JP2005079130A5 - - Google Patents
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- Publication number
- JP2005079130A5 JP2005079130A5 JP2003304255A JP2003304255A JP2005079130A5 JP 2005079130 A5 JP2005079130 A5 JP 2005079130A5 JP 2003304255 A JP2003304255 A JP 2003304255A JP 2003304255 A JP2003304255 A JP 2003304255A JP 2005079130 A5 JP2005079130 A5 JP 2005079130A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- film wiring
- atomic
- thin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 claims 9
- 239000010409 thin film Substances 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 239000011247 coating layer Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 229910052758 niobium Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003304255A JP2005079130A (ja) | 2003-08-28 | 2003-08-28 | 薄膜配線層 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003304255A JP2005079130A (ja) | 2003-08-28 | 2003-08-28 | 薄膜配線層 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005079130A JP2005079130A (ja) | 2005-03-24 |
| JP2005079130A5 true JP2005079130A5 (enExample) | 2006-08-24 |
Family
ID=34407993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003304255A Withdrawn JP2005079130A (ja) | 2003-08-28 | 2003-08-28 | 薄膜配線層 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005079130A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4655281B2 (ja) * | 2005-03-29 | 2011-03-23 | 日立金属株式会社 | 薄膜配線層 |
| US7719184B2 (en) | 2005-07-29 | 2010-05-18 | Kyocera Corporation | Organic EL element having a protective layer |
| JP6016083B2 (ja) | 2011-08-19 | 2016-10-26 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
| JP6361957B2 (ja) | 2013-03-22 | 2018-07-25 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
| JP5591411B1 (ja) * | 2013-07-03 | 2014-09-17 | パイオニア株式会社 | 有機ｅｌ装置 |
| JP6369750B2 (ja) * | 2013-09-10 | 2018-08-08 | 日立金属株式会社 | 積層配線膜およびその製造方法ならびにＮｉ合金スパッタリングターゲット材 |
| JP6681019B2 (ja) * | 2015-02-25 | 2020-04-15 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
-
2003
- 2003-08-28 JP JP2003304255A patent/JP2005079130A/ja not_active Withdrawn
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