JPH09199208A - Electric connector - Google Patents

Electric connector

Info

Publication number
JPH09199208A
JPH09199208A JP893896A JP893896A JPH09199208A JP H09199208 A JPH09199208 A JP H09199208A JP 893896 A JP893896 A JP 893896A JP 893896 A JP893896 A JP 893896A JP H09199208 A JPH09199208 A JP H09199208A
Authority
JP
Japan
Prior art keywords
spherical
spherical contact
connection
linear conductor
elastomer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP893896A
Other languages
Japanese (ja)
Inventor
Tsutomu Ogino
勉 荻野
Fumio Kono
文夫 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP893896A priority Critical patent/JPH09199208A/en
Publication of JPH09199208A publication Critical patent/JPH09199208A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector, in which a contact part of the connector can be arranged by a fine pitch, a shape of the contact part is simple, inspection and connection of an IC package can be surely stably performed without generating improper connection, and alignment to a terminal in a connected side is facilitated, relating the electric connector suited for use in the inspection and connection of the IC package of ball grid array type having a spherical protrusion electrode in an external terminal. SOLUTION: This electric connector is provided with a plurality of linear conductors 4 inserted in a thickness direction of an insulating elastomer layer. One end part of the linear conductor 4 is formed with a spherical contact part, at least partly this spherical contact part 5 is exposed from a bottom surface of a recessed part 6 provided in a surface of the insulating elastomer layer 3, when assuming L for wire size of the linear conductor 4, a spherical diameter R of the spherical contact part 5 is in an L<R<3L range, an exposed height E from a bottom surface of the spherical contact part 5 is in an R/3<E<R range.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、外部端子に球状の
突起電極を有するボール・グリッド・アレイ型のICパッ
ケージの検査や接続に用いて好適な電気コネクタに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric connector suitable for use in inspection and connection of a ball grid array type IC package having a spherical projection electrode as an external terminal.

【0002】[0002]

【従来の技術】従来、入出力端子数の多い表面実装型IC
パッケージとして、パッケージ本体の周囲4辺から外部
端子を取り出した形のクワッド・フラット・パッケージ
(以下、QFP という)が使用されているが、QFP の場
合、近年の端子数の増加に対応するには、実装面積をで
きるかぎり小さくするために、パッケージサイズを一定
寸法以下に抑え、端子ピッチを狭くして端子数を増やす
必要があり、そのため最近では、端子ピッチは 0.4mm程
度まで小さくなってきている。このような微細なピッチ
の多端子QFP のリード端子は細く変形しやすい。また端
子の位置合わせが困難なため、製造工程、検査工程およ
び実装工程などで多くの問題を生じていた。
2. Description of the Related Art Conventionally, surface mount type ICs with many input / output terminals
As the package, a quad flat package (hereinafter referred to as QFP) is used in which external terminals are taken out from four sides of the package body. In the case of QFP, in order to cope with the recent increase in the number of terminals, In order to make the mounting area as small as possible, it is necessary to keep the package size below a certain size and narrow the terminal pitch to increase the number of terminals. Therefore, recently, the terminal pitch has been reduced to about 0.4 mm. . The lead terminal of a multi-terminal QFP with such a fine pitch is thin and easily deformed. Further, since it is difficult to align the terminals, many problems occur in the manufacturing process, inspection process, mounting process, and the like.

【0003】この対策として、最近では、ICパッケージ
本体の上下一方の面に、平面状に端子電極を配したエリ
アアレイ型のICパッケージ、特に、球状の端子電極を取
り付けたボール・グリッド・アレイ型のICパッケージ
(以下、BGA という)が開発され、その実用化が進んで
いる。このBGA の検査に対して、従来のICパッケージと
同様に、BGA の端子電極に対応した接触子を備えた専用
のICソケットの使用が検討され開発が進められている。
一般にICソケットは、エンジニアリングプラスチック材
料の射出成形によって作られたソケット本体に、銅合金
系バネ材料などに金メッキを施した多数の接触子が圧入
固定されており、これらの接触子を介してICソケットに
接着されたICパッケージの端子電極と検査回路基板の電
極とが電気的に接続される。BGA 対応タイプのICソケッ
トの構成も基本的には同じ構成をしている。
As a countermeasure against this, recently, an area array type IC package in which terminal electrodes are arranged in a flat shape on one of the upper and lower surfaces of the IC package body, particularly a ball grid array type in which spherical terminal electrodes are attached IC package (hereinafter referred to as BGA) has been developed and is being put to practical use. For this BGA inspection, the use of a dedicated IC socket equipped with a contact corresponding to the terminal electrode of the BGA, like the conventional IC package, is being considered and is being developed.
In general, an IC socket has a socket body made by injection-molding an engineering plastic material and a large number of contacts plated with gold on a copper alloy spring material are press-fitted in the socket body. The terminal electrode of the IC package bonded to the electrode and the electrode of the inspection circuit board are electrically connected. The configuration of BGA compatible type IC sockets is basically the same.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、BGA 対
応タイプ用のICソケットには以下のような問題がある。
上記したICソケットの接触子は、接着されたICパッケー
ジの端子電極との接続に所定の接触圧力が必要であり、
さらにICパッケージの個々の端子電極の高さのばらつき
を吸収するために、接触子に屈曲部を設けた複雑な形状
となっており、接続不良を生じる一因となっていた。こ
のように形状の複雑な接触子を平面上に配列するのは容
易でなく、特に微細な間隔で接触子を配列することは極
めて困難であり、端子電極ピッチが 1.0mm以下のBGA に
対しては接触子の配列が対応できない、また端子電極と
接触子との位置出し機構、接触圧力機構など構成が複雑
となり、コストがかかるのが現状である。
However, the IC socket for the BGA compatible type has the following problems.
The contact of the above-mentioned IC socket requires a predetermined contact pressure for connection with the terminal electrode of the bonded IC package,
Further, in order to absorb the height variation of each terminal electrode of the IC package, the contactor has a complicated shape with a bent portion, which is one of the causes of connection failure. It is not easy to arrange contacts with complicated shapes in this way on a plane, and it is extremely difficult to arrange contacts at minute intervals, especially for a BGA with a terminal electrode pitch of 1.0 mm or less. However, the arrangement of the contacts is not applicable, and the structure such as the positioning mechanism for the terminal electrode and the contacts and the contact pressure mechanism are complicated, resulting in high costs.

