CN113308667A

CN113308667A - Method and apparatus for manufacturing vapor deposition mask

Info

Publication number: CN113308667A
Application number: CN202110124821.6A
Authority: CN
Inventors: 山田哲行
Original assignee: Japan Display Inc
Current assignee: Japan Display Inc
Priority date: 2020-02-07
Filing date: 2021-01-29
Publication date: 2021-08-27
Anticipated expiration: 2041-01-29
Also published as: KR102533404B1; JP7445449B2; CN113308667B; KR20210101139A; JP2021123777A

Abstract

The invention provides a method and an apparatus for manufacturing a vapor deposition mask capable of reducing peeling failure. In a method for manufacturing a vapor deposition mask, a mask frame is arranged on a first plating layer on which a vapor deposition pattern is formed via an adhesive layer, a spacer is arranged on the mask frame, a film is arranged so as to cover the first plating layer, the mask frame, and the spacer, a space below the film is decompressed so that the film presses the spacer, and the mask frame is pressed by the spacer, whereby the mask frame and the plating layer are pressed together. According to the present invention, peeling failure can be reduced.

Description

Method and apparatus for manufacturing vapor deposition mask

Technical Field

The present invention relates to a method and an apparatus for manufacturing a vapor deposition mask. In particular, the present invention relates to a method and an apparatus for manufacturing a vapor deposition mask having a film-like mask body in a mask frame.

Background

Examples of the flat panel display device include a liquid crystal display device and an organic el (electroluminescence) display device. These display devices are structured by laminating thin films made of a plurality of materials such as an insulator, a semiconductor, and a conductor on a substrate. These thin films are appropriately patterned and connected to each other, thereby realizing a function as a display device.

Methods for forming a thin film are roughly classified into a gas phase method, a liquid phase method, and a solid phase method. In addition, the gas phase method is classified into a physical gas phase method and a chemical gas phase method. As a typical example of the physical vapor phase method, a vapor deposition method is known. The most convenient method among the vapor deposition methods is vacuum vapor deposition. The vacuum vapor deposition method heats a material under high vacuum to sublimate or evaporate the material, thereby generating vapor of the material (hereinafter, these are collectively referred to as vaporization). In a region for depositing the material (hereinafter, a vapor deposition region), the vaporized material is solidified and deposited, thereby obtaining a material film. In order to selectively form a film in a vapor deposition region, vacuum vapor deposition is performed using a mask (vapor deposition mask) so as not to deposit a material in other regions (hereinafter, non-vapor deposition regions) (see patent documents 1 and 2).

Patent technical literature

Patent document

Patent document 1: japanese patent laid-open publication No. 2009-87840.

Patent document 2: japanese patent laid-open publication No. 2013-209710.

Disclosure of Invention

The vapor deposition mask has a mask frame for fixing a mask body, to which a vapor deposition pattern is formed. If the bonding of the mask body and the mask frame is uneven, a stress-concentrated bonding portion occurs at which the mask body is easily peeled off from the mask frame. In particular, in the vapor deposition step, the temperature of the vapor deposition mask is increased by radiant heat from the vapor deposition device, and therefore, a peeling failure is likely to occur in the vapor deposition mask that is not uniformly bonded, and the vapor deposition mask is difficult to repeat or use for a long period of time. An evaporation mask in which a mask body and a mask frame are uniformly joined is required.

In view of the above problems, an object of the present invention is to provide a method for manufacturing a vapor deposition mask that reduces peeling defects. Another object is to provide a manufacturing apparatus used in the method for manufacturing a vapor deposition mask with which peeling failure is reduced.

An embodiment of the present invention provides a method for manufacturing a vapor deposition mask, in which a mask frame is disposed on a first plating layer on which a vapor deposition pattern is formed via an adhesive layer, a spacer is disposed on the mask frame, a film is disposed so as to cover the first plating layer, the mask frame, and the spacer, a space below the film is decompressed so that the film presses the spacer, and the mask frame is pressed by the spacer, thereby pressing the mask frame and the plating layer together.

One embodiment of the present invention provides an apparatus for manufacturing a vapor deposition mask, including: a stage for mounting an object including a mask frame; a spacer located above the stage and contacting the mask frame; a film for pressing the spacer, which is located above the spacer; and a film fixing portion that fixes the film in close contact with the mounting table, the mounting table including a groove portion and an exhaust port provided in the groove portion.

According to the present invention, a method and an apparatus for manufacturing a vapor deposition mask that reduce peeling defects can be provided.

