JP2021123777A - Vapor deposition mask manufacturing method and manufacturing apparatus - Google Patents

Abstract

To provide a vapor deposition mask manufacturing method that reduces a detachment failure, and to provide a manufacturing apparatus.SOLUTION: A vapor deposition mask manufacturing method includes the steps of: disposing a mask frame via an adhesion layer on a first plating layer in which a vapor deposition pattern is formed; disposing a spacer on the mask frame; disposing a film so as to cover the first plating layer, the mask frame and the spacer; decompressing a space on a lower side of the film so that the film presses the spacer; and pressure-bonding the mask frame to the plating layer by pressing the mask frame with the spacer.SELECTED DRAWING: Figure 2E

Description

The present invention relates to a method and an apparatus for manufacturing a vapor deposition mask. In particular, the present invention relates to a method and an apparatus for manufacturing a vapor-deposited mask in which a thin-film mask body is provided on a mask frame.

Examples of the flat panel type display device include a liquid crystal display device and an organic EL (Electroluminescence) display device. These display devices are structures in which thin films containing various materials such as insulators, semiconductors, and conductors are laminated on a substrate. By appropriately patterning and connecting these thin films, the function as a display device is realized.

The methods for forming a thin film are roughly classified into a gas phase method, a liquid phase method, and a solid phase method. The gas phase method is classified into a physical gas phase method and a chemical gas phase method. The thin-film deposition method is known as a typical example of the physical vapor phase method. The simplest vapor deposition method is the vacuum vapor deposition method. In the vacuum vapor deposition method, a material is heated under a high vacuum to sublimate or evaporate the material to generate vapor of the material (hereinafter, these are collectively referred to as vaporization). In the region for depositing this material (hereinafter referred to as the vapor deposition region), the vaporized material is solidified and deposited to obtain a thin film of the material. A thin film is selectively formed with respect to the vapor deposition region, and vacuum deposition is performed using a mask (deposited mask) in order to prevent the material from depositing in the other regions (hereinafter referred to as non-deposited regions) (hereinafter, vacuum deposition mask). See Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2009-87840 Japanese Unexamined Patent Publication No. 2013-209710

In the vapor deposition mask, a mask frame for fixing the mask body is joined to the mask body on which the vapor deposition pattern is formed. If the joint between the mask body and the mask frame is not uniform, a joint portion where stress is concentrated is formed, and the mask body is easily peeled off from the mask frame at that portion. In particular, in the thin-film deposition step, the temperature of the thin-film deposition mask rises due to the radiant heat from the thin-film deposition apparatus. There has been a demand for a thin-film mask in which the mask body and the mask frame are uniformly bonded.

In view of the above problems, one of the problems of the present invention is to provide a method for manufacturing a vapor-deposited mask in which peeling defects are reduced. Another object of the present invention is to provide a manufacturing apparatus used in a method for manufacturing a vapor deposition mask in which peeling defects are reduced.

In the method for manufacturing a vapor deposition mask according to an embodiment of the present invention, a mask frame is arranged on a first plating layer on which a vapor deposition pattern is formed via an adhesive layer, and a spacer is arranged on the mask frame. The mask is placed by arranging the film so as to cover the first plating layer, the mask frame, and the spacer, depressurizing the space under the film so that the film presses the spacer, and the spacer presses the mask frame. The frame and the plating layer are crimped.

The apparatus for manufacturing a vapor deposition mask according to an embodiment of the present invention has a stage on which an object including a mask frame is installed, a spacer located above the stage, a spacer in contact with the mask frame, and a spacer located above the spacer. A film to be pressed and a film fixing portion for fixing the film in close contact with the stage are included, and the stage includes a groove portion and an exhaust port provided in the groove portion.

It is a top view of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing of the manufacturing apparatus of the vapor deposition mask which concerns on one Embodiment of this invention. It is a figure which shows the usage mode of the manufacturing apparatus of the vapor deposition mask which concerns on one Embodiment of this invention. It is a top view of the stage of the manufacturing apparatus of the vapor deposition mask which concerns on one Embodiment of this invention. It is a figure which shows the usage mode of the manufacturing apparatus of the vapor deposition mask which concerns on one Embodiment of this invention. It is an exploded perspective view of the spacer of the manufacturing apparatus of the vapor deposition mask which concerns on one Embodiment of this invention. It is sectional drawing of the spacer of the manufacturing apparatus 20 of the vapor deposition mask 10 which concerns on one Embodiment of this invention. It is sectional drawing of the spacer of the manufacturing apparatus 20 of the vapor deposition mask 10 which concerns on one Embodiment of this invention.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in various aspects without departing from the gist thereof, and is not construed as being limited to the description contents of the embodiments illustrated below.

