JPH04342134A - Etching device - Google Patents

Abstract

PURPOSE:To perform the etching without unevenness in an etching device for a printed wiring board. CONSTITUTION:By disposing flat spray nozzles in V shape, the etching without unevenness can be performed since liquid bank is not formed on a board 2 and etchant flows without a break.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to an etching apparatus.
In particular, it relates to an etching device using a spray nozzle.

0002

2. Description of the Related Art A conventional etching apparatus will be explained with reference to the drawings. FIG. 4 is a diagram of an etching section of a conventional etching apparatus viewed from above, FIG. 5 is a diagram of a conventional etching apparatus viewed from the side, and FIG. 6 is a diagram of a spray pattern of the conventional etching apparatus.

In the conventional etching apparatus, a plurality of spray tubes 1 are arranged above and below the pass line of the substrate 2 at an angle of several degrees with respect to the direction in which the substrate 2 travels. In the spray tube 1, full cone spray nozzles 4 are arranged in a staggered manner in the pass line direction. Further, the spray pipe 1 is equipped with a swinging mechanism using a motor and a crank (not shown).

The etching solution is sprayed onto the substrate 2 on the pass line from the upper and lower full-cone spray nozzles 4, and the spray pattern on the substrate 2 is as shown in FIG. Furthermore, the swinging mechanism moves the spray pattern on the substrate 2 left and right with respect to the traveling direction.

[0005]

[Problems to be Solved by the Invention] In the conventional etching apparatus, the spray pattern on the substrate is buffered (Fig. 6).
A pool of etching solution is formed in the shaded area A). When a liquid pool is formed, the etching speed of that part becomes slow, and there is a problem in that the etching becomes uneven compared to other parts.

An object of the present invention is to provide an etching apparatus that solves the above problems.

[0007]

[Means for Solving the Problems] In order to achieve the above object, an etching apparatus according to the present invention includes a spray pipe and a flat spray nozzle, the spray pipe being supplied with an etching solution. It is arranged opposite to the substrate conveyance path, and is bent in a V shape from the center toward both ends,
Flat spray nozzles spray the etching solution in the spray tube onto the substrate in the conveyance path, and are installed at regular intervals in the length direction of the spray tube.
Adjacent flat spray nozzles are arranged so that their spray areas on the substrate are partially overlapped.

[0008]

[Operation] By arranging the rows of flat spray nozzles in a V-shape and partially overlapping the spray areas of adjacent flat spray nozzles, the spray pattern is designed to eliminate buffering areas that would cause uneven etching. .

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a top view of an etched area according to an embodiment of the present invention, FIG. 2 is a side view of an etched area according to an embodiment of the present invention, and FIG. It is a pattern diagram.

In the figure, V-shaped spray tubes 1 are arranged above and below the pass line with their acute angles facing rearward in the direction in which the substrate 2 moves. In the spray pipe 1, the flat spray nozzles 3 are arranged at a slight inclination in the traveling direction from the vertical direction toward the pass line, and as shown in FIG. It is arranged so that Also, spray tube 1
is equipped with a swing mechanism using a motor and a crank (not shown).

The etching solution is sprayed onto the substrate 2 on the pass line at a slightly inclined angle from above and below, as shown in FIG.
A V-shaped spray pattern P as shown in is formed. Further, the swinging mechanism moves the spray pattern in the left and right directions with respect to the traveling direction.

0012

As explained above, in the etching apparatus according to the present invention, the etching solution spray hits the substrate at a slight angle of inclination, and the spray pattern forms a V-shape, so that the etching solution on the substrate is constantly moved in the direction of travel. Because the etchant flows toward the rear or outside of the substrate, no pools of etching solution are formed on the substrate, reducing uneven etching and eliminating variations in finished circuit width on the top surface of the processing board.
±30μm⇒±10μm (500×500mm, copper thickness 4
0 μm, circuit width 150 μm).

[Brief explanation of drawings]

FIG. 1 is a top view of an etched portion according to an embodiment of the present invention.

FIG. 2 is a lateral view of an etched portion according to an embodiment of the present invention.

FIG. 3 is a spray pattern diagram of an embodiment of the present invention.

FIG. 4 is a diagram of an etching section of a conventional etching apparatus viewed from above.

FIG. 5 is a lateral view of an etching section of a conventional etching apparatus.

FIG. 6 is a diagram of a spray pattern of a conventional etching apparatus.

[Explanation of symbols]

1 Spray tube 2 Board 3. Flat spray nozzle 4 Full cone spray nozzle

Claims (1)

[Claims] 1. An etching apparatus comprising a spray tube and a flat spray nozzle, the spray tube comprising:
The etching solution is supplied to the nozzle, which is placed facing the substrate conveyance path and is bent in a V shape from the center to both ends. The spray tubes are installed at regular intervals in the length direction of the spray tubes, and adjacent flat spray nozzles are arranged so that their spray areas on the substrate are partially overlapped. An etching device characterized in that it is an etching device.