JP2005116788A5 - - Google Patents

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Publication number
JP2005116788A5
JP2005116788A5 JP2003349377A JP2003349377A JP2005116788A5 JP 2005116788 A5 JP2005116788 A5 JP 2005116788A5 JP 2003349377 A JP2003349377 A JP 2003349377A JP 2003349377 A JP2003349377 A JP 2003349377A JP 2005116788 A5 JP2005116788 A5 JP 2005116788A5
Authority
JP
Japan
Prior art keywords
semiconductor device
interlayer insulating
insulating film
bonding pad
vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003349377A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005116788A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003349377A priority Critical patent/JP2005116788A/ja
Priority claimed from JP2003349377A external-priority patent/JP2005116788A/ja
Publication of JP2005116788A publication Critical patent/JP2005116788A/ja
Publication of JP2005116788A5 publication Critical patent/JP2005116788A5/ja
Pending legal-status Critical Current

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JP2003349377A 2003-10-08 2003-10-08 半導体装置 Pending JP2005116788A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003349377A JP2005116788A (ja) 2003-10-08 2003-10-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003349377A JP2005116788A (ja) 2003-10-08 2003-10-08 半導体装置

Publications (2)

Publication Number Publication Date
JP2005116788A JP2005116788A (ja) 2005-04-28
JP2005116788A5 true JP2005116788A5 (https=) 2006-11-24

Family

ID=34541260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003349377A Pending JP2005116788A (ja) 2003-10-08 2003-10-08 半導体装置

Country Status (1)

Country Link
JP (1) JP2005116788A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759229B2 (ja) * 2004-05-12 2011-08-31 ルネサスエレクトロニクス株式会社 半導体装置
JP2007019128A (ja) * 2005-07-06 2007-01-25 Sony Corp 半導体装置
WO2007116463A1 (ja) * 2006-03-31 2007-10-18 Fujitsu Limited 半導体装置
JP4785623B2 (ja) * 2006-05-31 2011-10-05 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP5599388B2 (ja) 2009-04-28 2014-10-01 三菱電機株式会社 電力用半導体装置
JP5383446B2 (ja) 2009-11-18 2014-01-08 パナソニック株式会社 半導体装置
KR101184375B1 (ko) 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
JP2012134543A (ja) * 2012-03-08 2012-07-12 Fujitsu Ltd 半導体装置
KR102739623B1 (ko) 2019-09-16 2024-12-06 삼성전자주식회사 반도체 장치

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