JP2005072268A5 - - Google Patents
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- Publication number
- JP2005072268A5 JP2005072268A5 JP2003300376A JP2003300376A JP2005072268A5 JP 2005072268 A5 JP2005072268 A5 JP 2005072268A5 JP 2003300376 A JP2003300376 A JP 2003300376A JP 2003300376 A JP2003300376 A JP 2003300376A JP 2005072268 A5 JP2005072268 A5 JP 2005072268A5
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- metal
- thick
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 239000011810 insulating material Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000788 chromium alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003300376A JP4056445B2 (ja) | 2003-08-25 | 2003-08-25 | 金属抵抗器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003300376A JP4056445B2 (ja) | 2003-08-25 | 2003-08-25 | 金属抵抗器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005072268A JP2005072268A (ja) | 2005-03-17 |
| JP2005072268A5 true JP2005072268A5 (enExample) | 2005-07-14 |
| JP4056445B2 JP4056445B2 (ja) | 2008-03-05 |
Family
ID=34405326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003300376A Expired - Lifetime JP4056445B2 (ja) | 2003-08-25 | 2003-08-25 | 金属抵抗器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4056445B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI400732B (zh) | 2003-07-10 | 2013-07-01 | Showa Denko Kk | Manufacturing method of capacitor for capacitor, capacitor manufacturing method and capacitor |
| JP4358664B2 (ja) | 2004-03-24 | 2009-11-04 | ローム株式会社 | チップ抵抗器およびその製造方法 |
| JP4868601B2 (ja) | 2007-12-05 | 2012-02-01 | Ｎｅｃトーキン株式会社 | 固体電解コンデンサ及びその製造方法 |
| JP4537465B2 (ja) * | 2008-02-18 | 2010-09-01 | 釜屋電機株式会社 | 抵抗金属板低抵抗チップ抵抗器の製造方法 |
| JP5039867B1 (ja) * | 2011-11-22 | 2012-10-03 | 株式会社シンテック | 抵抗器および抵抗器の製造方法 |
| KR101670140B1 (ko) | 2014-12-15 | 2016-10-27 | 삼성전기주식회사 | 저항 소자, 그 제조방법 및 저항 소자의 실장 기판 |
| JP2016213367A (ja) * | 2015-05-12 | 2016-12-15 | 株式会社磐城無線研究所 | 抵抗器及びその製造方法 |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| CN110911067A (zh) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | 电流感应电阻及其制造方法 |
| DE112022005685T5 (de) * | 2021-12-01 | 2024-09-12 | Rohm Co., Ltd. | Chip-Widerstand und Verfahren zur Herstellung desselben |
-
2003
- 2003-08-25 JP JP2003300376A patent/JP4056445B2/ja not_active Expired - Lifetime
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