JP2006144067A - Plate body having lattice-shaped opening and production method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce a plate body provided with one or more lattice-shaped openings 3 having many independent microopenings 5 partitioned by lattice-shaped linear bodies 6 inside the board face of a planar substrate 2 at high productivity while satisfactorily securing the dimensional precision and positional precision of the microopenings 5. <P>SOLUTION: Linear bodies 6 partitioning microopenings 5 are formed integrally with a substrate 2 by an electroforming process. In this way, the linear bodies 6 and the microopenings 5 partitioned by the linear bodies 6 can be produced with exceedingly high dimensional precision and further with high positional precision compared with those by a production method according to etching working and laser machining. Also, the vertical cross-sectional properties of each microopening 5 can be satisfactorily secured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plate body provided with one or two or more grid-like openings each having a plurality of independent micro-openings partitioned by a grid-like linear body in a plate surface of a flat board and a method for manufacturing the same.

  The plate body having a grid-like opening according to the present invention is suitable for use as a positioning jig when mounting various electrical components on an electronic circuit board. Can be found in, for example, Patent Document 1 and Patent Document 2.

JP 2002-111293 A JP 2002-111193 A

  At present, the minute openings constituting the lattice-shaped openings are produced by a method by wet etching or a method by laser processing. However, the wet etching method cannot form a minute opening with high dimensional accuracy. There is also a disadvantage in that the position accuracy of the minute aperture tends to be lowered. In the case of using a laser, if the number of micro openings to be formed is large, the manufacturing cost becomes high, and in addition, due to the influence of heat at the time of forming, warping due to thermal reaction, that is, undulation is likely to occur around the micro openings. There is concern about the deterioration of the vertical cross section.

  An object of the present invention is to provide a grid-like opening having a large number of independent minute openings in a plate surface of a flat substrate, and in a manufacturing method thereof, while ensuring a good dimensional accuracy and position accuracy of the minute openings, The object is to enable production with high productivity.

  In the present invention, as shown in FIGS. 2 and 6, a grid-like opening 3 having a large number of independent micro-openings 5 divided by a grid-like linear body 6 in the surface of a flat board 2 is provided. It is a plate body provided with 1 or 2 or more, Comprising: The said linear body 6 is integrally formed with the board | substrate 2 by the electroforming method, It is characterized by the above-mentioned.

  Specifically, as shown in FIGS. 1 and 8, the linear body 6 is formed so as to project from the middle part in the vertical direction of the opening inner surface 11 of the substrate 2 that defines the outer edge of the lattice-shaped opening 3 toward the opening inward direction. Can take the form.

  As shown in FIG. 1, the linear body 6 is interposed through a peripheral edge portion 10 that is formed so as to project from the middle portion in the vertical direction of the opening inner surface 11 of the substrate 2 that defines the outer edge of the lattice-like opening 3 toward the opening inward direction. The shape joined to the inner surface 11 of the opening can be taken.

  As shown in FIGS. 7 and 13, each minute opening 5 can have a tapered shape.

  In addition, as shown in FIG. 1, the present invention provides a grid-like opening 3 having a plurality of independent micro-openings 5, which are partitioned by a grid-like linear body 6 in the surface of a flat board 2. A method for producing two or more plate bodies, in which an electrodeposited metal is electroformed at a predetermined position on the surface of the mother die 15 as shown in FIG. As shown in FIG. 3E, a step of forming a resist body 25 corresponding to the minute opening 5 on the primary electrodeposition layer 21 as shown in FIG. 3E, and FIG. As described above, an electrodeposited metal is electroformed on the base electrode 15 and the primary electrodeposition layer 21 having no resist body 25 to the extent that the upper surface of the resist body 25 is exceeded. A second electroforming step for forming the secondary electrodeposition layer 26, and a resist body as shown in FIG. 5 and a step of polishing the resist body 25 and the secondary electrodeposition layer 26 so that the upper surfaces of the secondary electrodeposition layer 26 are flush with each other, and as shown in FIG. A step of forming a resist body 30 corresponding to the lattice-like openings 3 on the upper surfaces of the body 25 and the secondary electrodeposition layer 26; and secondary electrodeposition not covered with the resist body 30 as shown in FIG. A third electroforming step of forming a tertiary electrodeposition layer 31 constituting a part of the substrate 2 by electroforming an electrodeposited metal on the surface of the layer 26; and a resist body as shown in FIG. The steps of subjecting the resist body 30 and the tertiary electrodeposition layer 31 to a polishing treatment so that the upper surfaces of the electrodeposite 30 and the tertiary electrodeposition layer 31 are flush with each other, and FIG. 5C and FIG. As shown, the master 15 is peeled off, and the resist bodies 25 and 30 and the primary electrodeposition layer are removed. And removing the 1. Then, as shown in FIGS. 5B to 5D, the minute openings 5 are formed by removing the resist body 25, and the lattice-like openings 3 are formed by removing the resist body 30 and the primary electrodeposition layer 21. It is characterized by being. 5C and 5D, the resist bodies 25 and 30 may be removed after the mother die 15 is peeled off or before the mother die 15 is peeled off.

  In the present invention, as shown in FIG. 8, a grid-like opening 3 having a large number of independent micro-openings 5 partitioned by a grid-like linear body 6 in the plate surface of the flat board 2 is provided. A method of manufacturing a plate body having two or more, as shown in FIG. 9C, a primary electrodeposition layer corresponding to the grid-shaped openings 3 by electroforming an electrodeposited metal at a predetermined position on the surface of the mother die 15. As shown in FIG. 9E, a step of forming a resist body 25 corresponding to the minute openings 5 and the substrate 2 on the primary electrodeposition layer 21 as shown in FIG. As shown in a), the electrodeposition metal is electroformed on the primary electrodeposition layer 21 not having the resist body 25 to the extent that the upper surface of the resist body 25 is exceeded, and the secondary electrodeposition layer 26 that becomes the linear body 6 is formed. And a resist body 25 and secondary electrodeposition as shown in FIG. 10 (b). The resist body 25 and the secondary electrodeposition layer 26 are subjected to a polishing process so that the upper surface of the surface 26 is flush, and the resist body 25 is removed as shown in FIGS. After that, a step of forming a resist body 30 corresponding to the lattice-like openings 3 and the minute openings 5 on the primary electrodeposition layer 21 and the secondary electrodeposition layer 26, and as shown in FIG. As shown in FIG. 12B, a third electroforming process for forming a tertiary electrodeposition layer 31 to be the substrate 2 by electroforming an electrodeposited metal on the surface of the mother die 15 not covered with A step of polishing the resist body 30 and the tertiary electrodeposition layer 31 so that the upper surfaces of the resist body 30 and the tertiary electrodeposition layer 31 are flush with each other, and FIGS. ) As shown in FIG. And a 30 body and removing the primary electrodeposited layers 21. Then, as shown in FIGS. 12B to 12D, the minute openings 5 are formed by removing the resist body 30, and the lattice-like openings 3 are formed by removing the resist body 30 and the primary electrodeposition layer 21. It is characterized by being. 12C and 12D, the resist body 30 may be removed after the mother die 15 is peeled off or before the mother die 15 is peeled off.

  In the plate body 1 having the grid-like openings 3 according to the present invention, the linear bodies 6 are formed integrally with the substrate 2 by electroforming, so that the linear bodies 6 and the minute openings partitioned by the linear bodies 6 are used. 5 can be manufactured with high dimensional accuracy and with high positional accuracy. Compared to the type of etching, it has much higher accuracy and has the advantage that it can be manufactured while ensuring productivity. Compared to the laser processing type, it is advantageous in that the manufacturing cost is low and no waviness due to thermal reaction occurs, and the vertical cross-section of each micro-opening 5 is favorably secured and can be made with high accuracy. .

