JP2005015908A5

JP2005015908A5 -

Info

Publication number: JP2005015908A5
Application number: JP2003352701A
Authority: JP
Filing date: 2003-10-10
Publication date: 2006-11-24
Anticipated expiration: 2023-10-10

Description

本発明に係る蒸着マスク１は、図１および図６に示すごとく、多数独立の蒸着通孔５からなる蒸着パターン６をパターン形成領域４内に備えるマスク本体２と、マスク本体２の外周に配置された、低熱線膨張係数の材質からなるマスク本体２の補強用の枠体３とからなる。そして、マスク本体２のパターン形成領域４の外周縁４ａの上面と、枠体３の上面およびパターン形成領域４に臨む側面と、マスク本体２と枠体３との間隙部分に金属層を形成して、マスク本体２と枠体３とを接合していることを特徴とする。枠体３は、線膨張係数の小さなニッケル−鉄合金であるインバー材、あるいはニッケル−鉄−コバルト合金であるスーパーインバー材で形成することが好ましい。かかる材質を採用することで、初期寸法を確保できれば、熱影響によるマスク本体２の形状変化・寸法変化をよく抑えることができる。また、前記金属層は、電鋳法により形成されたことを特徴とする。 As shown in FIGS. 1 and 6, the vapor deposition mask 1 according to the present invention includes a mask main body 2 provided with a vapor deposition pattern 6 composed of a large number of independent vapor deposition through holes 5 in a pattern forming region 4, and an outer periphery of the mask main body 2. And a reinforcing frame 3 of the mask body 2 made of a material having a low coefficient of thermal expansion. Then, a metal layer is formed on the upper surface of the outer peripheral edge 4 a of the pattern formation region 4 of the mask body 2, the upper surface of the frame body 3 and the side surface facing the pattern formation region 4, and the gap portion between the mask body 2 and the frame body 3. The mask body 2 and the frame body 3 are joined . The frame 3 is preferably formed of an invar material that is a nickel-iron alloy having a small linear expansion coefficient or a super invar material that is a nickel-iron-cobalt alloy. By adopting such a material, if the initial dimensions can be ensured, it is possible to sufficiently suppress changes in the shape and dimensions of the mask body 2 due to thermal effects. The metal layer is formed by electroforming.

図４および図９に示すごとく、蒸着マスクは、複数個の独立したマスク本体２を備える形態を採ることができる。枠体３には、各マスク本体２に対応する開口３ａが複数個形成され、各開口３ａに、一個のマスク本体２がそれぞれ配置されている。そして、図１および図６に示すごとく、枠体３と、各マスク本体２のパターン形成領域４の外周縁４ａとを金属層を介して不離一体的に接合する。 As shown in FIGS. 4 and 9, the vapor deposition mask can take a form including a plurality of independent mask bodies 2. A plurality of openings 3a corresponding to each mask body 2 are formed in the frame 3, and one mask body 2 is disposed in each opening 3a. Then, as shown in FIGS. 1 and 6, a frame 3, inseparable integrally joined to the outer peripheral edge 4a of the pattern formation region 4 of each mask body 2 via the metallic layer.

図１および図９に示すごとく、金属層は、マスク本体２を枠体３側に引き寄せる、引っ張り応力Ｆ１が作用するようなテンションを加えた状態で形成することが好ましい。かかる引っ張り応力Ｆ１の付与は、金属層を作成する際の電鋳槽中に添加する第２種光沢剤中のカーボンの含有比率を調製することで実現できる。 As shown in FIGS. 1 and 9 metals layer, drawing the mask body 2 on the frame 3 side, it is preferable that tensile stress F1 is formed while applying a tension so as to act. Granting such tensile stress F1 can be realized by preparing the carbon content of the second in two gloss agent added in the electrodeposition picolinimidate for creating metallic layers.

