JP2005079254A - 窒化シリコン膜の成膜方法 - Google Patents
窒化シリコン膜の成膜方法 Download PDFInfo
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Abstract
【解決手段】 ICP型のプラズマCVD装置を用いて、シラン(SiH4)ガスと窒素(N2)ガスを原料ガスとして基板6上に窒化シリコン(SiN)膜を成膜する。このとき、シラン(SiH4)ガスの供給流量に対して、窒素(N2)ガスの供給流量を10倍以上とし、ガスの総供給量に対する高周波パワー(RFパワー:成膜室に入射する電磁波のエネルギー)を3W/sccm以上とし、基板温度を50°C〜300°Cとする。また、成膜圧力を10mTorr〜50mTorrとする。
【選択図】 図1
Description
前記成膜室に供給する原料ガスとしてシランガスと窒素ガスを用い、
シランガスの供給流量に対して、窒素ガスの供給流量を10倍以上とし、ガスの総供給量に対する高周波パワーを3W/sccm以上とし、基板温度を50°C〜300°Cとしたことを特徴とする。
これにより、ガス供給ノズル15を介して供給される窒素(N2)ガスが、成膜室3のうちで高周波アンテナ11から入射される電磁波が強い空間領域、即ち、プラズマがより強く発生する空間領域に供給される。
また、ガス供給ノズル14を介して供給されるシラン(SiH4)ガスが、成膜室3のうちで基板6近傍の空間領域に供給される。
このとき成膜条件を上述した(1)〜(4)とする。
図3は成膜温度(基板温度)を200°Cとしたときにおける、各RFパワーでの、屈折率と、シランガス流量に対する窒素ガス流量の比(N2/SiH4)との関係を示す特性図である。また図4は成膜温度(基板温度)を350°Cとしたときにおける、各RFパワーでの、屈折率と、シランガス流量に対する窒素ガス流量の比(N2/SiH4)との関係を示す特性である。
図4から分かるように、基板温度が350°C程度の高温で成膜をすると、流量やRFパワーに依存することなく、良好な膜質の窒化シリコン(SiN)膜の成膜ができる。
一方、図3から分かるように、基板温度が200°のような低温条件では、シランガス流量に対する窒素ガス流量の比(N2/SiH4)が10以上で、RFパワーを3W/sccm以上とすることにより、良好な膜質の窒化シリコン(SiN)膜の成膜ができることが判明した。
窒素(N2)ガスを効率良く分解することができる。
また、シラン(SiH4)ガスが基板6近傍の空間領域に供給されるため、基板6の近傍にてSi−N反応が行われる。
この両方の効果が相乗して、Si−N反応が促進し、膜質の改善を達成することができる。
2 容器
3 成膜室
4 天井板
5 ウエハ支持台
6 基板
7 載置部
8 支持軸
9 バイアス電源
10 静電電源
11 高周波アンテナ
12 整合器
13 高周波電源
14 ガス供給ノズル
15 ガス供給ノズル
16 ガス供給ノズル
17 排気口
Claims (4)
- 誘導結合プラズマ型のプラズマCVD装置を用いて、成膜室内の基板上に窒化シリコン膜を成膜する成膜方法であって、
前記成膜室に供給する原料ガスとしてシランガスと窒素ガスを用い、
シランガスの供給流量に対して、窒素ガスの供給流量を10倍以上とし、ガスの総供給量に対する高周波パワーを3W/sccm以上とし、基板温度を50°C〜300°Cとしたことを特徴とする窒化シリコン膜の成膜方法。 - 請求項1において、
成膜圧力を10mTorr〜50mTorrとしたことを特徴とする窒化シリコン膜の成膜方法。 - 請求項1または請求項2において、
前記成膜室のうちで入射される電磁波が強い空間領域に窒素ガスを供給し、前記成膜室内に設置した基板の近傍の空間領域にシランガスを供給することを特徴とする窒化シリコン膜の成膜方法。 - 請求項1または請求項2または請求項3において、
励起ガスとしての不活性ガスを、シランガスとアンモニアガスの総供給流量の20%以下の流量で、前記成膜室内に供給することを特徴とする窒化シリコン膜の成膜方法。
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