JP2005088587A5 - - Google Patents

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Publication number
JP2005088587A5
JP2005088587A5 JP2004263544A JP2004263544A JP2005088587A5 JP 2005088587 A5 JP2005088587 A5 JP 2005088587A5 JP 2004263544 A JP2004263544 A JP 2004263544A JP 2004263544 A JP2004263544 A JP 2004263544A JP 2005088587 A5 JP2005088587 A5 JP 2005088587A5
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JP
Japan
Prior art keywords
substrate
slot
moving
forming
operation includes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004263544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005088587A (ja
Filing date
Publication date
Priority claimed from US10/661,868 external-priority patent/US7051426B2/en
Application filed filed Critical
Publication of JP2005088587A publication Critical patent/JP2005088587A/ja
Publication of JP2005088587A5 publication Critical patent/JP2005088587A5/ja
Pending legal-status Critical Current

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JP2004263544A 2003-09-12 2004-09-10 基板スロット形成 Pending JP2005088587A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/661,868 US7051426B2 (en) 2002-01-31 2003-09-12 Method making a cutting disk into of a substrate

Publications (2)

Publication Number Publication Date
JP2005088587A JP2005088587A (ja) 2005-04-07
JP2005088587A5 true JP2005088587A5 (enExample) 2007-10-25

Family

ID=33300272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004263544A Pending JP2005088587A (ja) 2003-09-12 2004-09-10 基板スロット形成

Country Status (5)

Country Link
US (2) US7051426B2 (enExample)
JP (1) JP2005088587A (enExample)
GB (1) GB2405833A (enExample)
SG (1) SG110104A1 (enExample)
TW (1) TWI318932B (enExample)

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US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
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US6930055B1 (en) * 2004-05-26 2005-08-16 Hewlett-Packard Development Company, L.P. Substrates having features formed therein and methods of forming
US7874654B2 (en) * 2007-06-14 2011-01-25 Hewlett-Packard Development Company, L.P. Fluid manifold for fluid ejection device
US8262204B2 (en) * 2007-10-15 2012-09-11 Hewlett-Packard Development Company, L.P. Print head die slot ribs
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WO2010005434A1 (en) * 2008-07-09 2010-01-14 Hewlett-Packard Development Company, L.P. Print head slot ribs
WO2013095430A1 (en) 2011-12-21 2013-06-27 Hewlett Packard Development Company, L.P. Fluid dispenser
CN104066584B (zh) * 2012-04-24 2015-12-23 惠普发展公司，有限责任合伙企业 流体喷射装置
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US9902162B2 (en) 2013-02-28 2018-02-27 Hewlett-Packard Development Company, L.P. Molded print bar
KR101827070B1 (ko) 2013-02-28 2018-02-07 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 유체 유동 구조체 성형
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US9724920B2 (en) 2013-03-20 2017-08-08 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
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US9409394B2 (en) * 2013-05-31 2016-08-09 Stmicroelectronics, Inc. Method of making inkjet print heads by filling residual slotted recesses and related devices
US9346273B2 (en) 2013-05-31 2016-05-24 Stmicroelectronics, Inc. Methods of making an inkjet print head by sawing discontinuous slotted recesses
US9340023B2 (en) 2013-05-31 2016-05-17 Stmicroelectronics, Inc. Methods of making inkjet print heads using a sacrificial substrate layer
AR108508A1 (es) * 2016-05-19 2018-08-29 Sicpa Holding Sa Cabezal de impresora de chorro de tinta térmica y método de fabricación del mismo
WO2020101678A1 (en) * 2018-11-15 2020-05-22 Hewlett-Packard Development Company, L.P. Selectively lifting substrates

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US6911155B2 (en) 2002-01-31 2005-06-28 Hewlett-Packard Development Company, L.P. Methods and systems for forming slots in a substrate
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US6666546B1 (en) * 2002-07-31 2003-12-23 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6896360B2 (en) * 2002-10-31 2005-05-24 Hewlett-Packard Development Company, L.P. Barrier feature in fluid channel

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