JP2005093298A - Anisotropic conductive film for inspecting electronic part and inspection method for electronic part using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film for inspecting an electronic part hardly polluting an electrode of the electronic part to be inspected or a circuit pattern surface of a circuit board in a wide range of temperature, and to provide a highly reliable inspection method for the electronic part using the anisotropic conductive film. <P>SOLUTION: This anisotropic conductive film for inspecting the electronic part has a structure wherein a plurality of conduction paths made of a conductive material are mutually insulated and arranged penetrating a film substrate containing an epoxy resin having a naphthalene framework cross-linked by a phenol resin and acrylic rubber in a thickness direction, and both ends of each conduction path are exposed to front and rear faces of the film substrate. In this inspection method for electronic part, the anisotropic conductive film is arranged between the electronic part and the circuit board, and a current is applied to the electronic part while applying a load in a direction in which the anisotropic conductive film and the electronic part are pushed by a predetermined contact load. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection method for an electronic component such as an anisotropic conductive film for electronic component inspection and a semiconductor element using the same, and a semiconductor device including the electronic component.

When conducting a continuity test of a semiconductor element, an electronic component, or a circuit board, a method of detecting an electrical signal by bringing a probe pin into direct contact with an electrode portion of the component or the board is generally used. In the case of such probe pin contact, since it is necessary to align the probe pin with the electrode position of the component to be inspected, it is necessary to prepare a dedicated probe jig for each component to be inspected. Recently, the size and spacing of electrodes on electronic components and circuit boards have become smaller, which has caused problems such as difficulty in manufacturing probe pins and increased costs. The use of a film has been proposed (Patent Document 1).
International Publication No. 98/07216 Pamphlet

  However, when using anisotropic conductive films, there are problems such as poor contact between the electrodes and “contamination of the metal electrode part” in the continuity inspection of electronic components at high temperatures. The inventors have found. In addition, when performing a simple continuity test using a conductive rubber, there is a problem that a defect occurs in the mounting between the electronic component and the circuit board.

  The present invention has been made in order to solve the above-described problems, and is intended for electronic component inspection, which hardly contaminates the electrodes of electronic components to be inspected and the wiring pattern surfaces of circuit boards in a wide temperature range of 20 to 150 ° C. The main object is to provide an anisotropic conductive film. Another object of the present invention is to provide a highly reliable inspection method for electronic parts using such an anisotropic conductive film.

As a result of intensive studies to solve the above problems, the present inventors have found that the contamination of the metal electrode part is caused by low molecular weight components generated from anisotropic conductive films and silicone components from conductive rubber (made of silicone). It has been found that this is due to the adhesion to the metal electrode part. As a result of further diligent research based on this knowledge, the present invention having the following contents was completed.
(1) In a film substrate containing a naphthalene skeleton epoxy resin cross-linked with a phenol resin and acrylic rubber, a plurality of conductive paths made of a conductive material are insulated from each other, and the film substrate is arranged in the thickness direction. An anisotropic conductive film for electronic component inspection, having a structure in which both ends are exposed on the front and back surfaces of the film substrate.
(2) The elastic modulus of the whole structure of the anisotropic conductive film is 1 MPa to 100 MPa at 20 ° C. to 150 ° C., and the anisotropic conductive film has a thickness of 30 μm to 500 μm. Conductive film.
(3) Both ends of the conduction path protrude from the front and back surfaces of the film substrate, and a portion of the conduction path that penetrates the film substrate is made of a metal conductor having a diameter of 5 μm to 30 μm. (1) or (2) described above, wherein the projecting portion is composed of the metal conductor itself extending outside the film substrate, or a metal convex portion formed by plating at an end of the metal conductor. Anisotropic conductive film.
(4) The anisotropic conductive film according to any one of the above (1) to (3), the electrode of the electronic component and the anisotropic conductivity between the electronic component including at least one electrode and the circuit board. It arranged so that the conductive paths of the film are in contact, with one electrode per 50g ^/ mm ² ~5000g / mm 2 of the contact load of the electronic component, a load in a direction to press the anisotropic conductive film and the electronic component A method for inspecting an electronic component in which the electronic component is energized while being applied.
(5) The inspection method according to (4), wherein the anisotropic conductive film is compressed by applying the load, and the thickness of the film is reduced by 5 μm to 150 μm.

