JP2021105221A - Support device - Google Patents

Abstract

To provide a support device capable of holding and fixing a matrix in an appropriate arrangement state in a step of plating and the like and precisely executing electroforming or a plating step on the matrix.SOLUTION: A support device includes a flat substrate part, a frame support part arranged to have a frame shape on the substrate part, and a contact part that can be electrically connected to a matrix for electroforming while being interposed between the substrate part and the frame support part.SELECTED DRAWING: Figure 3

Description

The present invention relates to a support device that supports a master mold for electrocasting in an electrocasting or plating process.

A thin-film deposition mask method is often used as a method for forming a light emitting layer of an organic EL (Electroluminescence) element. In this thin-film deposition mask method, in order to deposit and form an organic luminescent substance at a desired position on a substrate made of a transparent material such as glass, a thin-film deposition mask in which a portion corresponding to a vapor deposition portion of the substrate is removed and perforated is used.
Since it is necessary to form such a thin-film deposition mask thinly and to form a large number of thin-film deposition holes through which a vapor-deposited substance passes with high accuracy, it has been recently proposed to form such a thin-film deposition mask by using electroforming.

In mask formation by electroforming, resists are placed in advance at many locations that serve as thin-film deposition holes on the surface of the master mold, and then electrodeposition made of a metal that can be electroformed, such as nickel, that forms a mask on the surface of the master mold by electroforming. A layer is formed, and at the same time, a state in which a large number of vapor-deposited through holes are provided in a predetermined pattern is generated. If necessary, if the frame for reinforcement is integrated by plating etc. to obtain the desired mask structure,
The master mold will be separated and completed as a vapor deposition mask.
As an example of a conventional thin-film deposition mask manufactured by using such electroforming, Japanese Patent Application Laid-Open No. 2005-15
Some are disclosed in Gazette No. 908.

Japanese Unexamined Patent Publication No. 2005-15908

The conventional thin-film deposition mask has the configuration shown in the above-mentioned patent document, and by appropriately integrating the frame body with the mask body by using the electroforming method, the mask can be used as a mask when heat is applied in the vapor deposition process. It is possible to suppress the relative deformation of the substrate and prevent the deterioration of the positional accuracy of the thin-film deposition product.

However, in the recent market, there is a demand for higher accuracy of the thin-film deposition product, and the mask has been made thinner and the through-hole pattern has been made finer, and the influence of the position accuracy of the mask has been accompanied by this. Is relatively large.

When a combination structure of a mask body and a frame is adopted as in a conventional vapor deposition mask, the mask body exists as an electrodeposition layer on the master mold in the process of integrating the mask body and the frame. Therefore, the integration reflects the accuracy of the master mold as it is.

If the master mold has distortion such as warpage due to the problem of accuracy of the master mold itself or the influence of electric casting in the previous process, if the electrodeposition layer on the master mold and the frame are integrated, they will be integrated. Since the distortion of the master mold does not change and is maintained as it is before and after the conversion, the influence of the distortion of the master mold affects the position accuracy of the mask body, which makes it difficult to further improve the accuracy of the mask. Had the problem.

The present invention has been made to solve the above problems, and it is possible to hold and fix the master mold in an appropriate arrangement state in a process such as plating, and to accurately execute the electroforming and plating steps on the master mold. It is an object of the present invention to provide a support device.

The master mold holder according to the disclosure of the present invention includes a substantially flat reference surface and one or more magnetic force generating portions capable of attracting a ferromagnetic substance by magnetic force to the reference surface, and is ferromagnetic. A master mold for electric casting, which contains a substance and is formed into a plate shape, can be attracted by the magnetic force of the magnetic force generating portion and can be held in a state of being in close contact with the reference surface.

As described above, according to the disclosure of the present invention, the master mold for electrocasting is attracted by the magnetic force of the magnetic force generating portion, the master mold is brought into close contact with the substantially flat reference surface, and the master mold is aligned with the reference surface shape. By holding it in a state, it can be applied to the plating process of integrating the frame body with the primary electrodeposition layer on the master mold during mask manufacturing, and on the master mold having an appropriate shape and arrangement along the reference plane. If a metal layer is formed by plating on the primary electrodeposition layer and the frame body, the frame body and the primary electrodeposition layer can be fixedly integrated with the metal layer while maintaining an appropriate positional relationship, and the frame body can be formed even after the mother mold is separated. It will be made to function to maintain the proper positional relationship as it is, the mask of the same quality can be surely obtained without being affected by the condition of the master mold, and the variation in the accuracy of the mask due to the master mold can be suppressed. , A uniform product can be obtained with high accuracy by a manufacturing process such as vapor deposition using a mask.

Further, the master mold holder according to the disclosure of the present invention has, if necessary, a plate-shaped magnet portion in which the magnetic force generating portion has a predetermined surface as the reference surface.

As described above, according to the disclosure of the present invention, a plate-shaped magnet portion is used as a main part of the magnetic force generating portion, and the master mold is attracted to the reference surface which is one surface of the magnet portion by the magnetic force generated from the reference surface. By making the magnets adhere to the reference surface, the attractive force is evenly and evenly applied to the reference surface of the magnet itself, and the state of close contact with the reference surface of the mother die can be obtained more reliably. In the plating process of integrating the frame with the primary electrodeposition layer on the master mold while efficiently holding the shape and arrangement in an appropriate shape according to the shape, the correct positional relationship between the frame and the primary electrodeposition layer. Can be reliably integrated with.