Drawings

Fig. 1A is a plan view of a vapor deposition mask according to an embodiment of the present invention.

Fig. 1B is a cross-sectional view of a vapor deposition mask according to an embodiment of the present invention.

Fig. 2A is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2B is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2C is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2D is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2E is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2F is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2G is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 3A is a schematic sectional view of an apparatus for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 3B is a diagram showing a usage mode of the vapor deposition mask manufacturing apparatus according to the embodiment of the present invention.

Fig. 3C is a schematic plan view of a mounting table of a vapor deposition mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 4A is a diagram showing a usage mode of a vapor deposition mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 4B is an exploded perspective view of a spacer in the vapor deposition mask manufacturing apparatus according to the embodiment of the present invention.

Fig. 5A is a sectional view of a spacer of the apparatus 20 for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention.

Fig. 5B is a sectional view of a spacer of the apparatus 20 for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention.

Description of reference numerals

10: vapor deposition mask, 20: manufacturing apparatus, 110: mask body, 111: open area, 112: non-open region, 113: opening, 120: mask frame, 130: connecting member, 210: support substrate, 220: metal layer, 230: photoresist layer, 240: first plating layer, 250: adhesive layer, 260: mask frame, 270: spacer, 280: film, 290: second plating layer, 310: mounting table, 311: groove portion, 312: exhaust port, 320A, 320B: spacer, 320-1: first bar, 320-2: second rod, 330: film, 340: membrane fixing part, 350: an object.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in various forms without departing from the gist thereof, and is not to be construed as being limited to the description of the embodiments illustrated below.

In the drawings, the width, thickness, shape, and the like of each portion are schematically shown in comparison with the actual embodiment in some cases for more clear explanation. However, the examples shown in the drawings are merely examples, and the present invention is not limited to the explanation as long as the mode shown in the drawings is not particularly described. In the present specification and the drawings, the same components as those described above are denoted by the same reference numerals in some cases, and detailed descriptions thereof are omitted as appropriate.

In the present invention, when a plurality of films are formed by etching or irradiating a certain film with light, the plurality of films may have different functions and actions. However, these plural films may be derived from films formed into the same layer by the same process, have the same layer structure and the same material. Therefore, these plural films are defined to exist in the same layer.

In the present specification and claims, when a scheme in which another structure is disposed on a certain structure is expressed, unless otherwise specified, the case where only "at … …" is described can be defined to include both a case where another structure is disposed directly above the certain structure so as to be in contact with the certain structure and a case where another structure is disposed above the certain structure with another structure interposed therebetween.

< first embodiment >

A structure of a vapor deposition mask 10 according to an embodiment of the present invention will be described with reference to fig. 1A and 1B.

Fig. 1A is a plan view of a vapor deposition mask 10 according to an embodiment of the present invention. Fig. 1B is a cross-sectional view of a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 1B is a cross-sectional view of the vapor deposition mask 10 taken along line a-a' shown in fig. 1.

The vapor deposition mask 10 includes a mask body 110, a mask frame 120, and a connection member 130. The mask body 110 is connected to the mask frame 120 via a connection member 130.

The mask frame 120 has an opening, and the mask body 110 is provided so as to overlap the opening of the mask frame 120. In fig. 1A, the mask frame 120 has 12 openings, and the mask body 110 is provided so as to overlap each opening. The number of openings provided in the mask frame 120 is not limited to this. The number of openings provided in the mask frame 120 can be determined as appropriate according to the size of the substrate to be vapor-deposited or the vapor deposition pattern.

The mask body 110 is provided with a plurality of openings 113 penetrating the mask body 110. Hereinafter, for convenience, a region in which the opening 113 is provided in the mask body 110 is referred to as an opening region 111, and a region in which the opening 113 is not provided in the mask body is referred to as a non-opening region 112. The boundary between the open region 111 and the non-open region 112 is not necessarily clear, but at least the non-open region 112 may be distinguished from the open region by the point where the opening 113 is not provided.

At the time of vapor deposition, the vapor deposition mask 10 and the vapor deposition substrate are aligned so that the vapor deposition region in the vapor deposition target substrate overlaps the opening region 111 and the non-vapor deposition region in the vapor deposition target substrate overlaps the non-opening region 112. The vapor of the vapor deposition material passes through the openings 113 of the opening region 111, and deposits the vapor deposition material on the vapor deposition region of the vapor deposition substrate.

When the deposition target substrate is a substrate of a display device, the openings 113 of the aperture region 111 can be arranged in accordance with the arrangement of pixels of the display device. The openings 113 are arranged in a matrix, for example.

The mask frame 120 can support the mask body 110. As described above, the mask frame 120 includes the opening, but in other words, the mask frame 120 may include a frame portion located on the outer side and a holder portion located on the inner side. The support portion imparts rigidity to the frame portion, and can prevent the frame portion from warping. The holder portion may be formed by combining a plurality of members. For example, one member of the bracket portion extends from one side of the frame portion toward the opposite side. The members of the holder portion are preferably provided in the vertical direction (the short side direction of the vapor deposition mask 10) and the horizontal direction (the long side direction of the vapor deposition mask 10). That is, the leg portion is preferably a well-shaped structure in which the longitudinally extending member and the transversely extending member intersect. However, the structure of the bracket portion is not limited thereto. The components of the bracket portion may also be arranged only in the longitudinal or transverse direction. The width of the frame portion and the width of the holder portion (or a member of the holder portion) can be appropriately determined according to the size of the vapor deposition mask 10. In order to expand the area of the vapor deposition pattern as much as possible, the width of the holder portion is preferably smaller than the width of the frame portion.

As shown in fig. 1B, the connection member 130 is disposed in a gap between the mask body 110 and the opening of the mask frame 120, and contacts a side surface of the mask body 110 and a side surface of the opening of the mask frame 120. That is, the mask body 110 and the mask frame 120 do not overlap in a plan view. In addition, the mask body 110 and the mask frame 120 may overlap each other in a plan view.

Since the connection member 130 only needs to connect the mask body 110 and the mask frame 120, the connection member 130 may not be provided on the entire surface of the side surface of the opening of the mask frame 120. The connection member 130 may be provided on at least a part of the side surface of the opening of the mask frame 120. On the other hand, the thickness of the mask body 110 is very small compared to the thickness of the mask frame. For example, the thickness of the mask body 110 is 1 μm to 20 μm, and the thickness of the mask frame 120 is 0.5mm to 2.0 mm. Therefore, in order to increase the adhesive strength of the mask body 110 and the mask frame 120, the connection member 130 is preferably provided on the entire surface of the side surface of the mask body 110.

In addition, the connection member 130 may be formed in a stepped shape between the mask body 110 and the mask frame 120.

According to the vapor deposition mask 10 of the present embodiment, the mask body 110 and the mask frame 120 are connected via the connection member 130. Therefore, by forming the connection members 130 uniformly in the surface of the vapor deposition mask 10, the bonding strength between the mask body 110 and the mask frame 120 can be made uniform. Therefore, poor peeling of the mask body 110 and the mask frame 120 is reduced.

< second embodiment >

A method for manufacturing the vapor deposition mask 10 according to one embodiment of the present invention will be described with reference to fig. 2A to 2G.

Fig. 2A to 2G are cross-sectional views showing a method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention.

First, as shown in fig. 2A, a metal layer 220 is formed on a support substrate 210, and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220.

In the manufacturing process of the vapor deposition mask 10, the support substrate 210 is a substrate that supports each layer. Therefore, the support substrate 210 is preferably a rigid substrate. The vapor deposition mask 10 preferably has a small thermal expansion coefficient. In the manufacturing process of the vapor deposition mask 10, the support substrate 210 is heated. If the support substrate 210 expands or contracts due to the heat treatment, the vapor deposition pattern of the vapor deposition mask 10 is shifted. Therefore, in order to stabilize the manufacturing process of the vapor deposition mask 10, the support substrate 210 is also preferably a rigid substrate having a small thermal expansion coefficient. Examples of the material of the support substrate 210 include stainless steel (SUS304 or SUS 430), 42 alloy, invar, super invar, and stainless invar.

The metal layer 220 can function as a base metal for electroforming (or electrolytic plating) described later. As a material of the metal layer 220, for example, nickel (Ni) or a nickel alloy is used. The metal layer 220 can be formed by sputtering or the like.

The vapor deposition mask 10 can also be manufactured using electroless plating instead of electroforming. In this case, an insulating layer can be used instead of the metal layer 220.

The photoresist layer 230 can function as a negative mold for electroforming described later. For example, the photoresist layer 230 is formed by disposing one or more photosensitive dry film resists on the metal layer 220 and thermocompression bonding so as to have a predetermined film thickness. The photosensitive dry film resist may be either a positive type or a negative type. In the following, the photosensitive dry film is described as a negative type.

The photoresist layer 230 has a predetermined pattern for forming a vapor deposition pattern of the vapor deposition mask 10. The predetermined pattern of the photoresist layer 230 can be formed by photolithography. That is, the predetermined pattern can be formed by bringing the mask into close contact with the dry film resist, irradiating the dry film with ultraviolet rays to expose the dry film, and dissolving and removing the unexposed portion.

Next, as shown in fig. 2B, a first plating layer 240 is formed using the photoresist layer 230 as a mask. The first plating layer 240 corresponds to the mask body 110 of the vapor deposition mask 10. The first plating layer 240 can be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are placed in an electroforming bath formed under predetermined conditions, and metal is plated from the surface of the metal layer 220 not covered with the photoresist layer 230 to the height of the photoresist layer 230. Examples of the material of the first plating layer 240 include nickel (Ni) and a nickel (Ni) -cobalt (Co) alloy.

Next, as shown in fig. 2C, the photoresist layer 230 is stripped (removed). The photoresist layer 230 can be stripped with an amine-based stripping solution, for example. By stripping the photoresist layer 230, a first plating layer 240 having an evaporation pattern is formed.

Further, the first plating layer 240 formed by electroforming may also be ground before the photoresist layer 230 is stripped. By grinding the first plating layer 240, the surface of the first plating layer 240 can be planarized.

Next, as shown in fig. 2D, a mask frame 260 provided with an adhesive layer 250 is disposed on the first plating layer 240. That is, the first plating layer 240 and the mask frame 260 are bonded together via the adhesive layer 250. In addition, in the process herein, it is not necessary to completely adhere the first plating layer 240 and the mask frame 260. Therefore, the adhesive layer 250 may not be completely hardened.

The mask frame 260 has an opening. The mask frame 260 is aligned and bonded so as not to overlap the openings of the vapor deposition pattern of the first plating layer 240. In other words, the openings of the mask frame 260 overlap the openings of the evaporation pattern of the first plating layer 240.

Since the adhesive layer 250 is removed in a subsequent step, it is preferably a material that is easily removed. As a material of the adhesive layer 250, for example, vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, cyanoacrylate resin, acrylic resin, or the like can be used. As a material of the adhesive layer 250, a dry film resist can be used. In the case where a dry film resist is used as the material of the adhesive layer 250, the dry film resist may be slightly exposed to the extent that weak adhesiveness remains on the surface thereof. By exposing the dry film resist to light, the dry film resist can be easily removed in a subsequent process.

In the subsequent steps, a dry film resist may be provided in the area of the vapor deposition pattern of the first plating layer 240 in order to protect the vapor deposition pattern of the first plating layer 240 (for example, to protect the openings of the vapor deposition pattern from being clogged with particles generated in the steps).

Next, spacers 270 are disposed on the mask frame 260. Further, a film 280 is disposed above the spacer 270 so as to cover the support substrate 210, the metal layer 220, the first plating layer 240, the adhesive layer 250, the mask frame 260, and the spacer 270. Subsequently, air between the support substrate 210 and the film 280 is exhausted (vacuum-exhausted), and the pressure on the lower side of the film 280 is reduced. That is, the space below the film 280 is set to be a negative pressure with respect to the space above the film 280. The film 280 is attracted toward the support substrate 210 by a pressure difference between the upper side and the lower side of the film 280 (fig. 2E). If the pressure on the lower side of the membrane 280 is further reduced, the membrane 280 presses the spacer 270. The mask frame 260 receives the pressure from the spacer 270, and is strongly bonded to the first plating layer 240 via the adhesive layer 250. This step is called vacuum pressure bonding.

The spacers 270 are disposed on the support portions of the mask frame 260. Since the spacers 270 are disposed on the bracket portions of the mask frame 260, the spacers 270 can uniformly apply force to the mask frame 260. The spacers 270 may be disposed on all of the plurality of support portions of the mask frame 260, or may be disposed on a part of the plurality of support portions. The spacer 270 may be disposed on the frame portion of the mask frame 260.

The cross-sectional shape of the spacer 270 is circular. When the sectional shape of the spacer 270 is a circle, the contact area of the mask frame 260 and the spacer 270 becomes small, and therefore, a force can be uniformly applied to the mask frame 260 at the time of vacuum crimping. However, the structure of the sectional shape of the spacer 270 is not limited thereto. The cross-sectional shape of the spacer 270 may be, for example, an ellipse or a polygon.

The width of the spacer 270 is preferably smaller than that of the bracket portion of the mask frame 260. When the width of the spacer 270 is smaller than the width of the leg portion of the mask frame 260, the film 280 is pressed to the side of the leg portion of the mask frame 260 by vacuum crimping, so the position of the spacer 270 on the leg portion of the mask frame 260 is automatically adjusted. Therefore, at the time of vacuum crimping, a force can be uniformly applied to the mask frame 260. However, the width of the spacer 270 is not limited thereto. The width of the spacer 270 may also be greater than the width of the support portion of the mask frame.

The material of the spacer 270 may be an organic resin such as polyethylene, polystyrene, polypropylene, polyvinyl chloride, or polyethylene terephthalate, or may be metal. The material of the spacer 270 is preferably an organic resin which is easy to mold and lightweight.

The degree of vacuum on the lower side of the film 280 is-50 kPa or less, preferably-70 kPa or less, and more preferably-90 kPa, when the atmospheric pressure is a gauge pressure of 0 kPa.

In the case where the spacer 270 is not provided, the mask frame 260 and the film 280 may be in close contact with each other in the vicinity of the exhaust port before the completion of vacuum exhaust, thereby closing the exhaust path so that the degree of vacuum may not be reduced. In this case, the mask frame 260 has different degrees of vacuum in the plane, and as a result, the pressure difference varies. Therefore, the force with which the film 280 presses the mask frame 260 is not uniform, and the adhesion of the first plating layer 240 to the mask frame 260 becomes non-uniform.

On the other hand, in the case where the spacer 270 is provided, a gap formed by the spacer 270 is generated in the upper portion of the mask frame 260. Therefore, the mask frame 260 and the film 280 can be prevented from adhering to each other. Accordingly, the degree of vacuum on the lower side of the film 280 becomes uniform, so the first plating layer 240 and the mask frame 260 are uniformly adhered together.

That is, the width of the surface of the spacer 270 in contact with the mask frame 260 is preferably smaller than the width of the spacer 270. By forming the shape in this manner, the film 280 does not adhere to the bottom of the spacer 270, and a void can be left.

After vacuum crimping, the spacers 270 and the film 280 are removed.

Next, as shown in fig. 2F, a second plating layer 290 connecting the first plating layer 240 and the mask frame 260 is formed. The second plating layer 290 can be formed by electroforming for energizing the metal layer 220 or the first plating layer 240. The second plating layer 290 corresponds to the connection members 130 of the vapor deposition mask 10. The second plating layer 290 is in contact with the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Specifically, the second plating layer 290 is formed to contact a part of the groove portion of the first plating layer 240 and the side surface of the mask frame 260 (the side surface of the frame portion and the holder portion of the vapor deposition mask 10).

The second plating layer 290 can be formed by the same method as the first plating layer 240.

The second plating layer 290 is not provided in the region of the first plating layer 240 corresponding to the open region 111. For example, a dry film resist is formed on the first plating layer 240 in a region corresponding to the opening region 111, thereby preventing plating on the first plating layer 240 in a region corresponding to the opening region 111. The dry film resist can be peeled off after the second plating layer 290 is formed.

Next, as shown in fig. 2G, the support substrate 210, the metal layer 220, and the adhesive layer 250 are peeled off, whereby the vapor deposition mask 10 in which the mask body 110 and the mask frame 120 are connected to each other by the connection member 130 is manufactured. By peeling the adhesive layer 250, a part of the first plating layer 240 adhered to the adhesive layer 250 (a part between the groove portions of the first plating layer 240 overlapping with the mask frame 260) is also peeled. That is, as shown in fig. 2G, the mask body 110 is not disposed below the mask frame 120. The supporting substrate 210, the metal layer 220, and the adhesive layer 250 may be peeled off from all the substrates and layers at once, or may be peeled off from each of the substrates and layers individually. Since the mask main body 110 has a very thin film thickness compared to the support substrate 210, stress is likely to be applied unilaterally to the mask main body 110 side during the peeling of the mask main body, and the mask main body 110 may be damaged. Therefore, by peeling first between the support substrate 210 and the metal layer 220 and then between the metal layer 220 and the mask main body 110, stress to the mask main body 110 can be reduced.

According to the method of manufacturing the vapor deposition mask 10 of the present embodiment, the spacers 270 are provided between the mask frame 260 and the film 280, and vacuum pressure bonding is performed. The film 280 does not directly press the mask frame 260, but presses the mask frame 260 via the spacer 270. Therefore, the pressure can be always applied from the same position, i.e., the upper surface of the mask frame 260. In the vacuum pressure bonding, since the gap is increased by the spacer 270 disposed between the mask frame 260 and the film 280, the mask frame 260 and the film 280 can be prevented from being closely adhered to each other. Therefore, vacuum evacuation can be easily performed at any position within the mask frame 260, and the degree of vacuum on the lower side of the film 280 can be kept constant.

As described above, the bonding strength of the second plating layer 290 can be made uniform by making the pressure on the mask frame 260 uniform. Therefore, since the joining strength of the connecting member 130 connecting the mask body 110 and the mask frame 120 is uniform, the vapor deposition mask 10 in which the peeling failure between the mask body 110 and the mask frame 120 is reduced can be manufactured.

< embodiment 3 >

A manufacturing apparatus 20 of a vapor deposition mask 10 according to an embodiment of the present invention will be described with reference to fig. 3A to 4B.

Fig. 3A is a schematic cross-sectional view of a manufacturing apparatus 20 for a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 3A is a schematic cross-sectional view of an apparatus for vacuum crimping described in the second embodiment.

As shown in fig. 3A, the manufacturing apparatus 20 includes a mounting table 310, a spacer 320, a film 330, and a film fixing portion 340. The spacer 320, the film 330, and the film fixing portion 340 are disposed above the stage 310. The membrane 330 is fixed to the membrane fixing portion 340.

The object (target object) to be vacuum-bonded is disposed on the mounting table 310. Therefore, the surface of the mounting table 310 is preferably flat. The surface of the mounting table 310 is provided with a groove 311. Further, the groove portion 311 is provided with an exhaust port 312 for vacuum exhaust. A vacuum pump (not shown) is connected to the exhaust port 312 via a pipe, and vacuum exhaust can be performed from the exhaust port.

The target object is, for example, a structure body including the support substrate 210, the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260, which is shown in fig. 2D and described in the second embodiment. Hereinafter, for convenience, a structure including the mask frame 260 will be described as an object.

Fig. 3B is a schematic view showing a usage mode of the manufacturing apparatus 20 for the vapor deposition mask 10 according to the embodiment of the present invention.

As shown in fig. 3B, an object 350 including the mask frame 260 is disposed on the stage 310, and the spacer 320 is disposed so as to overlap the frame portion and the holder portion of the mask frame 260 of the object 350. Next, the film fixing section 340 is moved to the mounting table 310 side, and the space where the target 350 and the spacer are arranged is sealed by the mounting table 310, the film 330, and the film fixing section 340. Thereafter, the space is depressurized through the exhaust port 312.

Fig. 3C is a schematic plan view of the mounting table 310 of the apparatus 20 for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention.

As shown in fig. 3C, the groove portion 311 is provided in a ring shape along the outer periphery of the mounting table 310. Preferably, the target is disposed inside the groove 311 and does not overlap the groove 311. Since vacuum evacuation is not easily performed if the groove portion 311 is covered with the target object, the inner diameter of the groove portion 311 is preferably larger than the target object.

As shown in fig. 3C, the exhaust ports 312 are provided at the four corners of the groove portion 311. However, the structure of the exhaust port 312 is not limited thereto. The exhaust port 312 may be provided between the four corners of the groove 311. The number of the exhaust ports 312 is not limited to four, and may be set as appropriate according to the size of the table.

The spacer 320 is positioned above the table 310, and when an object is placed on the table 310, the distance between the spacer 320 and the table 310 is controlled so as to contact the object. Alignment may also be performed in the contact between the object and the spacer 320. The alignment can be adjusted to match a portion of the shape of the target to the shape of the spacer 320. In addition, the alignment can be adjusted using a mark. The alignment can be performed by analyzing an image captured by a camera.

Fig. 4A is a diagram showing a usage mode of the vapor deposition mask 10 manufacturing apparatus 20 according to the embodiment of the present invention.

An object including the mask frame 260 is disposed on the stage 310, and the spacer 320 is disposed on the mask frame 260 so as to contact the mask frame 260. The spacer 320 has a well-shaped structure. That is, the first rod 320-1 extending in the transverse direction and the second rod 320-2 extending in the longitudinal direction cross. The first bar 320-1 and the second bar 320-2 overlap the support portion of the mask frame 260. The first bar 320-1 and the second bar 320-2 have respective ends overlapping the frame of the mask frame 260. The ends of the first bar 320-1 and the second bar 320-2 are preferably located inward of the ends of the mask frame 260. If the end portions of the first bar 320-1 and the second bar 320-2 protrude beyond the end portions of the mask frame 260, the end portions of the first bar 320-1 and the second bar 320-2 are not fixed. If vacuum pressure bonding is performed in this state, the center portion of the spacer 320 is lifted (the center portion of the spacer 320 is away from the mask frame 260), and thus pressure cannot be uniformly applied to the object. Therefore, it is preferable that the ends of the first and second rods 320-1 and 320-2 are positioned inward of the ends of the mask frame 260 and contact the mask frame 260 so that the ends of the spacers 320 are fixed.

Preferably, the first rod 320-1 and the second rod 320-2 each extend linearly. Each of the first bar 320-1 and the second bar 320-2 may extend to include a curved portion, but in this case, the curved portion is preferably not protruded to the outside of the holder portion of the mask frame 260.

Fig. 4B is an exploded perspective view of the spacer 320 of the vapor deposition mask manufacturing apparatus 20 according to the embodiment of the present invention. Specifically, FIG. 4B shows the portion where the first bar 320-1 and the second bar 320-2 intersect.

As shown in FIG. 4B, in the portion where the first bar 320-1 and the second bar 320-2 cross, the first bar 320-1 includes a first notch 321-1, and the second bar 320-2 includes a second notch 321-2. In addition, the first notch 321-1 is engaged with the second notch 321-2.

The first bar 320-1 and the second bar 320-2 each have a circular cross-sectional shape. When the first rod 320-1 and the second rod 320-2 have a circular cross-sectional shape, the mask frame 260 and the spacer 320 have a small contact area, and thus, a force can be uniformly applied to the mask frame 260 during vacuum pressure bonding. However, the cross-sectional shapes of the first bar 320-1 and the second bar 320-2 are not limited to this configuration. The first bar 320-1 and the second bar 320-2 may have an elliptical or polygonal cross-sectional shape, for example. In addition, the cross-sectional shape of the first bar 320-1 and the cross-sectional shape of the second bar 320-2 may be different.

The first rod 320-1 and the second rod 320-2 of the spacer 320 may not be separated. The first rod 320-1 and the second rod 320-2 of the spacer 320 may also be integrated.

When the spacer 320 is in contact with the target object, the distance of the film 330 from the table 310 is controlled such that the film 330 is in contact with the spacer 320. The film fixing section 340 closely contacts the outer periphery of the film 330 to the mounting table 310, and fixes the film 330 so that a sealed space is provided between the mounting table 310 and the film 330. In this state, when vacuum evacuation is performed from the exhaust port 312, the degree of vacuum in the sealed space decreases. Namely, the pressure in the sealed space is reduced. The vacuum degree of the sealed space is-50 kPa, preferably-70 kPa or less, and more preferably-90 kPa, under a gauge pressure of 0 kPa.

After vacuum pressure bonding, the degree of vacuum in the sealed space is returned to atmospheric pressure, and the target is taken out.

According to the manufacturing apparatus 20 of the vapor deposition mask 10 of the present embodiment, the film 330 can be vacuum-pressure bonded to the target object via the spacer 320. That is, the film 330 does not directly press the object but presses the object via the spacer 320. In the case where the object includes the mask frame 260, a uniform pressure can be applied to the upper surface of the mask frame 260. In the vacuum pressure bonding, since the gap is increased by the spacer 320 disposed between the mask frame 260 and the film 330, the mask frame 260 and the film 330 can be prevented from being closely attached to each other. Therefore, in the manufacturing apparatus 20, vacuum evacuation is easily performed at any position of the sealed space on the mounting table 310, and the degree of vacuum of the sealed space during vacuum pressure bonding can be kept constant. Therefore, since the bonding strength of the connecting members 130 connecting the mask body 110 and the mask frame 120 is uniform, the vapor deposition mask 10 in which the peeling failure between the mask body 110 and the mask frame 120 is reduced can be manufactured.

< modification example >

A modified example of the shape of the spacer 320 will be described with reference to fig. 5A and 5B.

Fig. 5A and 5B are cross-sectional views of a spacer 320A and a spacer 320B, respectively, in the apparatus 20 for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention. In fig. 5A and 5B, the

spacers

320A and 320B are disposed on the mask frame 260.

The spacer 320 described in the present embodiment has a function of ensuring an exhaust flow path for satisfactorily performing vacuum exhaust when a pressure between the film and the target is reduced. As described above, the exhaust gas flow path can be ensured by making the cross-sectional shape of the spacer 320 circular, elliptical, or polygonal and making the width of the contact surface with the object smaller than the maximum width of the spacer 320. However, the cross-sectional shape of the spacer 320 is not limited to this, and may have a cross-sectional shape such as the spacer 320A shown in fig. 5A or the spacer 320B shown in fig. 5B, for example.

In fig. 5A and 5B, the

spacers

320A and 320B have a width W1 at the contact surface with the object, a maximum width W2 at a portion distant from the contact surface, and a width W3 between the portion having the maximum width W2 and the contact surface, which is smaller than the width W1. Upon decompression, the film 330 comes into contact along the top of the spacer 320, the portion having the maximum width W2, and the shape of the object. However, when a portion (recessed portion) having the width W3 is present between the contact surface and the top of the spacer 320, a gap is formed in the portion having the width W3, and the portion can function as an exhaust gas flow path. Also, the width W1 of the contact surface is preferably less than the maximum width W2.

In the case of the spacer 320 having a circular cross-sectional shape or the like, strictly speaking, it is not a contact surface but a contact point, but the relationship between the portion having the maximum width W2 and the portion having the width W3 is the same as the

spacers

320A and 320B. Here, when considering the uniform pressing of the spacer 320 against the object, it is preferable to determine the cross-sectional shape of the spacer 320 so that the contact portion becomes a contact surface having a certain area.

As embodiments of the present invention, the above-described embodiments can be combined and implemented as appropriate, as long as they do not contradict each other. Further, those skilled in the art can add, delete, or modify the design of components, or add, omit, or modify the conditions of the process, as appropriate, based on the respective embodiments, and are included in the scope of the present invention as long as the gist of the present invention is satisfied.

The present invention can be explained as an effect achieved by the present invention, as long as the effect is known from the description of the present specification or can be easily predicted by a person skilled in the art.

Claims

1. A method for manufacturing a vapor deposition mask, comprising:

a mask frame is arranged on a first plating layer formed with a vapor deposition pattern through an adhesive layer,

a spacer is disposed on the mask frame,

disposing a film so as to cover the first plating layer, the mask frame, and the spacer,

depressurizing a space on a lower side of the film so that the film presses the spacer,

pressing the mask frame by the spacer to crimp the mask frame and the first plating layer together.

2. The method of manufacturing a vapor deposition mask according to claim 1, wherein:

the cross-sectional shape of the spacer has a maximum width between a contact surface of the spacer contacting the mask frame and a portion farthest from the mask frame, and has a width smaller than the maximum width between the contact surface and the portion having the maximum width.

3. The method of manufacturing a vapor deposition mask according to claim 1, wherein:

the spacer includes: a first bar having a first gap; and a second bar crossing the first bar and having a second notch,

the first notch and the second notch are embedded.

4. The method of manufacturing a vapor deposition mask according to claim 3, wherein the vapor deposition mask is made of a material having a high thermal conductivity

The first rod body and the second rod body are each circular in cross-sectional shape.

5. The method of manufacturing a vapor deposition mask according to claim 3, wherein:

the first and second rods each have a width less than a width of the mask frame.

6. The method for producing a vapor deposition mask according to any one of claims 3 to 5, wherein:

the material of each of the first rod and the second rod is an organic resin.

7. The method of manufacturing a vapor deposition mask according to claim 1, wherein:

the spacer has a well-shaped structure.

8. The method of manufacturing a vapor deposition mask according to claim 1, wherein:

the degree of vacuum when the mask frame and the first plating layer are pressed against each other is-90 kPa or less as expressed by gauge pressure.

9. A manufacturing apparatus, comprising:

a stage for mounting an object including a mask frame;

a spacer located above the stage and arranged to be in contact with the mask frame;

a film for pressing the spacer, which is located above the spacer; and

a film fixing portion that fixes the film,

the mounting table includes a groove portion and an exhaust port provided in the groove portion.

10. The manufacturing apparatus according to claim 9, wherein:

11. The manufacturing apparatus according to claim 9, wherein:

the first notch and the second notch are embedded.

12. The manufacturing apparatus according to claim 11, wherein:

13. The manufacturing apparatus according to claim 11, wherein:

14. The manufacturing apparatus according to any one of claims 11 to 13, wherein:

the material of each of the first rod and the second rod is an organic resin.

15. The vapor deposition mask manufacturing apparatus according to claim 9, wherein:

the spacer has a well-shaped structure.

16. The vapor deposition mask manufacturing apparatus according to claim 9, wherein:

and performing vacuum evacuation from an evacuation port so that the mounting table and the film are in close contact with each other, wherein a degree of vacuum in a space between the mounting table and the film is-90 kPa or less as expressed by a gauge pressure.