  The anisotropic conductive film for inspection of electronic parts of the present invention can reduce contamination of the metal electrode part due to adhesion of low molecular weight components when used for inspection of electronic parts at 20 ° C. to 150 ° C. Further, the electronic component inspection method of the present invention is a highly reliable inspection method with excellent contact properties.

  Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 schematically shows inspection of an electronic component using the anisotropic conductive film of the present invention. The basic structure of the anisotropic conductive film 1 of the present invention is the same as that described in Patent Document 1, and a conductive path 11 extends in the thickness direction in a plate-like film substrate 10 made of an insulating material. It is the structure which is mutually insulated and arranged in the state which penetrated. The present invention is characterized in that the film substrate 10 includes a resin / rubber described in detail below.

  The film substrate 10 includes a naphthalene skeleton epoxy resin crosslinked with a phenol resin and acrylic rubber. Although details of each resin will be described later, heat resistance is exhibited by the phenol resin acting as a crosslinking agent for the naphthalene skeleton epoxy resin, and flexibility is simultaneously exhibited by containing acrylic rubber. A method for obtaining such a film substrate 10 may refer to a known film manufacturing method. For example, a method of forming a film after adding a naphthalene skeleton epoxy resin, a phenol resin and an acrylic rubber to an appropriate solvent, etc. Is exemplified.

  The total weight of the phenolic resin-crosslinked naphthalene skeleton epoxy resin and acrylic rubber in the total weight of the film substrate 10 is preferably 50% or more, more preferably 70 to 90%. Examples of materials other than the resin and rubber that may be included in the film substrate 10 include polyurethane resins and polyorganosiloxane resins, but there are no particular limitations as long as they do not affect the characteristics of the present invention. Absent.

  From the viewpoint of heat resistance of the obtained film substrate, the amount of the phenol resin added to 100 parts by weight of the naphthalene skeleton epoxy resin in the production of the film substrate 10 is preferably 30 to 100 parts by weight, and more preferably 50 to 50 parts by weight. 70 parts by weight. From the viewpoint of contact with contacts such as electrodes, the amount of acrylic rubber added to 100 parts by weight of the naphthalene skeleton epoxy resin in the production of the film substrate 10 is preferably 50 to 500 parts by weight, more preferably 70. ~ 250 parts by weight.

  The “naphthalene skeleton epoxy resin” refers to a compound having a naphthalene skeleton and two or more oxirane rings (epoxy groups) in the molecular structure. The naphthalene skeleton epoxy resin is usually used in combination with a curing agent (phenol, amine or other compound having active hydrogen) to form a three-dimensional network polymer. The proportion of the naphthalene skeleton in the naphthalene skeleton epoxy resin is not particularly limited, but is preferably 30% by weight and more preferably 40 to 70% by weight from the viewpoint of heat resistance of the obtained film substrate.

  The naphthalene skeleton epoxy resin is a well-known resin, and its production method is also well-known and is not particularly limited.

  “Phenolic resin” is a resin obtained by condensation of phenol or a derivative thereof with an aldehyde. Examples of phenol or derivatives thereof include phenol and cresol. Examples of the aldehyde include formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde and the like.

  The phenol resin is a well-known resin, and its production method is also well-known and is not particularly limited.

  The “naphthalene skeleton epoxy resin crosslinked with a phenol resin” is a two-dimensional or three-dimensional continuous structure formed by bonding the oxirane ring (epoxy group) of the naphthalene skeleton epoxy resin and the phenol resin. It is resin which has.

  “Acrylic rubber” is a synthetic rubber mainly composed of alkyl acrylate. Examples of the alkyl ester include methyl ester, ethyl ester, butyl ester and the like.

  Acrylic rubber is well known and its production method is also well known and not particularly limited.

  The film substrate 10 used in the present invention is a plate-like material containing the above-described resin / rubber, and the thickness thereof is not particularly limited, but is preferably about 30 μm to 350 μm, more preferably about 30 μm to 150 μm.

  In the anisotropic conductive film for electronic component inspection according to the present invention, a plurality of conductive paths 11 made of a conductive material are insulated from each other in the above-described film substrate 10 and the film substrate 10 is thickened. It is arranged in a state penetrating in the direction. Both ends of each conduction path 11 are exposed on the front and back surfaces of the film substrate 10.

