JP2005108900A5 - - Google Patents
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- Publication number
- JP2005108900A5 JP2005108900A5 JP2003336445A JP2003336445A JP2005108900A5 JP 2005108900 A5 JP2005108900 A5 JP 2005108900A5 JP 2003336445 A JP2003336445 A JP 2003336445A JP 2003336445 A JP2003336445 A JP 2003336445A JP 2005108900 A5 JP2005108900 A5 JP 2005108900A5
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- metal
- metal electrode
- electrode
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 108
- 239000002184 metal Substances 0.000 claims description 108
- 238000001514 detection method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 14
- 239000012212 insulator Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002452 interceptive Effects 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- -1 nickel chromium Chemical compound 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003336445A JP2005108900A (ja) | 2003-09-26 | 2003-09-26 | 低抵抗器およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003336445A JP2005108900A (ja) | 2003-09-26 | 2003-09-26 | 低抵抗器およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005108900A JP2005108900A (ja) | 2005-04-21 |
| JP2005108900A5 true JP2005108900A5 (fr) | 2005-07-14 |
Family
ID=34532579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003336445A Pending JP2005108900A (ja) | 2003-09-26 | 2003-09-26 | 低抵抗器およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005108900A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078064A (ja) * | 2006-09-25 | 2008-04-03 | Harison Toshiba Lighting Corp | ヒータ、加熱装置、画像形成装置 |
| JP2009182144A (ja) * | 2008-01-30 | 2009-08-13 | Koa Corp | 抵抗器およびその製造方法 |
| JP4537465B2 (ja) * | 2008-02-18 | 2010-09-01 | 釜屋電機株式会社 | 抵抗金属板低抵抗チップ抵抗器の製造方法 |
| JP5263733B2 (ja) * | 2008-04-24 | 2013-08-14 | コーア株式会社 | 金属板抵抗器 |
| US9660404B2 (en) * | 2012-02-14 | 2017-05-23 | Koa Corporation | Terminal connection structure for resistor |
-
2003
- 2003-09-26 JP JP2003336445A patent/JP2005108900A/ja active Pending
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