マスク本体２は、それ自体に内方に収縮する方向の応力Ｆ２が作用するようなテンションを加えた状態で、金属層を介して枠体３に保持されている形態を採ることが好ましい。かかる応力Ｆ２の付与は、マスク本体２となる一次電着層１５を作成する際の電鋳槽中に添加する第２種光沢剤中のカーボンの含有比率を調製することで実現できる。さらに、母型１０を４２アロイやインバー、ＳＵＳ４３０（ステンレス）その他の低熱線膨張係数の材質からなるものとしたうえで、一次電着層１５の形成時における電鋳槽内の温度が高くなることで、かかる温度差に起因して、母型１０と母型上に形成されるニッケルやニッケル合金等の電着金属との熱膨張係数の差によって、母型から剥離した一次電着層１５が常温時には内方側に収縮するように設定することによっても実現できる。 The mask body 2 in a state where the direction of the stress F2 to contract inwardly to itself plus the tension as to act, it is preferable to adopt a form in which through the metallic layer is held in the frame 3. The application of the stress F2 can be realized by adjusting the content ratio of carbon in the second type brightener added to the electroforming tank when the primary electrodeposition layer 15 to be the mask body 2 is formed. Furthermore, the mold 10 is made of 42 alloy, Invar, SUS430 (stainless steel) or other material having a low coefficient of thermal expansion, and the temperature in the electroforming tank when the primary electrodeposition layer 15 is formed is increased. Thus, due to the temperature difference, the primary electrodeposition layer 15 peeled from the mother die due to the difference in thermal expansion coefficient between the mother die 10 and the electrodeposited metal such as nickel or nickel alloy formed on the mother die. It can also be realized by setting to shrink inward at room temperature.

図６ないし図８に示すごとく、マスク本体２のパターン形成領域４の外周縁４ａに、多数個の通孔２１を設け、マスク本体２のパターン形成領域４の外周縁４ａと枠体３とを、通孔２１を埋めるように形成された金属層を介して不離一体的に接合することができる。 6 to 8, a large number of through holes 21 are provided in the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2, and the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2 and the frame body 3 are connected. It may be inseparable integrally bonded via a metallic layer formed to fill the through hole 21.

また本発明は、図１に示すような多数独立の蒸着通孔５からなる蒸着パターン６をパターン形成領域４内に備えるマスク本体２と、マスク本体２の外周に配置された、低熱線膨張係数の材質からなるマスク本体２の補強用の枠体３とを金属層を介して接合してなる蒸着マスク１の製造方法において、図２（ｃ）および図１０（ｃ）に示すごとく、母型１０の表面に、レジスト体１４ａを有する一次パターンレジスト１４を設ける第１のパターンニング工程と、図２（ｄ）および図１０（ｄ）に示すごとく、一次パターンレジスト１４を用いて、母型１０上に電着金属を電鋳して、マスク本体２に対応する一次電着層１５を形成する第１の電鋳工程と、図３（ｃ）および図１２（ｃ）に示すごとく、一次電着層１５を囲むように、母型１０上に枠体３を配する枠体配設工程と、図３（ｅ）および図１２（ｅ）に示すごとく、枠体３の表面と、一次電着層１５の外周縁４ａ、すなわちマスク本体２のパターン形成領域４の外周縁４ａ表面とを覆うように電鋳法により金属層を形成して、該金属層を介して一次電着層１５と枠体３とを不離一体的に接合する第２の電鋳工程と、母型１０から一次電着層１５、枠体３および金属層を一体に剥離する剥離工程とを含む。 The present invention also includes a mask main body 2 having a vapor deposition pattern 6 composed of a large number of independent vapor deposition through holes 5 as shown in FIG. 1 in the pattern forming region 4, and a low thermal expansion coefficient disposed on the outer periphery of the mask main body 2. the method of manufacturing a deposition mask 1 and frame 3 for reinforcement of the mask body 2 is formed by bonding via a metallic layer made of a material, as shown in FIG. 2 (c) and FIG. 10 (c), the mother A first patterning step in which a primary pattern resist 14 having a resist body 14a is provided on the surface of the mold 10, and a primary mold using the primary pattern resist 14 as shown in FIGS. 2 (d) and 10 (d). A first electroforming step of forming a primary electrodeposition layer 15 corresponding to the mask body 2 by electroforming an electrodeposited metal on the substrate 10, as shown in FIGS. 3 (c) and 12 (c). On the matrix 10 so as to surround the electrodeposition layer 15 As shown in FIG. 3E and FIG. 12E, the surface of the frame 3 and the outer peripheral edge 4a of the primary electrodeposition layer 15, that is, the pattern of the mask body 2 the outer peripheral edge 4a forms a by Rikin genus layer electroforming so as to cover the surface of the forming region 4, inseparable integrally joining the primary electrodeposited layers 15 and the frame 3 through the gold genus layer to include a second electroforming step, the primary electrodeposited layers 15 from the matrix 10, and a peeling step of peeling the integrated frame body 3 and metals layer.