  As a mode in which the conductive path 11 penetrates the film substrate 10 in the thickness direction, as shown in FIG. 1, a mode of penetrating in the same direction as the thickness direction of the film substrate 10 or a mode of penetrating with an inclination from the thickness direction ( (Not shown) or the like, or the conductive path 11 may be curved in the film substrate 10 while being curved (not shown). Among these aspects, the conduction path 11 is inclined or curved in the film substrate 10 in consideration of contact with the electrode 2a of the electronic component 2 to be inspected and the wiring pattern 3a of the circuit board 3. It is preferable. The cross-sectional shape of each conduction path 11 may be any shape such as a circle or a polygon. It is preferable that the conductive paths 11 are densely arranged so that one to three conductive paths 11 are in contact with each electrode 2a of the electronic component 2 to be inspected. By insulating the plurality of conduction paths 11 from each other, the presence or absence of conduction for each of the electrodes 2a of the electronic component 2 and the wiring pattern 3a of the circuit board 3 can be inspected independently. FIG. 2A and FIG. 4 show an arrangement pattern of the conduction paths 11 appearing on one surface of the film substrate 10. FIG. 2B is a schematic view of the XX cross section of FIG. The conducting path 11 may have a square matrix shape as shown in FIG. 4, a close-packed shape as shown in FIG. 2A, or other random dense state. However, the close-packed state is preferable to cope with fine electrodes.

  Examples of the material of the conduction path 11 include known conductive materials, but metal materials such as copper, gold, aluminum, and nickel are preferable from the viewpoint of electrical characteristics, and copper and gold are more preferable from the viewpoint of conductivity. preferable. From the viewpoint of conductivity and elastic modulus, the conductive path 11 may be obtained by depositing a metal material in a through-hole formed in the film substrate 10 by plating. In this embodiment, a conductive path is formed by penetrating the film substrate. Among metal wires, for example, a metal conductor manufactured to transmit electricity, such as a copper wire defined in JIS 3 3103, is preferable, and the most excellent conduction path in terms of electrical characteristics, mechanical characteristics, and cost. It becomes. The shape, size, and number of the cross section (cross section perpendicular to the thickness direction of the film substrate 10) of the conductive path 11 can be appropriately selected depending on the use of the anisotropic conductive film of the present invention. In order to correspond to an electrode arrangement pattern with a fine pitch such as a pitch of 50 μm or less, the diameter of the conduction path 11 is preferably 5 μm to 30 μm, more preferably 5 μm to 20 μm. Here, when the cross section of the conduction path 11 is not circular, it is preferable that the cross-sectional area is substantially the same area as the circle of the said diameter.

  Both ends of the conductive path 11 only need to be exposed on the front and back surfaces of the film substrate 10, but both ends of the conductive path 11 are improved in terms of improving the contact property to the electrode 2 a of the electronic component 2 and the wiring pattern 3 a of the circuit board 3. Preferably protrudes from the front and back of the film substrate (see FIG. 3B). At this time, the degree of protrusion is preferably about 5 μm to 80 μm, more preferably about 10 μm to 30 μm, from the front and back surfaces of the film substrate 10. The protruding portion of the conductive path 11 may be a metal convex portion formed by plating on both ends of the conductive path 11 that penetrates the film substrate 10, or the metal conductive wire itself that penetrates the film substrate 10 extends. May be. In particular, in consideration of preventing oxidation of the conductive path 11 penetrating the film substrate 10, it is preferable to prevent oxidation by plating at the stage of forming the protruding portion. When the conductive path 11 protrudes from the film substrate 10, the surface of the protruding portion may be further covered with a metal material having high conductivity or a material such as gold or nickel having excellent corrosion resistance.

  FIG. 3 is a partial schematic view of one embodiment of the anisotropic conductive film of the present invention. As shown in this figure, a layer 12 made of another material may be provided between the resin material of the film substrate 10 and the conduction path 11. The layer 12 may be provided in layers, and the material may be selected according to the application and required characteristics such as insulation and conductivity. Examples of a material that can be used for the layer 12 surrounding the conduction path 11 include a polyimide resin, a polyamide resin, a polyester resin, and a polyurethane resin.

  The elastic modulus at 20 ° C. to 150 ° C. of the entire structure of the anisotropic conductive film of the present invention is preferably 1 MPa to 100 MPa, more preferably 10 MPa to 20 MPa. By setting the elastic modulus to 1 MPa or more, it is possible to prevent the adhesiveness to the electronic component 2 to be inspected from becoming excessive and to easily collect the electronic component 2 after the inspection. Further, if the elastic modulus is 100 MPa or less, the application of an appropriate contact load described later can easily absorb substrate undulation, chip warpage, and the like, thereby reducing conduction failure due to damage to the conduction path 11 and the like. it can.

