JP3302635B2 - Electrical connector and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electrical connector used for inspection, test, connection or the like of a ball grid array type IC package and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a surface mount type IC package having a large number of input / output terminals, a quat flat package (hereinafter abbreviated as QFP) 17 having a structure in which a plurality of terminals are respectively taken out from four sides of an IC package body has been conventionally used. Used (see FIG. 13). To cope with the recent increase in the number of terminals in the QFP 17, it is necessary to reduce the IC package size to a certain size or less and to reduce the terminal pitch in order to reduce the mounting area as much as possible.
Therefore, recently, the pitch of the terminals has been reduced to about 0.4 mm.

However, such a multi-terminal QFP1
No. 7 has a problem that the terminal pitch is very small and the terminal is easily deformed. Furthermore, since it is very difficult to align a large number of terminals, many problems occur in processes such as a manufacturing process, an inspection process, and / or a mounting process.

Therefore, recently, in view of the above, FIG.
As shown in FIG. 4 and FIG. 15, a ball grid array type IC package (hereinafter abbreviated as BGA) 18 in which terminals made of small solder ball electrodes 20 are arranged in a grid pattern on the entire back surface of the IC package body is developed. And its practical use is progressing.

In testing the BGA 18, the electric connector shown in FIG. 16 is conventionally used.
As shown in the figure, the electrical connector includes an insulating elastomer layer 19, and a large number of wires 10 are buried in a thickness direction of the elastomer layer 19 through a general-purpose ball bonder. Each wire 1 of this electrical connector
0 is a B (not shown) at its upper end, as shown in FIG.
GA18 solder ball electrode (often 0.75mm in diameter) 2
The pad 13 is formed in an enlarged diameter so as to be in contact with the electrode 22 of the inspection substrate 21 (hereinafter, referred to as an inspection substrate).
The ball contact portion 15 that contacts the bulge is formed. The electrical connector thus configured is disposed between the BGA 18 and the inspection board 21 so as to be able to conduct.
Is pressed, the elastomer layer 19 is compressed, and the BGA 18 and the inspection board 21 are conducted to be subjected to an inspection or the like.

[0006]

Since the conventional electrical connector is configured as described above, the contact area of the pad 13 with the solder ball electrode 20 of the BGA 18 is very small. As a result, the position of the solder ball electrode 20 is reduced. There is a problem that the connection resistance of each terminal tends to vary depending on the accuracy and the positional accuracy of the pad 13. Further, as the number of terminals increases, the pressing force required to obtain stable conduction increases. However, in consideration of the flatness of the BGA 18 (maximum 0.2 mm), the electrical connector has a compression amount of 0.2 mm or more. Is required. However, since the compressive load in this case is large, there is a problem that the electric connector cannot be used for a multi-pin BGA having 200 pins or more.

Further, when the inspection is repeatedly performed with a compression amount of 0.2 mm or more, as shown in FIG. 17, the pad 13 is depressed and damaged (peeling of the pad 13 from the elastomer layer 19) to the elastomer layer 19, and the wire 10 is Due to buckling, wear of the ball contact portion 15, or the like, the connection resistance increases, and there is a large problem that the electrical connector cannot be used repeatedly.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and suppresses a variation in connection resistance of each terminal.
An object of the present invention is to provide an electrical connector that can be used for A and the like and that can be used repeatedly, and a method for manufacturing the same.

[0009]

According to the first aspect of the present invention, in order to achieve the above object, a plurality of conductive filaments are buried in a composite layer, and the composite layer has elastic insulation. A plurality of terminal members provided on one surface of the insulating layer via a first coat layer, and a second coat layer laminated on the other surface of the insulating layer. The body is longer than the thickness of the composite layer, and both end portions thereof are straight portions directed in the thickness direction of the composite layer, and the rest of each conductive wire intersects at least the thickness direction of the composite layer. Bending in the direction to form an extra bending portion, and holding one end of each conductive wire in the first coat layer, and joining one end of each conductive wire to the terminal member. A terminal portion larger than the one end portion is formed, and the other end portion of each of the conductive filaments is substantially spherical. The contact portions are held in the second coat layer as a point portion, at least a part of each contact portion is exposed from the second coat layer, and the exposed surface is hard-plated, and the composite layer is formed. A concave portion located around each of the terminal members on one surface thereof, and a concave portion located around each of the contact portions on the other surface of the composite layer.

