JP2005088587A - 基板スロット形成 - Google Patents

基板スロット形成 Download PDF

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Publication number
JP2005088587A
JP2005088587A JP2004263544A JP2004263544A JP2005088587A JP 2005088587 A JP2005088587 A JP 2005088587A JP 2004263544 A JP2004263544 A JP 2004263544A JP 2004263544 A JP2004263544 A JP 2004263544A JP 2005088587 A JP2005088587 A JP 2005088587A
Authority
JP
Japan
Prior art keywords
substrate
slot
forming
nozzle
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004263544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005088587A5 (enExample
Inventor
Shen Buswell
バスウェル シェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2005088587A publication Critical patent/JP2005088587A/ja
Publication of JP2005088587A5 publication Critical patent/JP2005088587A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2004263544A 2003-09-12 2004-09-10 基板スロット形成 Pending JP2005088587A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/661,868 US7051426B2 (en) 2002-01-31 2003-09-12 Method making a cutting disk into of a substrate

Publications (2)

Publication Number Publication Date
JP2005088587A true JP2005088587A (ja) 2005-04-07
JP2005088587A5 JP2005088587A5 (enExample) 2007-10-25

Family

ID=33300272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004263544A Pending JP2005088587A (ja) 2003-09-12 2004-09-10 基板スロット形成

Country Status (5)

Country Link
US (2) US7051426B2 (enExample)
JP (1) JP2005088587A (enExample)
GB (1) GB2405833A (enExample)
SG (1) SG110104A1 (enExample)
TW (1) TWI318932B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016515952A (ja) * 2013-02-28 2016-06-02 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 鋸で切り出された通路を有する成型流体フロー構造
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US10836169B2 (en) 2013-02-28 2020-11-17 Hewlett-Packard Development Company, L.P. Molded printhead
US11292257B2 (en) 2013-03-20 2022-04-05 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US7429335B2 (en) * 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
US6930055B1 (en) * 2004-05-26 2005-08-16 Hewlett-Packard Development Company, L.P. Substrates having features formed therein and methods of forming
US7874654B2 (en) * 2007-06-14 2011-01-25 Hewlett-Packard Development Company, L.P. Fluid manifold for fluid ejection device
US8262204B2 (en) * 2007-10-15 2012-09-11 Hewlett-Packard Development Company, L.P. Print head die slot ribs
US8733902B2 (en) * 2008-05-06 2014-05-27 Hewlett-Packard Development Company, L.P. Printhead feed slot ribs
EP2310205B1 (en) * 2008-07-09 2013-12-11 Hewlett-Packard Development Company, L.P. Print head slot ribs
US9211713B2 (en) 2011-12-21 2015-12-15 Hewlett-Packard Development Company, L.P. Fluid dispenser
US9463485B2 (en) 2012-04-24 2016-10-11 Hewlett-Packard Development Company, L.P. Fluid ejection device
US9409394B2 (en) 2013-05-31 2016-08-09 Stmicroelectronics, Inc. Method of making inkjet print heads by filling residual slotted recesses and related devices
US9308728B2 (en) 2013-05-31 2016-04-12 Stmicroelectronics, Inc. Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
US9346273B2 (en) 2013-05-31 2016-05-24 Stmicroelectronics, Inc. Methods of making an inkjet print head by sawing discontinuous slotted recesses
US9340023B2 (en) 2013-05-31 2016-05-17 Stmicroelectronics, Inc. Methods of making inkjet print heads using a sacrificial substrate layer
AR108508A1 (es) * 2016-05-19 2018-08-29 Sicpa Holding Sa Cabezal de impresora de chorro de tinta térmica y método de fabricación del mismo
WO2020101678A1 (en) * 2018-11-15 2020-05-22 Hewlett-Packard Development Company, L.P. Selectively lifting substrates

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016515952A (ja) * 2013-02-28 2016-06-02 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 鋸で切り出された通路を有する成型流体フロー構造
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US10081188B2 (en) 2013-02-28 2018-09-25 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US10836169B2 (en) 2013-02-28 2020-11-17 Hewlett-Packard Development Company, L.P. Molded printhead
US10994539B2 (en) 2013-02-28 2021-05-04 Hewlett-Packard Development Company, L.P. Fluid flow structure forming method
US10994541B2 (en) 2013-02-28 2021-05-04 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US11130339B2 (en) 2013-02-28 2021-09-28 Hewlett-Packard Development Company, L.P. Molded fluid flow structure
US11426900B2 (en) 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
US11541659B2 (en) 2013-02-28 2023-01-03 Hewlett-Packard Development Company, L.P. Molded printhead
US11292257B2 (en) 2013-03-20 2022-04-05 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces

Also Published As

Publication number Publication date
US20060162159A1 (en) 2006-07-27
GB2405833A (en) 2005-03-16
US7966728B2 (en) 2011-06-28
SG110104A1 (en) 2005-04-28
TWI318932B (en) 2010-01-01
US20040055145A1 (en) 2004-03-25
US7051426B2 (en) 2006-05-30
GB0420178D0 (en) 2004-10-13
TW200524746A (en) 2005-08-01

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