In order to clarify the explanation, the drawings may be schematically represented by the width, thickness, shape, etc. of each part as compared with the actual embodiment. However, the examples shown in the drawings are merely examples, and the interpretation of the present invention is not limited unless the illustrated embodiment is specifically described. In the present specification and each figure, the same components as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present invention, when a plurality of films are formed by etching or irradiating a certain film with light, the plurality of films may have different functions and roles. However, these plurality of films are derived from films formed as the same layer in the same process, and have the same layer structure and the same material. Therefore, these multiple films are defined as existing in the same layer.

In the present specification and the scope of patent claims, when expressing an embodiment in which another structure is arranged on one structure, when the term "above" is simply used, the structure is specified unless otherwise specified. When another structure is placed directly above the structure so as to be in contact with the body, and when another structure is placed above one structure via another structure. Defined to include both.

<First Embodiment>
The configuration of the vapor deposition mask 10 according to the embodiment of the present invention will be described with reference to FIGS. 1A and 1B.

FIG. 1A is a plan view of the vapor deposition mask 10 according to the embodiment of the present invention. Further, FIG. 1B is a cross-sectional view of the vapor deposition mask 10 according to the embodiment of the present invention. Specifically, FIG. 1B is a cross-sectional view of the vapor deposition mask 10 cut along the line AA'shown in FIG.

The vapor deposition mask 10 includes a mask body 110, a mask frame 120, and a connecting member 130. The mask body 110 is connected to the mask frame 120 via a connecting member 130.

The mask frame 120 has an opening, and the mask body 110 is provided so as to overlap the opening of the mask frame 120. In FIG. 1A, the mask frame 120 has 12 openings, and the mask main body 110 is provided so as to overlap each of the openings. The number of openings provided in the mask frame 120 is not limited to this. The number of openings provided in the mask frame 120 can be appropriately determined according to the size of the substrate to be vapor-deposited and the vapor deposition pattern.

The mask body 110 is provided with a plurality of openings 113 penetrating the mask body 110. Hereinafter, for convenience, the region in which the opening 113 is provided in the mask main body 110 will be referred to as an opening region 111, and the region in which the mask main body is not provided with the opening 113 will be referred to as a non-opening region 112. The boundary between the open region 111 and the non-open region 112 is not always clear, but at least the non-open region 112 can be distinguished by the fact that the non-open region 112 is not provided with the opening 113.

At the time of vapor deposition, the vapor deposition mask 10 and the substrate to be vapor-deposited are aligned so that the vapor-deposited region and the opening region 111 of the substrate to be vapor-deposited overlap, and the non-deposited region and the non-opened region 112 of the substrate to be vapor-deposited overlap. The vapor of the vapor-deposited material passes through the opening 113 of the opening region 111, and the vapor-deposited material is deposited on the vapor-deposited region of the substrate to be vapor-deposited.

When the substrate to be vapor-deposited is the substrate of the display device, the openings 113 of the opening region 111 can be arranged corresponding to the arrangement of the pixels of the display device. The arrangement of the openings 113 is, for example, a matrix.

The mask frame 120 can support the mask body 110. As described above, the mask frame 120 includes an opening, but in other words, the mask frame 120 can also include a frame portion located on the outside and a crosspiece portion located on the inside. The crosspiece can give rigidity to the frame and prevent the frame from warping. The crosspiece may be formed by combining a plurality of members. For example, one member of the crosspiece extends from one side of the frame to the other opposite side. Further, it is preferable that the members of the crosspieces are provided in the vertical direction (short side direction of the vapor deposition mask 10) and the horizontal direction (long side direction of the vapor deposition mask 10). That is, it is preferable that the crosspiece has a well girder structure in which a member extending in the vertical direction and a member extending in the horizontal direction intersect. However, the structure of the crosspiece is not limited to this. The members of the crosspiece may be provided only in the vertical direction or the horizontal direction. Further, the width of the frame portion and the width of the crosspiece (or the member of the crosspiece) can be appropriately determined according to the size of the vapor deposition mask 10. In order to make the area of the vapor deposition pattern as wide as possible, it is preferable that the width of the crosspiece is smaller than the width of the frame.