  The plate body 1 can be suitably used as a jig for positioning the electric component when the electric component is mounted on the electronic circuit board. In this case, if the minute opening 5 is manufactured with high dimensional accuracy and positional accuracy as described above, the element can be mounted on the circuit board with high accuracy. This contributes to an improvement in the yield of electronic devices including the circuit board.

  As shown in FIGS. 1 and 8, when the linear body 6 is formed so as to project from the middle part in the vertical direction of the opening inner surface 11 of the substrate 2 toward the opening inward direction, the lattice-shaped opening 3 is formed on the substrate 2. It can be a stepped shape that is one step down from the top surface. As a result, it is possible to clearly distinguish the portion of the lattice-like opening 3 from the portion of the substrate 2, and therefore it is possible to accurately perform the mounting operation of the electrical component on the electronic circuit board using such a step. . That is, since the positioning operation of the set arm that holds the electrical component and drops it from the minute opening 5 with respect to the substrate 2 can be performed using the previous step, the alignment accuracy of the mounting operation is improved. Can contribute.

  In addition, as shown in FIG. 1, the linear body 6 is joined to the opening inner surface 11 via a peripheral edge portion 10 that extends from the middle portion of the opening inner surface 11 of the substrate 2 toward the opening inward direction. And the malfunction which a set arm contacts the opening inner surface 11 can be eliminated. That is, when the grid-like opening 3 is stepped down from the upper surface of the substrate 2 as described above, when the electrical component is dropped into the minute opening 5 existing at the outermost edge of the grid-like opening 3, the set arm Can easily come into contact with the inner surface 11 of the opening, and it becomes difficult to smoothly drop the electrical component into the minute opening 5 existing at the outermost edge. In that respect, if the linear body 6 is formed so as to protrude from the inner surface 11 of the opening via the peripheral portion 10, the minute opening 5 and the inner surface 11 of the outermost edge corresponding to the left and right and front and rear width dimensions of the peripheral portion 10. Therefore, the set arm does not come into contact with the inner surface 11 of the opening. Therefore, the operation of dropping the electrical component with respect to the minute opening 5 existing at the outermost edge can be smoothly advanced.

  As shown in FIGS. 7 and 13, if each minute opening 5 has a tapered shape, the electrical component can be positioned easily and reliably. That is, the electrical component can be slid downward along the taper during the next dropping operation only by aligning the electrical component with the opening position on the upper side where the opening size is large. This makes it possible to easily and reliably guide the electrical component to the final mounting position of the electronic circuit board.

(First embodiment)
1 to 5 show a first embodiment in which a plate body having a grid-like opening according to the present invention is applied to a jig for positioning electrical components. As shown in FIG. 2, the plate body 1 includes a square-shaped lattice-shaped opening 3 in the center of the board surface of the substrate 2 with a square plate-like substrate 2 as a base. The lattice-shaped opening 3 has a large number of independent micro-openings 5, and each micro-opening 5 is composed of a large number of “lines” that run in two directions, left and right and front and rear. 6 is divided. The “line” running in the left-right direction and the “line” running in the front-rear direction are orthogonal to each other, and therefore each micro-opening 5 has a rectangular shape. Here, each minute opening 5 was formed in a square shape having the same length in the left and right and front and rear. Moreover, each minute opening 5 was made into the straight form with the uniform opening dimension of the up-down direction.

  As shown in FIG. 1, the substrate 2 includes a lower layer 7 having a lattice-like opening 3 and an upper layer 9 formed on the upper surface of the lower layer 7 so as not to be separated from each other. Reference numeral 10 denotes a peripheral portion that is formed so as to protrude in a small width toward the inner direction of the opening at the upper end portion of the lower layer 7, in other words, the middle portion of the opening inner surface 11 of the substrate 2. Each “line” constituting 6 is bonded to the substrate 2 via the peripheral edge 10. The lower layer 7 and the upper layer 9 including these linear bodies 6 were formed by an electroforming method as described later using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal as a raw material. Symbol t1 indicates the vertical thickness of the peripheral portion 10 and the linear body 6, and symbol t2 indicates the vertical thickness of the substrate 2. The relationship t1 <t2 is satisfied as in the illustrated example. Thus, the thickness dimension of the linear body 6 etc. was set.

  In addition, the longitudinal cross-sectional view of FIG. 1 does not show the actual state of the plate body 1 but schematically shows it. Further, the opening size and the like of the minute opening 5 in FIG. 1 and the like are shown in such a size for the convenience of drawing, and are greatly different from the actual size. Further, the numerical aperture of the minute opening 5 is greatly different from the actual number.

  3 to 5 show a method of manufacturing the plate body 1 according to this embodiment. First, as shown in FIG. 3A, a photoresist layer 16 was formed on the surface of a mother die 15 made of, for example, stainless steel or brass. The photoresist layer 16 was formed by laminating one or several negative photosensitive dry film resists at a predetermined height and then thermocompression bonding. Next, after a pattern film 17 having a light transmitting hole 17a corresponding to the substrate 2 is brought into close contact with the photoresist layer 16, exposure is performed by irradiating ultraviolet light with an ultraviolet lamp 19 to develop and dry the film. By performing each treatment and dissolving and removing the unexposed portion, a straight resist body 20 corresponding to the substrate 2 was formed on the mother die 15 as shown in FIG.

  Next, as shown in FIG. 3C, an electrodeposited metal is electrodeposited by electroforming on the surface of the mother die 15 where the resist body 20 does not exist, and the primary electrodeposition layer 21 corresponding to the lattice-like openings 3. Was formed (first electroforming step). After the electroforming process, the resist body 20 was removed. FIG. 3C shows a state after the resist body 20 is removed.

  As shown in FIG. 3D, a photoresist layer 22 is formed on the entire surface of the mother die 15 so as to cover the primary electrodeposition layer 21, and on the photoresist layer 22, it corresponds to the minute opening 5. The pattern film 23 having the translucent hole 23a to be adhered was adhered. Next, exposure is performed by irradiating ultraviolet light with an ultraviolet lamp 19, development and drying are performed, and unexposed portions are dissolved and removed, so that the minute openings 5 are formed as shown in FIG. A corresponding resist body 25 was formed on the primary electrodeposition layer 21. Here, the mother exposed on the surface is used for the purpose of facilitating the removal and removal of the secondary electrodeposition layer 26 in the subsequent peeling step (steps from FIG. 5C to FIG. 5D). It is preferable to perform a known peeling process on the entire mold 15.

  As shown in FIG. 4A, an electrodeposited metal is electroformed on the primary electrodeposition layer 21 not having the matrix 15 and the resist body 25 to a height position exceeding the upper surface of the resist body 25 to form a linear shape. The secondary electrodeposition layer 26 to be the body 6 and the lower layer 7 was formed (second electroforming process). That is, an electrodeposited metal is electroformed on a portion where the resist body 25 does not exist on the primary electrodeposition layer 21 to form an electrodeposited metal layer 26a that becomes the linear body 6, and the lower layer 7 on the matrix 15 is formed. An electrodeposited metal layer 26b was formed. Furthermore, an electrodeposited metal layer 26 c to be the peripheral edge portion 10 was formed on the outer peripheral edge of the primary electrodeposition layer 21. These electrodeposited metal layers 26a and 26b are bonded via the electrodeposited metal layer 26c, and therefore, a secondary body formed by integrally electroforming the linear body 6, the peripheral edge portion 10, and the lower layer 7. An electrodeposition layer 26 was obtained.