Further, the master mold holder according to the disclosure of the present invention is formed of a plate-like body having a strength that does not easily deform, if necessary, and is integrally fixed to a surface of the magnet portion opposite to the reference surface. , It is equipped with a reinforcing plate.

As described above, according to the disclosure of the present invention, in the plate-shaped magnet portion forming the magnetic force generating portion, a reinforcing plate having a strength that does not deform is fixed to the surface opposite to the reference surface, and the magnet portion is a reinforcing plate. By obtaining a state in which the base surface is reinforced and does not easily deform, the shape of the reference surface to which the base mold is brought into close contact is firmly fixed, and the base surface shape is maintained with high accuracy without this deformation. By matching the molds, the master mold can be matched to the desired shape with high accuracy, and the plating process is executed on the master mold that has exactly the correct shape and arrangement, so that the primary mold is primary on the master mold. It is possible to proceed with the plating process while ensuring an appropriate positional relationship between the electrodeposition layer and the frame with high accuracy, and to improve the accuracy of the mask obtained by integrating the primary electrodeposition layer and the frame. can.

Further, the mask manufacturing method according to the disclosure of the present invention is a method for manufacturing a mask including a metal mask body provided with a large number of through holes and a metal frame body arranged so as to surround the outside of the mask body. A first electroforming step of forming a primary electrodeposition layer corresponding to the mask body by electroforming metal at a plurality of predetermined positions on the master mold, and the frame body are preset with respect to the primary electrodeposition layer. A metal layer in a predetermined range extending from a part or all of the surface of the frame to a part of the surface of the primary electrodeposition layer in a frame arrangement step of arranging the frame on the master mold so as to have a positional relationship. Is plated and formed,
A second electroforming process in which the frame body and the primary electrodeposition layer are integrally connected via the metal layer so as not to separate from each other, and the master mold and the integrated primary electrodeposition layer, the frame body, and the metal layer are separated. The mother mold is a plate-like body containing a ferromagnetic substance as a material, and at least the second electroforming step is performed.
This is performed in a state where the surface on the side opposite to the side with the primary electrodeposition layer and the frame of the master mold is attracted by magnetic force to a substantially planar reference plane arranged along the master mold.

As described above, according to the disclosure of the present invention, in the step of forming the primary electrodeposition layer corresponding to the mask body by electrocasting on the master die and then integrating the frame body with the primary electrodeposition layer by plating, the master die. Is attracted to a predetermined reference surface by magnetic force, and then plating is performed so that the master mold is aligned with the reference surface.
After firmly holding the mother mold and the primary electrodeposition layer formed on this mother mold in the same positional relationship at all times,
Integrated plating can be performed on the primary electrodeposition layer and the frame, and even if the conditions differ for each master die, the master die and the primary electrodeposition layer are modified to an appropriate arrangement, and the integration by plating is correct. It can be executed under the positional relationship, and when the mask is finally obtained, the mask body is reinforced and supported by a frame body appropriately integrated with the mask body to suppress the misalignment of each part of the mask body. Masks of the same quality can be produced, and masks can be used to produce highly accurate and homogeneous products.

Further, in the mask manufacturing method according to the disclosure of the present invention, if necessary, at least the second electric casting step is in a state where the master mold and the master mold are attracted by magnetic force and brought into close contact with the reference surface. The support device is attached to a predetermined support device, and the support device is attached to the support device.
A substrate portion that is a rectangular plate-shaped body, a frame-shaped support portion that is a frame-shaped body corresponding to each side of the rectangle of the substrate portion and is detachably attached to the substrate portion, and a thin metal plate material. It is provided with a contact portion for energizing the master mold, which is formed and is provided on at least two parallel frame side portions of the frame-shaped support portion, and at least before the second electrocasting step. After the mother mold is held by the mother mold holder and the mother mold holder is placed on the substrate portion of the support device, the frame-shaped support portion is attached to the substrate portion to attach the frame-shaped support portion to the frame-shaped support portion. The master mold and the master mold holder are sandwiched between the base and the substrate portion, and the contact portion provided on the two frame side portions of the frame-shaped support portion is brought into contact with the surface end portion of the master mold to form the contact portion. While making the master mold conductive, a fixed bearing force is applied symmetrically to the master mold from the two frame side portions of the frame-shaped support portion with the contact part, and the master mold is fixed on the substrate portion. be.

As described above, according to the disclosure of the present invention, in the second electrocasting step of integrating the frame body with the primary electrodeposition layer by plating, the support device provided with the substrate portion, the frame-shaped support portion and the contact portion has a master mold. The master mold is placed in close contact with the reference surface of the master mold holder, and the master mold is sandwiched between the frame-shaped support portion and the substrate portion of the support device. By bringing the contact portion into contact with the surface of the master mold at the frame side portion and fixing the master mold on the substrate portion, the force applied to the master mold from each contact portion of the frame-shaped support portion is of an appropriate magnitude and each contact portion. The fixing force applied to the mother mold is not biased and distorts the mother mold, and the mother mold receives the fixed bearing force symmetrically at its two ends and is stably supported. The electrocasting process of 2 can be performed accurately on the master mold.