【0005】また、最近では携帯電話、通信機器及びコ
ンピューターなどに、高周波の信号を処理するICパッケ
ージが頻繁に使用されている。このような高周波対応用
のICパッケージをICソケットで検査しようとすると、IC
ソケットの接触子は前記したように屈曲部を有する複雑
な形状をしているため、導通経路が長くなり、出力信号
の遅延や波形に歪を生じるという問題があった。したが
って、本発明の目的は、接点部を微細なピッチで配列す
ることができ、接点部の形状が簡単で接続不良を生じる
ことなくICパッケージの検査、接続が確実に安定して行
え、被接続側の端子とのアライメントの容易な電気コネ
クタを提供することにある。
Recently, IC packages for processing high frequency signals are frequently used in mobile phones, communication devices, computers and the like. If you try to inspect such a high frequency IC package with an IC socket, the IC
Since the contactor of the socket has a complicated shape having the bent portion as described above, there is a problem that the conduction path becomes long and the output signal is delayed or the waveform is distorted. Therefore, it is an object of the present invention that the contact portions can be arranged at a fine pitch, the shape of the contact portions is simple, and the inspection and connection of the IC package can be performed reliably and stably without causing connection failure. Another object of the present invention is to provide an electric connector that can be easily aligned with the side terminal.

【0006】[0006]

【課題を解決するための手段】本発明の電気コネクタ
は、絶縁性エラストマ層の厚み方向に貫通して複数の線
状導電体を設けた電気コネクタであって、線状導電体の
一方の端部が球状の接点部を形成し、この球状接点部の
少なくとも一部が絶縁性エラストマ層の表面に設けられ
た凹部の底面から露出しており、線状導電体の線径をL
とするとき、球状接点部の球径Rは、L<R<3Lの範
囲にあり、球状接点部の底面からの露出高Eは、R/3
<E<Rの範囲にあることを特徴とする。
An electrical connector of the present invention is an electrical connector having a plurality of linear conductors penetrating in the thickness direction of an insulating elastomer layer, wherein one end of the linear conductor is provided. Part forms a spherical contact part, and at least a part of this spherical contact part is exposed from the bottom surface of the recess provided in the surface of the insulating elastomer layer, and the wire diameter of the linear conductor is L
Then, the spherical diameter R of the spherical contact portion is in the range of L <R <3L, and the exposure height E from the bottom surface of the spherical contact portion is R / 3.
It is characterized by being in the range of <E <R.

【0007】本発明の電気コネクタは、絶縁性エラスト
マ層の厚み方向に貫通して複数の線状導電体が汎用のボ
ールボンダーにより埋設されてなり、線状導電体の一方
の端部に球状の接点部(以下、球状接点部という)とそ
の周囲に凹部が形成され、球状接点部の少なくとも一部
が絶縁性エラストマ層の表面に設けた凹部の底面から露
出してなるものである。以下、本発明の電気コネクタに
ついて詳細に説明する。
The electrical connector of the present invention comprises a plurality of linear conductors that are embedded in a general-purpose ball bonder so as to penetrate through the insulating elastomer layer in the thickness direction, and a spherical conductor is formed at one end of the linear conductor. A contact portion (hereinafter referred to as a spherical contact portion) and a concave portion are formed around the contact portion, and at least a part of the spherical contact portion is exposed from the bottom surface of the concave portion provided on the surface of the insulating elastomer layer. Hereinafter, the electrical connector of the present invention will be described in detail.

【0008】本発明の電気コネクタは、線状導電体が、
絶縁性エラストマ層の厚み方向に複数貫通して配列し、
埋設されている。このような構成とするために、絶縁性
エラストマ層の原料は硬化前は流動性を有し、硬化させ
ることにより架橋構造を形成するものが好ましく、例え
ば、シリコーン系ゴム、ポリブタジェンゴム、天然ゴ
ム、ポリイソプレンゴム、ウレタンゴム、クロロプレン
ゴム、ポリエステル系ゴム、スチレン−ブタジェン共重
合体ゴム、エピクロルヒドリンゴム、またはこれらの発
泡材料などが挙げられる。なかでも、硬化後の電気絶縁
性、耐熱性、圧縮永久歪に優れているシリコーンゴムが
最も好ましい。その硬度は、高すぎると圧縮接続の際の
荷重が大きくなり、低すぎると圧縮の際の歪量が大きく
なるため10〜80°H、好ましくは20〜60°Hのものが使
用される。
In the electrical connector of the present invention, the linear conductor is
Arranged through a plurality of insulating elastomer layers in the thickness direction,
It is buried. In order to have such a structure, it is preferable that the raw material of the insulating elastomer layer has fluidity before curing and forms a crosslinked structure by curing, and examples thereof include silicone rubber, polybutadiene rubber, and natural rubber. Examples thereof include rubber, polyisoprene rubber, urethane rubber, chloroprene rubber, polyester rubber, styrene-butadiene copolymer rubber, epichlorohydrin rubber, and foamed materials thereof. Of these, silicone rubber is most preferable because it has excellent electrical insulation properties, heat resistance, and compression set after curing. If the hardness is too high, the load at the time of compression connection becomes large, and if it is too low, the amount of strain at the time of compression becomes large, so that the hardness is 10 to 80 ° H, preferably 20 to 60 ° H.

【0009】電気コネクタの外縁に設けられるフレーム
は、シート状の絶縁性エラストマ層を保持し、電気コネ
クタの取扱いの際の利便性をよくするとともに、検査基
板や検査治具との位置決めに利用することができる。フ
レームの材質としては、汎用のエンジニアリングプラス
チック材、セラミック材、及び金属材料などを適宜選択
して使用できる。特に、耐熱性、寸法安定性に優れたエ
ンジニアリングプラスチック材では、ポリエーテルイミ
ド(PEI)、 ポリフェニレンサルファイド(PPS)、ポリエ
ーテルスルホン(PES) などの材料を使用するとよい。
The frame provided on the outer edge of the electric connector holds the sheet-shaped insulating elastomer layer, improves the convenience in handling the electric connector, and is used for positioning with the inspection board or the inspection jig. be able to. As the material of the frame, a general-purpose engineering plastic material, a ceramic material, a metal material or the like can be appropriately selected and used. Especially for engineering plastic materials having excellent heat resistance and dimensional stability, materials such as polyetherimide (PEI), polyphenylene sulfide (PPS), and polyether sulfone (PES) may be used.