  As shown in FIG. 4B, the polishing process was performed so that the upper surface of the secondary electrodeposition layer 26 and the upper surface of the resist body 25 were flush with each other. Next, as shown in FIG. 4C, a photoresist layer 27 is formed on the upper surfaces of the resist body 25 and the secondary electrodeposition layer 26, and the lattice-like openings 3 are formed on the photoresist layer 27. The pattern film 29 having the corresponding translucent hole 29a was adhered. Next, exposure is performed by irradiating with ultraviolet light with an ultraviolet lamp 19, development and drying are performed, and unexposed portions are dissolved and removed, whereby secondary electrodeposition is performed as shown in FIG. Resist bodies 30 corresponding to the lattice-like openings 3 were formed on the upper surfaces of the electrodeposited metal layers 26 a and 26 c constituting the layer 26 and the resist body 25. The external dimensions of the resist body 30 were substantially the same as those of the primary electrodeposition layer 21. In addition, it is preferable to perform a well-known adhesion process on the exposed secondary electrodeposition layer 26.

  As shown in FIG. 5A, an electrodeposited metal is electroformed on the surface of the secondary electrodeposition layer 26 not covered with the resist body 30 to a height position exceeding the upper surface of the resist body 30, and the upper layer 9 and A tertiary electrodeposition layer 31 was formed (third electroforming step). Next, as shown in FIG. 5B, the upper surface of the tertiary electrodeposition layer 31 was subjected to a polishing process with the resist body 30 as a reference. As a result, the upper surfaces of the tertiary electrodeposition layer 31 and the resist body 30 could be made flush with no step.

  Next, as shown in FIG. 5C, the resist bodies 25 and 30 were dissolved and removed. By removing the resist body 25, the minute opening 5 could be formed. Further, the primary electrodeposition layer 21 was removed after the matrix 15 was peeled off. As a result, as shown in FIG. 5 (d), a large number of independent micro-openings 5 partitioned by a grid-like linear body 6 are provided in the surface of the substrate 2 composed of the lower layer 7 and the upper layer 9. The plate body 1 provided with the lattice-like openings 3 could be obtained. The linear body 6 was able to be joined to the inner surface 11 of the opening via the peripheral edge portion 10 formed to project from the inner surface 11 of the lower layer 7 toward the inner side of the opening.

  FIG. 6 shows another embodiment of the plate body 1 according to the first embodiment, in which two grid-like openings 3 are provided on the board surface of the substrate 2 as shown in FIG. It differs from the form shown in FIG.

  FIG. 7 shows another embodiment of the plate body 1 according to the first embodiment, in which each minute opening 5 has a tapered shape that is constricted, and is different from the embodiment shown in FIG. To do. That is, each “line” constituting the linear body 6 has a taper shape that expands downward in a longitudinal sectional view, and each minute opening 5 has a taper shape that narrows down. Since other than that is equivalent to FIG. 1, the same code | symbol is attached | subjected to the same member and the description is abbreviate | omitted. Such an opening form can be obtained by forming the resist body 25 into a tapered shape in the step of FIG.

(Second Embodiment)
2 and 8 to 12 show a second embodiment in which a plate body having a grid-like opening according to the present invention is applied to a jig for positioning electrical components. As shown in FIG. 2 and FIG. 8, the plate body 1 includes a square lattice-shaped opening 3 in the center of the board surface of the substrate 2 with a square plate-like substrate 2 as a base. The lattice-shaped opening 3 has a large number of independent micro-openings 5, and each micro-opening 5 is composed of a large number of “lines” that run in two directions, left and right and front and rear. 6 is divided. The “line” running in the left-right direction and the “line” running in the front-rear direction are orthogonal to each other, and therefore each micro-opening 5 has a rectangular shape. Here, each minute opening 5 was formed in a square shape having the same length in the left and right and front and rear. Moreover, each minute opening 5 was made into the straight form with the uniform opening dimension of the up-down direction. The linear body 6 and the substrate 2 were formed by an electroforming method as described later, using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal as a raw material.

  In addition, the longitudinal cross-sectional view of FIG. 8 does not show the actual state of the plate body 1 but schematically shows it. Furthermore, for example, the opening size of the minute opening 5 in FIG. 8 and the like is shown in such a size for the convenience of drawing, and is greatly different from the actual size. Further, the numerical aperture of the minute opening 5 is greatly different from the actual number.

  9 to 12 show a method for manufacturing the plate body 1 according to the present invention. First, as shown in FIG. 9A, a photoresist layer 16 was formed on the surface of a matrix 15 made of, for example, stainless steel or brass having conductivity. The photoresist layer 16 was formed by laminating one or several negative photosensitive dry film resists at a predetermined height and then thermocompression bonding. Next, after a pattern film 17 having a light transmitting hole 17a corresponding to the substrate 2 is brought into close contact with the photoresist layer 16, exposure is performed by irradiating ultraviolet light with an ultraviolet lamp 19 to develop and dry the film. By performing each treatment and dissolving and removing the unexposed part, a straight resist body 20 corresponding to the substrate 2 was formed on the mother die 15 as shown in FIG.

  Next, as shown in FIG. 9C, an electrodeposited metal is electrodeposited by electroforming on the surface of the mother die 15 where the resist body 20 does not exist, and the primary electrodeposition layer 21 corresponding to the lattice-like openings 3 is deposited. Was formed (first electroforming step). After the electroforming process, the resist body 20 was removed. FIG. 9C shows a state after the resist body 20 is removed.

  As shown in FIG. 9 (d), a photoresist layer 22 is formed on the entire surface of the matrix 15 so as to cover the primary electrodeposition layer 21, and then the micro openings 5 and the substrate 2 are formed on the photoresist layer 22. The pattern film 23 having the translucent hole 23a corresponding to is closely attached. Next, exposure is performed by irradiating ultraviolet light with an ultraviolet light lamp 19, development and drying are performed, and unexposed portions are dissolved and removed, so that the minute openings 5 and 5 as shown in FIG. A resist body 25 corresponding to the substrate 2 was formed on the primary electrodeposition layer 21.

  As shown in FIG. 10A, the electrodeposited metal is electroformed onto the primary electrodeposition layer 21 not having the resist body 25 to a height position exceeding the upper surface of the resist body 25 to form the linear body 6. The secondary electrodeposition layer 26 was formed (second electroforming process). Next, as shown in FIG. 10B, after performing a polishing process so that the upper surface of the secondary electrodeposition layer 26 and the upper surface of the resist body 25 are flush with each other, as shown in FIG. The resist body 25 was removed.

  As shown in FIG. 10 (d), a photoresist layer 27 is formed on the upper surfaces of the primary electrodeposition layer 21, the secondary electrodeposition layer 26, and the mother die 15, and then the primary electrodeposition is formed on the photoresist layer 27. A pattern film 29 having a light transmitting hole 29a having the same dimensions as the wearing layer 21 was adhered. Next, exposure is performed by irradiating ultraviolet light with an ultraviolet light lamp 19, development and drying are performed, and unexposed portions are dissolved and removed, whereby primary electrodeposition layers 21 and 2 are formed as shown in FIG. A resist body 30 corresponding to the lattice-like openings 3 was formed on the upper surface of the next electrodeposition layer 26.

  As shown in FIG. 12 (a), the electrodeposited metal is electroformed on the surface of the mother die 15 not covered with the resist body 30 to a height position exceeding the upper surface of the resist body 30, so that the tertiary electrode serving as the substrate 2 is obtained. An adhesion layer 31 was formed (third electroforming step). At this time, the outermost edge portion 28 (see FIG. 11) of the secondary electrodeposition layer 26 to be the linear body 6 and the tertiary electrodeposition layer 31 to be the substrate 2 were joined together in an integrated manner. Next, as shown in FIG. 12B, the upper surface of the tertiary electrodeposition layer 31 was subjected to a polishing process using the resist body 30 as a reference. Thus, the upper surfaces of the tertiary electrodeposition layer 31 and the resist pair 30 could be made flush with no step.

  Next, as shown in FIG. 12C, the resist body 30 was dissolved and removed. The minute openings 5 could be formed by dissolving and removing the resist body 30. Further, the primary electrodeposition layer 21 was removed after the matrix 15 was peeled off. Thus, as shown in FIG. 12 (d), a plate body provided with a grid-like opening 3 having a large number of independent micro-openings 5 partitioned by a grid-like linear body 6 in the board surface of the substrate 2. 1 could be obtained.

  FIG. 13 shows another embodiment of the plate body 1 according to the second embodiment, in which each micro-opening 5 has a tapered shape that is constricted from the previous embodiment shown in FIG. To do. That is, each “line” constituting the linear body 6 has a taper shape that expands downward in a longitudinal sectional view, and each minute opening 5 has a taper shape that narrows down. Since other than that is equivalent to FIG. 1, the same code | symbol is attached | subjected to the same member and the description is abbreviate | omitted. Such an opening form can be obtained by forming the resist body 25 into a tapered shape with a constriction in the step of FIG.

  In the above embodiment, the substrate 2 has a quadrangular shape and the minute opening 5 has a quadrangular shape. However, the present invention is not limited to this. Similarly, the shape of the lattice-shaped opening 3 is not limited to a quadrangular shape. The number of grid-like openings 3 on the substrate 2 can be 3 or more. In the illustrated example, one plate body 1 is produced on one mother die 15, but the present invention is not limited to this, and a plurality of plate bodies 1 are produced on one mother die 15. Needless to say, they can be formed simultaneously.

  The lattice-like openings 3 may have different opening dimensions at the upper end and those at the lower end. Further, the projecting position of the minute opening 5 and the linear body 6 with respect to the substrate 2 may be any of the middle portions of the opening inner surface 11 in the vertical direction, and is not limited to the illustrated example.

1 is a longitudinal side view of a plate body having a grid-like opening according to a first embodiment of the present invention. Perspective view of plate body The figure for demonstrating the manufacturing method of a plate body The figure for demonstrating the manufacturing method of a plate body The figure for demonstrating the manufacturing method of a plate body The perspective view which shows another embodiment of a plate body Longitudinal side view showing another embodiment of plate body Vertical side view of a plate body having a grid-like opening according to a second embodiment of the present invention The figure for demonstrating the manufacturing method of a plate body The figure for demonstrating the manufacturing method of a plate body The figure for demonstrating the manufacturing method of a plate body The figure for demonstrating the manufacturing method of a plate body Longitudinal side view showing another embodiment of plate body

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plate body 2 Substrate 3 Grid-like opening 5 Micro opening 6 Linear body 10 Peripheral part 11 Opening inner surface 15 Master 21 Primary electrodeposition layer 25 Resist body 26 Secondary electrodeposition layer 30 Resist body 31 Tertiary electrodeposition layer

Claims (6)

One or two or more grid-like openings (3) having a large number of independent micro-openings (5) partitioned by a grid-like linear body (6) are provided in the board surface of the flat plate-like substrate (2). A plate body,
A plate body having a grid-like opening, wherein the linear body (6) is integrally formed with the substrate (2) by electroforming.   The linear body (6) is formed so as to project from the middle part in the vertical direction of the opening inner surface (11) of the substrate (2) defining the outer edge of the lattice opening (3) toward the opening inward direction. A plate body having the lattice-like openings described.   A peripheral portion (10) in which a linear body (6) projects from an intermediate portion in the vertical direction of the opening inner surface (11) of the substrate (2) defining the outer edge of the lattice-shaped opening (3) toward the opening inward direction. The plate body having a grid-like opening according to claim 2, which is joined to the inner surface (11) of the opening via the).   The plate body having a grid-like opening according to any one of claims 1 to 3, wherein each minute opening (5) has a tapered shape with a constriction. One or two or more grid-like openings (3) having a large number of independent micro-openings (5) partitioned by a grid-like linear body (6) are provided in the board surface of the flat plate-like substrate (2). A manufacturing method of a plate body,
A first electroforming step of electroforming an electrodeposited metal at a predetermined position on the surface of the matrix (15) to form a primary electrodeposition layer (21) corresponding to the lattice-like openings (3);
Forming a resist body (25) corresponding to the minute opening (5) on the primary electrodeposition layer (21);
On the primary electrodeposition layer (21) having no matrix (15) and the resist body (25), an electrodeposited metal is electroformed to the extent that it exceeds the upper surface of the resist body (25), and the linear body (6 ), And a second electroforming step of forming a secondary electrodeposition layer (26) to be a part of the substrate (2),
A step of polishing the resist body (25) and the secondary electrodeposition layer (26) so that the upper surfaces of the resist body (25) and the secondary electrodeposition layer (26) are flush with each other;
Forming a resist body (30) corresponding to the lattice openings (3) on the upper surfaces of the resist body (25) and the secondary electrodeposition layer (26);
On the surface of the secondary electrodeposition layer (26) not covered with the resist body (30), the electrodeposition metal is electroformed to form a tertiary electrodeposition layer (31) constituting a part of the substrate (2). A third electroforming step to
A step of polishing the resist body (30) and the tertiary electrodeposition layer (31) so that the upper surfaces of the resist body (30) and the tertiary electrodeposition layer (31) are flush with each other;
Peeling the matrix (15) and removing the resist body (25, 30) and the primary electrodeposition layer (21),
The minute openings (5) are formed by removing the resist body (25), and the lattice-like openings (3) are formed by removing the resist body (30) and the primary electrodeposition layer (21). A manufacturing method of a plate body having a grid-like opening as a feature. One or two or more grid-like openings (3) having a large number of independent micro-openings (5) partitioned by a grid-like linear body (6) are provided in the board surface of the flat plate-like substrate (2). A manufacturing method of a plate body,
A first electroforming step of electroforming an electrodeposited metal at a predetermined position on the surface of the matrix (15) to form a primary electrodeposition layer (21) corresponding to the lattice-like openings (3);
Forming a resist body (25) corresponding to the minute opening (5) and the substrate (2) on the primary electrodeposition layer (21);
On the primary electrodeposition layer (21) which does not have the resist body (25), the electrodeposition metal is electroformed to the extent that it exceeds the upper surface of the resist body (25), and the secondary electrodeposition which becomes the linear body (6) A second electroforming step of forming the layer (26);
A step of polishing the resist body (25) and the secondary electrodeposition layer (26) so that the upper surfaces of the resist body (25) and the secondary electrodeposition layer (26) are flush with each other;
After removing the resist body (25), on the primary electrodeposition layer (21) and the secondary electrodeposition layer (26), a resist body (30) corresponding to the lattice-like openings (3) and the minute openings (5) is formed. Forming, and
A third electroforming step of forming a tertiary electrodeposition layer (31) to be a substrate (2) by electroforming an electrodeposited metal on the surface of the matrix (15) not covered with the resist body (30) When,
A step of polishing the resist body (30) and the tertiary electrodeposition layer (31) so that the upper surfaces of the resist body (30) and the tertiary electrodeposition layer (31) are flush with each other;
Peeling the matrix (15) and removing the resist body (30) and the primary electrodeposition layer (21),
The minute openings (5) are formed by removing the resist body (30), and the lattice-shaped openings (3) are formed by removing the resist body (30) and the primary electrodeposition layer (21). A manufacturing method of a plate body having a grid-like opening as a feature.

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