It is a partially omitted schematic perspective view of the master mold holder which concerns on one Embodiment of this invention. It is a master mold holding state explanatory drawing of the master mold holder which concerns on one Embodiment of this invention. It is a schematic plan view of the master mold holder and the master mold support device attachment state which concerns on one Embodiment of this invention. 3 is an enlarged view of a cross-sectional view taken along the line AA of FIG. 3 and parts C and D in the cross-sectional view. It is the BB cross-sectional view of FIG. 3 and the enlarged view of the part E and part F in the cross-sectional view. It is a schematic plan view of the vapor deposition mask manufactured by the mask manufacturing method which concerns on one Embodiment of this invention. It is a structural explanatory drawing of the main part of the vapor deposition mask manufactured by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the primary pattern resist formation process in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the support device attachment process of the primary pattern resist-formed mother mold in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the support device mounting state of the master mold in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the process from the formation of a primary electrodeposition layer to the removal of a primary pattern resist in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the secondary pattern resist formation process in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention. It is explanatory drawing of the frame body mounting process in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention, and the support device mounting process of a master die and a master die support. It is explanatory drawing of the electrodeposition metal layer formation state in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention, and the removal state from the support device of a master die and a master die holder. It is explanatory drawing of the separation process from the master mold holder and the master mold of the mask in the mask manufacturing by the mask manufacturing method which concerns on one Embodiment of this invention.

Hereinafter, the master mold holder according to the embodiment of the present invention will be described with reference to FIGS. 1 to 15.
In this embodiment, an example of a configuration applied to the manufacture of a vapor deposition mask for an organic EL element will be described.
In each of the above figures, the master mold holder 50 according to the present embodiment has a reference surface 51 having a substantially flat surface on one surface.
The substantially plate-shaped magnet portion 51 as the magnetic force generating portion, which is designated as a and is capable of adsorbing a ferromagnetic substance on the reference surface 51a, is integrated with the surface of the magnet portion 51 opposite to the reference surface 51a. It is configured to include a reinforcing plate 52 made of a metal plate fixed to the above.

The magnet portion 51 is a rectangular plate-shaped permanent magnet, and one surface thereof is a substantially flat reference surface 51a.
The master mold 10 containing a ferromagnetic substance such as SUS430 material as a material can be adsorbed on the reference surface 51a.

The reinforcing plate 52 is a metal plate made of, for example, SUS430 material, which has sufficient strength not to be easily deformed, and is integrally fixed to a surface of the magnet portion 51 opposite to the reference surface 51a.

By suction by the master mold holder 50, the master mold 10 having a metal portion having a ferromagnetic substance is brought into close contact with the flat reference surface 51a of the master mold holder 50, so that the master mold 10 is distorted. Even if there is, such distortion can be corrected to an appropriate state.

The master mold 10 which is adsorbed and held by the master mold holder 50 has a rectangular shape or a square shape which is made of a material having conductivity such as stainless steel or steel and containing a ferromagnetic substance, which is used in the manufacturing process of the vapor deposition mask. It is a plate-like body. When the primary electrodeposition layer 15 and the metal layer 7 are formed in the vapor deposition mask manufacturing process, energization is performed in the electrolytic solution through the master mold 10 so that the resist on the surface of the master mold 10 is not covered. A layer of electrodeposited metal such as a primary electrodeposition layer 15 and a metal layer 7 is formed in a possible portion by electroforming (plating).

The master mold holder 50 according to the present embodiment is supported by a support device 60 for an electroforming or plating process in a state of being overlapped with the master mold 10 so as to be in close contact with the master mold holder 50.
The support device 60 includes a flat substantially plate-shaped substrate portion 61, a frame-shaped support portion 62 arranged in a frame shape on the substrate portion 61, a predetermined portion of the frame-shaped support portion 62, and a substrate portion 61. It is configured to include a contact portion 63 that is interposed between the two and is electrically contactable with the master mold.

The substrate portion 61 is a rectangular plate-like body having a sufficient thickness (for example, a thickness of 10 mm) that is not easily deformed, and the master molds 10 are arranged directly or stacked with the master mold holder 50 interposed therebetween. It is a configuration to be installed. Since the substrate portion 61 is bathed in the plating tank together with the master mold 10, the substrate portion 61 is not affected by the electrolytic solution used in electroplating or plating, for example, is made of vinyl chloride resin.

The frame-shaped support portion 62 is a frame-shaped combination of four elongated plate-shaped members corresponding to each side of the substrate portion 61, and is detachably attached to the substrate portion 61 with bolts and nuts. The inner peripheral portion of the frame-shaped support portion 62 is provided at a predetermined distance from the surface of the substrate portion 61 in a state where the frame-shaped support portion 62 is attached to the substrate portion 61, and is placed between the frame-shaped support portion 62 and the substrate portion 61. A protruding portion 62a is provided so as to sandwich the mold 10 and the mother mold holder 50 and restrain them so as not to be detached.

With the master mold 10 and the master mold holder 50 sandwiched between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61, each member of the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts. As a result, the master mold 10 and the master mold holder 50 are restrained so as not to be displaced or dislodged from the substrate portion 61.

