TWI318932B - Substrate slot formation - Google Patents

Substrate slot formation

Info

Publication number
TWI318932B
TWI318932B TW093121134A TW93121134A TWI318932B TW I318932 B TWI318932 B TW I318932B TW 093121134 A TW093121134 A TW 093121134A TW 93121134 A TW93121134 A TW 93121134A TW I318932 B TWI318932 B TW I318932B
Authority
TW
Taiwan
Prior art keywords
slot formation
substrate slot
substrate
formation
slot
Prior art date
Application number
TW093121134A
Other languages
English (en)
Chinese (zh)
Other versions
TW200524746A (en
Inventor
Shen Buswell
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW200524746A publication Critical patent/TW200524746A/zh
Application granted granted Critical
Publication of TWI318932B publication Critical patent/TWI318932B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
TW093121134A 2003-09-12 2004-07-15 Substrate slot formation TWI318932B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/661,868 US7051426B2 (en) 2002-01-31 2003-09-12 Method making a cutting disk into of a substrate

Publications (2)

Publication Number Publication Date
TW200524746A TW200524746A (en) 2005-08-01
TWI318932B true TWI318932B (en) 2010-01-01

Family

ID=33300272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121134A TWI318932B (en) 2003-09-12 2004-07-15 Substrate slot formation

Country Status (5)

Country Link
US (2) US7051426B2 (enExample)
JP (1) JP2005088587A (enExample)
GB (1) GB2405833A (enExample)
SG (1) SG110104A1 (enExample)
TW (1) TWI318932B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US7429335B2 (en) * 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
US6930055B1 (en) * 2004-05-26 2005-08-16 Hewlett-Packard Development Company, L.P. Substrates having features formed therein and methods of forming
US7874654B2 (en) * 2007-06-14 2011-01-25 Hewlett-Packard Development Company, L.P. Fluid manifold for fluid ejection device
US8262204B2 (en) * 2007-10-15 2012-09-11 Hewlett-Packard Development Company, L.P. Print head die slot ribs
EP2276633B1 (en) * 2008-05-06 2013-10-16 Hewlett-Packard Development Company, L.P. Print head feed slot ribs
EP2310205B1 (en) * 2008-07-09 2013-12-11 Hewlett-Packard Development Company, L.P. Print head slot ribs
CN103998246B (zh) 2011-12-21 2016-12-14 惠普发展公司，有限责任合伙企业 流体分配器
CN104066584B (zh) * 2012-04-24 2015-12-23 惠普发展公司，有限责任合伙企业 流体喷射装置
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
ES2747823T3 (es) 2013-02-28 2020-03-11 Hewlett Packard Development Co Barra de impresión moldeada
US11426900B2 (en) 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US9724920B2 (en) 2013-03-20 2017-08-08 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
US9346273B2 (en) 2013-05-31 2016-05-24 Stmicroelectronics, Inc. Methods of making an inkjet print head by sawing discontinuous slotted recesses
US9308728B2 (en) 2013-05-31 2016-04-12 Stmicroelectronics, Inc. Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
US9409394B2 (en) 2013-05-31 2016-08-09 Stmicroelectronics, Inc. Method of making inkjet print heads by filling residual slotted recesses and related devices
US9340023B2 (en) 2013-05-31 2016-05-17 Stmicroelectronics, Inc. Methods of making inkjet print heads using a sacrificial substrate layer
AR108508A1 (es) * 2016-05-19 2018-08-29 Sicpa Holding Sa Cabezal de impresora de chorro de tinta térmica y método de fabricación del mismo
WO2020101678A1 (en) * 2018-11-15 2020-05-22 Hewlett-Packard Development Company, L.P. Selectively lifting substrates