As shown in FIG. 1B, the connecting member 130 is provided in the gap between the opening of the mask main body 110 and the mask frame 120, and is in contact with the side surface of the mask main body 110 and the side surface of the opening of the mask frame 120. That is, in a plan view, the mask body 110 and the mask frame 120 do not overlap. It should be noted that the mask body 110 and the mask frame 120 can be superimposed on each other in a plan view.

Since the connecting member 130 may connect the mask body 110 and the mask frame 120, the connecting member 130 does not have to be provided on the entire side surface of the opening of the mask frame 120. The connecting member 130 may be provided on at least a part of the side surface of the opening of the mask frame 120. On the other hand, the thickness of the mask body 110 is very small compared to the thickness of the mask frame. For example, the thickness of the mask body 110 is 1 μm or more and 20 μm or less, and the thickness of the mask frame 120 is 0.5 mm or more and 2.0 mm or less. Therefore, in order to increase the adhesive strength between the mask body 110 and the mask frame 120, it is preferable that the connecting member 130 is provided on the entire side surface of the mask body 110.

Further, the connecting member 130 may be formed in a stepped shape between the mask main body 110 and the mask frame 120.

According to the vapor deposition mask 10 according to the present embodiment, the mask main body 110 and the mask frame 120 are connected via a connecting member 130. Therefore, by uniformly forming the connecting member 130 in the 10 planes of the thin-film deposition mask, the bonding strength between the mask main body 110 and the mask frame 120 can be made uniform. Therefore, poor peeling between the mask body 110 and the mask frame 120 is reduced.

<Second Embodiment>
A method for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention will be described with reference to FIGS. 2A to 2G.

2A to 2G are cross-sectional views showing a method of manufacturing the vapor deposition mask 10 according to the embodiment of the present invention.

First, as shown in FIG. 2A, a metal layer 220 is formed on the support substrate 210, and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220.

The support substrate 210 is a substrate that supports each layer in the manufacturing process of the vapor deposition mask 10. Therefore, the support substrate 210 is preferably a rigid substrate. Further, the vapor deposition mask 10 preferably has a small coefficient of thermal expansion. In the manufacturing process of the vapor deposition mask 10, the support substrate 210 is heated. When the support substrate 210 expands or contracts due to the heat treatment, the vapor deposition pattern of the vapor deposition mask 10 is displaced. Therefore, in order to stabilize the manufacturing process of the vapor deposition mask 10, the support substrate 210 is preferably a rigid substrate having a small coefficient of thermal expansion. The material of the support substrate 210 is, for example, stainless steel (SUS304 or SUS430, etc.), 42 alloy, Invar, Super Invar, Stainless Invar, or the like.

The metal layer 220 can function as a base metal for electroplating (or electrolytic plating) described later. The material of the metal layer 220 is, for example, nickel (Ni) or a nickel alloy. The metal layer 220 can be formed by sputtering or the like.

The vapor deposition mask 10 can also be manufactured by using electroless plating instead of electroforming. In this case, an insulating layer may be used instead of the metal layer 220.

The photoresist layer 230 can function as a master mold for electrocasting, which will be described later. As an example, the photoresist layer 230 is formed by arranging one or more photosensitive dry film resists on the metal layer 220 and heat-bonding so as to have a predetermined film thickness. The photosensitive dry film resist may be either a positive type or a negative type. In the following, the photosensitive dry film will be described as being a negative type.

The photoresist layer 230 has a predetermined pattern for forming the vapor deposition pattern of the vapor deposition mask 10. A predetermined pattern of the photoresist layer 230 can be formed by photolithography. That is, a predetermined pattern can be formed by bringing a mask into close contact with a dry film resist, exposing the dry film by irradiating it with ultraviolet rays, and dissolving and removing an unexposed portion.

Next, as shown in FIG. 2B, the first plating layer 240 is formed using the photoresist layer 230 as a mask. The first plating layer 240 corresponds to the mask body 110 of the vapor deposition mask 10. The first plating layer 240 can be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are placed in an electric casting tank built under predetermined conditions, and the surface of the metal layer 220 not covered by the photoresist layer 230 to the height of the photoresist layer 230. Form a metal plating. The material of the first plating layer 240 is, for example, nickel (Ni) or nickel (Ni) -cobalt (Co) alloy.

Next, as shown in FIG. 2C, the photoresist layer 230 is peeled off (removed). The photoresist layer 230 can be peeled off with, for example, an amine-based stripping solution. By peeling off the photoresist layer 230, a first plating layer 240 having a vapor deposition pattern is formed.

Before peeling off the photoresist layer 230, the first plating layer 240 formed by electrocasting may be polished. By polishing the first plating layer 240, the surface of the first plating layer 240 can be flattened.