The contact portion 63 is formed of a thin metal plate material such as a copper plate having a thickness of, for example, about 0.3 μm, and is a protruding portion 62a of a plate-shaped member having two long sides of the frame-shaped support portion 62. It is provided on top of each other. The contact portion 63 includes a protruding portion 62a of the frame-shaped support portion 62 and a substrate portion 6.
In a state where the frame-shaped support portion 62 is attached to the substrate portion 61 so as to sandwich the master mold 10 with 1.
The two ends of the surface of the master die 10 can be electrically contacted. In this case, at the two side portions of the frame-shaped support portion 62, each contact portion 63 comes into contact with the master mold 10 to prevent a gap between the frame-shaped support portion 62 and the master mold 10 so that the master mold 10 is not formed. Is fixed on the substrate portion 61, and is stably supported by receiving a fixed bearing force symmetrically at the two ends.

With the master mold 10 and the master mold holder 50 sandwiched between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61, each member of the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts. As a result, the master mold 10 is supported so as not to come off from the substrate portion 61, and the two contact portions 63 overlapping the frame-shaped support portion 62 are in close contact with the master mold 10, so that the master mold 10 has two end portions. It is pressed against the substrate portion 61 and fixed symmetrically on two sides.

The contact portions 63 are arranged to face each other at two of the frame-shaped support portions 62, and the two contact portions 63 are brought into close contact with the master mold 10 in a state where the frame-shaped support portion 62 is attached to the substrate portion 61 to form a master mold. The configuration is such that the 10 is fixedly supported at two symmetrical locations, but the configuration is not limited to this, and the master mold 10 may be supported at four symmetrical locations of the support device 60. In that case, the contact portion 63 is changed to the frame-shaped support portion 62.
In addition to arranging and supporting the four plate-shaped members in the same manner, the contact portion 63 is arranged on the predetermined two side portions of the frame-shaped support portion 62, while the dummy having the same thickness does not affect electrotyping or plating. The contact portion may be provided on the other two side portions of the frame-shaped support portion 62.

In addition, the contact portion 63 is arranged on the predetermined two side portions of the frame-shaped support portion 62, while the frame-shaped support portion 6 is arranged.
In the other two side portions of 2, assuming that the thickness of the protruding portion 62a of the frame-shaped support portion 62 is increased by the thickness of the contact portion 63, the four side portions of the frame-shaped support portion 62 are symmetrical with respect to the master mold 10. It can also be configured to support four locations.

When the master mold 10 is supported by the four side portions of the frame-shaped support portion 62 in the support device 60 in this way,
A more stable fixing state can be obtained, but the force applied to the mother mold from each contact portion of the frame-shaped support portion 62 is appropriately large so that the mother mold is not distorted due to the increase in the fixing force. It is preferable to use a support mechanism that is uniform between the contact sites.

The thin-film deposition mask 1 manufactured by using the mother mold holder 50 according to the present embodiment is arranged so as to surround a plurality of mask bodies 2 in which a large number of thin-film deposition holes 8 are provided in a predetermined pattern and the outside of the mask body 2. It is configured to include a frame body 3.

The mask body 2 is made of a nickel alloy such as nickel or nickel cobalt or other electrodeposited metal as a material, is formed into a sheet by electroforming, and is provided with a large number of independent thin-film deposition holes 8 through which a vapor-deposited substance passes in a predetermined pattern. It is a configuration that can be used.

The mask main body 2 includes an internal pattern forming region 2a provided with a large number of thin-film vapor deposition holes 8 and an outer peripheral edge 2b integrally joined with the frame body 3 via a metal layer 7 formed by plating. In the pattern forming region 2a, a large number of thin-film deposition holes 8 are arranged in rows in a plurality of holes arranged linearly in the front-rear direction for forming a light emitting layer, and the plurality of rows are arranged in parallel in the left-right direction. The matrix-like vapor deposition pattern 9 is formed.

The frame body 3 is a rectangular frame shape having a plate-like body thicker than the mask body 2, is arranged so as to surround the outside of the mask body 2 for reinforcement of the mask body 2, and is connected to the mask body 2. It is a structure that is integrated. Specifically, the frame body 3 is formed in a grid pattern as a whole, and the mask body 2 is located in each of the opening regions partitioned inside the frame body 3 and is integrated with the frame body 3 via the metal layer 7. It is a composition.

The frame 3 is formed of a material having a low coefficient of thermal expansion, for example, a material such as an Invar material which is a nickel-iron alloy or a superinvar material which is a nickel-iron-cobalt alloy. Then, the frame body 3 is connected and integrated with the outer peripheral edge 2b of the pattern forming region 2a of the mask body 2 so as not to be separated from each other by the metal layer 7 formed by plating.

As the material of the frame body 3, a material having a low coefficient of thermal expansion close to that of glass or the like, which is a substrate to be vapor-deposited, for example, glass or ceramic can also be used. In this case, conductivity is imparted to at least the surface of these materials.