In order to achieve the above object, according to the second aspect of the present invention, the lower ends of a plurality of conductive strips are joined upright to the plated portions on the surface of the substrate having plated portions on both sides. Forming at least a bend excess portion by bending each conductive wire at least in a direction intersecting the thickness direction of the substrate;
A step of forming the upper end portion into a substantially spherical contact portion with the upper end portion of each of the conductive filaments facing vertically, and sequentially providing a resin for a first coating layer and a resin for an insulating layer on the surface of the substrate. Cured to form a first coat layer and an elastic insulating layer,
Each contact portion is exposed from the insulating layer, a second coat layer resin is provided on the insulating layer to cure and form the second coat layer, and at least one of the contact portions is formed from the second coat layer. Exposing a portion, a step of applying hard plating to the exposed surface of each of the contact portions, a step of removing a non-plated portion of the substrate, the first and second coat layers, and the insulating layer And a step of forming a recessed portion located around the plated portion of the substrate by cutting out and a recessed portion located around each of the contact portions.

Here, the term "insulating layer" in the claims refers to various elastomers which have fluidity before curing and form a crosslinked structure when cured (have rubber-like elasticity at around normal temperature). Are preferred. For example, silicone rubber, polyptadiene rubber, natural rubber, polyisoprene rubber, urethane rubber, chloroprene rubber, polyester rubber, styrene-butadiene copolymer rubber, or an independent and / or open-cell foamed material thereof Applicable. In particular, silicone rubber which is excellent in electrical insulation after curing, heat resistance, and compression set is preferable, and among them, the material can be injected without breaking the arrangement of the conductive filaments, and leveling is performed in a short time. For this reason, it is preferable that the properties before curing are liquid and have low viscosity. In the case of silicone rubber, the viscosity is preferably 1000 poise or less, more preferably 200 poise or less, and usually 5 poise or more. If the hardness of the insulating layer is too high, the load during compression connection increases, and if it is too low, the amount of strain during compression increases.
~ 60 ° H is desirable.

"First coat layer", "second coat layer"
From the viewpoint of suppressing depression or damage of one end portion (including a pad) or a contact portion of the conductive wire body, buckling of the conductive wire body, or separation of the one end portion or the contact portion from the insulating layer,
Harder than the insulating layer (Rockwell hardness HRR90 or HRM60), hard to expand, (linear expansion coefficient 10 × 1
(0 ⁻⁵ cm / cm / ° C. or less), and an engineering plastic material excellent in heat resistance and insulation properties is preferable. Examples of this material include synthetic resins such as a polyester resin, an epoxy resin, a urethane resin, a polyimide resin, and an ABS resin. Such first and second coat layers are provided directly on the insulating layer or indirectly via another layer.

[0013] As the "conductive wire", gold, gold alloy,
Copper, aluminum, aluminum-silicon alloy, brass,
Wires made of phosphor bronze, beryllium copper, nickel, molybdenum, tungsten, stainless steel, etc., wires plated with gold, gold alloy, etc., fine wires made of conductive synthetic resin, carbon fiber, or gold-plated thereof A thin line or the like can be used. In particular, a wire that is suitable for a bonding method by wire bonding and has excellent conductivity is preferable. There is no particular limitation on the wire diameter of the conductive wire, but it is preferable that the wire be as thin as possible so that the compressive load during connection is as small as possible and the connection stability is not adversely affected.
Specifically, it can be said that a wire having a diameter of 100 μm or less used in ordinary wire bonding is easily available, and thus is preferable. In particular, it is desirable to use a wire having a wire diameter of 20 to 80 μm or less.

From the viewpoint of reducing the load at the time of joining and connection, the conductive wire is formed into various shapes such as a rectangular shape, a horizontal S shape, a horizontal U shape, a horizontal Z shape, and a horizontal Ω shape. Is done. Also, the straight line part
Since the thickness of the electrical connector is as thin as 1.0 to 2.0 mm and the elasticity of the insulating layer is utilized for compression during inspection and connection, the thickness is 0.2 to 0.5 mm, preferably 0.2 to 0.5 mm.
A length of 3 mm is good. In addition, the terminal portion generally has a BGA solder ball electrode having a diameter of 0.5 to 0.75 mm, and the position accuracy of the solder ball electrode and the position accuracy of the pad are taken into consideration while ensuring insulation between the terminal portions. Due to necessity, it is appropriately formed in a terminal enlarged shape such as a circle, an oval, a square, a polygon, or an ellipse. The terminal part is φ0.
6 to 0.8 mm is good. Further, the contact portion may be formed in a spherical shape, or may be formed in a shape that is approximately recognized as a spherical shape.

[0015] As an overall configuration of the conductive wire, for example, one end of each of a plurality of conductive wires is wire-bonded on a plated substrate by a general-purpose bonder, and one end is formed to a thickness of 0.2 to 0.2 mm.
Formed in a linear part of about 0.5 mm, offset each conductive filament, and then formed the other end in a linear part of about 0.2 to 0.5 mm to form each conductive filament in a substantially N-shape. The other end portion of each conductive wire can be formed as a contact portion. Also, one end of each conductive strip is wire-bonded on the plated substrate and this one end is
Formed in a linear portion of about 0.5 mm, curved each conductive filament, formed the other end in a linear portion of about 0.2-0.5 mm, and contacted the other end of each conductive filament with a contact It can also be formed in a part.