【0010】線状導電体の線径は、接続する際にかかる
荷重をできるだけ小さくする必要があり、さらに、低ピ
ッチで配設されたBGA の球状端子電極の電極間距離に対
応するため、接続安定性に悪影響を与えない範囲で、線
状導電体の線径は細い方が好ましく、具体的には線径0.
01〜0.2mm の範囲から選択される。線状導電体の配列に
は、入手が容易であって、汎用のボールボンダーの使用
が可能な線径0.02〜0.08mmの金線が好ましい。なお、本
発明に用いる線状導電体の断面は、必ずしも真円とは限
らず、長円や楕円、四角形に代表される多角形でもよい
が、いずれの場合もアスペクト比(長円、楕円では長径
/短径、四角形の場合は縦/横、多角形の場合は最長幅
/最短幅を示す。)が1〜2であるものの中から選択す
ることが望ましい。一般的に、線径とは真円における直
径を意味する用語であるが、本発明においては、線状導
電体の断面形状が真円以外の場合、すなわち長円、楕
円、多角形の場合は、これら断面形状の外接円を想定
し、その径を線径とみなすことにする。なお、市販の金
線などの線状導電体は円としての寸法表示、すなわちφ
000 mmという表示がなされているので、それを線径とし
て扱う。線状導電体としては、金、金合金、銅、アルミ
ニウム、アルミニウム−珪素合金、真鍮、りん青銅、ベ
リリウム銅、ニッケル、モリブデン、タングステンなど
の線状導電体、あるいはこれらの表面に金または金合金
などのメッキ加工を施した線状導電体などが使用でき
る。
The wire diameter of the linear conductor must be as small as possible to apply a load during connection, and further, it corresponds to the distance between the electrodes of the spherical terminal electrodes of the BGA arranged at a low pitch. Within the range that does not adversely affect the stability, the wire diameter of the linear conductor is preferably smaller, specifically, the wire diameter of 0.
It is selected from the range of 01-0.2mm. For the array of linear conductors, a gold wire having a wire diameter of 0.02 to 0.08 mm is preferable because it is easily available and a general-purpose ball bonder can be used. Note that the cross section of the linear conductor used in the present invention is not necessarily a perfect circle, and may be an oval, an ellipse, or a polygon represented by a quadrangle, but in any case, the aspect ratio (oblong or ellipse is The major axis / minor axis, the vertical / horizontal direction in the case of a quadrangle, the longest width / the shortest width in the case of a polygonal shape) are preferably 1 to 2. In general, the wire diameter is a term that means a diameter in a perfect circle, but in the present invention, when the cross-sectional shape of the linear conductor is other than a perfect circle, that is, when it is an ellipse, an ellipse, or a polygon. Assuming the circumscribed circles of these cross-sectional shapes, the diameter is considered to be the wire diameter. It should be noted that commercially available linear conductors such as gold wire are indicated as circles, that is, φ
Since it is displayed as 000 mm, treat it as the wire diameter. As the linear conductor, a linear conductor such as gold, gold alloy, copper, aluminum, aluminum-silicon alloy, brass, phosphor bronze, beryllium copper, nickel, molybdenum, or tungsten, or gold or gold alloy on the surface thereof. It is possible to use a linear conductor or the like that has been plated.

【0011】また、線状導電体の球状接点部は、線状導
電体の先端部に、汎用のレーザー光を照射して形成す
る。この線状導電体の端部を球状にすることで、BGA の
球状端子電極と圧縮接続した際に、線状導電体の接触部
が絶縁性エラストマ層の弾性によって反撥し、陥没する
ことなく、良好な接続状態が得られる。また、レーザー
光の出力や照射位置の調整で、接点部の球径Rを所定の
サイズに設定することができる。 この方法によって形
成される球状接点部の球径Rは、線状導電体の線径Lに
依存し、L<R<3Lの範囲にあるのが好ましい。より
具体的には、線状導電体の線径を例えば 0.076mmとする
と、線径のほぼ1〜3倍、すなわち球径Rは0.08〜0.22
mmとするのが好ましい。球状接点部の球径Rが、線状導
電体の線径L以下では球状接点とならず、しかもBGA の
球状端子電極と圧縮接続した際に、球状接点部が絶縁性
エラストマ層中に陥没して接続不良を生じ、電気コネク
タとして機能しない。一方、線状導電体の線径Lの3倍
以上では、BGA の球状端子電極の微細ピッチに対応する
ことができず、実装接続時にBGA の球状端子電極に平均
的に接続せず接続不安定となったり、位置ズレの原因と
なり好ましくない。従って、上記範囲に限定され、範囲
外では電気コネクタとしての所望の機能が得られない。
The spherical contact portion of the linear conductor is formed by irradiating the tip of the linear conductor with a general-purpose laser beam. By making the end of this linear conductor spherical, the contact part of the linear conductor repels due to the elasticity of the insulating elastomer layer when it is compression-connected to the spherical terminal electrode of BGA, and it does not sink. A good connection state can be obtained. Further, the spherical diameter R of the contact portion can be set to a predetermined size by adjusting the output of laser light and the irradiation position. The spherical diameter R of the spherical contact portion formed by this method depends on the linear diameter L of the linear conductor and is preferably in the range of L <R <3L. More specifically, assuming that the wire diameter of the linear conductor is 0.076 mm, the wire diameter is approximately 1 to 3 times, that is, the spherical diameter R is 0.08 to 0.22.
mm is preferred. If the spherical diameter R of the spherical contact portion is less than or equal to the wire diameter L of the linear conductor, the spherical contact portion does not become a spherical contact, and when the spherical terminal electrode of the BGA is compressed and connected, the spherical contact portion is depressed into the insulating elastomer layer. As a result, a connection failure occurs and it does not function as an electrical connector. On the other hand, if the wire diameter L of the linear conductor is three times or more, the fine pitch of the spherical terminal electrode of the BGA cannot be supported, and the spherical terminal electrode of the BGA is not connected on average during mounting and connection is unstable. It is not preferable because it may cause a positional shift. Therefore, it is limited to the above range, and the desired function as the electrical connector cannot be obtained outside the range.

【0012】凹部の形成には、汎用のレーザー、例えば
エキシマレーザー、アルゴンレーザー、YAG レーザー、
炭酸ガスレーザーなどを用いて線状導電体の球状接点部
に相当する部分にレーザー光を所定の方向、例えば上方
より照射して、球状接点部の周囲の絶縁性エラストマ層
を除去して凹部を設け、球状接点部を絶縁性エラストマ
層から露出させる。この凹部形成の際、球状接点部の配
列パターンと同じパターンの穴が設けられたマスクを、
絶縁性エラストマ層の加工面上に配列された球状接点部
と位置合わせして、このマスク上からレーザー光を照射
したり、同様のマスクを通したレーザー光を所定の球状
接点部に照射することにより、効率的にしかも精度よく
凹部の加工ができる。その際、球状接点部に影響を与え
ないようなレーザー光を選択する必要がある。一般に、
透明な材料は、波長の長いレーザー光を透過してしまう
ため、照射部分が除去されず、凹部形成加工が出来ない
場合がある。このような場合には、絶縁性エラストマ層
に適宜選択した着色剤などを添加し、レーザー光を吸収
しやすくすると、加工性が向上し、その表面もきれいに
仕上がる。
For forming the recess, a general-purpose laser such as an excimer laser, an argon laser, a YAG laser,
A portion of the linear conductor corresponding to the spherical contact portion is irradiated with laser light in a predetermined direction, for example, from above by using a carbon dioxide gas laser or the like, and the insulating elastomer layer around the spherical contact portion is removed to form a concave portion. Provided, exposing the spherical contact from the insulating elastomer layer. At the time of forming this concave portion, a mask provided with holes having the same pattern as the arrangement pattern of the spherical contact portions,
Aligning with the spherical contacts arranged on the processed surface of the insulating elastomer layer, irradiating laser light from this mask, or irradiating the predetermined spherical contact parts with laser light passing through a similar mask. Thus, the recess can be processed efficiently and accurately. At that time, it is necessary to select a laser beam that does not affect the spherical contact portion. In general,
Since a transparent material transmits a laser beam having a long wavelength, the irradiated portion may not be removed and the concave portion may not be processed. In such a case, if an appropriately selected coloring agent or the like is added to the insulating elastomer layer to easily absorb the laser beam, the workability is improved and the surface thereof is finished nicely.

【0013】線状導電体の球状接点部が凹部底面から露
出する露出高Eは、R/3<E<Rの範囲にあり、より好
ましくは、R/3<E<2/3 Rの範囲である。露出高Eが
R/3以下では、BGA の球状端子電極との接続可能部分が
少ないため、接続不安定あるいは絶縁性エラストマ層に
接触してしまって接続不可能となり、電気コネクタとし
て機能しない。また露出高EがR以上では、圧縮接続時
に球状接点部がその基部で座屈状態になり、接続の確実
性、安定性が低下し実装接続に適さない。さらにBGA の
検査での繰り返し使用時に球状接点部が切断されて接続
不可能の状態となり、この場合も電気コネクタとして機
能せず、好ましくない。
The exposure height E at which the spherical contact portion of the linear conductor is exposed from the bottom surface of the recess is in the range of R / 3 <E <R, and more preferably in the range of R / 3 <E <2/3 R. Is. When the exposure height E is R / 3 or less, the portion that can be connected to the spherical terminal electrode of the BGA is small, so that the connection becomes unstable or the insulating elastomer layer comes into contact and the connection becomes impossible, so that it does not function as an electrical connector. When the exposure height E is R or more, the spherical contact portion is buckled at the base portion during compression connection, and the reliability and stability of the connection deteriorate, which is not suitable for mounting connection. Furthermore, the spherical contact part is cut off after repeated use in BGA inspection, making it impossible to connect. In this case also, it does not function as an electrical connector, which is not preferable.

【0014】本発明の電気コネクタの球状接点部は、凹
部内に埋設され、かつ凹部底面の絶縁性エラストマ層表
面から露出している。BGA の球状端子電極との接続に際
し、対応する電気コネクタの接続箇所を、球状接点部を
埋設した凹部形状としたことによって、BGA の各球状端
子電極は、電気コネクタの凹部とワンタッチで嵌合し、
容易にアライメントされ、しかも安定して確実に接続さ
れる。BGA の球状端子電極ピッチが 1.0mm以下で、球状
端子電極径が 0.5あるいは 0.3mmという極小電極にたい
しても容易かつ確実に接続される。
The spherical contact portion of the electrical connector of the present invention is embedded in the recess and is exposed from the surface of the insulating elastomer layer on the bottom surface of the recess. When connecting to the spherical terminal electrode of the BGA, the corresponding electrical connector connection location has a concave shape with a spherical contact embedded, so that each spherical terminal electrode of the BGA can be fitted with the concave portion of the electrical connector with one touch. ,
Alignment is easy and the connection is stable and reliable. BGA has a spherical terminal electrode pitch of 1.0 mm or less, and it can be easily and reliably connected even to extremely small electrodes with a spherical terminal electrode diameter of 0.5 or 0.3 mm.

【0015】[0015]

【発明の実施の形態】本発明の電気コネクタは、BGA の
球状端子電極や検査基板あるいは電子回路基板の電極と
電気的接続を得るために使用されるが、その際の本発明
の電気コネクタを用いての実装の一態様を図1に示し
た。図2は本発明の電気コネクタの一実施態様を示し、
図2(a)はその平面図、(b)は図(a)のA−A矢
視線にそう縦断面図である。先ず、電気コネクタ1は、
フレーム2に保持されたシート状の絶縁性エラストマ層
3中に、線状導電体4がその厚み方向に貫通して埋設さ
れており、線状導電体の一方の先端部にはその線径より
も大きな直径を有する球状の接点部5が形成され、絶縁
性エラストマ層3の表面に設けられた凹部6の底面から
その一部が露出した状態で配設されている。
BEST MODE FOR CARRYING OUT THE INVENTION The electric connector of the present invention is used to obtain an electrical connection with a spherical terminal electrode of a BGA or an electrode of a test board or an electronic circuit board. One aspect of the mounting using is shown in FIG. FIG. 2 shows one embodiment of the electrical connector of the present invention,
2 (a) is a plan view thereof, and FIG. 2 (b) is a vertical sectional view taken along the line AA of FIG. 2 (a). First, the electrical connector 1
A linear conductor 4 is embedded in the sheet-shaped insulating elastomer layer 3 held by the frame 2 so as to penetrate in the thickness direction thereof. Also, a spherical contact portion 5 having a large diameter is formed, and the recessed portion 6 provided on the surface of the insulating elastomer layer 3 is arranged so that a part thereof is exposed from the bottom surface.

【0016】このような構成からなる電気コネクタ1が
BGA7と検査基板8との接続に実装されている。 BGA7
の球状端子電極9は、電気コネクタ1の表面に設けられ
た内面形状が円柱形状の凹部6に嵌合し、凹部6の底面
から露出した球状接点部5と、凹部6の周囲の絶縁性エ
ラストマ層3の弾性により損傷を受けずに接続される。
さらに、電気コネクタ1の球状接点部5の反対側の端子
電極10と検査基板8の電極11とを接続することによっ
て、電気コネクタ1を介して、 BGA7の球状端子電極9
と検査基板8の電極11との間に安定した確実な導通が得
られる。
The electrical connector 1 having such a structure is
It is mounted on the connection between the BGA 7 and the inspection board 8. BGA7
The spherical terminal electrode 9 is fitted in a recess 6 having an inner surface of a cylindrical shape provided on the surface of the electric connector 1, the spherical contact portion 5 exposed from the bottom of the recess 6 and an insulating elastomer around the recess 6. The elasticity of the layer 3 ensures a connection without damage.
Further, by connecting the terminal electrode 10 on the opposite side of the spherical contact portion 5 of the electric connector 1 and the electrode 11 of the inspection board 8, the spherical terminal electrode 9 of the BGA 7 is connected via the electric connector 1.
Stable and reliable conduction can be obtained between the electrode 11 and the electrode 11 of the inspection substrate 8.

【0017】絶縁性エラストマ層の表面に設けられた凹
部の形状を図3(a)、(b)および図4に示す。図3
(a)は凹部を示す平面図、(b)は(a)のBーB矢
視線に沿う縦断面図であり、図4は凹部の他の例を示す
平面図である。図3に示された凹部6の内面形状は円柱
形状をしており、その底面から線状導電体4の球状接点
部5が露出している。図3においてCは凹部6の内径で
あり、Dは凹部6の深さ、Rは球状接点部5の球径、E
は球状接点部5が凹部6の底面から露出している高さ、
Lは線状導電体4の線径である。図4におけるSは、凹
部6が平面視矩形であるときの一辺の長さである。凹部
の内径Cは、 BGA7の球状端子電極9の球径に対応し
て、多少のクリアランスを加味して設定すればよい。BG
A7の球状端子電極9の球径は、1.0 mmが一般的である
が、より小型化、精細化の傾向があり、球径 0.3mmある
いは 0.5mmの球状端子電極9も開発されている。これら
の球状端子電極9と電気コネクタ1とをスムーズに作業
性よく、位置ズレのない状態で接続させるには、 BGA7
の球状端子電極9のピッチのバラツキを考慮して、凹部
6によって形成された円柱形状の内径Cを 0.5〜1.2mm
とするのが最適である。
The shapes of the recesses formed on the surface of the insulating elastomer layer are shown in FIGS. 3 (a), 3 (b) and 4. FIG.
(A) is a plan view showing a recess, (b) is a vertical cross-sectional view taken along the line BB of (a), and FIG. 4 is a plan view showing another example of the recess. The inner surface of the recess 6 shown in FIG. 3 has a cylindrical shape, and the spherical contact portion 5 of the linear conductor 4 is exposed from the bottom surface thereof. In FIG. 3, C is the inner diameter of the concave portion 6, D is the depth of the concave portion 6, R is the spherical diameter of the spherical contact portion 5, and E is
Is the height at which the spherical contact portion 5 is exposed from the bottom surface of the concave portion 6,
L is the wire diameter of the linear conductor 4. S in FIG. 4 is the length of one side when the recess 6 is rectangular in a plan view. The inner diameter C of the recess may be set corresponding to the spherical diameter of the spherical terminal electrode 9 of the BGA 7 with some clearance taken into consideration. BG
The spherical diameter of the spherical terminal electrode 9 of A7 is generally 1.0 mm, but it tends to be smaller and finer, and spherical terminal electrodes 9 having a spherical diameter of 0.3 mm or 0.5 mm have also been developed. To connect these spherical terminal electrodes 9 and the electrical connector 1 smoothly and with good workability and without positional deviation, use the BGA7
In consideration of the variation in pitch of the spherical terminal electrodes 9, the inner diameter C of the cylindrical shape formed by the recess 6 is 0.5 to 1.2 mm.
Is optimal.

【0018】さらに凹部6の深さDは、 BGA7の球状端
子電極9の径が 0.3〜1.0mm であることから、 0.2〜0.
7mm とすることで、 BGA7を電気コネクタ1に圧縮して
接続させても、 BGA7は凹部6を形成している絶縁性エ
ラストマ層3の表面に接することなく接続される(図1
参照)。また、図4は凹部6の内面形状が四角柱の場合
であり、この場合も図3(a)と同様に一辺Sを 0.4〜
1.2mm 、深さDを 0.2〜0.7mm とするのが好ましい。凹
部6の内面形状は、図3(a)、(b)に示すような円
柱形状、あるいは図4に示すような四角柱状が挙げられ
るが、 BGA7の端子電極9が球状であることから、位置
ズレ防止、接続時の位置合わせの容易性などを考慮する
と円柱形状が最も好ましい。
Further, the depth D of the recess 6 is 0.2 to 0 because the diameter of the spherical terminal electrode 9 of the BGA 7 is 0.3 to 1.0 mm.
By setting the thickness to 7 mm, even if the BGA 7 is compressed and connected to the electrical connector 1, the BGA 7 is connected without coming into contact with the surface of the insulating elastomer layer 3 forming the recess 6 (see FIG. 1).
reference). Further, FIG. 4 shows a case where the inner surface shape of the concave portion 6 is a quadrangular prism, and in this case as well, the side S is 0.4 to 0.4
It is preferable that the depth D is 1.2 mm and the depth D is 0.2 to 0.7 mm. The inner surface shape of the recess 6 may be a columnar shape as shown in FIGS. 3 (a) and 3 (b) or a square columnar shape as shown in FIG. 4, but since the terminal electrode 9 of the BGA 7 is spherical, The columnar shape is most preferable in consideration of displacement prevention, ease of alignment at the time of connection, and the like.

【0019】図5、6および7において、凹部6に埋設
された線状導電体4の配列例を示した。 BGA7の球状端
子電極9の径にかかわりなく、確実に安定した接続を行
うには、図6および図7のように、一つの凹部6に埋設
された線状導電体4の数は3〜4本が好ましいが、対応
する BGA7の球状端子電極数が増えるにつれ製造コスト
がかかる。従って、通常のケースにおいては1〜4本で
の対応が好ましい。なお、安定した接続性と製造コスト
を考慮すると、図6に示した3本が最も好ましい。さら
に、本発明の電気コネクタを実施例にもとづき詳細に説
明する。
FIGS. 5, 6 and 7 show examples of arrangement of the linear conductors 4 embedded in the recesses 6. In order to ensure a stable connection regardless of the diameter of the spherical terminal electrode 9 of the BGA 7, the number of the linear conductors 4 embedded in one recess 6 is 3 to 4 as shown in FIGS. 6 and 7. Although books are preferred, manufacturing costs increase as the number of spherical terminal electrodes of the corresponding BGA7 increases. Therefore, in a normal case, it is preferable to deal with 1 to 4. Considering stable connectivity and manufacturing cost, the three shown in FIG. 6 are most preferable. Furthermore, the electrical connector of the present invention will be described in detail based on examples.

【0020】[0020]

【実施例】本発明の電気コネクタを次のようにして作製
した。 [実施例1] 線状導電体のボンディング:厚み1.0 μmの金メッキ
を施した厚み 0.5mm、縦横それぞれ35mmの銅製のボンデ
ィング基板上に、汎用のボールボンダーを用いて、直径
76μmの金線を垂直に0.5mmピッチでボンディング基板
の中央部に縦17列、横17列(総電極数289)のマトリクス
状に、1電極当たり3本の金線をボンディング配列し
た。1電極に対応する3本の金線は、1辺が0.27mmの正
三角形の各頂点にそれぞれボンディングした。配列した
金線全ての先端にアルゴンレーザー光を照射して、各先
端に直径が 150μmの球状接点部を形成し、ボンディン
グ基板からの高さが 1.0mmで均一になるように揃えた。
さらに、この基板上の外縁に沿って縦横それぞれ30mm、
高さ 1.2mm、厚さ5mmのポリフェニレンサルファイド製
のフレームを配設した。
EXAMPLE An electrical connector of the present invention was manufactured as follows. [Example 1] Bonding of a linear conductor: a general-purpose ball bonder was used to form a diameter on a copper bonding substrate having a thickness of 0.5 mm and a length of 35 mm which was plated with gold having a thickness of 1.0 μm.
Gold wires of 76 μm were vertically arranged at a pitch of 0.5 mm on the central portion of the bonding substrate in a matrix of 17 rows and 17 columns (total number of electrodes: 289), and three gold wires were bonded and arranged per electrode. Three gold wires corresponding to one electrode were bonded to each vertex of an equilateral triangle having a side of 0.27 mm. The tips of all the arranged gold wires were irradiated with an argon laser beam to form spherical contact portions with a diameter of 150 μm at each tip, and the height from the bonding substrate was 1.0 mm so that the height was uniform.
Furthermore, along the outer edge on this board, each 30 mm in length and width,
A frame made of polyphenylene sulfide having a height of 1.2 mm and a thickness of 5 mm was arranged.

【0021】絶縁性エラストマ層の成形:このフレー
ムの枠内に、絶縁性エラストマ層としてシリコーンゴム
KE-106(信越化学工業製、商品名) 100重量部に対し、
硬化剤Cat-RG(信越化学工業製、商品名)10重量部、シ
リコーンゴム用着色剤K-Color-BK-02(信越化学工業製、
商品名)を10重量部添加して十分に混合した材料を、硬
化後のレベルがフレームと同じ高さになるまで注入し、
銅製のボンディング基板を水平に保ちながら、 120℃で
60分加熱処理して硬化させた。続いて、銅製のボンディ
ング基板を塩化第二鉄溶液によりエッチング除去し、十
分に洗浄したのち 200℃で60分のポストキュアー処理を
行った。
Molding of the insulating elastomer layer: Silicon rubber is used as the insulating elastomer layer in the frame of this frame.
For 100 parts by weight of KE-106 (Shin-Etsu Chemical Co., Ltd., trade name)
Curing agent Cat-RG (manufactured by Shin-Etsu Chemical Co., Ltd.) 10 parts by weight, coloring agent for silicone rubber K-Color-BK-02 (manufactured by Shin-Etsu Chemical Co., Ltd.,
Add 10 parts by weight of (commercial name) and mix well, inject until the level after curing becomes the same level as the frame,
While keeping the copper bonding board horizontal,
It was cured by heat treatment for 60 minutes. Then, the copper bonding substrate was removed by etching with a ferric chloride solution, thoroughly washed, and then post-cured at 200 ° C. for 60 minutes.

【0022】凹部の形成:さらに、BGA の球状端子電
極と同じ位置に直径 0.4mmの穴を設けた厚み 0.5mmのマ
スクを、フレームの上に位置合わせして固定し、その上
方よりYAG レーザー光を照射して、マスクの穴の部分に
露出したシリコーンゴム部分を、深さにして0.2mm除去
して凹部を形成し、各凹部底面のシリコーンゴム表面か
ら、三角形の各頂点位置にそれぞれ球状接点部が 100μ
m突出した本発明の電気コネクタを得た。
Formation of concave portion: Further, a 0.5 mm thick mask having a hole with a diameter of 0.4 mm provided at the same position as the spherical terminal electrode of the BGA is aligned and fixed on the frame, and the YAG laser beam is applied from above. The silicone rubber exposed in the hole of the mask is removed to a depth of 0.2 mm to form a recess, and a spherical contact is made from the silicone rubber surface on the bottom of each recess to each vertex of the triangle. Part is 100μ
An electrical connector of the present invention having a protruding m was obtained.

【0023】実装:このようにして作製した電気コネ
クタを、先の図1に示すように、直径 0.3mm、高さ 0.2
mmのハンダ製の球状端子電極が 0.5mmピッチで縦17列、
横17列のマトリクス状に配列されたBGA と検査基板との
間で 0.1mm圧縮・接続したところ、安定した導通が得ら
れ、導通試験を行う上で何等問題はなかった。なお、絶
縁性エラストマ層を成形する際に使用したフレームは、
製品の保護枠として作製した電気コネクタから取り外す
ことなく使用した。
Mounting: As shown in FIG. 1 above, the electrical connector produced in this manner was used to have a diameter of 0.3 mm and a height of 0.2 mm.
mm soldered spherical terminal electrodes with 0.5 mm pitch in 17 columns,
When 0.1 mm was compressed and connected between the BGA arranged in a matrix of 17 rows and the inspection board, stable conduction was obtained, and there was no problem in conducting the conduction test. The frame used to mold the insulating elastomer layer is
The product was used without being removed from the electrical connector produced as a protective frame for the product.

【0024】[実施例2〜5及び比較例1〜4]金線の
先端に形成した球状接点部の球径(R)、シリコーンゴ
ム表面に形成した凹部の深さ(H)、およびこの凹部底
面のシリコーンゴム表面から突出する球状接点部の露出
高(E)を変えた以外は、実施例1と同様にして、電気
コネクタを作製した。その結果を表1にまとめて示す。
[Examples 2 to 5 and Comparative Examples 1 to 4] The spherical diameter (R) of the spherical contact portion formed at the tip of the gold wire, the depth (H) of the concave portion formed on the surface of the silicone rubber, and the concave portion. An electrical connector was produced in the same manner as in Example 1 except that the exposed height (E) of the spherical contact portion protruding from the bottom surface of the silicone rubber was changed. The results are summarized in Table 1.

【0025】実施例1〜5のいずれの電気コネクタも、
1年間の実装導通連続試験後においても、球状接点部は
シリコーンゴム中に陥没することなく良好な接続導通状
態を維持していた。一方、比較例1の電気コネクタは、
球状接点部の球径が大き過ぎてBGA の球状端子電極の微
細ピッチに対応することができず位置ズレを生じ、比較
例2の電気コネクタは、球状接点部の露出高が小さいた
め、BGA の球状端子電極との接続可能部分が少なく、接
続が不安定で電気コネクタとして機能せず、比較例3の
電気コネクタは、BGA の球状端子電極と圧縮接続した際
に、球状接点部がシリコーンゴム中に陥没して接続不良
を生じた。さらに、比較例4の電気コネクタは、圧縮接
続時に球状接点部がその基部で座屈状態になり、接続の
確実性、安定性が低下し実装接続に適さないものであっ
た。
In any of the electrical connectors of Examples 1 to 5,
Even after a continuous test of mounting continuity for one year, the spherical contact portion maintained a good connection continuity state without being depressed in the silicone rubber. On the other hand, the electrical connector of Comparative Example 1
Since the spherical diameter of the spherical contact portion is too large to accommodate the fine pitch of the spherical terminal electrodes of the BGA, a positional deviation occurs, and the electrical connector of Comparative Example 2 has a small exposed height of the spherical contact portion. Since there are few parts that can be connected to the spherical terminal electrode and the connection is unstable and it does not function as an electrical connector, the electrical connector of Comparative Example 3 has a spherical contact part made of silicone rubber when compressedly connected to the spherical terminal electrode of BGA. And the connection was poor. Further, in the electrical connector of Comparative Example 4, the spherical contact portion was buckled at its base during compression connection, and the reliability and stability of the connection deteriorated, which was not suitable for mounting connection.

【0026】[0026]

【表1】 [Table 1]

【0027】[0027]

【発明の効果】本発明の電気コネクタは、絶縁性エラス
トマ層の厚み方向に貫通する線状導電体の一方の端部に
球状接点部を設けたことによって、従来のICソケットが
所定の接触圧力を得るために屈曲した導通経路の長い接
触子を用いているのに対して、線状導電体を極力短く、
微細なピッチで平面状に配列することができ、ICソケッ
トでは困難な端子電極ピッチが 1.0mm以下、特に 0.5mm
以下のBGA に対しても、高周波の信号を処理する場合の
検査、特性検査の接続の際にも信号の遅延や波形の歪を
生じることなく、またBGA の球状の突起電極と常に同一
箇所で接触するため安定した検査、接続が可能である。
また、接点部を線状導電体の線径より大きな径を有する
球状接点部とし、少なくともその一部が露出しているよ
うにすることによって、被接続側の電極で圧接された際
に、電気コネクタの接点部が絶縁性エラストマ層中に、
実装時または実装中陥没して接続不良が生じるのを防止
することができ、確実に接続される。さらに、この球状
接点部を、周囲が弾性を有する絶縁性エラストマ層の凹
部内に設けたことにより、BGA の検査、接続の際にBGA
の球状の突起電極は、この凹部にガイドされるかたちで
損傷を受けずに、また位置出しガイド機構を用いずに位
置ズレもなく電気コネクタ側の球状接点部に確実にアラ
イメントされる。
According to the electrical connector of the present invention, the conventional IC socket has a predetermined contact pressure by providing the spherical contact portion at one end of the linear conductor penetrating in the thickness direction of the insulating elastomer layer. In order to obtain a long contact of a bent conduction path to obtain, the linear conductor is as short as possible,
It can be arranged in a plane with a fine pitch, and the terminal electrode pitch that is difficult for IC sockets is 1.0 mm or less, especially 0.5 mm.
Even for the following BGAs, signal delays and waveform distortions do not occur during inspection and processing when processing high-frequency signals, and at the same location as the spherical protruding electrodes of the BGA at all times. Stable inspection and connection are possible due to contact.
Further, by making the contact portion a spherical contact portion having a diameter larger than the wire diameter of the linear conductor, and at least a part of the contact portion being exposed, when the contact side electrode is pressure-welded, electric contact is made. The contact part of the connector is in the insulating elastomer layer,
It is possible to prevent a connection failure due to depression at the time of mounting or during mounting, and the connection is surely made. Furthermore, by providing this spherical contact part in the concave part of the insulating elastomer layer with elastic periphery, BGA inspection and connection at the time of BGA
The spherical projection electrode of (1) is securely aligned with the spherical contact portion of the electric connector side without being damaged by being guided by the concave portion and without any positional deviation without using the positioning guide mechanism.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の電気コネクタを、BGA と検査基板との
接続に使用したときの状態を示す縦断面図である。
FIG. 1 is a vertical sectional view showing a state in which an electric connector of the present invention is used for connecting a BGA and a test board.

【図2】本発明の電気コネクタの一実施態様に係り、
(a)はその平面図、(b)はA−A矢視線にそう縦断
面図である。
FIG. 2 relates to an embodiment of an electrical connector of the present invention,
(A) is the top view, (b) is a vertical cross-sectional view taken along the line AA.

【図3】(a)は本発明の電気コネクタの凹部を示す上
面図であり、(b)は凹部の内面形状が円柱形状を示す
縦断面図である。
FIG. 3 (a) is a top view showing a recess of the electrical connector of the present invention, and FIG. 3 (b) is a longitudinal sectional view showing the inner surface of the recess having a cylindrical shape.

【図4】本発明の電気コネクタの凹部の内面形状が四角
柱状を示す上面図である。
FIG. 4 is a top view showing an inner surface of a concave portion of the electric connector of the present invention having a square pillar shape.

【図5】(a)は本発明の電気コネクタの一つの凹部に
埋設された線状導電体の数が2本である場合を示す凹部
の上面図であり、(b)はその縦断面図である。
5A is a top view of a recess showing a case where the number of linear conductors embedded in one recess of the electrical connector of the present invention is two, and FIG. 5B is a longitudinal sectional view thereof. Is.

【図6】(a)は本発明の電気コネクタの線状導電体が
3本の場合を示す凹部の上面図であり、(b)はその縦
断面図である。
FIG. 6 (a) is a top view of a recess showing a case where the electric connector of the present invention has three linear conductors, and FIG. 6 (b) is a longitudinal sectional view thereof.

【図7】(a)は本発明の電気コネクタの線状導電体が
4本の場合を示す凹部の上面図であり、(b)はその縦
断面図である。
FIG. 7A is a top view of a recess showing a case where the electric connector of the present invention has four linear conductors, and FIG. 7B is a vertical cross-sectional view thereof.

【符号の説明】[Explanation of symbols]

1. 電気コネクタ、 2. フレーム、 3. 絶縁性エラストマ層、 4. 線状導電体、 5. 球状接点部、 6. 凹部、 7. BGA 、 8. 検査基板、 9. 球状端子電極、 10. 端子電極、 11. 電極、 1. Electrical connector, 2. Frame, 3. Insulating elastomer layer, 4. 4. Linear conductor, Spherical contact point, 6. Recess, 7. BGA, 8. Inspection board, 9. Spherical terminal electrode, 10.Terminal electrode, 11.Electrode,

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01R 33/94 9462−5B H01R 33/94 Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H01R 33/94 9462-5B H01R 33/94

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】絶縁性エラストマ層の厚み方向に貫通して
複数の線状導電体を設けた電気コネクタであって、線状
導電体の一方の端部が球状の接点部を形成し、この球状
接点部の少なくとも一部が絶縁性エラストマ層の表面に
設けられた凹部の底面から露出しており、線状導電体の
線径をLとするとき、球状接点部の球径Rは、L<R<
3Lの範囲にあり、球状接点部の底面からの露出高E
は、R/3<E<Rの範囲にあることを特徴とする電気
コネクタ。
1. An electrical connector provided with a plurality of linear conductors penetrating in a thickness direction of an insulating elastomer layer, wherein one end of the linear conductor forms a spherical contact portion. At least a part of the spherical contact portion is exposed from the bottom surface of the recess provided in the surface of the insulating elastomer layer, and when the wire diameter of the linear conductor is L, the spherical diameter R of the spherical contact portion is L <R <
Exposed height E from the bottom of the spherical contact point in the range of 3L
Is an electrical connector in the range of R / 3 <E <R.
JP893896A 1996-01-23 1996-01-23 Electric connector Pending JPH09199208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP893896A JPH09199208A (en) 1996-01-23 1996-01-23 Electric connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP893896A JPH09199208A (en) 1996-01-23 1996-01-23 Electric connector

Publications (1)

Publication Number Publication Date
JPH09199208A true JPH09199208A (en) 1997-07-31

Family

ID=11706619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP893896A Pending JPH09199208A (en) 1996-01-23 1996-01-23 Electric connector

Country Status (1)

Country Link
JP (1) JPH09199208A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249145A (en) * 1999-12-28 2001-09-14 Micronics Japan Co Ltd Probe card and method of manufacturing it
JP2005093298A (en) * 2003-09-18 2005-04-07 Nitto Denko Corp Anisotropic conductive film for inspecting electronic part and inspection method for electronic part using it
JP2006261144A (en) * 2005-03-15 2006-09-28 Minowa Koa Inc Method of manufacturing resistor and measurement instrument of resistor
JP2007285970A (en) * 2006-04-19 2007-11-01 Nec Electronics Corp Device and method of measuring kelvin contact
JP2008140574A (en) * 2006-11-30 2008-06-19 Shin Etsu Polymer Co Ltd Sheet form connector, and its manufacturing method
JP2012018158A (en) * 2010-07-06 2012-01-26 Samsung Electro-Mechanics Co Ltd Substrate inspection device and substrate inspection method therefor
JP2012049058A (en) * 2010-08-30 2012-03-08 Ushio Inc Single end lamp
JP2014175148A (en) * 2013-03-08 2014-09-22 Shin Etsu Polymer Co Ltd Method of manufacturing anisotropic conductive member, anisotropic conductive member, method of electrical connection between devices and electronic apparatus
JPWO2015025660A1 (en) * 2013-08-19 2017-03-02 ポリマテック・ジャパン株式会社 connector

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249145A (en) * 1999-12-28 2001-09-14 Micronics Japan Co Ltd Probe card and method of manufacturing it
JP2005093298A (en) * 2003-09-18 2005-04-07 Nitto Denko Corp Anisotropic conductive film for inspecting electronic part and inspection method for electronic part using it
JP2006261144A (en) * 2005-03-15 2006-09-28 Minowa Koa Inc Method of manufacturing resistor and measurement instrument of resistor
JP2007285970A (en) * 2006-04-19 2007-11-01 Nec Electronics Corp Device and method of measuring kelvin contact
JP4574588B2 (en) * 2006-04-19 2010-11-04 ルネサスエレクトロニクス株式会社 Kelvin contact measuring device and measuring method
JP2008140574A (en) * 2006-11-30 2008-06-19 Shin Etsu Polymer Co Ltd Sheet form connector, and its manufacturing method
JP2012018158A (en) * 2010-07-06 2012-01-26 Samsung Electro-Mechanics Co Ltd Substrate inspection device and substrate inspection method therefor
JP2012049058A (en) * 2010-08-30 2012-03-08 Ushio Inc Single end lamp
JP2014175148A (en) * 2013-03-08 2014-09-22 Shin Etsu Polymer Co Ltd Method of manufacturing anisotropic conductive member, anisotropic conductive member, method of electrical connection between devices and electronic apparatus
JPWO2015025660A1 (en) * 2013-08-19 2017-03-02 ポリマテック・ジャパン株式会社 connector

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