TW200507033A - Resist elimination device - Google Patents

Resist elimination device

Info

Publication number
TW200507033A
TW200507033A TW093118285A TW93118285A TW200507033A TW 200507033 A TW200507033 A TW 200507033A TW 093118285 A TW093118285 A TW 093118285A TW 93118285 A TW93118285 A TW 93118285A TW 200507033 A TW200507033 A TW 200507033A
Authority
TW
Taiwan
Prior art keywords
substrate
along
resist
delivery direction
spray nozzles
Prior art date
Application number
TW093118285A
Other languages
Chinese (zh)
Other versions
TWI345260B (en
Inventor
Daisuke Suganaga
Osamu Fujine
Shigeru Mizukawa
Katsutoshi Nakata
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Publication of TW200507033A publication Critical patent/TW200507033A/en
Application granted granted Critical
Publication of TWI345260B publication Critical patent/TWI345260B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention is to provide a resist elimination device, which can prevent the generation of bubble and fog as well as eliminating the resist on the substrate effectively. Place a plurality of header pipes 31 extending in the delivery direction of substrate with determined space along the width direction of substrate. The flat spray nozzles are installed in each header pipe 31 with determined space. For each header pipe 31, it rotates simultaneously in two directions with determined angles, enabling plural flat spray nozzles 32 swindle simultaneously along two sides of centered base side. The plural flat spray nozzles 32 of each header pipe 31 enable resist elimination solution to be blown linearly along the delivery direction of substrate. Thus the spread direction is substantially along the pipe axis in the delivery direction of substrate and prevents the interference of spray liquid between the neighboring nozzles. The blowing angle is under 30 degree against the delivery direction of substrate, ideally it is under 15 degree inclination θ along the same direction.
TW93118285A 2003-08-04 2004-06-24 Resist elimination device TWI345260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003285719A JP4323252B2 (en) 2003-08-04 2003-08-04 Resist removal device

Publications (2)

Publication Number Publication Date
TW200507033A true TW200507033A (en) 2005-02-16
TWI345260B TWI345260B (en) 2011-07-11

Family

ID=34113894

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93118285A TWI345260B (en) 2003-08-04 2004-06-24 Resist elimination device

Country Status (3)

Country Link
JP (1) JP4323252B2 (en)
TW (1) TWI345260B (en)
WO (1) WO2005013342A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG145580A1 (en) * 2007-02-15 2008-09-29 Epomid Chemical & Machinery Pt Nozzle tip
DE102007063202A1 (en) * 2007-12-19 2009-06-25 Gebr. Schmid Gmbh & Co. Method and apparatus for treating silicon wafers
JP5139120B2 (en) * 2008-02-27 2013-02-06 新光電気工業株式会社 Surface treatment method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04342134A (en) * 1991-05-17 1992-11-27 Nec Corp Etching device
JP3866856B2 (en) * 1998-04-24 2007-01-10 大日本スクリーン製造株式会社 Substrate processing equipment
JP2001200379A (en) * 2000-01-20 2001-07-24 Hitachi Chem Co Ltd Etching apparatus
JPWO2002049087A1 (en) * 2000-12-12 2004-04-15 住友精密工業株式会社 Swing shower type transfer type substrate processing equipment
JP2002359452A (en) * 2001-03-29 2002-12-13 Sumitomo Bakelite Co Ltd Method of manufacturing flexible circuit printed wiring board
JP2003322976A (en) * 2002-05-07 2003-11-14 Fuji Photo Film Co Ltd Method for atomizing liquid, method and device for developing substrate by using the same
JP2004152987A (en) * 2002-10-30 2004-05-27 Kemitoron:Kk Method and system for etching printed wiring board
JP2004174463A (en) * 2002-11-29 2004-06-24 Mitsubishi Paper Mills Ltd Method for cleaning substrate

Also Published As

Publication number Publication date
WO2005013342A1 (en) 2005-02-10
JP4323252B2 (en) 2009-09-02
JP2005057032A (en) 2005-03-03
TWI345260B (en) 2011-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees