JP2005023398A - メッキ方法およびメッキ装置 - Google Patents

メッキ方法およびメッキ装置 Download PDF

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Publication number
JP2005023398A
JP2005023398A JP2003192500A JP2003192500A JP2005023398A JP 2005023398 A JP2005023398 A JP 2005023398A JP 2003192500 A JP2003192500 A JP 2003192500A JP 2003192500 A JP2003192500 A JP 2003192500A JP 2005023398 A JP2005023398 A JP 2005023398A
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JP
Japan
Prior art keywords
plating
plated
carrier tape
storage recess
cathode member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003192500A
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English (en)
Japanese (ja)
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JP2005023398A5 (https=
Inventor
Satoshi Kaneko
敏 兼子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneko Denki KK
Original Assignee
Kaneko Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneko Denki KK filed Critical Kaneko Denki KK
Priority to JP2003192500A priority Critical patent/JP2005023398A/ja
Priority to US10/717,584 priority patent/US20050006243A1/en
Priority to EP03257520A priority patent/EP1496142A3/en
Publication of JP2005023398A publication Critical patent/JP2005023398A/ja
Publication of JP2005023398A5 publication Critical patent/JP2005023398A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2003192500A 2003-07-04 2003-07-04 メッキ方法およびメッキ装置 Pending JP2005023398A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003192500A JP2005023398A (ja) 2003-07-04 2003-07-04 メッキ方法およびメッキ装置
US10/717,584 US20050006243A1 (en) 2003-07-04 2003-11-21 Plating method and plating apparatus
EP03257520A EP1496142A3 (en) 2003-07-04 2003-11-28 Electroplating method and electroplating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003192500A JP2005023398A (ja) 2003-07-04 2003-07-04 メッキ方法およびメッキ装置

Publications (2)

Publication Number Publication Date
JP2005023398A true JP2005023398A (ja) 2005-01-27
JP2005023398A5 JP2005023398A5 (https=) 2006-10-26

Family

ID=33447965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003192500A Pending JP2005023398A (ja) 2003-07-04 2003-07-04 メッキ方法およびメッキ装置

Country Status (3)

Country Link
US (1) US20050006243A1 (https=)
EP (1) EP1496142A3 (https=)
JP (1) JP2005023398A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009504906A (ja) * 2005-08-09 2009-02-05 ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー 複数の基板を収容する又は保持する装置及び電気メッキ装置
JP2011208203A (ja) * 2010-03-29 2011-10-20 Tdk Corp めっき装置、めっき方法およびチップ型電子部品の製造方法
JP2013160380A (ja) * 2012-02-01 2013-08-19 Nix Inc 被めっき材の保護具

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113818057B (zh) * 2021-09-25 2023-03-10 山东睿思精密工业有限公司 一种散件cpu散热片连续电镀方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898145A (en) * 1971-02-17 1975-08-05 Scm Corp Process for applying contrasting coatings to a workpiece
US4321124A (en) * 1981-02-02 1982-03-23 Select Technology Corporation Loose parts plating apparatus
US4904363A (en) * 1989-04-25 1990-02-27 Burndy Corporation Selective plating systems
US5133847A (en) * 1991-02-28 1992-07-28 Amp Incorporated Component carrier, method of manufacture and use therefor
DE50001414D1 (de) * 2000-11-13 2003-04-10 Wilhelm Steckelbach Modulare Vorrichtung zum Oberflächenbehandeln von Behandlungsgut in Form von Einzelheiten

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009504906A (ja) * 2005-08-09 2009-02-05 ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー 複数の基板を収容する又は保持する装置及び電気メッキ装置
JP2011208203A (ja) * 2010-03-29 2011-10-20 Tdk Corp めっき装置、めっき方法およびチップ型電子部品の製造方法
JP2013160380A (ja) * 2012-02-01 2013-08-19 Nix Inc 被めっき材の保護具

Also Published As

Publication number Publication date
EP1496142A2 (en) 2005-01-12
EP1496142A3 (en) 2006-04-05
US20050006243A1 (en) 2005-01-13

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