The "substrate" has a thickness of 0.15 to 0.5
mm of gold, gold alloy, copper, aluminum, brass, or phosphor bronze can be used. In particular, from the viewpoints of workability (bonding property and etching property), cost, and electrical characteristics, it is preferable to apply gold plating to the bonding portion of the copper plate. When manufacturing electrical connectors,
If the molding frame is set on the outer periphery of the substrate, the insulating layer can be held, the handleability of the electrical connector can be improved, and the positioning with the circuit, the inspection substrate, and the like can be facilitated. As the molding frame, a general-purpose engineering plastic material, a ceramic material, a metal material, or the like can be appropriately selected and used. Examples of the engineering plastic material include materials such as polyetherimide (PEI), polyphenylene sulfide (PPS), and polyether sulfone (PES) which are excellent in dimensional stability and heat resistance.

According to the present invention, the surfaces of the first coat layer, the insulating layer, and the second coat layer which are not in contact with the BGA solder ball electrodes, the test board electrodes, and the like are cut out and lowered. Even when the electrical connector is compressed beyond a predetermined value, the load can be suppressed. In addition, since the one end portion and the contact portion of the conductive wire are protected by the first and second coat layers, one end of the conductive wire is depressed in the insulating layer, or one end is peeled off from the insulating layer. There is no. In addition, since the portions other than the both ends of each conductive wire are bent or bent, even if a buckling load of a predetermined value or more is applied, inappropriate bending unlike the related art does not occur. Further, the hard plating applied to the exposed surface of each contact portion improves the surface performance, thereby preventing the contact portion from being damaged or worn.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. Note that the electrical connector according to the present embodiment is upside down when manufactured (the state shown in FIGS. 2 to 10) and when used (the state shown in FIG. 1). As shown in FIGS. 1 to 10, the electrical connector according to the present embodiment is basically embedded with a composite layer 1 having a substantially plate-shaped cross section and a fixed arrangement pitch in the thickness direction of the composite layer 1. It has a large number of wires 10 and is formed in a thin plate shape.

The composite layer 1 is composed of a first polyimide resin layer 2 having excellent heat resistance, a silicone rubber layer 3 having excellent elasticity, and a second polyimide resin layer 4 integrated in a laminated structure from the bottom to the top in FIG. A large number of concave portions 5 and convex portions 6 having a circular cross section are alternately arranged at predetermined intervals in the vertical and horizontal directions of the rear surface and the front surface, and a terminal member 7 is bonded to each convex portion 6 on the rear surface. The solder ball electrode 20 of the BGA 18
Is formed in the terminal portion that comes into contact with. The terminal member 7 is composed of a copper substrate 8 for bonding. Nickel is plated on both sides of the substrate 8 and gold is plated on each nickel, and these platings form a pattern plating portion 9. I do.

Each wire 10 is extended longer than the thickness of the composite layer 1, and the rest other than the upper and lower ends is formed as a surplus bent portion 11 in the longitudinal direction and the oblique horizontal direction of the composite layer 1 from the viewpoint of load reduction and the like. It is bent and has a substantially N-shape as a whole. The lower end portion 12 of each wire 10 is a linear portion oriented in the vertical direction, and the end portion is bonded to the terminal member 7 through the first polyimide resin layer 2 as a pad 13 having an enlarged diameter. Further, the upper end portion 14 of each wire 10 is a linear portion oriented in the vertical direction, and the end portion is formed so as to bulge into a ball contact portion 15 having an enlarged diameter, and the convex portion 6 of the second polyimide resin layer 4 is formed. And a hard gold plating 16 is applied to the exposed surface of the ball contact portion 15 from the viewpoint of preventing abrasion. The ball contact portion 15 thus configured acts so as to contact the electrode 22 of the inspection board 21.

In the above configuration, the electrical connector is placed between the BGA 18 and the inspection board 21 so as to be electrically conductive with the front and back turned upside down (the state shown in FIG. 1). Is compressed, the BGA 18 and the test board 21 are electrically connected by the wire 10, and the BGA 18 and the test board 21 are tested, tested, or mounted. When the electrical connector is connected to the BGA 18, the solder ball electrode 20 of the BGA 18 may be irradiated with infrared rays or the like to melt the solder ball electrode 20.

Next, a method of manufacturing the electrical connector according to the present embodiment will be described with reference to FIGS. First,
As shown in FIG. 3, a lower end portion 12 of a wire 10 is bonded to a central portion of a large number of pattern plating portions 9 on a surface of a bonding substrate 8 by a general-purpose wire bonder to form a pad 13 having an increased diameter. Then, each wire 10 is formed into a substantially N-shape to form a surplus bending portion 11.
Then, a known laser is applied to the upper end portion 14 of each wire 10 erected linearly to form a ball contact portion 15 as shown in FIG. The length of the wire 10 to the ball contact portion 15 is uniformly set to 1.2 mm.

As shown in FIG. 2, the bonding substrate 8 includes a copper substrate having a thickness of about 0.15 to 0.5 mm.
Nickel having a thickness of about 3 μm is plated as a base, and gold having a thickness of about 0.1 μm to 0.3 μm is plated on each nickel. The pad positions are provided so as to match the pitch arrangement of the solder ball electrodes 20 of the BGA 18.

Next, as shown in FIG. 5, a frame-shaped molding frame (not shown) is arranged along the outer peripheral edge of the substrate 8.
A polyimide resin is injected into the molding frame so as to have a thickness of about 0.1 to 0.2 mm, and the polyimide resin is cured at 150 ° C. for 1 hour to form a substrate 8, a large number of wires 10, The polyimide resins are bonded to each other, and a first polyimide resin layer 2 having a plate-shaped cross section is formed. After the first polyimide resin layer 2 is formed in this way, as shown in the figure, a flowable silicone rubber is injected onto the first polyimide resin layer 2 so as to cover the ball contact portions 15, and this silicone rubber is heated at 120 ° C. Curing for 30 minutes to form a large number of wires 10, polyimide resin, and silicone rubber in a mutually bonded state, and to form a silicone rubber layer 3 having a plate shape in cross section, which is excellent in elasticity.

Next, the surface of the silicone rubber layer 3 is shaved by irradiating a known laser to completely expose each of the ball contact portions 15 (see FIG. 6). Inject a flowable polyimide resin so as to completely cover
The ball contact portion 15, the silicone rubber layer 3, and the polyimide resin are adhered to each other by curing at 0 ° C. for 1 hour to form the second polyimide resin layer 4 having a plate-shaped cross section. reference). By this curing, the composite layer 1 is laminated. After the second polyimide resin layer 4 is formed, the surface of the second polyimide resin layer 4 is shaved by irradiating a known laser, and a large number of ball contact portions 15 are each formed to have a diameter of about 2/3 (0.03 to 0.03). (About 1 mm).

Next, hard gold plating 16 is applied to the exposed surfaces of the numerous ball contact portions 15 exposed by the electrolytic method, each having a thickness of about 0.1 to 0.3 μm (see FIG. 8). The non-plated portions other than 9 are removed by a known etching means to leave the gold pattern plated portion 9 of φ0.65 (see FIG. 9). By this etching, a large number of terminal portions larger than the pads 13 of the wire 10 are formed.

After leaving the gold pattern plating portion 9 in this manner, the surface of the first polyimide resin layer 2, the silicone rubber layer 3, and the surface of the second polyimide resin layer 4 are each irradiated with a known laser beam by 0.2 mm. By shaving about 0.4 mm, a concave portion 5 surrounding the periphery of the pattern plating portion 9 of each substrate 8 and a concave portion 5 surrounding the periphery of each ball contact portion 15 are formed, respectively, and come into contact with the solder ball electrode 20 of the BGA 18. If the large terminal is formed in a protruding structure, an electric connector can be obtained (see FIG. 10).

According to the above configuration and manufacturing method, a large-sized terminal portion is formed and the pad 13 of the wire 10 is substantially enlarged, so that the contact area of the BGA 18 with the solder ball electrode 20 can be greatly increased. In addition, the problem that the connection resistance of each terminal varies due to the positional accuracy of the solder ball electrode 20 and the positional accuracy of the pad 13 can be surely solved. In addition, since the surfaces of the first polyimide resin layer 2, the silicone rubber layer 3, and the second polyimide resin layer 4 that do not contact the solder ball electrodes 20 of the BGA 18 and the electrodes 22 of the test board 21 are greatly shaved, for example, Can be suppressed to a very small value even when the pressure is 0.2 mm or more.

Further, since the pad 13 and the ball contact portion 15 of the wire 10 are coated with the first and second polyimide resin layers 2 and 4, the pad 13 is depressed in the silicone rubber layer 3 or the silicone rubber layer 3 The pad 13 does not peel off at all. In addition, since each wire 10 in the silicone rubber layer 3 is formed to be bent substantially in an N shape, buckling of the wire 10 does not occur at all. Further, each ball contact portion 1
Since the hard gold plating 16 is applied to the exposed surface of 5, the wear prevention of each ball contact portion 15 can be expected. As a result, even if the electrical connector is continuously used with a compression amount of 0.2 mm or more, it is possible to significantly suppress the increase in the connection resistance of each terminal, and to greatly improve the durability of the electrical connector. Can be.

The characteristics of the electrical connector of the above embodiment and the conventional electrical connector, specifically, the connection resistance at the time of compression, the load at the time of compression, and the number of times of repeated use were compared.
Can be obtained.

