TWI772559B - Evaporation mask and method of making the same - Google Patents

Abstract

The present invention provides a vapor deposition mask and a method for manufacturing the same. The vapor deposition mask is a vapor deposition mask in a form in which a mask body is supported by a frame, which can suppress an increase in manufacturing cost and realize an increase in the size of the vapor deposition mask. In addition, the flatness of the vapor deposition mask can be maintained, thereby ensuring good reproduction accuracy and vapor deposition accuracy. The vapor deposition mask (1) includes a mask body (2) and a frame body (3) arranged around the mask body, and the mask body (2) has a plurality of independent vapor deposition through holes (5). The evaporation pattern (6). A support frame (46) is fixed to the lower surface side of the casing. A frame opening (48) corresponding to the mask opening (11) of the frame body (3) is formed in the support frame (46), and the frame opening (48) is formed in an opening shape larger than the mask opening (11). This further enhances the overall structural strength and rigidity of the vapor deposition mask, prevents deflection of the vapor deposition mask and maintains the flatness, thereby enabling the reproduction accuracy of the vapor deposition layer and the high precision of the vapor deposition accuracy.

Description

Evaporation mask and method of making the same

The present invention relates to a vapor deposition mask and a method for manufacturing the same, and more particularly, to a vapor deposition mask in which a mask body is supported by a frame and a method for manufacturing the same. The present invention can be applied to, for example, a vapor deposition mask suitable for use in forming a light-emitting layer of an organic EL element, and a method for producing the same.

In mobile devices such as smartphones and tablet terminals having display devices, organic EL displays that are lighter in weight and consume less power have begun to be used instead of liquid crystal displays for the purpose of reducing the weight of the device and prolonging the drive time. An organic EL display is manufactured by forming the light-emitting layer (evaporation layer) of an organic EL element on a board|substrate (evaporation object) by the vapor deposition mask method. In this case, the manufacturing cost of the organic EL display can be reduced by using a vapor deposition mask having a larger size with more mask bodies to manufacture more products in one vapor deposition operation. Therefore, there is an increasing demand for the enlargement of the vapor deposition mask from manufacturers of organic EL displays.

A vapor deposition mask used in the vapor deposition mask method is disclosed in Patent Document 1, for example. In such Patent Document 1, "a metal mask (mask main body) having a plurality of mask portions (vapor deposition patterns)" and "a frame shape and the metal mask is fixed in a tensioned state" The frame (frame body) holding the metal mask" constitutes the vapor deposition mask, wherein the frame is made of invar material. The metal mask is joined to the frame by spot welding.

The present applicant has also proposed such a vapor deposition mask, and is disclosed in Patent Document 1, for example. Such a vapor deposition mask is composed of a plurality of mask bodies provided with vapor deposition patterns, and a reinforcing frame joined to the mask bodies. The frame body is formed of a constant steel material (a material with a low thermal linear expansion coefficient), and the outer periphery of each shield body is integrally joined by a metal layer formed to surround the frame body of the shield body. prior art literature

Patent Document 1: Japanese Patent Laid-Open No. 2004-323888 Patent Document 2: Japanese Patent Laid-Open No. 2005-15908

The problem to be solved by the invention

As shown in the vapor deposition masks of Patent Document 1 and Patent Document 2, the frame for fixing and holding the metal mask and the frame for reinforcing the mask main body are made of constant steel material, so that even when the working environment during vapor deposition is high temperature It is possible to suppress the expansion of the vapor deposition mask even in the environment, and to ensure the reproduction accuracy and vapor deposition accuracy of the vapor deposition layer (light-emitting layer). However, although the metal mask of the vapor deposition mask of Patent Document 1 is fixed and held to the frame in a tensioned state, when the vapor deposition mask becomes large, the area of the metal mask not supported by the frame increases , so that the metal mask is warped due to its own weight. Therefore, the reproduction accuracy and the vapor deposition accuracy are inevitably lowered.