In the thin-film deposition mask 1, a primary pattern resist 14 is provided on the surface of the master mold 10 so as to correspond to a non-arranged portion of the primary electrodeposition layer 15, and then primary electroforming is performed on the master mold 10 by electroforming an electrodeposited metal. After the deposition layer 15 is formed, the secondary pattern resist 18 covering the pattern forming region 2a corresponding portion of the primary electrodeposition layer 15 is formed, and the frame body 3 is further arranged so as to surround the primary electrodeposition layer 15. , The metal layer 7 is plated so as to cover the surface of the frame 3 and the outer peripheral edge 2b surface of the primary electrodeposition layer 15.
The primary electrodeposition layer 15, the frame body 3 and the metal layer 7 are integrally connected to each other so as not to separate from the primary electrodeposition layer 15 and the frame body 3 via the metal layer 7. It is manufactured by separating the mother mold 10 and the mother mold 10.

In the process of separating the matrix 10 from the primary electrodeposition layer 15 and the metal layer 7 (see FIG. 15B),
When the master mold 10 is a stainless steel material, a method of physically peeling it off from the vapor deposition mask side by applying force is adopted, and when the master mold 10 is another metal material, it is dissolved and removed using a chemical solution. The etching method is used. In the case of etching, an etching solution having selective etching property is used so that the mother die 10 is dissolved but the materials forming the primary electrodeposition layer 15, the frame body 3 and the metal layer 7 are not affected.

The primary electrodeposition layer 15 is made of a nickel alloy such as nickel or nickel-cobalt suitable for electroforming, and is formed by electroforming on a portion of the master die 10 where there is no primary pattern resist 14. In the thin-film deposition mask 1, the primary electrodeposition layer 15 is formed to form a mask body 2 that covers the surface of the thin-film deposition substrate, excluding the thin-film deposition through holes 8 corresponding to the vapor deposition target points such as the light emitting layer in the vapor deposition substrate. The Rukoto.

The primary pattern resist 14 is formed of an insulating material having solubility resistance to an electrolytic solution used in electroforming of the primary electrodeposition layer 15, and is preset on the master mold 10.
It is arranged so as to correspond to the non-arranged portion of the above, and is removed after the formation of the primary electrodeposition layer 15 (see FIGS. 8 and 9).

The primary pattern resist 14 is disposed on the master die 10 prior to the formation of the primary electrodeposition layer 15, and a photosensitive resist, for example, a negative type photosensitive dry film resist, is used as the master die 1.
A mask film 12 having a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position of the primary electrodeposition layer 15 is arranged at 0 so as to have a predetermined thickness, for example, about 20 μm. In the mounted state, it is formed into a shape corresponding to the non-arranged portion of the primary electrodeposition layer 15 through treatments such as curing by exposure by ultraviolet irradiation and development to remove the resist in the non-irradiated portion.

The secondary pattern resist 18 is formed of an insulating material having solubility resistance to the electrolytic solution used for plating the metal layer 7, and is arranged so as to correspond to a preset non-arranged portion of the metal layer 7. , Is removed after the formation of the metal layer 7 and the separation of the matrix 10 (FIG. 14, FIG.
(See FIG. 15).

In the secondary pattern resist 18, a photosensitive resist, for example, a negative type photosensitive dry film resist is adhered and arranged on the master mold 10 and the already arranged primary electrodeposition layer 15, and the metal layer of the vapor deposition mask 1 is formed. A series of steps of exposure by ultraviolet irradiation with a mask film 17 having a predetermined pattern corresponding to the positions of 7 and the frame 3 placed on the mask film 17 is repeated once or a plurality of times to obtain a required resist thickness. The non-arranged portion of the metal layer 7 (pattern forming region 2a of the mask body 2) undergoes processing such as development to remove the photosensitive material of the non-irradiated portion in the exposure.
It is formed in a shape corresponding to.

The metal layer 7 is made of nickel, a nickel-cobalt alloy, or the like, and is exposed on the master mold 10, the already arranged primary electrodeposition layer 15, and the frame 3 where the secondary pattern resist 18 is not arranged. , It is a structure formed by plating.

The metal layer 7 joins the outer peripheral edge 2b of the pattern forming region 2a of the mask body 2 and the frame body 3. The metal layer 7 is laminated on the upper surface of the mask body 2 related to the outer peripheral edge 2b of the pattern forming region by plating. Specifically, the metal layer 7 includes an upper surface of the primary electrodeposition layer 15 corresponding to the outer peripheral edge 2b portion of the mask body 2, an upper surface of the frame body 3 and a side surface on the pattern forming region 2a side, and a primary electrodeposition layer 15 (mask body 2). ) And the frame body 3 are formed in the gap portion, and the outer peripheral edge 2b of the mask body 2 and the opening peripheral edge of the frame body 3 are integrally connected so as not to separate from each other.

Next, a mask manufacturing process using the master mold holder according to the present embodiment will be described.
First, the resist layer 11 is arranged on the master die 10 in correspondence with the vapor deposition through holes 8 of the mask body 2, that is, the non-arranged portion of the primary electrodeposition layer 15 which is preset on the master die 10 (FIG. 8). Specifically, on the surface side of the master die 10, for example, a negative type photosensitive dry film resist is formed according to a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposition layer 15 to be formed. Several sheets are laminated and thermocompression bonded to form a resist layer 11 (see FIG. 8 (A)).
..

Then, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15 is brought into close contact with the surface of the resist layer 11 so as to have a light-transmitting hole 12a corresponding to the vapor deposition through hole 8. After that, each process such as curing by exposure by ultraviolet irradiation (see FIGS. 8B and 8C), development for removing the resist of the masked non-irradiated portion, and drying are performed. In this way, the primary pattern resist 14 corresponding to the non-arranged portion of the primary electrodeposition layer 15 is formed on the matrix 10.
Formed on top (see FIG. 9 (A)).
The primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other method, and the forming method is not limited to the above.

The master mold 10 having the primary pattern resist 14 is attached to the support device 60 (
(See FIGS. 9B and 9C), the primary electrodeposition layer 15 is formed by electroforming. Specifically, first, the master mold 10 is placed on the board portion 61 of the support device 60 after the frame-shaped support portion 62 is removed, and then the frame-shaped support portion 62 is attached to the board portion 61 with bolts and nuts. The master mold 10 is sandwiched between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61 so that the master mold 10 is restrained and supported so as not to be separated from the substrate portion 61.

At this time, the contact portion 6 provided so as to overlap the members of the two side portions that are the long sides of the frame-shaped support portion 62.
3 electrically contacts the surface end portion of the master mold 10, and the contact portion 63 and the master mold 10 are brought into a conductive state.
Further, each contact portion 63 comes into contact with the master mold 10, and the frame-shaped support portion 6 is formed on two sides of the contact portions 63.
Since no gap is formed between the base mold 10 and the base mold 10, the base mold 10 receives a fixed bearing force symmetrically from the two sides of the frame-shaped support portion 62 and is fixed on the substrate portion 61 (FIG. 10). reference).

In this way, with the master die 10 fixed to the support device 60 so as not to shift, the master die 10 is placed together with the support device 60 in an electroforming tank built under predetermined conditions, and the mother die 10 is passed through the contact portion 63 of the support device 60. By energizing the mold 10, electroformed metal such as nickel alloy is formed on the surface (exposed region) of the master mold 10 that is not covered with the primary pattern resist 14 within the thickness range of the primary pattern resist 14. As a result, for example, a primary electrodeposition layer 15 having a thickness of 12 μm and serving as the mask body 2 is formed (see FIG. 11 (A)).

At the time of this electrocasting, the master mold 10 is fixed by the two opposing sides of the frame-shaped support portion 62 in the support device 60, so that the fixing force is applied evenly and in a well-balanced manner, and the primary mold 10 is formed on the master mold 10. The dimensional accuracy of the electrodeposition layer 15 can be made stable without changing from end to end.

After the electrocasting is completed, the master mold 10 taken out from the electrocasting tank together with the support device 60 is removed from the support device 60 (see FIG. 11B). Then, by dissolving and removing the primary pattern resist 14 from the master die 10, a primary electrodeposition layer 15 serving as a mask body 2 provided with a large number of independent vapor deposition through holes 8 forming a predetermined thin film deposition pattern 9 can be obtained ( (See FIG. 11 (C)).

After the primary electrodeposition layer 15 is obtained, the resist layer 16 is arranged on the entire surface of the master mold 10 including the formed portion of the primary electrodeposition layer 15. Specifically, for example, a negative type photosensitive dry film resist is placed on the surface side of the master mold 10 to a predetermined thickness (for example, about 15 μm) set in advance.
One or several sheets are laminated according to m), and the resist layer 16 is formed by thermocompression bonding (FIG. 12 (FIG. 12).
See A)).

Then, as shown in FIG. 12B, the mask film 17 having the translucent holes 17a corresponding to the pattern forming region 2a of the mask body 2 is brought into close contact with the surface of the resist layer 16 and then exposed by ultraviolet irradiation. (See FIGS. 12 (B) and 12 (C)). As a result, the portion corresponding to the pattern forming region 2a becomes the resist layer 16a cured by exposure, and the other portion becomes the unexposed resist layer 16b.
After that, a process of dissolving and removing the unexposed resist layer 16b exposed on the surface is performed.
A secondary pattern resist 18 covering the pattern forming region 2a is formed (see FIG. 13 (A)).
..

After the secondary pattern resist 18 is formed in this way, the adhesive layer 19 is arranged in advance on the lower surface side of the frame body 3 that has been formed through the frame body forming step, and is placed at a preset location on the primary electrodeposition layer 15. Align and arrange (see FIG. 13B).

The frame body 3 in this state can be temporarily fixed on the primary electrodeposition layer 15 so as not to easily move due to the adhesiveness of the adhesive layer 19.
The temporarily fixed frame body 3 is subjected to a step of applying a load from above the frame body 3 and crimping the frame body 3 as necessary to make the frame body 3 more difficult to separate from the primary electrodeposition layer 15. You can also.

After the frame body 3 is arranged, the master mold 10 is attached to the support device 60 again together with the master mold holder 50 (see FIG. 13C), and the metal layer 7 is formed by plating.
Specifically, the master mold holder 5 is attached to the substrate portion 61 of the support device 60 after the frame-shaped support portion 62 is removed.
0 is placed, and the mother mold 10 is further placed on the mother mold holder 50. Since the master mold 10 has ferromagnetism, it is attracted by the magnetic force of the master mold holder 50 and is held along the reference surface 51a.

After mounting the master mold, the frame-shaped support portion 62 is attached to the substrate portion 61 with bolts and nuts, and the master mold 10 and the master mold holder 50 are placed between the protruding portion 62a of the frame-shaped support portion 62 and the substrate portion 61. Sandwich, mother mold 1
The state is such that 0 and the master mold holder 50 are restrained and supported so as not to be separated from the substrate portion 61.

At this time, the contact portion 63 provided on the long side portion of the frame-shaped support portion 62 electrically contacts the surface end portion of the master mold 10 in the same manner as described above, and the contact portion 63 and the master mold 10 are in a conductive state. .. In addition, each contact part 6
3 comes into contact with the master mold 10 and no gap is formed between the frame-shaped support portion 62 and the master mold 10 on the two sides of the contact portions 63, so that the master mold 10 is the second of the frame-shaped support portion 62. It receives a fixed bearing force symmetrically from the side and becomes a fixed state on the substrate portion 61 (see FIGS. 4 (B) and 4 (C)).

Further, in this case, the mother mold 10 supported by the mother mold holder 50 is in a state along the reference surface 51a of the mother mold holder 50 by suction by the mother mold holder 50, so that the mother mold 10 Even if there is a distortion in the mold, the distortion is corrected so that the master mold 10 can maintain a proper flat shape.

The master mold 10 attached to the support device 60 together with the master mold holder 50 is placed in a plating tank that has been bathed under predetermined conditions, and the master mold 10 is energized through the contact portion 63 of the support device 60. As a result, the upper surface of the primary electrodeposition layer 15 that is not covered by the secondary pattern resist 18 and is exposed on the surface of the outer peripheral edge 2b of the pattern forming region 2a, the primary electrodeposition layer 15a on the lower side of the frame body 3 and its side. The metal layer 7 is plated with an electrodeposited metal on each exposed surface of the master die 10 exposed to the surface and the surface of the frame 3.
Is formed (see FIG. 14 (A)). The metal layer 7 allows the primary electrodeposition layer 15 and the frame body 3 to be integrally connected so as not to separate from each other.

At the time of this plating, the master mold 10 on which the primary electrodeposition layer 15 is formed is held by the master mold holder 50 so as to form an appropriate shape, so that the metal layer 7 is correctly integrated with the frame body 3. It is executed under the positional relationship and can be integrated without being affected by the distortion of the master mold 10.

After the formation of the metal layer 7 is completed, the master mold 10 is removed from the plating tank to the master mold holder 50 and the support device 6.
Take out with 0. The master mold 10 is removed from the support device 60 together with the master mold holder 50 (FIG. 1).
4 (B)), and further removed from the master mold holder 50 (see FIG. 15 (A)).

Then, as a final step, the master mold 10 is separated from the integrated primary electrodeposition layer 15, the frame body 3, and the metal layer 7 (see FIG. 15B).
After the master mold 10 is separated, the primary electrodeposition layer 15a existing under the frame 3 is removed together with the adhesive layer 19, and then the secondary pattern resist 18 is removed to complete the production of the vapor deposition mask 1. (See FIG. 15 (C)). If the adhesive layer 19 remains on the lower side of the frame body 3, it is removed when the secondary pattern resist 18 is removed.

In addition, the secondary pattern resist 18 is removed before the mother mold 10 is separated, and then the mother mold 1 is removed.
The procedure may be such that 0 is separated and the primary electrodeposition layer 15a existing under the frame 3 is removed together with the adhesive layer 19.

As described above, the master mold holder according to the present embodiment attracts the master mold 10 by magnetic force during the plating step of integrating the frame body 3 with the primary electrodeposition layer 15 on the master mold 10 to hold the master mold. Since the master die 10 is brought into close contact with the substantially flat reference surface 51a of the tool 50 and the master die 10 is held in a state of matching the reference surface shape, the frame body 3 is integrated with the primary electrodeposition layer 15 on the master die. When the metal layer 7 is formed by plating on the primary electrodeposition layer 15 and the frame 3 on the master die 10 having an appropriate shape and arrangement along the reference surface 51a in the plating process, the frame 3 and the primary are formed. The metal layer 7 with the electrodeposition layer 15 in an appropriate positional relationship
The frame body 3 will function to maintain an appropriate positional relationship as it is even after the mother mold 10 is separated, and a mask of the same quality will be ensured without being affected by the condition of the mother mold 10. It is possible to suppress variations in the accuracy of the mask due to distortion of the master mold 10 and the like, and an accurate and uniform product can be obtained in a manufacturing process such as vapor deposition using the mask.

In the mask manufacturing process using the master mold holder according to the above embodiment, the master mold 10 in which the primary electrodeposition layer 15 is formed in advance during the plating step on the primary electrodeposition layer 15 and the frame body 3
Is held by the master mold holder 50 to support the master mold 10 so as to have an appropriate shape in the plating process. In addition, the primary electrodeposition layer 15 is also formed by electrocasting. , The mother mold holder 50 is attached to the support device 60 together with the mother mold 10, and the mother mold 10 is brought into close contact with the reference surface 51a of the mother mold holder 50 to hold the mother mold 10 in an appropriate shape and arrangement. It can also be configured so that the primary electrodeposition layer 15 has an appropriate shape that is not affected by the distortion of the master die 10 even when it is not integrated with the frame body 3, and the position of the mask body 2 when the mask is completed. The accuracy can be further improved.

Further, in the step of forming the primary electrodeposition layer 15 by such electrocasting and the step of integrating the primary electrodeposition layer 15 and the frame body 3 by plating, the support device 60 for supporting and fixing the master die 10 and the master die 10 are formed. The master mold holder 50 to be held is made of a material that is resistant to the chemical solution used for developing the unexposed resist and the chemical solution used for removing the resist after the electrocasting or plating process, respectively, and does not deteriorate. In addition, when the support device 60 to which the master mold 10 and the master mold holder 50 are attached can be comfortably handled together with the master mold 10 in each device used in a series of steps from the formation of the resist to the removal of the resist, and the master mold alone. Similarly, when the shape and size of the master mold 10 on the support device 60 are such that each step related to the resist can be executed, the master mold 10 is supported together with the master mold holder 50 before the primary pattern resist is formed. Until after the plating step of attaching the master mold 10 to the primary electrodeposition layer 15 on the master mold 10 and integrating the frame body 3 with the primary electrodeposition layer 15, the master mold 10 is attached to the support device 60 and each step related to mask manufacturing is performed. The master mold 10 may not be removed from the support device 60 other than electrocasting and plating. In this case, by minimizing the attachment / detachment of the master mold 10 to the support device 60, it is possible to prevent the occurrence of a situation in which an unnecessary force is applied to the master mold 10 to cause distortion of the master mold 10, and the mask is manufactured. The adverse effect from the mother mold 10 on the mother mold 10 can be further suppressed.

Further, in the master mold holder according to the embodiment, the plate-shaped magnet portion 5 as the magnetic force generating portion
1 is provided, and the entire reference surface 51a is the surface of the magnet. However, the present invention is not limited to this, and the magnet as the magnetic force generating portion generates a sufficient attractive force to hold the master mold 10 as the reference surface of the holder. If it is possible to evenly adhere to the magnets, a plurality of small magnets are provided on another flat plate member forming the reference surface as a partially interspersed arrangement, and the reference surface includes the surface of a member other than the magnets. It is also possible to configure the structure so that the magnet is arranged inside the holder and does not appear on the surface, and the reference surface is the surface of a member other than the magnet. In addition, the magnetic force generating portion that attracts the master mold with the master mold holder is not limited to the permanent magnet, and an electromagnet may be used.

Further, the master mold holder 50 according to the above embodiment is formed as a plate-like body separate from the support device 60 that supports the master mold 10 in the steps of electroforming and plating, and together with the master mold 10 as necessary. It is configured to be attached to the support device 60 and used to hold the master mold 10, but the present invention is not limited to this.
If it has a reference surface and a magnetic force generating portion that attracts the master mold 10 to the reference surface, it can be integrally incorporated in the support device 60. In this case, the surface of the substrate portion 61 on which the master molds 10 are arranged on top of each other in the support device 60 also serves as a reference surface for the master mold holder. A magnetic force generating portion such as a magnet is provided on the substrate portion 61 or a frame-shaped support portion as long as the master mold 10 can be uniformly adhered to the surface of the substrate portion 61 which is a reference surface by generating a sufficient attractive force. It can also be configured to be provided in 62.

1 Thin-film deposition mask 2 Mask body 2a Pattern formation area 2b Outer peripheral edge 3 Frame body 7 Metal layer 8 Thin-film deposition hole 9 Thin-film deposition pattern 10 Master mold 11 Resist layer 12 Mask film 12a Transmissive hole 14 Primary pattern resist 15, 15a Primary electrodeposition layer 16 Resist layer 17 Mask film 17a Transmissive hole 18 Secondary pattern resist 19 Adhesive layer 50 Mother mold holder 51 Magnet part 51a Reference surface 52 Reinforcing plate 60 Support device 61 Board part 62 Frame-shaped support part 62a Protrusion part 63 Contact part

Claims (6)

Flat substrate and
A frame-shaped support portion arranged on the substrate portion and
A support device including a contact portion that is interposed between the substrate portion and the frame-shaped support portion and is electrically contactable with a master mold for electric casting. A protruding portion is provided on the inner peripheral portion of the frame of the frame-shaped support portion.
The support device according to claim 1, wherein a master mold for electric casting is sandwiched between the protruding portion and the substrate portion, and the protruding portion is brought into close contact with the master mold. The support device according to claim 2, wherein the contact portion is provided so as to overlap the protruding portion. The substrate portion has a rectangular shape and has a rectangular shape.
The frame-shaped support portion is detachably attached to the substrate portion by combining plate-shaped members corresponding to each side of the substrate portion in a frame shape.
The contact portions are arranged to face each other at two of the frame-shaped support portions, and the two contact portions are brought into close contact with the base mold for electrocasting while the frame-shaped support portions are attached to the substrate portion. The support device according to any one of claims 1 to 3, wherein the mold is fixedly supported at two symmetrical positions. The support device according to any one of claims 1 to 4, wherein a master mold holder is interposed on the substrate portion. The support device according to claim 5, wherein the master mold holder includes a magnet portion having a reference surface and a reinforcing plate fixed to a surface of the magnet portion opposite to the reference surface. ..

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