JP2006199833A5 - - Google Patents
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- Publication number
- JP2006199833A5 JP2006199833A5 JP2005013420A JP2005013420A JP2006199833A5 JP 2006199833 A5 JP2006199833 A5 JP 2006199833A5 JP 2005013420 A JP2005013420 A JP 2005013420A JP 2005013420 A JP2005013420 A JP 2005013420A JP 2006199833 A5 JP2006199833 A5 JP 2006199833A5
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- melting point
- point metal
- low melting
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000010419 fine particle Substances 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005013420A JP2006199833A (ja) | 2005-01-20 | 2005-01-20 | 異方性導電接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005013420A JP2006199833A (ja) | 2005-01-20 | 2005-01-20 | 異方性導電接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006199833A JP2006199833A (ja) | 2006-08-03 |
| JP2006199833A5 true JP2006199833A5 (enrdf_load_stackoverflow) | 2007-11-29 |
Family
ID=36958123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005013420A Pending JP2006199833A (ja) | 2005-01-20 | 2005-01-20 | 異方性導電接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006199833A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101221148B1 (ko) * | 2007-03-12 | 2013-01-10 | 센주긴조쿠고교 가부시키가이샤 | 이방성 도전 재료 |
| JP5061668B2 (ja) * | 2007-03-14 | 2012-10-31 | 富士通株式会社 | ２種類の配線板を有するハイブリッド基板、それを有する電子装置、及び、ハイブリッド基板の製造方法 |
| KR100926747B1 (ko) * | 2007-11-12 | 2009-11-16 | 한국전자통신연구원 | 도전 접착제 및 이를 이용한 플립칩 본딩 방법 |
| KR101025620B1 (ko) * | 2009-07-13 | 2011-03-30 | 한국과학기술원 | 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 |
| CN114752332B (zh) * | 2022-04-08 | 2023-07-14 | 宁波曦晗科技有限公司 | 一种基于液态金属宽温区各向异性导电胶及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07139832A (ja) * | 1993-11-15 | 1995-06-02 | Mitsubishi Heavy Ind Ltd | 冷凍装置 |
| JP3347512B2 (ja) * | 1995-03-17 | 2002-11-20 | 富士通株式会社 | 低温接合用はんだ合金、これを用いた電子機器およびその製造方法 |
| JP4032532B2 (ja) * | 1998-10-23 | 2008-01-16 | 日立化成工業株式会社 | 回路部材の実装方法 |
| JP2000133050A (ja) * | 1998-10-27 | 2000-05-12 | Sekisui Chem Co Ltd | 異方性導電膜及び導電接続構造体 |
| JP2001130930A (ja) * | 1999-11-04 | 2001-05-15 | Mitsubishi Electric Corp | 陰極線管の製造方法 |
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2005
- 2005-01-20 JP JP2005013420A patent/JP2006199833A/ja active Pending