In this regard, in the vapor deposition mask of Patent Document 2, since each mask body is joined to a frame that surrounds the mask body, even when the vapor deposition mask becomes large, it is difficult to cause masking due to its own weight. Warp deformation of the cover body can ensure the reproduction accuracy and deposition accuracy of the vapor deposition layer. However, even the frame body made of Hengfan steel material swells slightly during the vapor deposition operation. In addition, although the frame body is formed of a metal plate made of Hengfan steel, the thickness of the metal plate generally circulated is generally uneven, and the plate thickness may vary depending on the position of the frame body. Therefore, the amount of expansion differs in each part of the frame, and the difference in the amount of expansion may appear as a deformation of the entire vapor deposition mask. In this way, when the vapor deposition mask is deformed, the flatness of the vapor deposition mask is deteriorated, and the reproduction accuracy and the vapor deposition accuracy are extremely lowered. This deformation is remarkably manifested as the frame becomes large. The generation of deformation caused by such variation in the thickness of the base material can be suppressed by managing the manufacturing process of the metal sheet, and by exclusively manufacturing and using a base material with a small thickness variation, but the base material becomes expensive accordingly, resulting in An increase in the manufacturing cost of the vapor deposition mask. Here, the plate thickness variation refers to the variation in thickness with respect to the standard size of the metal sheet.

An object of the present invention is to provide a vapor deposition mask, which is a vapor deposition mask in a form in which a mask body is supported by a frame, and which can suppress an increase in manufacturing cost and achieve a high-quality vapor deposition mask and a method for manufacturing the same. In addition, the flatness of the vapor deposition mask can be maintained, and the reproducing accuracy and vapor deposition accuracy of the vapor deposition layer can be ensured.

The vapor deposition mask of the present invention includes a mask body 2 including a vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5 and a frame body 3 arranged around the mask body 2 . The vapor deposition mask of the present invention is characterized in that a support frame 46 is fixed to the lower surface side of the frame body 3 . Further, a frame opening 48 corresponding to the mask opening 11 of the frame body 3 is formed in the support frame 46 , and the frame opening 48 is formed in an opening shape larger than the mask opening 11 . Furthermore, an auxiliary frame 47 is fixed to the lower surface side of the support frame 46 .

The vapor deposition mask of the present invention is characterized in that the frame body 3 includes an outer peripheral frame 10 , a vertical frame 12 and a horizontal frame 13 defining the mask opening 11 in the outer peripheral frame 10 . The vertical frame 12 and the horizontal frame 13 are entirely supported by the support frame 46 , the auxiliary frame 47 is formed in a frame shape, and the peripheral edge of the support frame 46 is supported by the auxiliary frame 47 .

The vapor deposition mask of the present invention is characterized in that the frame body 3 , the support frame 46 , and the auxiliary frame 47 are integrally formed by welding, and the welding parts 49 are provided at the four corners, the vertical frame 12 and the horizontal frame of the frame body 3 . The peripheral portion on the extension line of 13.

The vapor deposition mask of the present invention is characterized in that the mask body 2 and the frame body 3 are integrally joined via the metal layer 8 .

The vapor deposition mask of the present invention is characterized in that a plurality of frame bodies 3 and 3 are laminated, and the frame bodies 3 and 3 adjacent to each other in the lamination direction are joined to each other via an adhesive layer 19 .

The vapor deposition mask of the manufacturing method of the vapor deposition mask of the present invention includes a mask main body 2 having a plurality of independent vapor deposition through holes 5 and a frame body 3 arranged around the mask main body 2 . The formed vapor deposition pattern 6 . Furthermore, the manufacturing method of the vapor deposition mask is characterized by comprising: a step of preparing the mask body 2 and the frame body 3; a step of integrally joining the mask body 2 and the frame body 3; and joining on the lower surface side of the frame body 3 A step of supporting the frame 46 ; and a step of engaging the auxiliary frame 47 on the lower surface side of the supporting frame 46 .