The elastic modulus of the entire structure of the anisotropic conductive film is the elastic modulus of the anisotropic conductive film as a finished product including the film substrate 10 and the conductive path 11 and is measured by the following tensile test.
・ Measuring device Viscoelasticity measuring device RSA-II manufactured by TA Instruments Japan Co., Ltd.
・ Test piece 100 μm × 5 mm × 22.5 mm,
Measurement conditions The physical properties at a frequency of 10 Hz, a temperature of 20 ° C., and 150 ° C. are measured in a tensile mode with respect to one direction of the surface expansion direction of the test piece.

A method for controlling the elastic modulus of the anisotropic conductive film is not particularly limited, but a method for improving the elastic modulus is exemplified below.
・ Reduce the amount of acrylic rubber.
-Use a material with a small proportion of naphthalene skeleton in the naphthalene skeleton epoxy resin.
-Use epoxy resin or phenol resin with multiple functional groups in one molecule.
In order to reduce the elastic modulus of the anisotropic conductive film, a method opposite to the above may be taken.

  The thickness of the anisotropic conductive film of this invention becomes like this. Preferably they are 30 micrometers-500 micrometers, More preferably, they are 50 micrometers-200 micrometers. A thickness of 30 μm or more is preferable in that the contact property to the electrode (particularly one having a large step) of the object to be inspected is excellent. Moreover, if thickness is 500 micrometers or less, it is preferable at the point which can reduce the transmission loss by the influence of the length of a conduction path. The thickness of the anisotropic conductive film refers to the maximum length in the direction perpendicular to the surface expansion direction of the film substrate 10 out of the distance between two points of the anisotropic conductive film. Therefore, when the conductive path 11 does not protrude from the film substrate 10, the thickness of the anisotropic conductive film is equal to the thickness of the film substrate 10, and when the conductive path 11 protrudes from the film substrate 10, the thickness of the anisotropic conductive film is different. The thickness of the directionally conductive film is usually the distance between both ends of the conduction path 11 (length T in FIG. 3).

When manufacturing the anisotropic conductive film 1 as described above, a method for obtaining a structure in which the conductive path 11 penetrates the film substrate 10 is not particularly limited. As an example of such a method, as described in Patent Document 1, a large number of insulated conductors are fixed in a tightly bundled state so that they cannot be separated from each other, and a surface that forms an angle with each insulated electrode is used as a cut surface. The method of slicing to film thickness is mentioned. More specifically, the method includes a production method having the following steps (1) to (7) or (1) to (5) and (7).
(1) A step of winding a film mainly comprising any of the above-mentioned naphthalene skeleton epoxy resin, phenol resin or acrylic rubber on the core material,
(2) A step of winding a metal conductor having a diameter of 5 to 30 μm on the metal conductor so as to maintain a constant interval;
(3) Furthermore, a film, a metal conducting wire, a film, a metal conducting wire,.
(4) A step of heating and / or pressurizing the coil obtained in the step (3) to fuse and / or press-bond the wound films to form a coil block;
(5) A step of cutting the coil block obtained in the step (4) into a predetermined film thickness with a plane intersecting with the wound insulated conductor at an angle,
(6) A step of etching the insulating resin portion of the film-like material obtained in (5) above, and causing the metal conductor to protrude from the film substrate surface,
(7) A step of further depositing a metal on the end surface of the metal conductor exposed on the film substrate surface of the film-like product obtained in (5) or (6) above and projecting from the film substrate surface.

  Next, the inspection method of the present invention using the above-described anisotropic conductive film will be described. The inspection object of the present invention is an electronic component having at least one electrode. Here, the “electronic component” is a component that exhibits a function when energized, and includes a semiconductor element, a liquid crystal panel, a high-frequency component, and the like. Applying the inspection method of the present invention to an electronic device or semiconductor device incorporating an electronic component corresponds to application of the inspection method of the incorporated electronic component.

  1, the anisotropic conductive film 1 is sandwiched between an electronic component 2 and a circuit board 3, and a predetermined load to be described later is applied while sandwiched as shown in FIG. The electronic component 2 is electrically connected. In this method, even if the electronic component 2 and the circuit board 3 are warped, swelled or stepped, they are absorbed by the anisotropic conductive film 1 being deformed by itself, and the electrode 2a of the electronic component and the corresponding circuit are absorbed. The circuit pattern 3a on the substrate 3 is appropriately in contact with a preferable minimum load.

  Here, the “circuit board” may be a circuit board as a product on which the electronic component 2 is to be mounted, or may be a circuit board as an inspection jig manufactured using it as a model.

  When the anisotropic conductive film 1 is sandwiched between the electronic component 2 and the circuit board 3, the electrode 2a of the electronic component 2 and the conductive path 11 of the anisotropic conductive film may be sandwiched, It is preferable that the conductive paths 11 are densely arranged so that one to three conductive paths 11 are in contact with each electrode 2a of the electronic component 2 to be inspected.

While the anisotropic conductive film 1 is sandwiched between the electronic component 2 and the circuit board 3 as described above, a load is applied in a direction in which the anisotropic conductive film 1 and the electronic component 2 are pressed. For example, as shown in FIG. 1, the load in such a direction is realized by fixing the circuit board 3 to a base (table) and pressing it from the electronic component 2 side. Contact load at this time is preferably per one electrode of the electronic component is ^{50g / mm 2 ~5000g / mm 2} , when the circuit board 3 to be inspected flat is 100g ^/ mm ² ~3000g ^/ mm 2 Is particularly preferred. This contact load is in a range in which the electrode 2a of the electronic component 2 is hardly deformed and the contact resistance is low. That is, when the contact load is less than 50 g / mm ^2, is difficult to follow on the electrode reliable connection is less likely to take (conduction ratio is not 100%), exceeds 5000 g / mm ^2, the electronic components during inspection 2 The electrode 2a is deformed, and connection failure is likely to occur during mounting. In particular, when the electronic component has a protruding electrode having a protrusion height of about 20 μm to 200 μm, such as a solder bump or a solder ball, the utility of setting the contact load in the above range is most remarkable.

  The “contact load per electrode” is a value obtained by dividing the total load applied to the electronic component 2 by the number of electrodes 2a in contact. Here, the electrode 2a is an electrode provided in the electronic component 2 to be inspected. The total load applied to the electronic component 2 can be controlled, for example, by setting a flip chip bonder.

As described above, the load applied when the anisotropic conductive film 1 is sandwiched between the electronic component 2 and the circuit board 3 is compressed so that the thickness of the anisotropic conductive film 1 is reduced by 5 μm to 150 μm. A load is preferred. By performing the function inspection of the electronic component 2 in such a compressed state, warping and undulation of the electronic component 2 and the circuit board 3 can be absorbed more efficiently.
The displacement amount (thickness reduction amount) of the anisotropic conductive film under inspection can be directly measured by a micro compression tester (manufactured by Shimadzu Corporation, MCT-W).

  In this way, the electronic component 2 is inspected by energizing the electronic component 2 to be inspected while applying a load. Here, the inspection is not particularly limited as long as it is an inspection that requires energization of the electronic component 2, for example, whether it is confirmation whether or not energization is performed, or measurement of contact resistance at the electrode 2 a. Good.

An anisotropic conductive film (Example 1, Comparative Examples 1 and 2) was manufactured by the above-described steps (1) to (7). The material of the film substrate of each anisotropic conductive film is as follows.
(Example 1)
The following resin mixture was used.
Naphthalene type epoxy resin (epoxy equivalent 270) ... 100 (parts by weight)
Cresol novolac type epoxy resin (hydroxyl equivalent 174) ·· 65 (parts by weight)
Acrylic rubber (epoxy monomer copolymer crosslinking type) ... 170 (parts by weight)
(Comparative Example 1)
Polyether type polyurethane rubber (Nisshinbo Co., Ltd. MF-50T-MX)
(Comparative Example 2)
Silicone rubber (commercially available product with siloxane as the main component and vulcanizing agent added)

The following anisotropic conductive film was manufactured using the film substrate of the said material.
-Film substrate thickness: 200 μm
・ Projection length of the conductive path from the front and back surfaces of the film substrate: 20 μm
-Thickness of gold plating applied to both ends of the conduction path: 0.2 μm
・ Total thickness of anisotropic conductive film: 240 μm
-Diameter of conduction path: 25 μm
-Distance between central axes of adjacent conductive paths (pitch): 100 μm