これによれば、レジスト体１４ａの除去に伴い、一次電着層１５に蒸着通孔５が形成される。また、パターン形成領域４の外周縁４ａに電鋳形成された金属層によって、パターン形成領域４の外周縁４ａと枠体３とを不離一体的に接合することができる。パターンレジスト１４は、フォトレジスト等を使用したリソグラフィー法その他の任意の方法で形成でき、パターンレジスト１４の形成手段は問わない。 According to this, the vapor deposition through-hole 5 is formed in the primary electrodeposition layer 15 with the removal of the resist body 14a. Also, depending on metallic layer which is electroformed formed on the outer peripheral edge 4a of the pattern formation region 4 can be bonded to the outer peripheral edge 4a and the frame 3 of the pattern forming region 4 inseparable integrally. The pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other method, and any means for forming the pattern resist 14 can be used.

また、本発明は、図１、図４および図６、図９に示すごとく、多数独立の蒸着通孔５からなる蒸着パターン６をパターン形成領域４内に備える複数個のマスク本体２と、各マスク本体２に対応する複数個の開口３ａを備える、低熱線膨張係数の材質からなるマスク本体２の補強用の枠体３とを金属層を介して接合してなる蒸着マスク１の製造方法において、図２（ｃ）および図１０（ｃ）に示すごとく、母型１０の表面に、レジスト体１４ａを有する一次パターンレジスト１４を設ける第１のパターンニング工程と、図２（ｄ）および図１０（ｄ）に示すごとく、一次パターンレジスト１４を用いて母型１０上に電着金属を電鋳し、該母型１０上にマスク本体２に対応する一次電着層１５を所定位置に複数個形成する第１の電鋳工程と、図３（ｃ）および図１２（ｃ）に示すごとく、枠体３の各開口３ａ内に、該開口３ａに対応する一次電着層１５が位置するように位置合わせしながら、母型１０上に枠体３を配する枠体配設工程と、図３（ｅ）および図１２（ｅ）に示すごとく、枠体３の表面と、一次電着層１５の外周縁４ａ、すなわちマスク本体２のパターン形成領域４の外周縁４ａ表面とを覆うように、電鋳法により金属層を形成して、該金属層を介して一次電着層１５と枠体３とを不離一体的に接合する第２の電鋳工程と、母型１０から一次電着層１５、枠体３および金属層を一体に剥離する剥離工程とを含む。 In addition, as shown in FIGS. 1, 4, 6 and 9, the present invention includes a plurality of mask bodies 2 each having a deposition pattern 6 formed of a large number of independent deposition holes 5 in the pattern formation region 4, comprising a plurality of apertures 3a corresponding to the mask body 2, a method of manufacturing a low heat rays and a frame member 3 for reinforcing the mask body 2 made of a material of thermal expansion coefficient formed by cementing through the metallic layer deposition mask 1 2 (c) and FIG. 10 (c), a first patterning step of providing a primary pattern resist 14 having a resist body 14a on the surface of the mother die 10, and FIG. 2 (d) and FIG. 10 (d), an electrodeposition metal is electroformed on the mother die 10 using the primary pattern resist 14, and a plurality of primary electrodeposition layers 15 corresponding to the mask body 2 are formed on the mother die 10 at predetermined positions. FIG. 3 shows a first electroforming process for forming individual pieces. c) and as shown in FIG. 12 (c), the frame body is formed on the matrix 10 while aligning so that the primary electrodeposition layer 15 corresponding to the opening 3a is positioned in each opening 3a of the frame body 3. 3 and the pattern formation of the surface of the frame 3 and the outer peripheral edge 4a of the primary electrodeposition layer 15, that is, the mask body 2 as shown in FIGS. 3 (e) and 12 (e). to cover the outer peripheral edge 4a surface region 4, to form a Rikin genus layer by the electroforming method, inseparable integrally bond the primary electrodeposited layers 15 and the frame 3 through the gold genus layer to include a second electroforming step, the primary electrodeposited layers 15 from the matrix 10, and a peeling step of peeling the integrated frame body 3 and metals layer.

図３（ｄ）および図１２（ｄ）に示すごとく、第２の電鋳工程（図３（ｅ）又は図１２（ｅ））に先立って、母型１０上に形成された一次電着層１５の表面に、パターン形成領域４を覆うレジスト体１８ａを形成する工程を含み、前記第２の電鋳工程において、レジスト体１８ａを利用して金属層を電鋳法にて形成するようにしてもよい。 As shown in FIGS. 3D and 12D, the primary electrodeposition layer formed on the matrix 10 prior to the second electroforming process (FIG. 3E or 12E). 15 surface of includes the step of forming a resist material 18a covering the pattern formation region 4, in the second electroforming step, by using a resist body 18a so as to form at metallic layer electroforming May be.

図１０（ｅ）に示すごとく第１の電鋳工程において、マスク本体２に対応する一次電着層１５の外周縁４ａには、多数個の通孔２１が形成されるようにしてあり、図１２（ｅ）に示すごとく第２の電鋳工程においては、該通孔２１を埋めるように金属層が形成されるようにすることができる。

As shown in FIG. 10E, in the first electroforming process, a large number of through holes 21 are formed in the outer peripheral edge 4a of the primary electrodeposition layer 15 corresponding to the mask body 2. in a second electroforming step as shown in 12 (e), it is possible to make metallic layer is formed to fill the vent hole 21.

Claims

A mask body 2 provided with a vapor deposition pattern 6 comprising a large number of independent vapor deposition holes 5 in the pattern formation region 4;
It consists of a frame 3 for reinforcement of the mask body 2 made of a material having a low coefficient of thermal expansion, arranged on the outer periphery of the mask body 2,
Forming a metal layer on the upper surface of the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2, the upper surface of the frame 3 and the side surface facing the pattern forming region 4, and the gap between the mask body 2 and the frame 3; A vapor deposition mask characterized in that the mask body 2 and the frame 3 are joined .

The vapor deposition mask according to claim 1, wherein the metal layer is formed by an electroforming method.

The vapor deposition mask includes a plurality of independently formed mask bodies 2,
A plurality of openings 3a corresponding to each mask body 2 are formed in the frame 3, and one mask body 2 is arranged in each opening 3a.
The vapor deposition mask according to claim 1 or 2 , wherein the frame body 3 and the outer peripheral edge 4a of the pattern forming region 4 of each mask body 2 are joined together in a non-separable manner through a metal layer .

The vapor deposition mask according to claim 1, 2 or 3 , wherein the metal layer is formed in a state in which a tension is applied so that the tensile stress F <b> 1 acts to draw the mask body 2 toward the frame body 3.

The mask main body 2 is held by the frame body 3 via a metal layer in a state where a tension is applied to the mask main body 2 so that a stress F2 in the direction of inward contraction acts on the mask main body 2. 4. The vapor deposition mask according to 4.

A large number of through holes 21 are provided in the outer peripheral edge 4 a of the pattern forming region 4 of the mask body 2 .
The outer peripheral edge 4a of the pattern forming region 4 of the mask body 2 and the frame body 3 are integrally and integrally joined through a metal layer formed so as to fill the through hole 21. The vapor deposition mask of 4 or 5.

The vapor deposition mask according to claim 1, 2, 3, 4, 5, or 6, wherein the mask main body 2 has a polygonal shape in plan view, and the corners thereof are chamfered.

The deposition pattern 6 composed of multiple independent evaporation holes 5 and luma disk body 2 provided in the pattern formation region 4, is disposed on the outer periphery of the mask body 2, the mask body 2 made of a material of low coefficient of linear thermal expansion and a frame member 3 for reinforcing method for manufacturing a deposition mask 1 formed by joining via the metallic layer,
A first patterning step of providing a primary pattern resist 14 having a resist body 14a on the surface of the matrix 10;
With primary pattern resist 14, and electroforming electrodeposited metal on the matrix 10, a first electroforming process that form the primary electrodeposited layers 15 corresponding to the mask body 2,
A frame body disposing step of disposing the frame body 3 on the matrix 10 so as to surround the primary electrodeposition layer 15 ;
The surface of the frame 3, to form a primary conductive outer peripheral edge 4a of the adhesive layer 15, i.e. Rikin genus layer by electroforming so as to cover the outer peripheral edge 4a surface of the pattern formation region 4 of the mask body 2, the a second electroforming step for joining the primary electrodeposited layers 15 and the frame 3 inseparable integrally via the metallic layer,
Method for manufacturing a deposition mask, characterized in that the matrix 10 including a peeling step of peeling primary electrodeposited layers 15, the frame body 3 and Metals layer together.

From a material having a low coefficient of thermal expansion, comprising a plurality of mask bodies 2 provided with a vapor deposition pattern 6 comprising a large number of independent vapor deposition holes 5 in the pattern formation region 4 and a plurality of openings 3a corresponding to the respective mask bodies 2. A method of manufacturing a vapor deposition mask 1 formed by joining a reinforcing frame 3 of a mask body 2 to be bonded via a metal layer,
A first patterning step of providing a primary pattern resist 14 having a resist body 14a on the surface of the matrix 10;
First electroforming, in which an electrodeposited metal is electroformed on a mother die 10 using a primary pattern resist 14, and a plurality of primary electrodeposition layers 15 corresponding to the mask body 2 are formed on the mother die 10 at predetermined positions. Process,
A frame body arranging step of arranging the frame body 3 on the mother die 10 while aligning so that the primary electrodeposition layer 15 corresponding to the opening 3a is located in each opening 3a of the frame body 3;
A metal layer is formed by electroforming so as to cover the surface of the frame 3 and the outer peripheral edge 4 a of the primary electrodeposition layer 15, that is, the outer peripheral edge 4 a surface of the pattern formation region 4 of the mask body 2, and the metal A second electroforming step in which the primary electrodeposition layer 15 and the frame body 3 are joined together in a single and separated manner through layers,
A method for manufacturing a vapor deposition mask, comprising: a peeling step of integrally peeling the primary electrodeposition layer 15, the frame 3, and the metal layer from the matrix 10.

On the surface of the primary electrodeposited layers 15 formed on the mother die 10 includes a more Engineering you a resist material 18a covering the pattern formation region 4,
The method for manufacturing a vapor deposition mask according to claim 8 or 9, wherein in the second electroforming step, a metal layer is formed by electroforming using a resist body 18a .

Forming a photoresist layer 16 for forming a resist body 18a covering the pattern formation region 4 on the surface of the primary electrodeposition layer 15 formed on the matrix 10;
In the frame body arranging step, the frame body 3 is temporarily fixed on the mother die 10 by using the adhesiveness of the unexposed photoresist layer 16b.
The manufacturing method of the vapor deposition mask of Claim 8 or 9 or 10 which is made to perform a 2nd electroforming process in this temporarily fixed state .

In the first electroforming step, a large number of through holes 21 are formed in the outer peripheral edge 4a of the primary electrodeposition layer 15 corresponding to the mask body 2.
The method for manufacturing a vapor deposition mask according to claim 8, 9, 10, or 11, wherein a metal layer is formed so as to fill the through hole 21 in the second electroforming process .

Prior to the second electroforming step, activation treatment is performed on the primary electrodeposition layer 15 around the through-hole 21, or an adhesion surface such as strike nickel or matte nickel is formed. Item 13. A method for producing a vapor deposition mask according to Item 12.