[Table 1]

[0031]

Comparative Example Comparative Example 1. First, thickness 0.15mm, length 50
In a central portion of one side of a copper substrate having a width of 50 mm and a width of 50 mm, nickel 1 was formed in a matrix of 20 rows each in the vertical and horizontal directions (a total of 400 rows) at φ0.15 mm, pitch 1.27 mm.
μm and then gold 0.2 μm were plated to obtain a substrate 8 for wire bonding. Using a general-purpose ball bonder at the center of the pattern plating portion 9 of the
6 μm wires 10 (gold wires) were bonded at a pitch of 1.27 mm in a matrix of 20 rows and columns (400 rows in total). At this time, the wire 10 is vertically
mm, inclined at an angle of 60 ° from the vertical direction, 1.04m
An extra bending length portion 11 was formed by offsetting m, and the structure was further extended in the vertical direction (see FIG. 3).

Next, the upper end portion 14 of each wire 10 is irradiated with an argon laser so that the upper end portion 14 has a diameter of 150 μm.
The ball contact portions 15 were formed, and a number of the wires 10 were arranged so that the height was uniform at 1.2 mm. Many wires 1
After aligning 0, 35m in length and width on the substrate 8
A molding frame made of polyetherimide (hereinafter abbreviated as PEI) having a height of 1.3 mm and a width of 5 mm was set.

Next, a polyimide resin CRC-6061P (Sumitomo Bakelite Co., Ltd.) is placed inside the molding frame.
(Trade name) was injected from the substrate 8 so as to have a height of 0.1 mm, and was cured by heating at 150 ° C. for 1 hour to form the first polyimide resin layer 2. Then, the rubber hardness after curing is 25 ° H. on the first polyimide resin layer 2.
s (JIS A) 2-component silicone rubber KE1
216A / B (Shin-Etsu Chemical Co., Ltd., trade name) 50 each
10 parts by weight of a coloring agent K-Color-Bk-02 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) is added to the parts by weight, and a mixture obtained by adding 10 parts by weight is 0 from the upper end portion 14 of the ball contact portion 15 of the wire 10. .1 mm higher and injected at 120 ° C.
Heat treatment was performed for 0 minutes to cure the silicone rubber layer 3 having elasticity.

Next, from above the silicone rubber layer 3, Y
By scanning irradiation with an AG laser, the ball contact portion 15 of each wire 10 is moved 0.15 from the surface of the silicone rubber layer 3.
mm, the silicone rubber layer 3 is removed until it protrudes, and a polyimide resin CRC-6061P is placed inside the molding frame.
(Manufactured by Sumitomo Bakelite Co., Ltd., trade name) at a height of 0.1 mm from the ball contact portion 15 and 150 ° C.
And cured by heating for 1 hour to form a second polyimide resin layer 4. Subsequently, a YAG laser is scanned and irradiated from above the second polyimide resin layer 4 so that the ball contact portions 15 of the wires 10 project from the surface of the second polyimide resin layer 4 by 0.05 mm. Layer 4 was removed.

Next, the substrate 8 is etched with a ferric chloride solution to form a gold pattern plating portion 9 having a diameter of 0.15 mm.
And washed thoroughly. After that, after-curing treatment was performed at 200 ° C. for 1 hour to manufacture an electrical connector.

Then, φ0.75 mm, height 0.6 mm
An electrical connector is interposed between the BGA 18 and the inspection board 21 in which the solder ball electrodes 20 having a height of 20 mm are arranged in a matrix of 20 rows and rows (400 rows in total) at a pitch of 1.27 mm, and are compressed by 0.25 mm. . As a result, stable conductivity could be obtained, but the compression load was large, and the compression device had to be increased in size to uniformly compress the BGA 18. Further, since the diameter of the pad 13 is smaller than that of the solder ball electrode 20, when the pad is repeatedly compressed, a portion where the solder ball electrode 20 comes off from the pad 13 is generated, and it is difficult to obtain stable conduction.

Comparative Example 2 0.15mm thick, 50m long
A copper substrate having a diameter of 0.65 mm, a pitch of 1.27 mm, and a matrix of 20 rows each in a vertical direction and a horizontal direction (a total of 400 rows) is plated with nickel 1 μm and gold 0.2 μm in a central portion of both sides of a 50 mm wide copper substrate. Was used as a substrate 8 for wire bonding. Then, one surface of the substrate 8 is subjected to the same processing in the same manner as in the first embodiment, and
An electrical connector provided with the pad 13 of the substrate 8 having a gold plating of 16 mm was manufactured.