The electronic components (semiconductor elements) to be inspected are as follows.
・ Chip size: 10mm × 10mm (thickness: 500μm)
・ Electrode type: Au stud bump ・ Electrode bump diameter: 70 μm
・ Bump height: 70μm
・ Number of electrodes: 156 ・ Pitch between centers of electrodes: 200 μm

The specifications of the circuit board for evaluation are as follows.
・ Glass epoxy board: FR-4
・ Thickness including circuit pattern thickness: 1 mm
The ratio of the circuit width of the circuit pattern to the width of the gap portion: 100 μm / 100 μm

An anisotropic conductive film is sandwiched between the electronic component and the circuit board, and an electric current is applied while applying a load of 200 g / m ² per electrode. The amount of displacement, deformation of the bump, and adhesion to the board Measurements and observations were made. Measurement and inspection were performed at 20 ° C. and 150 ° C. for each film. The results are listed in Table 1.

In the table, the “silicone component adhesion amount to the test object” is a value obtained by quantifying the silicone component remaining on the contact surface after pressing the anisotropic conductive film against the copper foil by the SEM-EPMA method.
“Contact” was “OK” when continuity was confirmed using a compression tester, and “NG” otherwise.
“Adhesion with circuit board” is “Yes” if the anisotropic conductive film cannot be removed smoothly after inspection, or if there is an adherent such as a film fragment on the board even if it can be removed. If there was none, it was set to “none”

Although Comparative Example 1 (using polyurethane rubber) can be used at room temperature (20 ° C.), it cannot be said to be an excellent anisotropic conductive film in that adhesion to a circuit board is observed at 150 ° C.
Comparative Example 2 (using silicone rubber) is inferior as an anisotropic conductive film for inspection because a low molecular weight component of silicone adheres (transfers) to the object to be inspected.
On the other hand, the anisotropic conductive films of the examples have high heat resistance, no fusion at high temperatures, and no contamination of the test object due to low molecular weight components, so they can be used in a wide temperature range. An anisotropic conductive film.

The inspection method of the present invention is typically expressed. The dimensions of each part are exaggerated for explanation. It is a schematic diagram of the anisotropic conductive film used for this invention. FIG. 2A shows an arrangement pattern of conduction paths appearing on one surface of the film substrate, and an XX sectional view thereof is FIG. It is a schematic diagram of the anisotropic conductive film of this invention. It is a schematic diagram of the anisotropic conductive film used for this invention, Comprising: The arrangement pattern of the conduction path which appears on the one surface of a film substrate is shown. In addition, this figure expands a part of one surface of a film substrate similarly to Fig.2 (a), Comprising: It does not show the outer peripheral shape whole of a film substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film 10 Film board 11 Conduction path 2 Electronic component 3 Circuit board F Contact load

Claims (5)

  In a film substrate containing a naphthalene skeleton epoxy resin cross-linked with a phenol resin and acrylic rubber, a plurality of conductive paths made of a conductive material are insulated from each other and penetrate the film substrate in the thickness direction. An anisotropic conductive film for inspection of electronic parts, wherein the conductive paths are arranged in a state, and each conductive path has a structure in which both ends are exposed on the front and back surfaces of the film substrate.   2. The anisotropic conductive film according to claim 1, wherein an elastic modulus of the entire structure of the anisotropic conductive film is 1 MPa to 100 MPa at 20 ° C. to 150 ° C., and a thickness of the anisotropic conductive film is 30 μm to 500 μm. . Both ends of the conduction path protrude from the front and back surfaces of the film substrate,
The portion of the conduction path that penetrates the film substrate is made of a metal conductor having a diameter of 5 μm to 30 μm,
The projecting portion of the conductive path from the film substrate consists of the metal conductor itself extending outside the film substrate, or a metal convex portion formed by plating at the end of the metal conductor,
The anisotropic conductive film according to claim 1 or 2. The anisotropic conductive film according to any one of claims 1 to 3, wherein an electrode of the electronic component and a conductive path of the anisotropic conductive film are provided between an electronic component including at least one electrode and a circuit board. Place it in contact,
In one electrode per 50g ^/ mm ² ~5000g / mm 2 of the contact load of the electronic component, while applying a load in a direction to press the anisotropic conductive film and the electronic component, energizing the electronic component inspecting method of the electronic component .   The inspection method according to claim 4, wherein by applying the load, the anisotropic conductive film is compressed and the thickness of the film is reduced by 5 μm to 150 μm.

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