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US140497A (en) * 1873-07-01 Improvement in bee-hives
US4721977A (en) 1984-11-26 1988-01-26 Kentek Information Systems, Inc. Electrographic printer with abutting chips each having an array of charge-discharging elements
US4746935A (en) 1985-11-22 1988-05-24 Hewlett-Packard Company Multitone ink jet printer and method of operation
US4887100A (en) 1987-01-10 1989-12-12 Am International, Inc. Droplet deposition apparatus
JP2511092B2 (ja) * 1988-01-30 1996-06-26 日産自動車株式会社 流体用センサ
US5081063A (en) 1989-07-20 1992-01-14 Harris Corporation Method of making edge-connected integrated circuit structure
US4961821A (en) 1989-11-22 1990-10-09 Xerox Corporation Ode through holes and butt edges without edge dicing
US5578418A (en) 1990-03-21 1996-11-26 Canon Kabushiki Kaisha Liquid jet recording head and recording apparatus having same
US5160403A (en) 1991-08-09 1992-11-03 Xerox Corporation Precision diced aligning surfaces for devices such as ink jet printheads
JPH0574932A (ja) 1991-09-17 1993-03-26 Fujitsu Ltd 半導体ウエハのダイシング方法
JPH05147223A (ja) 1991-12-02 1993-06-15 Matsushita Electric Ind Co Ltd インクジエツトヘツド
DE4220284C1 (de) 1992-06-20 1993-09-30 Bosch Gmbh Robert Verfahren zum Zerteilen von Verbundwafern
US5440332A (en) 1992-07-06 1995-08-08 Compa Computer Corporation Apparatus for page wide ink jet printing
US5250084A (en) * 1992-07-28 1993-10-05 C Four Pty. Ltd. Abrasive tools and process of manufacture
US5387314A (en) 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
US5408739A (en) 1993-05-04 1995-04-25 Xerox Corporation Two-step dieing process to form an ink jet face
US6074048A (en) 1993-05-12 2000-06-13 Minolta Co., Ltd. Ink jet recording head including interengaging piezoelectric and non-piezoelectric members and method of manufacturing same
US5391236A (en) 1993-07-30 1995-02-21 Spectrolab, Inc. Photovoltaic microarray structure and fabrication method
US5818481A (en) 1995-02-13 1998-10-06 Minolta Co., Ltd. Ink jet printing head having a piezoelectric driver member
US6139132A (en) 1995-09-05 2000-10-31 Seiko Epson Corporation Ink jet recording head with nozzle communicating hole having smaller width than pressurizing chambers in direction of array of pressurizing chambers
US5658471A (en) 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
US6007415A (en) * 1995-12-08 1999-12-28 Norton Company Sanding disks
EP0790126B1 (en) 1996-02-14 1999-12-15 Océ-Technologies B.V. Print head for an ink-jet printer
JP3595641B2 (ja) 1996-02-29 2004-12-02 キヤノン株式会社 インクジェット記録ヘッドの製造方法及びインクジェット記録ヘッド
JPH09320996A (ja) 1996-03-29 1997-12-12 Denso Corp 半導体装置の製造方法
JPH1027971A (ja) 1996-07-10 1998-01-27 Nec Corp 有機薄膜多層配線基板の切断方法
US5825076A (en) 1996-07-25 1998-10-20 Northrop Grumman Corporation Integrated circuit non-etch technique for forming vias in a semiconductor wafer and a semiconductor wafer having vias formed therein using non-etch technique
JP3984689B2 (ja) 1996-11-11 2007-10-03 キヤノン株式会社 インクジェットヘッドの製造方法
JP3414227B2 (ja) 1997-01-24 2003-06-09 セイコーエプソン株式会社 インクジェット式記録ヘッド
US5921846A (en) * 1997-03-21 1999-07-13 The Johns Hopkins University Lubricated high speed fluid cutting jet
JP3450157B2 (ja) 1997-07-01 2003-09-22 三星ダイヤモンド工業株式会社 真空吸着パッド
US6267904B1 (en) 1997-07-15 2001-07-31 Skyerbrook Research Pty Ltd Method of manufacture of an inverted radial back-curling thermoelastic ink jet
WO1999012740A1 (en) 1997-09-10 1999-03-18 Seiko Epson Corporation Porous structure, ink jet recording head, methods of their production, and ink jet recorder
US6241335B1 (en) 1997-12-24 2001-06-05 Canon Kabushiki Kaisha Method of producing ink jet recording head and ink jet recording head produced by the method
JPH11198387A (ja) 1998-01-09 1999-07-27 Canon Inc インクジェット記録ヘッドの製造方法
US6271102B1 (en) 1998-02-27 2001-08-07 International Business Machines Corporation Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
ITTO980562A1 (it) 1998-06-29 1999-12-29 Olivetti Lexikon Spa Testina di stampa a getto di inchiostro
US6286938B1 (en) 1999-02-17 2001-09-11 Hitachi, Ltd. Ink jet recording head and ink jet recording apparatus
US6312612B1 (en) 1999-06-09 2001-11-06 The Procter & Gamble Company Apparatus and method for manufacturing an intracutaneous microneedle array
TW448108B (en) 1999-12-10 2001-08-01 Wisertek Internat Corp Ink jet head and its manufacturing method
US6238269B1 (en) 2000-01-26 2001-05-29 Hewlett-Packard Company Ink feed slot formation in ink-jet printheads
US20020118253A1 (en) 2000-03-21 2002-08-29 Nec Corporation Ink jet head having improved pressure chamber and its manufacturing method
US6560871B1 (en) * 2000-03-21 2003-05-13 Hewlett-Packard Development Company, L.P. Semiconductor substrate having increased facture strength and method of forming the same
KR20020009828A (ko) 2000-07-27 2002-02-02 윤종용 잉크 젯 프린트 헤드의 비아홀 형성방법
US6291317B1 (en) 2000-12-06 2001-09-18 Xerox Corporation Method for dicing of micro devices
US6749289B2 (en) * 2001-03-22 2004-06-15 Fuji Photo Film Co., Ltd. Liquid ejection apparatus and inkjet printer, and method of manufacturing them
US6555480B2 (en) * 2001-07-31 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate with fluidic channel and method of manufacturing
US6641745B2 (en) 2001-11-16 2003-11-04 Hewlett-Packard Development Company, L.P. Method of forming a manifold in a substrate and printhead substructure having the same
US6911155B2 (en) 2002-01-31 2005-06-28 Hewlett-Packard Development Company, L.P. Methods and systems for forming slots in a substrate
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US6979797B2 (en) 2002-01-31 2005-12-27 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
US7051426B2 (en) 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US6666546B1 (en) * 2002-07-31 2003-12-23 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6896360B2 (en) * 2002-10-31 2005-05-24 Hewlett-Packard Development Company, L.P. Barrier feature in fluid channel