Then, φ0.75 mm, height 0.6 mm
An electrical connector is interposed between the BGA 18 and the inspection board 21 in which the solder ball electrodes 20 having a height of 20 mm are arranged in a matrix of 20 rows and rows (400 rows in total) at a pitch of 1.27 mm, and are compressed by 0.25 mm. . As a result, stable conductivity could be obtained, and the solder ball electrode 20 did not come off from the pad 13 even after repeated compression. However, since the compression load is large,
The ball contact portion 15 was scraped and deformed during repeated compression, making it difficult to obtain stable conduction.

Comparative Example 3 Hard gold plating 16 was applied to the surface of the ball contact portion 15 of each wire 10 of the electrical connector obtained in Example 2 by a 0.5 μm electrolytic method to manufacture an electrical connector. In this electrical connector, since the pads 13 and the ball contact portions 15 were each plated with gold, stable connection was possible. Further, the ball contact portion 15
Since the surface was gold plated 16, there was no problem of shaving or deformation during repeated compression.

[0040]

[Embodiment 1] First, thickness 0.15mm, length 50
1 mm of nickel and 0.2 mm of gold are plated in a matrix of 20 rows each in vertical and horizontal directions (total of 400 rows) at φ0.65 mm and pitch 1.27 mm on the center of both sides of a copper substrate of 50 mm and 50 mm width. Was used as a substrate 8 for wire bonding. Using a general-purpose ball bonder, a wire 10 (gold wire) having a diameter of 76 μm is formed at the center of the pattern plating portion 9 of the substrate 8 at a pitch of 1.27 mm.
In this manner, bonding was performed in a matrix of 20 rows and columns (400 rows in total). At this time, the wire 10 was vertically inclined by 0.3 mm and the angle was inclined by 60 ° from the vertical direction.
An extra-flexion length portion 11 was formed by offsetting by 04 mm, and further extended vertically (see FIG. 3).

Next, the upper end portion 14 of each of the wires 10 is irradiated with an argon laser (output 5 W) to form a ball contact portion 15 having a diameter of 150 μm on the upper end portion 14. We arranged to be uniform. After many wires 10 were aligned, a PEI molding frame 35 mm in length, 1.3 mm in height and 5 mm in width was set on the substrate 8.

Next, a polyimide resin CRC-6061P (Sumitomo Bakelite Co., Ltd.) is placed inside the molding frame.
(Trade name) was injected from the substrate 8 so as to have a height of 0.1 mm, and was cured by heating at 150 ° C. for 1 hour to form the first polyimide resin layer 2. Then, the rubber hardness after curing is 25 ° H. on the first polyimide resin layer 2.
s (JIS A) 2-component silicone rubber KE1
216A / B (Shin-Etsu Chemical Co., Ltd., trade name) 50 each
10 parts by weight of a coloring agent K-Color-Bk-02 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) is added to the parts by weight, and a mixture obtained by adding 10 parts by weight is 0 from the upper end portion 14 of the ball contact portion 15 of the wire 10. .1 mm higher and injected at 120 ° C.
Heat treatment was performed for 0 minutes to cure the silicone rubber layer 3 having elasticity.

Next, from above the silicone rubber layer 3, Y
Scanning irradiation (irradiation time: 60 seconds) with an AG laser (output: 100 W) removes the silicone rubber layer 3 until the concealed ball contact portion 15 of each wire 10 protrudes from the surface of the silicone rubber layer 3 by 0.15 mm, Polyimide resin CRC-6061P (manufactured by Sumitomo Bakelite Co., Ltd., trade name) is injected into the inside of the molding frame so as to have a height of 0.1 mm from the ball contact portion 15 and is cured by heating at 150 ° C. for 1 hour. Then, a second polyimide resin layer 4 was formed. Subsequently, the YAG laser is scanned and irradiated from above the second polyimide resin layer 4 so that the ball contact portions 15 of the respective wires 10 in the concealed state are changed to the second polyimide resin layer 4.
The second polyimide resin layer 4 was removed until it protruded 0.05 mm from the surface of.

Next, each of the wires 10 exposed by the electrolytic method
0.5 μm hard gold plating 16 on the ball contact portion 15
Was given. Subsequently, the substrate 8 was etched with a ferric chloride solution to leave the gold pattern plated portion 9 having a diameter of 0.65 mm and sufficiently washed. Then, after-curing treatment was performed at 200 ° C. for 1 hour. Then, after that, the first polyimide resin layer 2 and the silicone rubber layer 3 are subjected to scanning irradiation (irradiation time: 150 seconds) from above the surface on which the substrate 8 is left so as to have a depth of 0.3 mm. After removal, the second polyimide resin layer 4 and the silicone rubber layer 3 on the opposite side were removed with a width of 0.6 mm and a depth of 0.3 mm, and the electrical connector of FIGS. 1 to 10 was manufactured.