Next, as shown in FIG. 2D, the mask frame 260 provided with the adhesive layer 250 is arranged on the first plating layer 240. That is, the first plating layer 240 and the mask frame 260 are adhered to each other via the adhesive layer 250. In the process here, it is not necessary to completely bond the first plating layer 240 and the mask frame 260. Therefore, the adhesive layer 250 does not have to be completely cured.

The mask frame 260 has an opening. The mask frame 260 is aligned and adhered so as not to overlap the opening of the vapor deposition pattern of the first plating layer 240. In other words, the opening of the mask frame 260 overlaps with the opening of the vapor deposition pattern of the first plating layer 240.

Since the adhesive layer 250 is removed in a later step, it is preferable that the adhesive layer 250 is a material that is easy to remove. As the material of the adhesive layer 250, for example, vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, cyanoacrylate resin, acrylic resin and the like can be used. Further, as the material of the adhesive layer 250, a dry film resist can also be used. When a dry film resist is used as the material of the adhesive layer 250, the dry film resist may be exposed weakly to such an extent that weak adhesiveness remains on the surface thereof. By exposing the dry film resist, it becomes easy to remove the dry film resist in a later step.

In the subsequent steps, in order to protect the vapor deposition pattern of the first plating layer 240 (for example, to protect the openings of the vapor deposition pattern from being blocked by particles generated by the process), the first plating layer 240 A dry film resist may be provided in the region of the vapor deposition pattern.

Next, the spacer 270 is arranged on the mask frame 260. Further, the film 280 is arranged above the spacer 270 so as to cover the support substrate 210, the metal layer 220, the first plating layer 240, the adhesive layer 250, the mask frame 260, and the spacer 270. Subsequently, the air between the support substrate 210 and the film 280 is exhausted (vacuum exhaust) to reduce the pressure on the lower side of the film 280. That is, the space on the lower side of the film 280 is made a negative pressure with respect to the space on the upper side of the film 280. The pressure difference between the upper side and the lower side of the film 280 attracts the film 280 to the support substrate 210 side (FIG. 2E). When the pressure on the lower side of the film 280 is further reduced, the film 280 presses the spacer 270. Under the pressure from the spacer 270, the mask frame 260 adheres more strongly to the first plating layer 240 via the adhesive layer 250. This process is a so-called vacuum crimping process.

The spacer 270 is arranged on the crosspiece of the mask frame 260. By arranging the spacer 270 on the crosspiece of the mask frame 260, the spacer 270 can uniformly apply a force to the mask frame 260. Further, the spacer 270 may be arranged on all of the plurality of crosspieces of the mask frame 260, or may be arranged on a part of the plurality of crosspieces. Further, the spacer 270 can be arranged in the frame portion of the mask frame 260.

The cross-sectional shape of the spacer 270 is circular. When the cross-sectional shape of the spacer 270 is circular, the contact area between the mask frame 260 and the spacer 270 becomes small, so that a force can be uniformly applied to the mask frame 260 at the time of vacuum pressure bonding. However, the structure of the cross-sectional shape of the spacer 270 is not limited to this. The cross-sectional shape of the spacer 270 may be, for example, an ellipse or a polygon.

The width of the spacer 270 is preferably smaller than the width of the crosspiece of the mask frame 260. If the width of the spacer 270 is smaller than the width of the crosspiece of the mask frame 260, the film 280 is pressed against the side surface of the crosspiece of the mask frame 260 by vacuum pressure bonding, so that the position of the spacer 270 on the crosspiece of the mask frame 260 is positioned. It will be adjusted automatically. Therefore, the force can be uniformly applied to the mask frame 260 at the time of vacuum crimping. However, the width of the spacer 270 is not limited to this. The width of the spacer 270 may be larger than the width of the crosspiece of the mask frame.

The material of the spacer 270 may be an organic resin such as polyethylene, polystyrene, polypropylene, polyvinyl chloride, or polyethylene terephthalate, or may be a metal. The material of the spacer 270 is preferably an organic resin that is easy to mold and is lightweight.

The degree of vacuum on the lower side of the film 280 is −50 kPa or less, preferably −70 kPa or less, and more preferably −90 kPa at a gauge pressure where the atmospheric pressure is 0 kPa.

If the spacer 270 is not provided, the mask frame 260 and the film 280 may come into close contact with each other in the vicinity of the exhaust port to block the exhaust path before the vacuum exhaust is completed, and the degree of vacuum may not decrease. In that case, the degree of vacuum will be different within the 260 planes of the mask frame, and as a result, the pressure difference will vary. Therefore, the force with which the film 280 presses the mask frame 260 varies, and the adhesion between the first plating layer 240 and the mask frame 260 becomes non-uniform.

On the other hand, when the spacer 270 is provided, a gap is generated by the spacer 270 in the upper part of the mask frame 260. Therefore, it is possible to prevent the mask frame 260 and the film 280 from coming into close contact with each other. Therefore, since the degree of vacuum on the lower side of the film 280 becomes uniform, the first plating layer 240 and the mask frame 260 are uniformly adhered to each other.

That is, the width of the surface where the spacer 270 contacts the mask frame 260 is preferably smaller than the width of the spacer 270. With such a shape, the film 280 does not adhere to the vicinity of the hem of the spacer 270, and a gap can be left.

After vacuum crimping, the spacer 270 and film 280 are removed.

Next, as shown in FIG. 2F, a second plating layer 290 connecting the first plating layer 240 and the mask frame 260 is formed. The second plating layer 290 can be formed by electroforming the metal layer 220 or the first plating layer 240 by energizing the metal layer 220 or the first plating layer 240. The second plating layer 290 corresponds to the connecting member 130 of the vapor deposition mask 10. The second plating layer 290 is in contact with the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Specifically, the second plating layer 290 is formed so as to be in contact with a part of the groove portion of the first plating layer 240 and the side surface of the mask frame 260 (the frame portion of the vapor deposition mask 10 and the side surface of the crosspiece portion).

The second plating layer 290 can be formed in the same manner as the first plating layer 240.

The second plating layer 290 is not provided in the region corresponding to the opening region 111 of the first plating layer 240. For example, a dry film resist can be formed on the region corresponding to the opening region 111 of the first plating layer 240 to prevent the region corresponding to the opening region 111 of the first plating layer 240 from being plated. The dry film resist can be peeled off after the formation of the second plating layer 290.

Next, as shown in FIG. 2G, by peeling off the support substrate 210, the metal layer 220, and the adhesive layer 250, the vapor deposition mask 10 in which the mask body 110 and the mask frame 120 are connected by the connecting member 130 is manufactured. Will be done. By peeling off the adhesive layer 250, a part of the first plating layer 240 (the part between the grooves of the first plating layer 240 superimposed on the mask frame 260) that was adhered to the adhesive layer 250 is also peeled off. That is, as shown in FIG. 2G, the mask body 110 is not provided below the mask frame 120. The support substrate 210, the metal layer 220, and the adhesive layer 250 may be peeled off from all the substrates and layers at once, or each of the substrates and layers may be peeled off individually. Since the mask body 110 has a much thinner film thickness than the support substrate 210, deformation stress is likely to be unilaterally applied to the mask body 110 side when the mask body is peeled off, which may lead to damage to the mask body 110. .. Therefore, the stress on the mask body 110 can be reduced by first peeling between the support substrate 210 and the metal layer 220 and then peeling between the metal layer 220 and the mask body 110.

According to the method for manufacturing the vapor deposition mask 10 according to the present embodiment, a spacer 270 is provided between the mask frame 260 and the film 280 to perform vacuum pressure bonding. The film 280 does not press the mask frame 260 directly, but presses the mask frame 260 via the spacer 270. Therefore, pressure can always be applied from the same position, that is, from the upper surface of the mask frame 260. Further, in vacuum pressure bonding, the gap is increased by the spacer 270 arranged between the mask frame 260 and the film 280, so that the mask frame 260 and the film 280 can be prevented from coming into close contact with each other. Therefore, vacuum exhaust is facilitated at any place within the 260 surface of the mask frame, and the degree of vacuum on the lower side of the film 280 is kept constant.

From the above, since the pressure on the mask frame 260 is made uniform, the bonding strength of the second plating layer 290 can be made uniform. Therefore, since the bonding strength of the connecting member 130 connecting the mask body 110 and the mask frame 120 is made uniform, it is possible to manufacture the vapor deposition mask 10 in which the peeling failure between the mask body 110 and the mask frame 120 is reduced. ..

<Third Embodiment>
The manufacturing apparatus 20 of the vapor deposition mask 10 according to the embodiment of the present invention will be described with reference to FIGS. 3A to 4B.

FIG. 3A is a schematic cross-sectional view of the manufacturing apparatus 20 for the vapor deposition mask 10 according to the embodiment of the present invention. Specifically, FIG. 3A is a schematic cross-sectional view of the apparatus used in the vacuum crimping described in the second embodiment.

As shown in FIG. 3A, the manufacturing apparatus 20 includes a stage 310, a spacer 320, a film 330, and a film fixing portion 340. The spacer 320, the film 330, and the film fixing portion 340 are provided above the stage 310. The film 330 is fixed to the film fixing portion 340.

The object to be vacuum-bonded (object to be vacuum-bonded) is arranged on the stage 310. Therefore, the surface of the stage 310 is preferably flat. A groove 311 is provided on the surface of the stage 310. Further, the groove portion 311 is provided with an exhaust port 312 for performing vacuum exhaust. A vacuum pump (not shown) is connected to the exhaust port 312 via a pipe, and vacuum exhaust can be performed from the exhaust port.

The object is, for example, a structure including a support substrate 210, a metal layer 220, a first plating layer 240, an adhesive layer 250, and a mask frame 260, as shown in FIG. 2D described in the second embodiment. In the following, for convenience, a structure including the mask frame 260 may be described as an object.

FIG. 3B is a schematic view showing a usage mode of the vapor deposition mask 10 manufacturing apparatus 20 according to the embodiment of the present invention.

As shown in FIG. 3B, the object 350 including the mask frame 260 is arranged on the stage 310, and the spacer 320 is arranged so as to overlap the frame portion and the crosspiece portion of the mask frame 260 of the object 350. Next, the film fixing portion 340 is moved to the stage 310 side, and the space where the object 350 and the spacer are arranged is sealed by the stage 310, the film 330, and the film fixing portion 340. After that, the pressure in the space is reduced through the exhaust port 312.

FIG. 3C is a schematic plan view of the stage 310 of the manufacturing apparatus 20 for the vapor deposition mask 10 according to the embodiment of the present invention.

As shown in FIG. 3C, the groove portion 311 is provided in an annular shape along the outer circumference of the stage 310. It is preferable that the object is arranged inside the groove 311 and does not overlap with the groove 311. If the groove 311 is covered with an object, it becomes difficult to evacuate the vacuum. Therefore, it is preferable that the inner diameter of the groove 311 is larger than that of the object.

As shown in FIG. 3C, the exhaust ports 312 are provided at the four corners of the groove 311. However, the configuration of the exhaust port 312 is not limited to this. The exhaust port 312 can also be provided between the four corners of the groove 311. Further, the number of exhaust ports 312 is not limited to four, and can be appropriately provided according to the size of the stage.

The spacer 320 is located above the stage 310, and when the object is placed on the stage 310, the distance between the spacer 320 and the stage 310 is controlled so as to come into contact with the object. Alignment may be performed in the contact between the object and the spacer 320. The alignment can be adjusted so that a part of the shape of the object and the shape of the spacer 320 are aligned. The alignment can also be adjusted using a marker. The alignment can be performed by analyzing the image taken by the camera.

FIG. 4A is a diagram showing a usage mode of the manufacturing apparatus 20 for the vapor deposition mask 10 according to the embodiment of the present invention.

An object including the mask frame 260 is arranged on the stage 310, and the spacer 320 is arranged on the mask frame 260 so as to be in contact with the mask frame 260. The spacer 320 has a well girder structure. That is, the first rod body 320-1 extending in the horizontal direction and the second rod body 320-2 extending in the vertical direction intersect. The first rod body 320-1 and the second rod body 320-2 overlap with the crosspiece of the mask frame 260. Further, each end of the first rod body 320-1 and the second rod body 320-2 overlaps with the frame portion of the mask frame 260. It is preferable that each end of the first rod 320-1 and the second rod 320-2 is located inside the end of the mask frame 260. When each end of the first rod 320-1 and the second rod 320-2 protrudes from the end of the mask frame 260, each of the first rod 320-1 and the second rod 320-2 The end of the is not fixed. If vacuum crimping is performed in this state, the central portion of the spacer 320 rises (the central portion of the spacer 320 separates from the mask frame 260), so that it becomes impossible to uniformly apply pressure to the object. Therefore, each end of the first rod 320-1 and the second rod 320-2 is located inside the end of the mask frame 260 so that the end of the spacer 320 is fixed, and the mask is masked. It is preferably in contact with the frame 260.

It is preferable that each of the first rod body 320-1 and the second rod body is linearly extended. Each of the first rod body 320-1 and the second rod body can be stretched so as to include a curved portion, but in that case, it is preferable that the curved portion does not protrude outward from the crosspiece portion of the mask frame 260. ..

FIG. 4B is an exploded perspective view of the spacer 320 of the vapor deposition mask manufacturing apparatus 20 according to the embodiment of the present invention. Specifically, FIG. 4B shows a portion where the first rod body 320-1 and the second rod body 320-2 intersect.

As shown in FIG. 4B, at the intersection of the first rod body 320-1 and the second rod body 320-2, the first rod body 320-1 includes the first notch 321-1 and the second rod. Body 320-2 includes a second notch 321-2. Further, the first notch 321-1 and the second notch 321-2 are fitted to each other.

The cross-sectional shape of each of the first rod body 320-1 and the second rod body 320-2 is circular. If the cross-sectional shape of each of the first rod body 320-1 and the second rod body 320-2 is circular, the contact area between the mask frame 260 and the spacer 320 becomes small, so that the mask is uniformly masked during vacuum pressure bonding. A force can be applied to the frame 260. However, the configuration of each cross-sectional shape of the first rod body 320-1 and the second rod body 320-2 is not limited to this. The cross-sectional shape of each of the first rod body 320-1 and the second rod body 320-2 may be, for example, an ellipse or a polygon. The cross-sectional shape of the first rod body 320-1 and the cross-sectional shape of the second rod body 320-2 may be different.

The spacer 320 does not have to be separated into the first rod body 320-1 and the second rod body 320-2. In the spacer 320, the first rod body 320-1 and the second rod body 320-2 may be integrated.

When the spacer 320 comes into contact with the object, the distance between the film 330 and the stage 310 is controlled so that the film 330 comes into contact with the spacer 320. Further, the film fixing portion 340 fixes the film 330 so that the outer periphery of the film 330 is brought into close contact with the stage 310 and a closed space is provided between the stage 310 and the film 330. In this state, if vacuum exhaust is performed from the exhaust port 312, the degree of vacuum in the closed space decreases. That is, the closed space is decompressed. The degree of vacuum in the closed space is −50 kPa or less, preferably −70 kPa or less, and more preferably −90 kPa at a gauge pressure where the atmospheric pressure is 0 kPa.

After vacuum crimping, the degree of vacuum in the closed space is returned to atmospheric pressure, and the object is taken out.

According to the manufacturing apparatus 20 of the vapor deposition mask 10 according to the present embodiment, the film 330 can be vacuum-bonded to the object through the spacer 320. That is, the film 330 does not directly press the object, but presses the object through the spacer 320. When the object includes the mask frame 260, a uniform pressure can be applied to the upper surface of the mask frame 260. Further, in vacuum crimping, the spacer 320 arranged between the mask frame 260 and the film 330 increases the gap, so that the mask frame 260 and the film 330 can be prevented from coming into close contact with each other. Therefore, the manufacturing apparatus 20 facilitates vacuum exhaust at any place in the closed space on the stage 310, and can keep the degree of vacuum in the closed space constant during vacuum crimping. Therefore, since the bonding strength of the connecting member 130 connecting the mask body 110 and the mask frame 120 is made uniform, it is possible to manufacture the vapor deposition mask 10 in which the peeling failure between the mask body 110 and the mask frame 120 is reduced. ..

<Modification example>
An example of modification of the shape of the spacer 320 will be described with reference to FIGS. 5A and 5B.

5A and 5B are cross-sectional views of a spacer 320A and a spacer 320B of the vapor deposition mask 10 manufacturing apparatus 20 according to the embodiment of the present invention, respectively. In FIGS. 5A and 5B, the spacer 320A and the spacer 320B are arranged on the mask frame 260.

One of the functions of the spacer 320 described in the present embodiment is to secure an exhaust flow path for satisfactorily performing vacuum exhaust when depressurizing the space between the film and the object. As described above, the cross-sectional shape of the spacer 320 is circular, oval, or polygonal, and the width of the contact surface with the object is made smaller than the maximum width of the spacer 320 to secure the exhaust flow path. can do. However, the cross-sectional shape of the spacer 320 is not limited to this, and may have a cross-sectional shape such as the spacer 320A shown in FIG. 5A or the spacer 320B shown in FIG. 5B.

In FIGS. 5A and 5B, the spacer 320A and the spacer 320B have a width W1 on the contact surface with the object, a maximum width W2 at a portion away from the contact surface, and a portion between the portion having the maximum width W2 and the contact surface. It has a width W3 smaller than the maximum width W1. When the pressure is reduced, the film 330 comes into contact with the top of the spacer 320, the portion having the maximum width W2, and the shape of the object. However, if a portion having a width W3 (recessed portion) exists between the contact surface and the top of the spacer 320, a gap is formed in the portion having the width W3 and can function as an exhaust flow path. Further, it is preferable that the width W1 of the contact surface is smaller than the maximum width W2.

When the cross-sectional shape is a circular spacer 320, strictly speaking, it should be expressed as a contact point rather than a contact surface, but the relationship between the portion having the maximum width W2 and the portion having the width W3 is the spacer 320A. And spacer 320B. However, considering the uniform pressing of the spacer 320 on the object, it is preferable to determine the cross-sectional shape of the spacer 320 so that the contact portion has a contact surface having a certain area.

Each of the above-described embodiments of the present invention can be appropriately combined and implemented as long as they do not contradict each other. In addition, those skilled in the art who have appropriately added, deleted, or changed the design of components based on each embodiment, or those who have added, omitted, or changed the conditions of the process also have the gist of the present invention. As long as it is included in the scope of the present invention.

Of course, other effects different from those brought about by the aspects of each of the above-described embodiments, which are clear from the description of the present specification or which can be easily predicted by those skilled in the art, will naturally occur. It is understood that it is brought about by the present invention.

10: Vapor deposition mask, 20: Manufacturing equipment, 110: Mask body, 111: Open area, 112: Non-open area, 113: Open, 120: Mask frame, 130: Connecting member, 210: Support substrate, 220: Metal layer, 230: photoresist layer, 240: first plating layer, 250: adhesive layer, 260: mask frame, 270: spacer, 280: film, 290: second plating layer, 310: stage, 311: groove, 312: exhaust port , 320, 320A, 320B: Spacer, 320-1: 1st rod, 320-2: 2nd rod, 330: Film, 340: Film fixing part, 350: Object

Claims (16)

A mask frame is placed via an adhesive layer on the first plating layer on which the vapor deposition pattern is formed.
A spacer is placed on the mask frame,
A film is arranged so as to cover the first plating layer, the mask frame, and the spacer.
The space below the film is depressurized so that the film presses against the spacer.
A method for manufacturing a vapor-deposited mask in which the mask frame and the first plating layer are pressure-bonded by the spacer pressing the mask frame. The spacer has a maximum width between a contact surface with the mask frame and a portion farthest from the mask frame.
The method for producing a thin-film deposition mask according to claim 1, wherein the contact surface and the portion having the maximum width have a width smaller than the maximum width. The spacer includes a first rod body including a first notch and a second rod body including a second notch intersecting the first rod body.
The method for manufacturing a thin-film deposition mask according to claim 1, wherein the first notch and the second notch are fitted to each other. The method for manufacturing a vapor deposition mask according to claim 3, wherein the cross-sectional shapes of the first rod and the second rod are circular. The method for producing a vapor-deposited mask according to claim 3 or 4, wherein the width of each of the first rod and the second rod is smaller than the width of the mask frame. The method for producing a vapor-deposited mask according to any one of claims 3 to 5, wherein each of the materials of the first rod and the second rod is an organic resin. The method for manufacturing a vapor deposition mask according to claim 1, wherein the spacer has a grid structure. The method for manufacturing a vapor-deposited mask according to any one of claims 1 to 7, wherein the degree of vacuum when the mask frame and the first plating layer are crimped is −90 kPa or less at a gauge pressure. A stage on which an object including a mask frame is installed, a spacer located above the stage and in contact with the mask frame, and a spacer.
A film located above the spacer and pressing the spacer,
Including a film fixing portion for fixing the film,
The stage is a manufacturing apparatus including a groove portion and an exhaust port provided in the groove portion. The spacer has a maximum width between a contact surface with the mask frame and a portion farthest from the mask frame.
The manufacturing apparatus according to claim 9, wherein a width smaller than the maximum width is provided between the contact surface and the portion having the maximum width. The spacer includes a first rod body including a first notch and a second rod body including a second notch intersecting the first rod body.
The manufacturing apparatus according to claim 9, wherein the first notch and the second notch are fitted to each other. The manufacturing apparatus according to claim 11, wherein each of the first rod body and the second rod body has a circular cross-sectional shape. The manufacturing apparatus according to claim 11, wherein the width of each of the first rod body and the second rod body is smaller than the width of the mask frame. The manufacturing apparatus according to any one of claims 11 to 13, wherein the materials of the first rod and the second rod are organic resins. The apparatus for manufacturing a vapor deposition mask according to claim 9, wherein the spacer has a grid structure. 15. The apparatus for manufacturing a vapor deposition mask according to any one of the following items.

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