Also Published As

Publication number Publication date
GB0420178D0 (en) 2004-10-13
SG110104A1 (en) 2005-04-28
US20060162159A1 (en) 2006-07-27
TW200524746A (en) 2005-08-01
GB2405833A (en) 2005-03-16
US20040055145A1 (en) 2004-03-25
JP2005088587A (ja) 2005-04-07
US7051426B2 (en) 2006-05-30
US7966728B2 (en) 2011-06-28

Similar Documents

Publication Publication Date Title
TWI318932B (en) Substrate slot formation
AU158409S (en) Showerhead
SG126757A1 (en) Organometallic compounds
AU155161S (en) Case
EP1653502A4 (en) SEMICONDUCTOR LAYER
GB0305927D0 (en) Compound
GB0306718D0 (en) Compound
EP1679997A4 (en) SUBSTRATE CONTAINER
GB0324792D0 (en) Compound
AU155596S (en) Case
GB0317841D0 (en) Compound
TWI367955B (en) Coating
TW564994U (en) R-chip substrate strippulator
TWI340110B (en) Cassette for substrate
GB0317842D0 (en) Compound
GB2394772B (en) Multi level
GB0324599D0 (en) Compound
TW581097U (en) Substrate holder
GB0409177D0 (en) Improved substrate
HRP20031088A2 (en) Motor-cultivator share
GB0320237D0 (en) Substrate functionalisation
GB0304600D0 (en) Downways-up specs
AU157160S (en) Tile
AU157161S (en) Tile
AU154603S (en) Tile

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees