JP2005057032A - Resist removing device - Google Patents

Resist removing device Download PDF

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JP2005057032A
JP2005057032A JP2003285719A JP2003285719A JP2005057032A JP 2005057032 A JP2005057032 A JP 2005057032A JP 2003285719 A JP2003285719 A JP 2003285719A JP 2003285719 A JP2003285719 A JP 2003285719A JP 2005057032 A JP2005057032 A JP 2005057032A
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substrate
spray nozzles
resist
substrate transport
flat
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JP4323252B2 (en
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Daisuke Suganaga
大輔 菅長
Osamu Fujine
修 藤根
Shigeru Mizukawa
茂 水川
Katsutoshi Nakada
勝利 中田
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Sumitomo Precision Products Co Ltd
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Sumitomo Precision Products Co Ltd
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Priority to TW93118285A priority patent/TWI345260B/en
Priority to PCT/JP2004/010117 priority patent/WO2005013342A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resist removing device in which occurrence of bubbles and mist can effectively be suppressed and removing resist can efficiently be removed from above a substrate. <P>SOLUTION: A plurality of header pipes 31 extending in a substrate conveyance direction are arranged in a substrate widthwise direction at prescribed intervals. Flat spray nozzles 32 are fitted to the header pipes 31 at the prescribed intervals. The header pipes 31 are synchronously rotated in both directions at a prescribed angle. Consequently, a plurality of the flat spray nozzles 32 are synchronously rocked to both sides with a base side as a center. A plurality of the flat spray nozzles 32 in the header pipes 31 are arranged in a pipe axial direction by turning a spread direction in the substrate conveyance direction so that resist removal liquid is linearly sprayed along the substrate conveyance direction, and they are tilted in the direction at an angle θ which is not more than 30°, not more than 15° if preferable with respect to the substrate conveyance direction so that interference of spray liquid is avoided between the adjacent spray nozzles. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、液晶製造プロセスにおけるレジスト剥離処理や現像処理等に使用されるレジスト除去装置に関し、特に基板搬送式のレジスト除去装置に関する。   The present invention relates to a resist removing apparatus used for resist stripping and developing processes in a liquid crystal manufacturing process, and more particularly to a substrate transport type resist removing apparatus.

液晶パネルの製造では、ガラス基板の表面に積層回路を形成するために成膜、レジスト塗布、現像、エッチング、剥離の各処理が繰り返される。ここに使用される剥離装置としては例えば基板搬送式がある。基板搬送式の剥離装置では、水平方向に搬送される基板の表面に上方のシャワーユニットから剥離液が散布されることにより、その基板の表面に残るレジストが溶解除去される。   In manufacturing a liquid crystal panel, each process of film formation, resist coating, development, etching, and peeling is repeated to form a laminated circuit on the surface of a glass substrate. An example of the peeling device used here is a substrate transfer type. In the substrate transport type peeling apparatus, the resist remaining on the surface of the substrate is dissolved and removed by spraying the stripping solution from the upper shower unit onto the surface of the substrate transported in the horizontal direction.

レジスト剥離装置におけるシャワーユニットとしては、液体を円錐形状に吐出するフルコーンタイプのスプレーノズルをマトリックス状に配列したものが通常使用されている。剥離装置以外では、フルコーンタイプのスプレーノズルを両側へ同期して揺動させるエッチング装置用のシャワーユニットが特許文献１に記載されている。また、液体を直線状に吹き付けるフラットタイプのスプレーノズルを搬送方向に直角な板幅方向に対してハ字状に傾斜配置したエッチング装置用のシャワーユニットが特許文献２に記載されている。   As a shower unit in a resist stripping apparatus, a full cone type spray nozzle that discharges liquid in a conical shape is generally used in a matrix. In addition to the peeling device, Patent Document 1 discloses a shower unit for an etching device that swings a full cone type spray nozzle in synchronization with both sides. Further, Patent Document 2 discloses a shower unit for an etching apparatus in which flat type spray nozzles for spraying a liquid in a straight line are arranged in a slanted manner in a letter C shape with respect to a plate width direction perpendicular to the transport direction.

国際公開第０２／４９０８７号パンフレットInternational Publication No. 02/49087 Pamphlet

特開２００１−２００３７９号公報JP 2001-200379 A

基板搬送式のレジスト剥離装置でのシャワーユニットについての基本的な考え方は、基板の表面に剥離液を大量に供給することにある。この観点から、フルコーンタイプのスプレーノズルをマトリックス状に配列したシャワーユニットを使用していたわけであるが、フルコーンタイプのスプレーノズルの場合、液を旋回させて噴出するため、泡が発生しやすい問題がある。また、剥離液を大量に供給する割には、基板表面から除去されたレジストが基板上に残りやすく、再付着の問題がある。更には、液滴が細かくなってミストが発生しやすく、そのミストが基板に付着することからも再付着の問題がある。   The basic concept of the shower unit in the substrate transport type resist stripping apparatus is to supply a large amount of stripping solution to the surface of the substrate. From this point of view, a shower unit in which full cone type spray nozzles are arranged in a matrix was used. However, in the case of a full cone type spray nozzle, liquid is swirled and ejected, so bubbles are likely to be generated. There's a problem. In addition, the resist removed from the substrate surface tends to remain on the substrate for supplying a large amount of the stripping solution, and there is a problem of redeposition. Furthermore, since the droplets are fine and mist is likely to be generated, and the mist adheres to the substrate, there is a problem of redeposition.

特許文献１及び特許文献２に記載されたシャワーユニットはエッチング用であるため、均一処理の面では優れるが、レジスト剥離に適しているとは言えない。即ち、特許文献１に記載されたシャワーユニットの場合は、フルコーンタイプのスプレーノズルの使用に伴う泡、ミストの問題がある上、そのスプレーノズルを両側へ同期して揺動させるにもかかわらず、除去レジストを含む剥離液の基板上からの排出性が十分とは言えず、その剥離レジストが基板上に残りやすい問題がある。また、特許文献２に記載されたシャワーユニットの場合は、基板上での液干渉が激しく、除去レジストが基板上に残留する傾向が顕著である。   Since the shower units described in Patent Document 1 and Patent Document 2 are for etching, they are excellent in terms of uniform processing, but cannot be said to be suitable for resist stripping. That is, in the case of the shower unit described in Patent Document 1, there is a problem of bubbles and mist associated with the use of a full cone type spray nozzle, and the spray nozzle is swung synchronously on both sides. However, it cannot be said that the release liquid containing the removal resist from the substrate is sufficiently discharged, and there is a problem that the release resist tends to remain on the substrate. Further, in the case of the shower unit described in Patent Document 2, liquid interference on the substrate is intense, and the tendency that the removed resist remains on the substrate is remarkable.

本発明の目的は、泡及びミストの発生を効果的に抑制でき、しかも、除去レジストを基板上から効率的に排除できるレジスト除去装置を提供することにある。   An object of the present invention is to provide a resist removing apparatus that can effectively suppress the generation of bubbles and mist, and that can efficiently remove the removed resist from the substrate.

上記目的を達成するために、本発明のレジスト除去装置は、基板を支持して水平方向に搬送する基板搬送機構と、前記基板の表面に薬液を供給するために基板搬送面の上方に設けられたシャワーユニットとを備えており、該シャワーユニットは、薬液が基板搬送方向に沿って直線的に且つ並列的に吹き付けられるように複数列に配置された多数個のフラット型スプレーノズルと、多数個のフラット型スプレーノズルを基部側を中心にして両側へ同期揺動させるノズル揺動機構とを有している。   In order to achieve the above object, a resist removing apparatus according to the present invention is provided above a substrate transport surface for supporting a substrate and transporting it in a horizontal direction and supplying a chemical to the surface of the substrate. The shower unit includes a plurality of flat type spray nozzles arranged in a plurality of rows so that the chemical solution is sprayed linearly and in parallel along the substrate transport direction, and a plurality of shower units. And a nozzle rocking mechanism that synchronously rocks the flat spray nozzle to both sides around the base side.

本発明のレジスト除去装置においては、フラット型スプレーノズルが液拡散方向をほぼ基板搬送方向に向けて複数列に並ぶことにより、各列でレジスト除去液が基板搬送方向に沿って直線的に吹き付けられる。そして、各列のフラット型スプレーノズルが基部側を中心として両側へ交互に同期揺動することにより、複数列の液膜が両側へ交互に傾斜し、基板の表面からレジストを含む薬液が基板の両側へ効率的に排除される。しかも、フルコーン型スプレーノズルの使用で問題となる泡の発生及びミストの発生が効果的に抑制され、発生した泡の排除も効果的に行われる。   In the resist removing apparatus of the present invention, the flat spray nozzles are arranged in a plurality of rows with the liquid diffusion direction substantially in the substrate carrying direction, so that the resist removing solution is sprayed linearly along the substrate carrying direction in each row. . Then, the flat type spray nozzles in each row alternately swing to both sides centering on the base side, so that the liquid films in the plurality of rows are alternately inclined to both sides, and the chemical liquid containing the resist is transferred from the surface of the substrate to the substrate. Efficiently eliminated on both sides. In addition, the generation of bubbles and mist, which are problematic when using a full cone spray nozzle, is effectively suppressed, and the generated bubbles are effectively eliminated.

多数個のフラット型スプレーノズルは、基板幅方向に所定間隔で配列されそれぞれが回転可能に支持された基板搬送方向の複数のヘッダー管に所定の間隔で取付け、ノズル揺動機構は、各ヘッダー管を両方向に所定角度で同期して回転させることにより、多数個のフラット型スプレーノズルを両側へ回転揺動させる構成が好ましい。   A large number of flat type spray nozzles are mounted at a predetermined interval on a plurality of header tubes arranged in the substrate width direction at predetermined intervals and each of which is rotatably supported, and the nozzle swing mechanism is connected to each header tube. It is preferable to rotate and swing a large number of flat type spray nozzles to both sides by rotating them in both directions at a predetermined angle.

基板搬送方向に並ぶ複数のフラット型スプレーノズルは、隣接するスプレーノズルの間で噴射液の干渉が回避されるように、基板搬送方向に対し３０度以下、好ましくは１５度以下の角度で同方向へ傾斜させることが好ましい。この傾斜角度が大きいと、基板上の液体を基板の両側へ排除する機能が低下する。この傾斜角度の下限については、干渉回避の点から１度以上が好ましい。   The plurality of flat type spray nozzles arranged in the substrate transport direction are in the same direction at an angle of 30 degrees or less, preferably 15 degrees or less with respect to the substrate transport direction so as to avoid the interference of the spray liquid between adjacent spray nozzles. It is preferable to incline to. When this inclination angle is large, the function of removing the liquid on the substrate to both sides of the substrate is deteriorated. The lower limit of the tilt angle is preferably 1 degree or more from the viewpoint of avoiding interference.

本発明のレジスト除去装置は、基板搬送面上にマトリックス状に配列された多数個のフラット型スプレーノズルを用いて基板搬送方向に沿った複数列の直線状液噴射を行うことにより、泡及びミストの発生を効果的に抑制することができる。しかも、それらのフラット型スプレーノズルを両側へ同期して回転揺動させ、複数列の液膜を上端側を中心にして両側へ同期的に傾斜させることにより、処理の均一性を高めつつ、基板上の液体を両側へ効率的に排除し、除去レジスト及び泡を基板上から効率的に排除することができる。   The resist removal apparatus of the present invention performs foam and mist by performing multiple rows of linear liquid injection along the substrate transport direction using a large number of flat spray nozzles arranged in a matrix on the substrate transport surface. Can be effectively suppressed. In addition, these flat type spray nozzles are rotated and swung synchronously on both sides, and a plurality of rows of liquid films are tilted synchronously on both sides with the upper end as the center, thereby improving the processing uniformity and the substrate. The upper liquid can be efficiently removed to both sides, and the removal resist and bubbles can be efficiently removed from the substrate.

以下に本発明の実施形態を図面に基づいて詳細に説明する。図１は本発明の一実施形態を示すレジスト除去装置の側面図、図２は同レジスト除去装置の正面図、図３は同レジスト除去装置におけるスプレーパターンを示す平面図である。   Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a side view of a resist removing apparatus showing an embodiment of the present invention, FIG. 2 is a front view of the resist removing apparatus, and FIG. 3 is a plan view showing a spray pattern in the resist removing apparatus.

本実施形態のレジスト除去装置は、液晶パネル用ガラス基板の製造に使用される基板搬送式のレジスト剥離装置である。このレジスト除去装置は、ガラス基板１０を水平に支持して水平方向に搬送する基板搬送機構２０と、基板搬送機構２０によって搬送されるガラス基板１０の表面に剥離液を供給するシャワーユニット３０とを備えている。   The resist removal apparatus of this embodiment is a substrate transport type resist peeling apparatus used for manufacturing a glass substrate for a liquid crystal panel. The resist removing apparatus includes a substrate transport mechanism 20 that horizontally supports and transports the glass substrate 10 and a shower unit 30 that supplies a stripping solution to the surface of the glass substrate 10 transported by the substrate transport mechanism 20. I have.

基板搬送機構２０は、基板搬送方向Ｘに所定間隔で配列された複数の搬送ローラ２１と、所定数の搬送ローラ２１に１個の割合で組み合わされた押さえローラ２２とを有している。各搬送ローラ２１は、基板搬送方向Ｘに直角な水平方向の回転軸に大径円板状の支持部を所定間隔で取付けた構成になっており、両端の支持部は、ガラス基板１０の幅方向の位置決めのために基板１０の両エッジ部に嵌合する鍔付き形状に形成されている。   The substrate transport mechanism 20 includes a plurality of transport rollers 21 arranged at predetermined intervals in the substrate transport direction X, and a pressing roller 22 combined with a predetermined number of transport rollers 21 at a rate of one. Each transport roller 21 has a structure in which large-diameter disk-shaped support portions are attached to a horizontal rotation axis perpendicular to the substrate transport direction X at a predetermined interval, and the support portions at both ends have the width of the glass substrate 10. It is formed in a hooked shape that fits on both edge portions of the substrate 10 for positioning in the direction.

シャワーユニット３０は、基板幅方向に等間隔で配列された複数のヘッダー管３１と、各ヘッダー管３１に所定間隔で下向きに取付けられた複数のスプレーノズル３２と、スプレーノズル３２を揺動させるためにヘッダー管３１を両方向へ所定角度で回転させるノズル揺動機構３３とを有している。   The shower unit 30 has a plurality of header tubes 31 arranged at equal intervals in the substrate width direction, a plurality of spray nozzles 32 attached downward to each header tube 31 at a predetermined interval, and for swinging the spray nozzles 32. And a nozzle swing mechanism 33 that rotates the header pipe 31 in both directions at a predetermined angle.

各ヘッダー管３１は、基板搬送方向Ｘに平行な水平管であって、中心回りに回転自在に支持されており、図示されないフレキシブル管を介して剥離液を供給される。   Each header tube 31 is a horizontal tube parallel to the substrate transport direction X, and is supported so as to be rotatable around the center, and is supplied with a stripping solution via a flexible tube (not shown).

スプレーノズル３２は、複数のヘッダー管３１に所定間隔で取付けられることにより、基板搬送面の上方に縦横両方に所定数ずつマトリックス状に配列されている。各スプレーノズル３２は、ガラス基板１０の表面に剥離液が直線状に吹き付けられるように、その剥離液を三角形の膜状に吐出するフラットノズルである。各ヘッダー管３１における複数のスプレーノズル３２、即ち、基板搬送方向Ｘ（縦方向）に並ぶ複数のスプレーノズル３２は、各ノズルの直線状スプレーパターン３４が基板搬送方向Ｘに若干の隙間をあけて直線状に並び、且つ、その基板搬送方向Ｘに対して向きに同じ角度θで傾斜するように配置されている。   The spray nozzles 32 are attached to the plurality of header tubes 31 at a predetermined interval, so that a predetermined number of them are arranged in a matrix form both vertically and horizontally above the substrate transport surface. Each spray nozzle 32 is a flat nozzle that discharges the stripping solution into a triangular film shape so that the stripping solution is sprayed linearly on the surface of the glass substrate 10. The plurality of spray nozzles 32 in each header tube 31, that is, the plurality of spray nozzles 32 arranged in the substrate transport direction X (vertical direction), is such that the linear spray pattern 34 of each nozzle has a slight gap in the substrate transport direction X. They are arranged in a straight line and are inclined at the same angle θ in the direction of the substrate transport direction X.

基板搬送方向Ｘに並ぶ複数ノズルの各スプレーパターン３４が基板搬送方向Ｘに対して同じ向きに傾斜することにより、隣接するノズルから噴出された剥離液の基板上での干渉が回避される。ここにおける傾斜角度θは３０度以下、とりわけ１５度以下が好ましく、ここでは約５度に設定されている。   Since the spray patterns 34 of the plurality of nozzles arranged in the substrate transport direction X are inclined in the same direction with respect to the substrate transport direction X, interference of the stripping liquid ejected from the adjacent nozzles on the substrate is avoided. Here, the inclination angle θ is preferably 30 degrees or less, particularly preferably 15 degrees or less, and is set to about 5 degrees here.

ノズル揺動機構３３は、基板幅方向に並ぶ複数のヘッダー管３１を両方向へ所定角度ずつ同期回転させる（特許文献１参照）。これにより、基板搬送面上にマトリックス状に配列された多数のスプレーノズル３２が同期して両側へ回転揺動する。スプレーノズル３２の回転揺動角度ωは、揺動による基板幅方向の液噴射範囲Ｗが隣接する縦方向のノズル列間でオーバーラップするようにノズル列の間隔Ｄに応じて適宜選択される。また揺動周期は７〜１５秒が好ましい。即ち、周期が短いと、基板上に薬液が載るパドル処理時間が短くなり、パドル後、薬液が両側へ排除される時間が短くなるため、処理効率か低下する。また、この周期が長いと、基板上に載る薬液を両側へ排除する力が弱くなり、やはり処理効率が低下する。   The nozzle swing mechanism 33 synchronously rotates the plurality of header tubes 31 arranged in the substrate width direction by a predetermined angle in both directions (see Patent Document 1). As a result, a large number of spray nozzles 32 arranged in a matrix on the substrate transport surface rotate and swing to both sides synchronously. The rotational swing angle ω of the spray nozzle 32 is appropriately selected according to the interval D of the nozzle rows so that the liquid ejection range W in the substrate width direction due to the swing overlaps between adjacent vertical nozzle rows. The oscillation period is preferably 7 to 15 seconds. That is, when the cycle is short, the paddle processing time for placing the chemical on the substrate is shortened, and the time for removing the chemical to both sides after the paddle is shortened, so that the processing efficiency is lowered. In addition, if this period is long, the force for removing the chemical solution placed on the substrate to both sides becomes weak, and the processing efficiency also decreases.

本実施形態のレジスト除去装置においては、基板搬送面の上方に配置されたシャワーユニット３０から剥離液がシャワー状に噴射される。そして、そのシャワーのなかをガラス基板１０が通過する。これにより、基板１０の表面に残るレジストが溶解除去される。   In the resist removal apparatus of the present embodiment, the stripping solution is sprayed in a shower form from the shower unit 30 disposed above the substrate transport surface. Then, the glass substrate 10 passes through the shower. Thereby, the resist remaining on the surface of the substrate 10 is dissolved and removed.

ここで、シャワーユニット３０は、基板搬送面の上方にマトリックス状に配列された多数個のフラット型スプレーノズル３２によって構成されている。具体的には、各ヘッダー管３１における複数のスプレーノズル３２、即ち、基板搬送方向Ｘ（縦方向）に並ぶ複数のスプレーノズル３２から、下方を通過するガラス基板１０の表面に剥離液が直線状に噴射される。これにより、ガラス基板１０の表面に対して、基板搬送方向に沿った複数列の直線状液噴射が実施される。しかも、多数個のフラット型スプレーノズル３２は両側へ同期して回転揺動する。   Here, the shower unit 30 is configured by a large number of flat spray nozzles 32 arranged in a matrix above the substrate transport surface. Specifically, the stripping liquid is linearly formed on the surface of the glass substrate 10 passing below from the plurality of spray nozzles 32 in each header tube 31, that is, the plurality of spray nozzles 32 arranged in the substrate transport direction X (vertical direction). Is injected into. Thereby, a plurality of lines of linear liquid injection along the substrate transport direction is performed on the surface of the glass substrate 10. Moreover, the large number of flat type spray nozzles 32 rotate and swing in synchronization with both sides.

フラット型スプレーノズル３２を使用することにより、泡及びミストの発生が抑制される。フラット型スプレーノズル３２を使用して複数列の直線状液噴射を実施すると、基板表面への液供給が板幅方向で不均一になるが、そのフラット型スプレーノズル３２は両側へ同期して回転揺動するため、不均一が緩和される。   By using the flat spray nozzle 32, the generation of bubbles and mist is suppressed. When a plurality of lines of linear liquid injection are performed using the flat type spray nozzle 32, the liquid supply to the substrate surface becomes uneven in the plate width direction, but the flat type spray nozzle 32 rotates in synchronization with both sides. Since it swings, unevenness is alleviated.

そして何よりも、直線状液噴射が回転揺動と組み合わされることにより、基板上の液体が基板の両側へ効率的に排出される。即ち、直線状液噴射と回転揺動の組合せにより噴射液膜が両側へ交互に傾斜し、その液膜が右側へ一斉に傾いたときは基板上の液体が右側へ排除され、左側へ一斉に傾いたときは基板上の液体が左側へ排除されるのである。その結果、基板の表面から剥離したレジストを含む剥離液剥離液中の泡が効率的に排除され、ミストの抑制等とあいまってレジストの再付着が効果的に防止される。   Above all, the liquid on the substrate is efficiently discharged to both sides of the substrate by combining the linear liquid ejection with the rotation swing. That is, the spray liquid film tilts alternately on both sides due to the combination of linear liquid spray and rotational swing, and when the liquid film tilts all at once on the right side, the liquid on the substrate is eliminated on the right side and all on the left side all at once. When tilted, the liquid on the substrate is removed to the left. As a result, bubbles in the stripping solution stripping solution containing the resist stripped from the surface of the substrate are efficiently eliminated, and resist re-adhesion is effectively prevented together with mist suppression and the like.

なお、上記実施形態はレジスト剥離装置であるが、現像装置であってもよい。また基板は水平に支持されて搬送されるが、側方へ傾斜して搬送される傾斜搬送方式でもよい。   In addition, although the said embodiment is a resist peeling apparatus, a developing apparatus may be sufficient. The substrate is transported while being supported horizontally, but an inclined transport method in which the substrate is transported while being inclined to the side may be used.

本発明の一実施形態を示すレジスト除去装置の側面図である。It is a side view of the resist removal apparatus which shows one Embodiment of this invention. 同レジスト除去装置の正面図である。It is a front view of the resist removal apparatus. 同レジスト除去装置におけるスプレーパターンを示す平面図である。It is a top view which shows the spray pattern in the same resist removal apparatus.

符号の説明Explanation of symbols

１０ ガラス基板
２０ 基板搬送機構
２１ 搬送ローラ
２２ 押さえローラ
３０ シャワーユニット
３１ ヘッダー管
３２ スプレーノズル
３３ ノズル揺動機構
３４ スプレーパターン DESCRIPTION OF SYMBOLS 10 Glass substrate 20 Substrate conveyance mechanism 21 Conveyance roller 22 Pressing roller 30 Shower unit 31 Header pipe 32 Spray nozzle 33 Nozzle swing mechanism 34 Spray pattern

Claims (3)

基板を支持して水平方向に搬送する基板搬送機構と、前記基板の表面に薬液を供給するために基板搬送面の上方に設けられたシャワーユニットとを備えており、該シャワーユニットは、薬液が基板搬送方向に沿って直線的に且つ並列的に吹き付けられるように複数列に配置された多数個のフラット型スプレーノズルと、多数個のフラット型スプレーノズルを基部側を中心にして両側へ同期揺動させるノズル揺動機構とを有するレジスト除去装置。   A substrate transport mechanism for supporting the substrate and transporting it horizontally; and a shower unit provided above the substrate transport surface for supplying a chemical solution to the surface of the substrate. A large number of flat spray nozzles arranged in multiple rows so as to be sprayed linearly and in parallel along the substrate transport direction, and a large number of flat spray nozzles are synchronously swung to both sides around the base side. A resist removing apparatus having a nozzle swinging mechanism to be moved. 多数個のフラット型スプレーノズルは、基板幅方向に所定間隔で配列されそれぞれが回転可能に支持された基板搬送方向の複数のヘッダー管に所定の間隔で取付けられており、ノズル揺動機構は、各ヘッダー管を両方向に所定角度で同期して回転させることにより、多数個のフラット型スプレーノズルを両側へ回転揺動させる請求項１に記載のレジスト除去装置。   A large number of flat type spray nozzles are attached at predetermined intervals to a plurality of header tubes in the substrate transport direction, which are arranged at predetermined intervals in the substrate width direction and are rotatably supported. 2. The resist removing apparatus according to claim 1, wherein each of the header pipes is rotated in both directions at a predetermined angle to rotate and swing a large number of flat type spray nozzles to both sides. 基板搬送方向に並ぶ複数のフラット型スプレーノズルは、隣接するスプレーノズルの間で噴射液の干渉が回避されるように、基板搬送方向に対し３０度以下の角度で同方向へ傾斜する請求項１に記載のレジスト除去装置。   The plurality of flat type spray nozzles arranged in the substrate transport direction are inclined in the same direction at an angle of 30 degrees or less with respect to the substrate transport direction so that the interference of the spray liquid is avoided between adjacent spray nozzles. The resist removing apparatus according to 1.
JP2003285719A 2003-08-04 2003-08-04 Resist removal device Expired - Fee Related JP4323252B2 (en)

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JP2003285719A JP4323252B2 (en) 2003-08-04 2003-08-04 Resist removal device
TW93118285A TWI345260B (en) 2003-08-04 2004-06-24 Resist elimination device
PCT/JP2004/010117 WO2005013342A1 (en) 2003-08-04 2004-07-15 Resist removing apparatus

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