JP2005149764A5 - - Google Patents
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- Publication number
- JP2005149764A5 JP2005149764A5 JP2003381658A JP2003381658A JP2005149764A5 JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5 JP 2003381658 A JP2003381658 A JP 2003381658A JP 2003381658 A JP2003381658 A JP 2003381658A JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5
- Authority
- JP
- Japan
- Prior art keywords
- particle
- particles
- core
- conductive
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 17
- 239000011258 core-shell material Substances 0.000 claims 5
- 239000007771 core particle Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 230000009477 glass transition Effects 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003381658A JP4686120B2 (ja) | 2003-11-11 | 2003-11-11 | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003381658A JP4686120B2 (ja) | 2003-11-11 | 2003-11-11 | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005149764A JP2005149764A (ja) | 2005-06-09 |
| JP2005149764A5 true JP2005149764A5 (enrdf_load_stackoverflow) | 2006-09-21 |
| JP4686120B2 JP4686120B2 (ja) | 2011-05-18 |
Family
ID=34690964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003381658A Expired - Fee Related JP4686120B2 (ja) | 2003-11-11 | 2003-11-11 | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4686120B2 (enrdf_load_stackoverflow) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100722493B1 (ko) * | 2005-09-02 | 2007-05-28 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름 |
| WO2007145657A2 (en) * | 2005-11-01 | 2007-12-21 | Massachusetts Institute Of Technology | Initiated chemical vapor deposition of vinyl polymers for the encapsulation of particles |
| TW200729236A (en) * | 2005-12-22 | 2007-08-01 | Sekisui Chemical Co Ltd | Conductive fine particle and anisotropic conductive material |
| US20100065311A1 (en) * | 2006-07-03 | 2010-03-18 | Hitachi Chemical Company, Ltd. | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
| KR100752533B1 (ko) * | 2006-11-06 | 2007-08-29 | 한국과학기술연구원 | 고분자 미세 캡슐-도전성 입자 복합체 및 이의 제조 방법 |
| KR100871759B1 (ko) | 2007-04-13 | 2008-12-05 | 엘에스엠트론 주식회사 | 이방 도전성 접착용 도전볼 |
| JP5368760B2 (ja) * | 2008-09-29 | 2013-12-18 | 積水化学工業株式会社 | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
| JP5548053B2 (ja) * | 2010-07-02 | 2014-07-16 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 |
| JP5672022B2 (ja) * | 2011-01-25 | 2015-02-18 | 日立化成株式会社 | 絶縁被覆導電粒子、異方導電性材料及び接続構造体 |
| JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
| JP5803393B2 (ja) * | 2011-08-02 | 2015-11-04 | 日立化成株式会社 | 絶縁被覆導電粒子及び異方導電性接着フィルム |
| JP6044195B2 (ja) * | 2011-09-06 | 2016-12-14 | 日立化成株式会社 | 絶縁被覆用粒子、絶縁被覆導電粒子、異方導電材料及び接続構造体 |
| CN103030728B (zh) * | 2011-09-06 | 2017-09-26 | 日立化成株式会社 | 绝缘包覆用粒子、绝缘包覆导电粒子、各向异性导电材料及连接结构体 |
| JP5750342B2 (ja) * | 2011-09-12 | 2015-07-22 | 株式会社日本触媒 | 絶縁性微粒子、絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体 |
| JP5952553B2 (ja) * | 2011-12-14 | 2016-07-13 | 株式会社日本触媒 | 導電性微粒子及びこれを含む異方性導電材料 |
| JP5939063B2 (ja) * | 2012-07-11 | 2016-06-22 | 日立化成株式会社 | 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤 |
| KR102528599B1 (ko) | 2017-05-08 | 2023-05-02 | 니폰 가가쿠 고교 가부시키가이샤 | 피복 입자 및 그 제조 방법 |
| US11407863B2 (en) | 2017-05-08 | 2022-08-09 | Nippon Chemical Industrial Co., Ltd. | Coated particles and production method therefor |
| SG11202005226VA (en) * | 2019-03-26 | 2020-11-27 | Furukawa Electric Co Ltd | Method for producing anisotropic conductive sheet |
| CN110176588B (zh) * | 2019-05-28 | 2022-01-28 | 中国科学院重庆绿色智能技术研究院 | 电极材料的制备方法 |
| WO2022044913A1 (ja) | 2020-08-24 | 2022-03-03 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2895872B2 (ja) * | 1989-09-26 | 1999-05-24 | 触媒化成工業株式会社 | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
| JP5060692B2 (ja) * | 2001-07-13 | 2012-10-31 | 株式会社日本触媒 | 異方導電性材料 |
| TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| KR100589799B1 (ko) * | 2003-05-06 | 2006-06-14 | 한화석유화학 주식회사 | 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품 |
-
2003
- 2003-11-11 JP JP2003381658A patent/JP4686120B2/ja not_active Expired - Fee Related
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