Then, φ0.75 mm, height 0.6 mm
An electrical connector is interposed between the BGA 18 and the inspection board 21 in which the solder ball electrodes 20 having a height of 20 mm are arranged in a matrix of 20 rows and rows (400 rows in total) at a pitch of 1.27 mm, and are compressed by 0.25 mm. . As a result, stable conductivity can be obtained, and the variation of each electrode is 1
The resistance was as small as 5 to 25 mΩ, and no problem occurred in conducting an electrical characteristic test of BGA18. In addition, 0.3
The compression was repeatedly performed with the compression amount of mm, and the electrical connection was continuously confirmed.
No point exceeding Ω occurred.

Embodiment 2 FIG. First, thickness 0.15mm, length 5
A central portion of both sides of a copper substrate of 0 mm and 50 mm in width is plated with nickel 1 μm and gold 0.2 μm in a matrix of 30 rows each in vertical and horizontal directions (total 900 rows) at φ0.65 mm, pitch 1.5 mm, and total of 900 rows. Was used as a substrate 8 for wire bonding. Using a general-purpose ball bonder, wires 10 (gold wires) having a diameter of 76 μm were bonded at a pitch of 1.5 mm in a matrix of 30 rows vertically and horizontally (total 900 rows) at the center of the pattern plating portion 9 of the substrate 8. At this time, as shown in FIG. 11, the wire 10 was gently curved in the lateral direction of the substrate 8 within a range of 0.4 mm to form a surplus bent portion 11A.

Next, the upper end portion 14 of each of the wires 10 is irradiated with an argon laser (output 5 W) to form a ball contact portion 15 having a diameter of 150 μm on the upper end portion 14. We arranged to be uniform. After many wires 10 were aligned, a PEI molding frame 35 mm in length, 1.3 mm in height and 5 mm in width was set on the substrate 8.

Next, a polyimide resin CRC-6061P (Sumitomo Bakelite Co., Ltd.) is placed inside the molding frame.
(Trade name) was injected from the substrate 8 so as to have a height of 0.1 mm, and was cured by heating at 150 ° C. for 1 hour to form the first polyimide resin layer 2. Then, the rubber hardness after curing is 25 ° H. on the first polyimide resin layer 2.
s (JIS A) 2-component silicone rubber KE1
216A / B (Shin-Etsu Chemical Co., Ltd., trade name) 50 each
10 parts by weight of a coloring agent K-Color-Bk-02 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) is added to the parts by weight, and a mixture obtained by adding 10 parts by weight is 0 from the upper end portion 14 of the ball contact portion 15 of the wire 10. .1 mm higher and injected at 120 ° C.
Heat treatment was performed for 0 minutes to cure the silicone rubber layer 3 having elasticity.

Then, a ball contact portion 15 of each wire 10 concealed by scanning irradiation with a YAG laser under the same conditions as in Example 1 from the top of the silicone rubber layer 3 projects from the surface of the silicone rubber layer 3 by 0.15 mm. The silicone rubber layer 3 is removed until the inside of the molding frame, and the polyimide resin CRC-6061P (Sumitomo Bakelite Co., Ltd.)
(Trade name) was injected from the ball contact portion 15 so as to have a height of 0.1 mm, and was heated and cured at 150 ° C. for 1 hour to form a second polyimide resin layer 4. continue,
The YAG laser is scanned and irradiated from above the second polyimide resin layer 4 so that the ball contact portion 15 of each wire 10 in the concealed state is 0.0 mm from the surface of the second polyimide resin layer 4.
The second polyimide resin layer 4 was removed until it protruded by 5 mm.

Next, each of the wires 10 exposed by the electrolytic method
0.5 μm hard gold plating 16 on the ball contact portion 15
Was given. Subsequently, the substrate 8 was etched with a ferric chloride solution to leave the gold pattern plating portion 9 having a diameter of 0.5 mm and sufficiently washed. Then, after-curing treatment was performed at 200 ° C. for 1 hour. Then, after that, the first polyimide resin layer 2 and the silicone rubber layer 3 were removed at a depth of 0.2 mm by scanning irradiation with a YAG laser under the same conditions as in Example 1 from above the surface where the substrate 8 was left. The opposite side second polyimide resin layer 4 and silicone rubber layer 3 were removed at a width of 1.0 mm and a depth of 0.2 mm to produce the electrical connector shown in FIG.

Then, φ0.75 mm, height 0.6 mm
An electrical connector is interposed between the BGA 18 and the test board 21 in which the solder ball electrodes 20 having a height of 1.5 mm are arranged in a matrix of 30 rows each vertically and horizontally (a total of 900 rows) at a pitch of 1.5 mm, and compressed by 0.25 mm. . As a result, stable conductivity can be obtained, and the variation of each electrode is reduced by 15%.
-25 mΩ, no problem occurred in conducting the electrical characteristics test of BGA18. In addition, 0.3m
The compression was repeatedly performed with a compression amount of m, and the electrical connection was continuously confirmed. As a result, the resistance was 100 mΩ even after exceeding 50,000 times.
No points were exceeded.

