 (enExample) |
| EP (1) | EP1533075B1 (enExample) |
| JP (1) | JP4689241B2 (enExample) |
| KR (1) | KR101157649B1 (enExample) |
| CN (1) | CN100343958C (enExample) |
| DE (1) | DE602004007597T2 (enExample) |
| TW (1) | TWI339146B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7377840B2 (en) * | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
| WO2005030439A1 (ja) * | 2003-09-26 | 2005-04-07 | Shin-Etsu Handotai Co., Ltd. | 研磨布及び研磨布の加工方法並びにそれを用いた基板の製造方法 |
| US6958002B1 (en) * | 2004-07-19 | 2005-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with flow modifying groove network |
| KR101334012B1 (ko) * | 2005-07-25 | 2013-12-02 | 호야 가부시키가이샤 | 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법 |
| JP5080769B2 (ja) * | 2006-09-15 | 2012-11-21 | 株式会社東京精密 | 研磨方法及び研磨装置 |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| CN102814725B (zh) * | 2011-06-08 | 2015-11-25 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
| JP6065208B2 (ja) * | 2012-12-25 | 2017-01-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP5919592B1 (ja) * | 2015-02-23 | 2016-05-18 | 防衛装備庁長官 | 研磨装置 |
| US9770092B2 (en) * | 2015-08-20 | 2017-09-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Brush, back surface treatment assembly and method for cleaning substrate |
| CN105500183B (zh) * | 2015-11-26 | 2018-08-10 | 上海集成电路研发中心有限公司 | 一种研磨垫及其使用周期检测方法 |
| SE539716C2 (en) * | 2016-06-15 | 2017-11-07 | Valmet Oy | Refine plate segment with pre-dam |
| US10688621B2 (en) * | 2016-08-04 | 2020-06-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-defect-porous polishing pad |
| KR102702996B1 (ko) * | 2018-12-10 | 2024-09-04 | 삼성전자주식회사 | 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치 |
| GB2582639B (en) * | 2019-03-29 | 2023-10-18 | Zeeko Innovations Ltd | Shaping apparatus, method and tool |
| CN113021181B (zh) * | 2021-03-22 | 2023-05-30 | 万华化学集团电子材料有限公司 | 一种高去除速率、低划伤化学机械抛光垫及其应用 |
| CN114619362B (zh) * | 2022-04-07 | 2024-04-12 | 南京理工大学 | 一种球阀研磨盘装置 |
| CN115922557B (zh) * | 2023-03-09 | 2023-07-25 | 长鑫存储技术有限公司 | 一种抛光组件及抛光设备 |
| DE102024109581A1 (de) * | 2024-04-05 | 2025-10-09 | Lapmaster Wolters Gmbh | Läppscheibe für eine Läppmaschine, Läppmaschine und Verfahren zum Läppen eines Werkstücks mit einer Läppmaschine |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT374206B (de) * | 1982-11-15 | 1984-03-26 | Hirsch Kurt | Verfahren und vorrichtung zum vorschaeumen von kunststoffen |
| US5093651A (en) * | 1990-10-11 | 1992-03-03 | Thomas Edward M | Intelligent smoke detector |
| JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
| US5645469A (en) * | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
| US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6093651A (en) | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| US6139402A (en) * | 1997-12-30 | 2000-10-31 | Micron Technology, Inc. | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| JPH11216663A (ja) * | 1998-02-03 | 1999-08-10 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
| JPH11267961A (ja) * | 1998-03-23 | 1999-10-05 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
| JP2000033553A (ja) * | 1998-05-11 | 2000-02-02 | Sony Corp | 研磨パッドおよび研磨方法 |
| JP2000000755A (ja) * | 1998-06-16 | 2000-01-07 | Sony Corp | 研磨パッド及び研磨方法 |
| KR20000025003A (ko) * | 1998-10-07 | 2000-05-06 | 윤종용 | 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드 |
| US6110832A (en) * | 1999-04-28 | 2000-08-29 | International Business Machines Corporation | Method and apparatus for slurry polishing |
| US20020068516A1 (en) | 1999-12-13 | 2002-06-06 | Applied Materials, Inc | Apparatus and method for controlled delivery of slurry to a region of a polishing device |
| US6241596B1 (en) * | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
| US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
| KR20030015567A (ko) * | 2001-08-16 | 2003-02-25 | 에스케이에버텍 주식회사 | 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드 |
| US6602123B1 (en) * | 2002-09-13 | 2003-08-05 | Infineon Technologies Ag | Finishing pad design for multidirectional use |
-
2003
- 2003-11-13 US US10/712,186 patent/US7018274B2/en not_active Expired - Lifetime
-
2004
- 2004-11-01 TW TW093133219A patent/TWI339146B/zh not_active IP Right Cessation
- 2004-11-04 DE DE602004007597T patent/DE602004007597T2/de not_active Expired - Lifetime
- 2004-11-04 EP EP04256800A patent/EP1533075B1/en not_active Expired - Lifetime
- 2004-11-12 KR KR1020040092276A patent/KR101157649B1/ko not_active Expired - Lifetime
- 2004-11-12 CN CNB2004100929813A patent/CN100343958C/zh not_active Expired - Lifetime
- 2004-11-15 JP JP2004330015A patent/JP4689241B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004007597T2 (de) | 2008-04-17 |
| DE602004007597D1 (de) | 2007-08-30 |
| TW200529978A (en) | 2005-09-16 |
| JP2005150745A (ja) | 2005-06-09 |
| CN1617308A (zh) | 2005-05-18 |
| US20050107009A1 (en) | 2005-05-19 |
| KR101157649B1 (ko) | 2012-06-18 |
| KR20050046599A (ko) | 2005-05-18 |
| JP4689241B2 (ja) | 2011-05-25 |
| EP1533075A1 (en) | 2005-05-25 |
| US7018274B2 (en) | 2006-03-28 |
| EP1533075B1 (en) | 2007-07-18 |
| CN100343958C (zh) | 2007-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |