JP2019039062A - Matrix holder and method of manufacturing mask - Google Patents

Abstract

To provide a matrix holder capable of improving the accuracy of a forming body by fixing and supporting a matrix in an appropriate arrangement state along a predetermined reference surface and preventing the forming body on the matrix from being affected by the distortion of the matrix during a step such as the plating.SOLUTION: A matrix 10 is absorbed by a magnetic force of a magnetic force generating part, the matrix is closely adhered to a substantially planar reference surface 51a, and the matrix 10 is held while being fitted to the shape of a reference surface. Therefore, when this technique is applied to a plating step of integrating a frame body with a primary electrodeposition layer on the matrix 10 and a metal layer is formed by plating with respect to the primary electrodeposition layer and the frame body over the matrix 10 disposed to have an appropriate shape along the reference surface 51a in manufacturing masks, the frame body and the primary electrodeposition layer are integrally fixed with each other by the metal layer while maintaining an appropriate positional relation so that the frame body can be functioned to maintain the appropriate positional relation as it is after the separation of the matrix. Accordingly, masks having the same quality can be surely obtained without being influenced by the condition of the matrix 10 so that the variations in accuracy of masks caused by the matrix 10 can be suppressed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mother die holder used in a manufacturing process by electroforming a metal mask.

As a method for forming a light emitting layer of an organic EL (Electroluminescence) element, a vapor deposition mask method is often used. In this vapor deposition mask method, a vapor deposition mask in which a portion corresponding to the vapor deposition portion of the substrate is removed and perforated is used in order to vapor-deposit and form an organic light emitting material on a substrate made of a transparent material such as glass.
In recent years, it has been proposed to form such a vapor deposition mask using electroforming because it is necessary to form a thin film and to form a large number of vapor deposition through holes through which a vapor deposition material passes.

In mask formation by electroforming, resists are placed in advance at a number of locations on the surface of the mother die to be vapor deposition holes, and then electrodeposition is made of an electroformable metal such as nickel that forms a mask on the mother die surface by electroforming. A layer is formed, and a state where a large number of vapor deposition through holes are provided in a predetermined pattern at the same time is generated. If a desired mask structure is obtained by integrating the reinforcing frame by plating or the like as necessary, the mother die is separated and completed as a vapor deposition mask.
An example of a conventional vapor deposition mask manufactured using such electroforming is disclosed in Japanese Patent Application Laid-Open No. 2005-15908.

JP 2005-15908 A

  The conventional vapor deposition mask has a configuration shown in the above-mentioned patent document, and the mask when heat is applied in the vapor deposition process by appropriately integrating the frame body with the mask body using an electroforming technique, Relative deformation of the substrate can be suppressed, and deterioration of the positional accuracy of the vapor deposition product can be prevented.

  However, in recent years, there has been a demand for higher accuracy of the deposited products, and it has become possible to reduce the thickness of the mask and miniaturize the through-hole pattern. Is relatively large.

  When adopting a combined structure of the mask body and frame as in the case of conventional vapor deposition masks, the mask body must exist as an electrodeposition layer on the matrix in the process of integrating the mask body and frame. Therefore, the integration reflects the accuracy of the mother die as it is.

  If there is distortion such as warpage due to the accuracy of the master itself or the influence of electroforming in the previous process, the electrodeposition layer on the master and the frame are integrated. Since the distortion of the matrix is not changed in particular before and after the conversion, the influence of the distortion of the matrix will affect the positional accuracy of the mask body, making it difficult to further improve the accuracy of the mask. It had the problem that.

  The present invention has been made in order to solve the above-mentioned problems, and in a process such as plating, the mother mold is held and fixed in an appropriate arrangement state along a predetermined reference surface, and the influence of the distortion of the mother mold is exerted on the mother mold. An object of the present invention is to provide a mother mold holder capable of improving the accuracy of the molded article while suppressing the spread to the formed article, and a mask manufacturing method using the mother mold holder.

  A matrix holder according to the disclosure of the present invention includes a substantially planar reference surface and one or a plurality of magnetic force generators that can adsorb a ferromagnetic substance to the reference surface with a magnetic force. An electroforming matrix that includes a substance and has a plate shape can be held in a state of being attracted by the magnetic force of the magnetic force generator and in close contact with the reference surface.

  As described above, according to the disclosure of the present invention, the mother die for electroforming is attracted by the magnetic force of the magnetic force generator, the mother die is brought into close contact with the substantially flat reference surface, and the mother die is matched to the reference surface shape. By holding it in a state, it is applied to a plating process in which the frame is integrated with the primary electrodeposition layer on the mother die when manufacturing the mask, and on the mother die having an appropriate shape and arrangement along the reference plane. If a metal layer is formed by plating on the primary electrodeposition layer and the frame body, the frame body and the primary electrodeposition layer are fixed and integrated with the metal layer in an appropriate positional relationship, and the frame body remains after separation of the matrix. It will function to maintain the appropriate positional relationship as it is, and the same quality mask can be reliably obtained without being affected by the condition of the mother mold, and variations in mask accuracy caused by the mother mold can be suppressed. A homogeneous product can be obtained with high accuracy by a manufacturing process such as vapor deposition using a mask.

  In addition, in the mother die holder according to the disclosure of the present invention, the magnetic force generation part includes a plate-like magnet part having a predetermined surface as the reference surface as necessary.

  As described above, according to the disclosure of the present invention, a plate-like magnet part is used as a main part of the magnetic force generation part, and the mother die is attracted to the reference surface which is one surface of the magnet part by the magnetic force generated from the reference surface. In this way, the magnet itself can be evenly attracted evenly with the reference surface, which is the magnet itself, and the contact state of the mother die to the reference surface can be obtained more reliably. In the plating process that integrates the frame body with the primary electrodeposition layer on the matrix while efficiently maintaining the appropriate shape and arrangement according to the shape, the frame and the primary electrodeposition layer are in the correct positional relationship. Can be integrated reliably.

  In addition, the mother die holder according to the disclosure of the present invention is formed of a plate-like body having a strength that does not easily deform, if necessary, and is integrally fixed to a surface of the magnet portion opposite to the reference surface. A reinforcing plate is provided.

  Thus, according to the disclosure of the present invention, a reinforcing plate having a strength that does not deform is fixed to a surface opposite to the reference surface in the plate-like magnet portion forming the magnetic force generating portion, and the magnet portion is a reinforcing plate. By providing a state that is reinforced and does not easily deform, the reference surface for closely contacting the mother die is securely fixed in shape, and the reference surface shape is maintained with high accuracy without deformation. By matching the molds, the mother mold can be matched to the desired shape with high accuracy, and the plating process is performed on the mother mold that is strictly in the correct shape and arrangement, so that the primary mold on the mother mold is obtained. The plating process can be advanced while ensuring an appropriate positional relationship between the electrodeposition layer and the frame with high accuracy, and the accuracy of the mask obtained by integrating the primary electrodeposition layer and the frame should be higher. it can.

  Further, a mask manufacturing method according to the disclosure of the present invention is a mask manufacturing method including a metal mask body provided with a large number of through holes, and a metal frame body disposed so as to surround the outside of the mask body. A first electroforming step of forming a primary electrodeposition layer corresponding to the mask body by electroforming metal at a plurality of predetermined positions on the mother die, and setting the frame body in advance for the primary electrodeposition layer A frame body disposing step of disposing on the matrix so as to be in a positional relationship, and a metal layer within a predetermined range extending from a part or all of the surface of the frame to a part of the surface of the primary electrodeposition layer. A second electroforming step in which the frame and the primary electrodeposition layer are integrally connected via the metal layer so as not to leave, the master, the integrated primary electrodeposition layer, the frame, and A separation step of separating the metal layer, wherein the matrix is made of a ferromagnetic material. A plate-like body including at least the second electroforming step, the surface on the side opposite to the side on which the primary electrodeposition layer and the frame body of the mother die are located is a substantially planar shape arranged along the mother die. This is performed in a state of being attracted to the reference surface by magnetic force.

  Thus, according to the disclosure of the present invention, in the step of forming the primary electrodeposition layer corresponding to the mask main body on the mother die by electroforming, and then integrating the frame body on the primary electrodeposition layer by plating, the mother die After making the state of adsorbing to the predetermined reference surface by magnetic force, by carrying out plating, the master mold and the primary electrodeposition layer formed on this master mold are always the same along the reference surface It is possible to perform integrated plating on the primary electrodeposition layer and the frame body while maintaining a strong positional relationship, and even if the condition differs for each mother die, the mother die and the primary electrodeposition layer can be arranged appropriately. After modification, the integration by plating can be executed under the correct positional relationship. When the mask is finally obtained, the mask body is reinforced and supported by a frame that is appropriately integrated with the mask body. Make masks of the same quality to prevent misalignment of each part. Can be can be produced a homogeneous product with high precision by using a mask.

  In addition, in the mask manufacturing method according to the disclosure of the present invention, as necessary, at least the second electroforming step is a state in which the mother die and the mother die are attracted by a magnetic force to be in close contact with the reference surface. A matrix holding tool that can be held in a state is attached to a predetermined support device, and the support device is provided on a substrate portion that is a rectangular plate-like body and rectangular sides of the substrate portion. A frame-like support portion that is a corresponding frame-like body and is detachably attached to the substrate portion, and is formed of a thin metal plate material, and is provided so as to overlap at least two parallel frame side portions of the frame-like support portion. And a contact portion for energizing the mother die, the mother die is held by the mother die holder at least before the second electroforming step, and the mother die holder is the support device. The frame-shaped support portion is attached to the substrate portion after being placed on the substrate portion. In addition, the mother die and the mother die holder are sandwiched between the frame-like support portion and the substrate portion, and the contact portion provided to overlap the two frame side portions of the frame-like support portion is brought into contact with the end surface of the mother die. Then, while the contact portion and the mother die are in a conductive state, a fixed support force is applied symmetrically to the mother die from the two frame side portions of the frame-like support portion with the contact portions, and the mother die is placed on the substrate portion. It is a fixed state.

  As described above, according to the disclosure of the present invention, in the second electroforming process in which the frame body is integrated with the primary electrodeposition layer by plating, the support device including the substrate portion, the frame-shaped support portion, and the contact portion is provided with a matrix. The frame is supported between the frame-shaped support portion and the substrate portion of the support device, while the mother die is in close contact with the reference surface of the matrix holder. The contact part is brought into contact with the surface of the mother die at the frame side portion, and the mother die is fixed on the substrate part, so that the force applied to the mother die from each contact part of the frame-like support part has an appropriate magnitude and each contact part. The fixing force applied to the mother die is not biased and the mother die is not distorted, and the mother die is supported stably by receiving the fixed supporting force symmetrically at its two ends. 2 can be accurately performed on the mother die.

It is a partially-omission schematic perspective view of the mother die holder concerning one embodiment of the present invention. It is a mother mold holding state explanatory view of a mother mold holder concerning one embodiment of the present invention. It is a schematic plan view of the mother die holder according to an embodiment of the present invention and the mother die supporting device attached state. FIG. 4 is an AA cross-sectional view of FIG. 3 and an enlarged view of a C portion and a D portion in the cross-sectional view. FIG. 4 is a cross-sectional view taken along the line BB in FIG. 3 and an enlarged view of a portion E and a portion F in the cross-sectional view. It is a schematic plan view of the vapor deposition mask manufactured with the mask manufacturing method which concerns on one Embodiment of this invention. It is principal part structure explanatory drawing of the vapor deposition mask manufactured with the mask manufacturing method which concerns on one Embodiment of this invention. It is primary pattern resist formation process explanatory drawing in the mask manufacture by the mask manufacturing method concerning one Embodiment of this invention. It is explanatory drawing of the support apparatus attachment process of the primary pattern resist formed mother die in the mask manufacture by the mask manufacturing method concerning one Embodiment of this invention. It is a support apparatus attachment state explanatory drawing of the mother die in mask manufacture by the mask manufacturing method concerning one embodiment of the present invention. It is process explanatory drawing from the primary electrodeposition layer formation in a mask manufacture by the mask manufacturing method concerning one Embodiment of this invention to a primary pattern resist removal. It is secondary pattern resist formation process explanatory drawing in the mask manufacture by the mask manufacturing method concerning one Embodiment of this invention. It is frame body attachment process in mask manufacture by the mask manufacture method concerning one embodiment of the present invention, and a supporting device attachment process explanatory drawing of a mother mold and a mother mold support. It is explanatory drawing explanatory drawing of the electrodeposition metal layer formation state in the mask manufacture by the mask manufacturing method which concerns on one Embodiment of this invention, and the removal state from the support device of a mother die and a mother die holder. It is a separation process explanatory drawing from a mother mold holder of a mask in a mask manufacture by a mask manufacturing method concerning one embodiment of the present invention, and a mother mold.

Hereinafter, a mother mold holder according to an embodiment of the present invention will be described with reference to FIGS. In this embodiment, an example of a configuration applied to manufacture of an organic EL element deposition mask will be described.
In each of the drawings, the mother die holder 50 according to the present embodiment has one surface as a substantially flat reference surface 51a, and is capable of adsorbing a ferromagnetic material to the reference surface 51a as the magnetic force generation unit. The magnet plate 51 includes a substantially plate-shaped magnet portion 51 and a reinforcing plate 52 made of a metal plate that is integrally fixed to a surface opposite to the reference surface 51 a of the magnet portion 51.

  The magnet portion 51 is a rectangular plate-shaped permanent magnet, and one surface of the magnet portion 51 is a substantially flat reference surface 51a, and the base 10 includes a ferromagnetic material such as SUS430 material as a material on the reference surface 51a. Can be adsorbed.

  The reinforcing plate 52 is a metal plate made of, for example, a SUS430 material having sufficient strength that does not easily deform, and is configured to be integrally fixed to a surface of the magnet unit 51 opposite to the reference surface 51a.

  When the mother die 10 having a metal part having a ferromagnetic substance is brought into close contact with the flat reference surface 51a of the mother die holder 50 by the suction by the mother die holder 50, the mother die 10 is distorted. Even if there is, such distortion can be corrected and put into an appropriate state.

  The mother die 10 that is sucked and held by the mother die holder 50 is a rectangular or rectangular shape that is made of a material containing a ferromagnetic material and having conductivity such as stainless steel or steel used in the manufacturing process of the vapor deposition mask. It is a plate-like body. When the primary electrodeposition layer 15 and the metal layer 7 are formed in the vapor deposition mask manufacturing process, the energization through the mother die 10 is performed in the electrolytic solution so that the resist on the surface of the mother die 10 is not covered. An electrodeposited metal layer such as the primary electrodeposition layer 15 and the metal layer 7 is formed in the possible portion by electroforming (plating).

The mother die holder 50 according to the present embodiment is supported by a support device 60 for electroforming or plating process in a state of being overlapped so as to be in close contact with the mother die 10.
The support device 60 includes a flat substantially plate-like substrate portion 61, a frame-like support portion 62 disposed in a frame shape on the substrate portion 61, a predetermined portion of the frame-like support portion 62, and the substrate portion 61. It is the structure provided with the contact part 63 which can interpose between and can be electrically contacted with a mother die.

  The substrate portion 61 is a rectangular plate-like body having a sufficient thickness (for example, a thickness of 10 mm) that is not easily deformed, and the mother die 10 is arranged so as to overlap directly or with the mother die holder 50 interposed therebetween. It is a configuration to be provided. Since this board | substrate part 61 is built in a plating tank with the mother mold 10, it is made from the polyvinyl chloride resin which is not influenced by the electrolyte solution used by electroforming or plating, for example.

  The frame-shaped support portion 62 is configured to be detachably attached to the substrate portion 61 with bolts and nuts by combining four elongated plate-like members corresponding to the respective sides of the substrate portion 61 into a frame shape. The frame inner periphery of the frame support 62 has a predetermined distance from the surface of the substrate 61 when the frame support 62 is attached to the substrate 61. Protruding portions 62a are provided to restrain the mold 10 and the mother die holder 50 so that they cannot be detached.

  Each member of the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts in a state where the mother die 10 and the mother die holder 50 are sandwiched between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61. Thus, the mother die 10 and the mother die holder 50 are restrained so as not to be displaced or detached from the substrate portion 61.

  The contact portion 63 is formed of a metal thin plate material such as a copper plate having a thickness of, for example, about 0.3 μm, and the protruding portion 62a of the plate-like member of the two side portions which are the long sides of the frame-like support portion 62. It is provided to overlap. This contact portion 63 is formed on the surface of the mother die 10 with the frame-like support portion 62 attached to the substrate portion 61 so that the mother die 10 is sandwiched between the protruding portion 62a of the frame-like support portion 62 and the substrate portion 61. One end can be electrically contacted. In this case, at each of the two side portions of the frame-shaped support portion 62, the contact portions 63 come into contact with the mother die 10 so that no gap is generated between the frame-shaped support portion 62 and the mother die 10. Is fixed on the substrate portion 61 and is supported stably by receiving a fixed supporting force symmetrically at the two end portions.

  Each member of the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts in a state where the mother die 10 and the mother die holder 50 are sandwiched between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61. Thus, the mother die 10 is supported so as not to be detached from the substrate portion 61, and the two contact portions 63 overlapping the frame-like support portion 62 are in close contact with the mother die 10, so that the mother die 10 has two end portions. Then, it is pressed against the substrate part 61 and fixed symmetrically on the two sides.

  The contact parts 63 are arranged opposite to each other in two of the frame-shaped support parts 62, and the two contact parts 63 are brought into close contact with the mother mold 10 with the frame-shaped support parts 62 attached to the substrate part 61. However, the present invention is not limited to this, and the mother die 10 may be supported at four symmetrical positions of the support device 60. In that case, the contact portion 63 is similarly arranged and supported on the four plate-like members of the frame-like support portion 62, and the contact portion 63 is arranged on two predetermined side portions of the frame-like support portion 62, while having the same thickness. In this case, a dummy contact portion that does not affect electroforming or plating may be provided on the other two sides of the frame-shaped support portion 62.

  In addition, the contact portion 63 is arranged on two predetermined side portions of the frame-shaped support portion 62, while the thickness of the protruding portion 62a of the frame-shaped support portion 62 is set to the contact portion on the other two side portions of the frame-shaped support portion 62. As an increase in the thickness of 63, the four symmetric portions of the mother die 10 can be supported by the four sides of the frame-like support portion 62 as described above.

  In this way, when the mother die 10 is supported by the four sides of the frame-like support portion 62 in the support device 60, a more stable fixing state can be achieved, but on the contrary, the fixing force is increased so that the mother die is not distorted. It is preferable to provide a support mechanism in which the force applied to the mother die from each contact portion of the frame-shaped support portion 62 has an appropriate magnitude and is uniform between the contact portions.

  The vapor deposition mask 1 manufactured using the mother die holder 50 according to the present embodiment is arranged so as to surround a plurality of mask main bodies 2 provided with a plurality of vapor deposition through holes 8 in a predetermined pattern and the outside of the mask main body 2. The frame 3 is provided.

  The mask body 2 is formed into a sheet by electroforming using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal, and has a large number of independent vapor deposition through holes 8 through which the vapor deposition material passes. It is the structure which is made.

  The mask body 2 includes an internal pattern forming region 2a provided with a large number of vapor deposition through holes 8, and an outer peripheral edge 2b joined integrally with the frame body 3 through a metal layer 7 formed by plating. In the pattern formation region 2a, a large number of vapor deposition through holes 8 are used for forming a light emitting layer, and a plurality of through hole groups arranged linearly in the front-rear direction are arranged in a row, and the plurality of rows are arranged in parallel in the left-right direction. A matrix-shaped vapor deposition pattern 9 is formed.

  The frame body 3 is a plate-like body that is thicker than the mask body 2 and has a rectangular frame shape. The frame body 3 is disposed around the outside of the mask body 2 to reinforce the mask body 2 and is connected to the mask body 2. It is the structure integrated. Specifically, the frame body 3 is formed in a lattice shape as a whole, and the mask main body 2 is positioned in each of the opening regions divided into a plurality of sections, and is integrated with the frame body 3 via the metal layer 7. It is a configuration.

  The frame 3 is formed of a material having a low thermal expansion coefficient, for example, a material such as an invar material that is a nickel-iron alloy or a super invar material that is a nickel-iron-cobalt alloy. The frame 3 is connected and integrated with the outer peripheral edge 2b of the pattern formation region 2a of the mask body 2 by a metal layer 7 formed by plating so as not to be separated from each other.

  In addition, the material of the frame 3 can also use the material of the low thermal expansion coefficient close | similar to the glass etc. which are vapor deposition substrates, for example, things, such as glass and a ceramic. In this case, conductivity is imparted to at least the surface of these materials.

  The vapor deposition mask 1 has a primary pattern resist 14 provided on the surface of the mother die 10 so as to correspond to the non-arranged portions of the primary electrodeposition layer 15, and then the primary electrode is electroplated on the mother die 10 by electroforming metal. After the deposition layer 15 is formed, the secondary pattern resist 18 covering the portion corresponding to the pattern formation region 2 a of the primary electrodeposition layer 15 is formed, and the frame body 3 is disposed so as to surround the primary electrodeposition layer 15. The metal layer 7 is formed by plating so as to cover the surface of the frame body 3 and the surface of the outer peripheral edge 2b of the primary electrodeposition layer 15, and the primary electrodeposition layer 15 and the frame body 3 are connected via the metal layer 7. The integrated primary electrodeposition layer 15, the frame body 3, the metal layer 7, and the mother die 10 are manufactured in a state of being integrally connected so as not to be separated.

  In the process of separating the mother mold 10 from the primary electrodeposition layer 15 and the metal layer 7 (see FIG. 15B), when the mother mold 10 is made of stainless steel, it is physically peeled off from the deposition mask side by applying force. In addition, when the mother die 10 is made of another metal material, an etching method in which a chemical solution is used for dissolution and removal is used. In the case of etching, an etching solution having a selective etching property is used so that the matrix 10 is dissolved but the material forming the primary electrodeposition layer 15, the frame 3, and the metal layer 7 is not affected.

  The primary electrodeposition layer 15 is made of a nickel alloy such as nickel or nickel-cobalt suitable for electroforming, and is formed by electroforming on a portion of the matrix 10 where the primary pattern resist 14 is not present. In the vapor deposition mask 1, the primary electrodeposition layer 15 is formed as a mask main body 2 that covers the surface of the vapor deposition substrate excluding the vapor deposition through holes 8 corresponding to vapor deposition target portions such as a light emitting layer in the vapor deposition substrate. The Rukoto.

  The primary pattern resist 14 is formed of an insulating material having resistance to dissolution with respect to an electrolytic solution used for electroforming the primary electrodeposition layer 15, and the primary electrodeposition layer 15 that is preset on the mother die 10 is not formed. It arrange | positions corresponding to an arrangement | positioning part, and is removed after formation of the primary electrodeposition layer 15 (refer FIG. 8, FIG. 9).

  The primary pattern resist 14 is disposed prior to the formation of the primary electrodeposition layer 15 on the mother die 10, and a photosensitive resist, for example, a negative photosensitive dry film resist is applied to the mother die 10 with a predetermined thickness, For example, it is disposed so as to have a thickness of about 20 μm, and ultraviolet irradiation is performed with a mask film 12 having a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position of the primary electrodeposition layer 15. The film is formed in a shape corresponding to the non-arranged portion of the primary electrodeposition layer 15 through processing such as curing by exposure and development for removing the resist in the non-irradiated portion.

  The secondary pattern resist 18 is formed of an insulating material having resistance to dissolution with respect to an electrolytic solution used in plating of the metal layer 7, and is disposed corresponding to a predetermined non-arranged portion of the metal layer 7. After the formation of the metal layer 7 and the separation of the mother die 10, it is removed (see FIGS. 14 and 15).

  The secondary pattern resist 18 is formed by sticking a photosensitive resist, for example, a negative photosensitive dry film resist, on the master 10 and the primary electrodeposition layer 15 that has already been arranged, and at the same time, the metal layer of the vapor deposition mask 1. 7 and a series of steps of performing exposure by ultraviolet irradiation in a state where the mask film 17 having a predetermined pattern corresponding to the position of the frame body 3 is placed, once or a plurality of times to obtain a necessary resist thickness, Through a process such as development for removing the photosensitive material in the non-irradiated part in the exposure, the metal layer 7 is formed in a shape corresponding to the non-arranged part (pattern forming region 2a of the mask body 2).

  The metal layer 7 is made of nickel, nickel-cobalt alloy, or the like, and is exposed on the matrix 10 and the already disposed primary electrodeposition layer 15 and the frame 3 where the secondary pattern resist 18 is not disposed and exposed. The structure is formed by plating.

  The metal layer 7 joins the outer peripheral edge 2b of the pattern formation region 2a of the mask body 2 and the frame body 3. The metal layer 7 is laminated by plating on the upper surface of the mask body 2 related to the outer peripheral edge 2b of the pattern formation region. Specifically, the metal layer 7 includes the upper surface of the primary electrodeposition layer 15 corresponding to the outer peripheral edge 2b of the mask body 2, the upper surface of the frame 3, the side surface on the pattern forming region 2a side, and the primary electrodeposition layer 15 (mask body 2). ) And the frame 3, so that the outer peripheral edge 2 b of the mask body 2 and the opening peripheral edge of the frame 3 are integrally connected so as not to leave.

Next, a mask manufacturing process using the mother die holder according to the present embodiment will be described.
First, the resist layer 11 is disposed on the mother die 10 in correspondence with the vapor deposition through holes 8 of the mask body 2, that is, the non-arranged portions of the primary electrodeposition layer 15 that are set in advance on the mother die 10 (FIG. 8). Specifically, for example, a negative photosensitive dry film resist is formed on the surface of the mother die 10 according to a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposition layer 15 to be formed. Several layers are laminated and a resist layer 11 is formed by thermocompression bonding (see FIG. 8A).

Then, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15 is adhered to the surface of the resist layer 11 such as having a light transmitting hole 12a corresponding to the vapor deposition through hole 8. Then, each process of hardening by the exposure by ultraviolet irradiation (refer FIG. 8 (B), (C)), the development which removes the resist of the non-irradiated part masked, and drying is performed. In this way, the primary pattern resist 14 corresponding to the non-arranged portion of the primary electrodeposition layer 15 is formed on the mother die 10 (see FIG. 9A).
The primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other method, and the formation method is not limited to the above.

  The mother die 10 having the primary pattern resist 14 is formed with the primary electrodeposition layer 15 by electroforming in a state of being attached to the support device 60 (see FIGS. 9B and 9C). Specifically, first, after the mother die 10 is placed on the substrate portion 61 of the support device 60 after the frame-shaped support portion 62 is removed, the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts. The mother die 10 is sandwiched between the protruding portion 62 a of the frame-like support portion 62 and the substrate portion 61, and the mother die 10 is restrained and supported so as not to be detached from the substrate portion 61.

  At this time, the contact part 63 provided so as to overlap the members of the two long sides of the frame-like support part 62 is in electrical contact with the surface end of the mother die 10, and the contact 63 and the mother die 10 becomes conductive. In addition, each contact portion 63 comes into contact with the mother die 10, and there is no gap between the frame-like support portion 62 and the mother die 10 on the two sides where the contact portions 63 are present. By receiving a fixed support force symmetrically from the two sides of the support portion 62, the support portion 62 is fixed on the substrate portion 61 (see FIG. 10).

  In a state where the mother die 10 is fixed so as not to be displaced with respect to the support device 60 in this manner, the mother die 10 and the support device 60 are placed in an electroforming tank that has been built under a predetermined condition, and the mother die 10 is connected through the contact portion 63 of the support device 60. By energizing the mold 10, electroforming of an electrodeposited metal such as a nickel alloy on the surface (exposed region) not covered with the primary pattern resist 14 of the mother mold 10 within the thickness range of the primary pattern resist 14. Thus, for example, a primary electrodeposition layer 15 to be the mask body 2 having a thickness of 12 μm is formed (see FIG. 11A).

  At the time of this electroforming, by fixing the mother die 10 on the two opposite sides of the frame-like support portion 62 in the support device 60, the fixing force is applied in a balanced manner without being biased, and the primary formed on the mother die 10 The dimensional accuracy of the electrodeposition layer 15 can be stabilized without changing from end to end.

  After the completion of electroforming, the mother die 10 taken out together with the support device 60 from the electroforming tank is removed from the support device 60 (see FIG. 11B). And the primary electrodeposition layer 15 used as the mask main body 2 provided with many independent vapor deposition through-holes 8 which make the predetermined vapor deposition pattern 9 is obtained by dissolving and removing the primary pattern resist 14 from the mother die 10 ( (See FIG. 11C).

  After the primary electrodeposition layer 15 is obtained, a resist layer 16 is disposed on the entire surface of the mother die 10 including the portion where the primary electrodeposition layer 15 is formed. Specifically, for example, one or several negative photosensitive dry film resists having a predetermined thickness (for example, about 15 μm) are laminated on the surface side of the mother die 10 and the resist is formed by thermocompression bonding. The layer 16 is formed (see FIG. 12A).

Then, as shown in FIG. 12B, a mask film 17 having a light transmitting hole 17a corresponding to the pattern formation region 2a of the mask body 2 is brought into close contact with the surface of the resist layer 16, and then exposed by ultraviolet irradiation. (See FIGS. 12B and 12C). Thereby, the part corresponding to the pattern formation region 2a becomes the resist layer 16a cured by exposure, and the other part becomes the unexposed resist layer 16b.
Thereafter, a process of dissolving and removing the unexposed resist layer 16b exposed on the surface is performed to form a secondary pattern resist 18 covering the pattern formation region 2a (see FIG. 13A).

  After forming the secondary pattern resist 18 in this way, the adhesive layer 19 previously disposed on the lower surface side of the frame body 3 that has been formed through the frame body forming step is formed at a predetermined position on the primary electrodeposition layer 15. They are aligned and arranged (see FIG. 13B).

The frame 3 in this state can be temporarily fixed so as not to move easily on the primary electrodeposition layer 15 due to the adhesiveness of the adhesive layer 19.
For the temporarily fixed frame 3, if necessary, a process of applying a load from the top of the frame 3 and press-bonding is performed to make the frame 3 more difficult to separate from the primary electrodeposition layer 15. You can also.

After the frame body 3 is arranged, the metal layer 7 is formed by plating in a state where the mother die 10 is attached to the support device 60 together with the mother die holder 50 (see FIG. 13C).
Specifically, the mother die holder 50 is placed on the substrate portion 61 of the support device 60 after the frame-like support portion 62 is removed, and the mother die 10 is placed on the mother die holder 50. Since the mother die 10 has ferromagnetism, it is attracted by the magnetic force of the mother die holder 50 and held in a state along the reference surface 51a.

  After placing the mother die, the frame-like support portion 62 is attached to the substrate portion 61 with bolts and nuts, and the mother die 10 and the mother die holder 50 are placed between the protruding portion 62a of the frame-like support portion 62 and the substrate portion 61. The mother die 10 and the mother die holder 50 are restrained and supported so as not to be detached from the substrate portion 61.

  At this time, the contact portion 63 provided on the long side portion of the frame-like support portion 62 is in electrical contact with the surface end portion of the mother die 10 in the same manner as described above, and the contact portion 63 and the mother die 10 are brought into a conductive state. . In addition, each contact portion 63 comes into contact with the mother die 10, and there is no gap between the frame-like support portion 62 and the mother die 10 on the two sides where the contact portions 63 are present. By receiving a fixed support force symmetrically from the two sides of the support portion 62, the support portion 62 is fixed on the substrate portion 61 (see FIGS. 4B and 4C).

  Further, in this case, the mother die 10 supported by the mother die holder 50 is in a state along the reference surface 51a of the mother die holder 50 by suction by the mother die holder 50, so that the mother die 10 Even when there is distortion, the distortion is corrected, and the master mold 10 can maintain a flat shape.

  The mother die 10 attached to the support device 60 together with the mother die holder 50 is placed in a plating bath that is bathed under a predetermined condition, and the mother die 10 is energized through the contact portion 63 of the support device 60. As a result, the upper surface of the primary electrodeposition layer 15 exposed to the surface related to the outer peripheral edge 2b of the pattern formation region 2a without being covered with the secondary pattern resist 18, the primary electrodeposition layer 15a on the lower side of the frame 3 and its side Then, a metal layer 7 is formed on each exposed surface of the mother die 10 exposed on the surface and on the surface of the frame 3 by plating with an electrodeposited metal (see FIG. 14A). By this metal layer 7, the primary electrodeposition layer 15 and the frame 3 can be integrally connected so as not to leave.

  At the time of this plating, the mother die 10 on which the primary electrodeposition layer 15 is formed is held by the mother die holder 50 so as to have an appropriate shape, so that the integration with the frame 3 by the metal layer 7 is correct. It is executed under the positional relationship and can be integrated without being affected by the distortion of the matrix 10.

  When the formation of the metal layer 7 is completed, the mother die 10 is taken out from the plating tank together with the mother die holder 50 and the support device 60. The mother die 10 is removed from the supporting device 60 together with the mother die holder 50 (see FIG. 14B), and is also removed from the mother die holder 50 (see FIG. 15A).

Then, as a final step, the matrix 10 is separated from the integrated primary electrodeposition layer 15, the frame body 3, and the metal layer 7 (see FIG. 15B).
After the matrix 10 is separated, the primary electrodeposition layer 15a existing on the lower side of the frame 3 is removed together with the adhesive layer 19, and then the secondary pattern resist 18 is removed, whereby the deposition mask 1 is manufactured. (See FIG. 15C). If the adhesive layer 19 remains on the lower side of the frame 3, it is removed when the secondary pattern resist 18 is removed.

  In addition, the secondary pattern resist 18 is removed before the mother die 10 is separated, and then the mother die 10 is separated, and the primary electrodeposition layer 15 a existing on the lower side of the frame 3 is removed together with the adhesive layer 19. A procedure may be used.

  As described above, the mother die holder according to the present embodiment holds the mother die by attracting the mother die 10 with a magnetic force in the plating step of integrating the frame 3 with the primary electrodeposition layer 15 on the mother die 10. Since the mother die 10 is brought into close contact with the substantially planar reference surface 51a of the tool 50 and is held in a state where the mother die 10 is matched to the reference surface shape, the frame 3 is integrated with the primary electrodeposition layer 15 on the mother die. When the metal layer 7 is formed by plating on the primary electrodeposition layer 15 and the frame body 3 on the mother die 10 having an appropriate shape and arrangement along the reference surface 51a in the plating step to be converted, the frame body 3 and the primary The electrodeposition layer 15 is fixed and integrated with the metal layer 7 in an appropriate positional relationship, and the frame body 3 is allowed to function as it is to maintain an appropriate positional relationship even after the mother die 10 is separated. A mask of the same quality can be reliably obtained without being affected by the condition of the mold 10, and the master mold 10 Suppressed variations in accuracy of the mask caused by distortion and the like, accurately homogeneous product is obtained in the manufacturing process such as vapor deposition using a mask.

  In the mask manufacturing process using the mother die holder according to the embodiment, the mother die 10 on which the primary electrodeposition layer 15 has been formed in advance is used as the mother in the plating process for the primary electrodeposition layer 15 and the frame 3. Although it is configured to support the mother die 10 so as to have an appropriate shape in the plating step so as to be held by the die holder 50, in addition to this, it is also supported in the forming step by electroforming of the primary electrodeposition layer 15 A structure in which the mother die 10 is attached to the apparatus 60 together with the mother die 10, the mother die 10 is brought into close contact with the reference surface 51 a of the mother die holder 50, and the mother die 10 is held in an appropriate shape and arrangement. Even if the primary electrodeposition layer 15 is not integrated with the frame 3, the shape of the mask body 2 at the time of completion of the mask can be adjusted so as to have an appropriate shape that is not affected by the distortion of the matrix 10. Further improvement can be achieved And thus.

  Further, in such a process of forming the primary electrodeposition layer 15 by electroforming or an integration process by plating the primary electrodeposition layer 15 and the frame 3, the support device 60 for supporting and fixing the mother die 10 and the mother die 10 are provided. The mother mold holder 50 to be held is made of a material that is resistant and does not deteriorate with respect to the chemical used for developing the unexposed resist and the chemical used for removing the resist after electroforming or plating. In addition, the support device 60 to which the mother die 10 and the mother die holder 50 are attached can be easily handled together with the mother die 10 in each device used in a series of steps from formation of resist to removal, and the mother die alone. If the shape and size are such that each step relating to the resist can be performed on the mother die 10 on the supporting device 60 in the same manner as in FIG. Take 60 Thus, until after the plating step of integrating the frame body 3 with the primary electrodeposition layer 15 on the mother die 10, the steps relating to mask manufacturing are performed while the mother die 10 remains attached to the support device 60. The mother die 10 may not be removed from the support device 60 other than casting or plating. In this case, the mask manufactured by preventing the occurrence of a situation in which unnecessary force is applied to the mother die 10 to cause distortion of the mother die 10 by minimizing the attachment and detachment of the mother die 10 to the support device 60. The adverse effect from the mother die 10 can be further suppressed.

  Moreover, in the mother die holder according to the embodiment, the plate-like magnet portion 51 as a magnetic force generating portion is provided, and the entire reference surface 51a is the surface of the magnet. If it is possible to generate a sufficient attractive force with a magnet as a magnetic force generation unit so that the mother die 10 can be brought into close contact with the reference surface of the holder, a plurality of small-sized members are formed on another flat plate member forming the reference surface. The magnet is provided as a partly scattered arrangement so that the reference surface also includes the surface of a member other than the magnet, or the magnet is disposed inside the holder and does not appear on the surface, and the reference surface is entirely other than the magnet. It can also be set as the structure used as a member surface. In addition, the magnetic force generator that attracts the mother die with the mother die holder is not limited to a permanent magnet, and an electromagnet may be used.

  In addition, the mother die holder 50 according to the embodiment is a plate-like body that is a separate body from the support device 60 that supports the mother die 10 in the process of electroforming or plating, and together with the mother die 10 as necessary. It is configured to be used for holding the mother die 10 by being attached to the support device 60, but is not limited to this, as long as it has a reference surface and a magnetic force generating part that attracts the mother die 10 to it. It can also be set as the structure integrated in the support apparatus 60 integrally. In this case, the surface of the substrate portion 61 on which the mother die 10 is placed in the support device 60 also serves as a reference surface of the mother die holder. The magnetic force generating portion such as a magnet is provided on the substrate portion 61 as long as it generates a sufficient attractive force so that the mother die 10 can be brought into close contact with the surface of the substrate portion 61 as a reference surface. It can also be set as the structure provided in 62. FIG.

DESCRIPTION OF SYMBOLS 1 Deposition mask 2 Mask main body 2a Pattern formation area 2b Outer periphery 3 Frame body 7 Metal layer 8 Deposition through hole 9 Deposition pattern 10 Master mold 11 Resist layer 12 Mask film 12a Translucent hole 14 Primary pattern resist 15, 15a Primary electrodeposition layer DESCRIPTION OF SYMBOLS 16 Resist layer 17 Mask film 17a Transmissive hole 18 Secondary pattern resist 19 Adhesive layer 50 Master mold holder 51 Magnet part 51a Reference surface 52 Reinforcement plate 60 Support device 61 Substrate part 62 Frame-like support part 62a Protrusion part 63 Contact part

Claims (5)

A substantially planar reference surface;
Comprising one or a plurality of magnetic force generation portions that enable the ferromagnetic material to be adsorbed to the reference surface by magnetic force,
A master die for electroforming that is made into a plate shape including a ferromagnetic substance can be held in a state of being attracted by the magnetic force of the magnetic force generation unit and in close contact with the reference surface. Retaining tool. In the mother mold holder according to claim 1,
The matrix holder is characterized in that the magnetic force generating part has a plate-like magnet part having a predetermined surface as the reference surface. In the mother mold holder according to claim 2,
A mother mold holder, comprising: a reinforcing plate that is formed of a plate-like body having a strength that does not easily deform, and is integrally fixed to a surface of the magnet portion opposite to the reference surface. In a mask manufacturing method comprising a metal mask main body provided with a large number of through holes and a metal frame disposed so as to surround the outside of the mask main body,
A first electroforming step of forming a primary electrodeposition layer corresponding to the mask body by metal electroforming at a plurality of predetermined positions on a matrix;
A frame body disposing step of disposing the frame body on a matrix so as to have a preset positional relationship with respect to the primary electrodeposition layer;
A metal layer is plated in a predetermined range extending from a part or all of the surface of the frame to a part of the surface of the primary electrodeposition layer, and the frame and the primary electrodeposition layer are not separated via the metal layer. A second electroforming process for connecting together,
A separation step of separating the matrix and the integral primary electrodeposition layer, the frame and the metal layer,
The matrix is a plate-like body containing a ferromagnetic material as a material,
At least in the second electroforming step, the surface on the side opposite to the side where the primary electrodeposition layer and the frame body of the mother die are located is adsorbed by a magnetic force to a substantially planar reference surface arranged along the mother die. A mask manufacturing method characterized by being performed in a state. In the mask manufacturing method according to claim 4,
At least the second electroforming step attaches the mother die and a mother die holder that can hold the mother die in a state of being attracted by a magnetic force and in close contact with the reference surface to a predetermined support device. Performed in a state
The support device is
A substrate portion that is a rectangular plate-shaped body;
A frame-like support portion that is a frame-like body corresponding to each side of the rectangle of the substrate portion and is detachably attached to the substrate portion;
It is formed of a metal thin plate material, and includes a contact portion for energization to a mother die provided to overlap at least two parallel frame side portions of the frame-shaped support portion,
At least before the second electroforming step, the frame-shaped support is performed after the mother mold is held by the mother mold holder and the mother mold holder is placed on the substrate portion of the support device. Is attached to the substrate portion, the mother die and the mother die holder are sandwiched between the frame-like support portion and the substrate portion, and the contact portion provided on the two frame side portions of the frame-like support portion is overlapped with the mother portion. While making the contact surface part and the mother die conductive, contact the mold surface end, and apply a fixed support force symmetrically to the mother die from the two frame sides of the frame-like support part with the contact parts. A method for manufacturing a mask, characterized in that a mold is fixed on a substrate.

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