Table 2 summarizes the results of Comparative Examples 1 to 3 to Examples 1 and 2 described above.

[Table 2]

[0053]

As described above, according to the present invention, it is possible to suppress the variation in the connection resistance of each terminal, apply it to a multi-pin BGA or the like, and furthermore, it is possible to use it repeatedly. effective. Furthermore, even if the electrical connector is repeatedly used with a compression amount equal to or greater than a predetermined value, an increase in the connection resistance of each terminal can be suppressed, and the durability of the electrical connector can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a use state of an embodiment of an electric connector according to the present invention.

FIG. 2 is an explanatory sectional view showing a bonding substrate in an embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 3 is an explanatory sectional view showing a wire bonding step in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 4 is an explanatory sectional view showing a step of forming a ball contact portion in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 5 is an explanatory sectional view showing a step of forming a first polyimide resin layer and a silicone rubber layer in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 6 is an explanatory sectional view showing a step of exposing a ball contact portion in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 7 is an explanatory sectional view showing a step of forming a second polyimide resin layer in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 8 is an explanatory sectional view showing a ball contact portion exposing step and a hard gold plating step in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 9 is an explanatory cross-sectional view showing an etching step in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 10 is an explanatory sectional view showing a recess forming step in the embodiment of the method for manufacturing an electrical connector according to the present invention.

FIG. 11 is an explanatory partial sectional view showing an electric connector used in the second embodiment.

FIG. 12 is a partial cross-sectional explanatory view showing a use state of the electrical connector used in the second embodiment.

FIG. 13 is an explanatory perspective view showing a QFP package.

FIG. 14 is an explanatory perspective view showing a BGA package.

FIG. 15 is a perspective rear view of the BGA package of FIG. 14;

FIG. 16 is an explanatory view showing a conventional electric connector.

FIG. 17 is an explanatory view of a use state showing a conventional electric connector.

[Explanation of symbols]

 Reference Signs List 1 composite layer 2 first polyimide resin layer (first coat layer) 3 silicone rubber layer (insulating layer) 4 second polyimide resin layer (second coat layer) 5 concave portion 6 convex portion 7 terminal member 8 substrate 9 Pattern plating part (plating part) 10 Wire (conductive strip) 11 Extra bending part 11A Extra bending part 12 Lower end part 13 Pad 14 Upper end part 15 Ball contact part (Contact part) 16 Gold plating (Plating) 18 BGA 20 Solder Ball electrode 21 Inspection board 22 Electrode

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-10-19931 (JP, A) JP-A-9-229963 (JP, A) JP-A-6-84379 (JP, U) Table 2000-502812 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 1/06-1/073 G01R 31/26 G01R 31/28-31/3193 H01R 33/76

Claims (2)

(57) [Claims] 1. An electrical connector having a plurality of conductive wires embedded in a composite layer, the composite layer including an elastic insulating layer, and a plurality of terminal members on one surface of the insulating layer. A second coat layer is laminated on the other surface of the insulating layer, and each of the conductive filaments is longer than the thickness of the composite layer. A straight portion directed in the thickness direction of the layer, the remaining portion of each conductive wire is bent at least in a direction intersecting with the thickness direction of the composite layer to form a bend excess portion,
While holding one end portion of each conductive wire on the first coat layer, joining one end of each conductive wire to the terminal member to form a terminal portion larger than the one end, The other end of each of the conductive filaments is a substantially spherical contact portion, and the contact portion is held on the second coat layer, and at least a part of each contact portion is exposed from the second coat layer. The exposed surface is subjected to hard plating, and a concave portion located around each of the terminal members on one surface of the composite layer, and a concave portion located around each of the contact portions on the other surface of the composite layer. An electrical connector, characterized in that: 2. The method according to claim 1, wherein the lower ends of the plurality of conductive strips are joined upright to the plated portions on the surface of the substrate having plated portions on both front and back surfaces, and each of the conductive strips is connected at least in a direction intersecting the thickness direction of the substrate. A step of bending the body to form an extra bending portion, forming the upper end portion into a substantially spherical contact portion with the upper end portion of each of the conductive filaments facing upward and downward, and forming a first on the surface of the substrate. A resin for a coating layer and a resin for an insulating layer are sequentially provided to form a first coating layer and an insulating layer having elasticity by curing, exposing each contact portion from the insulating layer, and forming a second coating layer on the insulating layer. A step of providing a resin for curing to form a second coat layer and exposing at least a part of each of the contact portions from the second coat layer; and applying a hard plating to an exposed surface of each of the contact portions. Removing the non-plated portion of the substrate; Forming a second coat layer, a concave portion located around the plated portion of the substrate by cutting out the insulating layer, and a concave portion located around each of the contact portions. Method of manufacturing an electrical connector.