The manufacturing method of the vapor deposition mask of the present invention is characterized in that, in the step of preparing the mask main body 2 and the frame body 3, it includes: a frame body forming step of forming the frame body 3; The primary patterning step of the resist 29 for the resist body 29a corresponding to the plated through hole 5; In the first electroforming step of the casting layer 30, in the step of integrally joining the mask body 2 and the frame body 3, the mask body 2 and the frame body 3 are integrally joined through the metal layer formed by electroforming.

The manufacturing method of the vapor deposition mask of the present invention is characterized in that a plurality of vapor deposition mask bodies 50 in which the mask main body 2 and the frame body 3 are integrally joined via a metal layer are prepared, and the plurality of vapor deposition masks are After the bodies 50 are joined to the support frame 46 one by one, the auxiliary frame 47 is joined to the side of the support frame 46 opposite to the side to which the vapor deposition mask body 50 is fixed.

The manufacturing method of the vapor deposition mask of the present invention is characterized in that the frame body 3 , the support frame 46 , and the auxiliary frame 47 are integrally joined by welding, and the welding portions 49 are provided at the four corners and the vertical frames 12 and 12 of the frame body 3 . The peripheral portion on the extension line of the horizontal frame 13 . effect of invention

According to the vapor deposition mask of the present invention, by supporting the entire frame body 3 (the vertical frame 12 and the horizontal frame 13 ) by the support frame 46 , the structural strength and rigidity of the entire vapor deposition mask can be further enhanced, thereby preventing vapor deposition. The mask is deflected and deformed to maintain the flatness, and further, the reproduction accuracy of the vapor deposition layer and the high precision of the vapor deposition accuracy can be achieved. Furthermore, by supporting the support frame 46 (periphery) with the auxiliary frame 47 , the reproduction accuracy and the deposition accuracy of the vapor deposition layer can be further improved.

Furthermore, by forming the frame body 3 with the upper frame 16 and the lower frame 17, and by joining the upper and lower frames 16 and 17 through the adhesive layer 18 to form them into one body, when the frame body 3 having the same thickness as the conventional one is formed, it is possible to use more By forming the frame body 3 with a thin metal plate, the thickness variation of the entire frame body 3 can be reduced, and even a large-scale vapor deposition mask can suppress the occurrence of deformation due to thermal expansion caused by the thickness variation of the metal plate. .

Furthermore, by forming the mask body 2 and the metal layer 8 by electroforming, the metal layer 8 can be formed in a state where a tension such as a stress acting to pull the mask body 2 toward the frame body 3 is applied, or the metal layer 8 can be The mask body 2 is held in the frame body 3 under a tension such as a stress acting in a direction of shrinking inward, and the expansion amount of the mask body 2 caused by the temperature rise in the vapor deposition apparatus is absorbed by the tension. , so that the positional displacement of the mask body 2 relative to the frame body 3 caused by the expansion and the occurrence of wrinkles can be prevented. Therefore, even when the temperature is raised in the vapor deposition apparatus, the matching accuracy of the mask body 2 with respect to the substrate to be vapor-deposited at normal temperature can be well ensured, and this can contribute to the improvement of the light-emitting layer (the vapor-deposited layer) with respect to the vapor-deposited substrate. The reproduction accuracy of the substrate.

(first embodiment)

1 to 10 show a first embodiment of a vapor deposition mask and a method for manufacturing the same according to the present invention. In addition, the dimension, such as thickness and width in FIG. 1 to FIG. 10 of this embodiment, does not show an actual situation, but each shows schematically. The same applies to the drawings of the following embodiments.

As shown in FIGS. 2 and 3 , the vapor deposition mask 1 includes a plurality of mask main bodies 2 and a reinforcing frame 3 arranged around the mask main bodies 2 so as to surround the mask main bodies 2 . The mask body 2 is formed into a rectangle with rounded four corners, and includes a pattern forming area 4 inside the mask body 2 . In the pattern formation region 4 , a vapor deposition pattern 6 is formed by a plurality of independent vapor deposition through holes 5 through which the vapor deposition material from the vapor deposition source passes. As shown in FIG. 3 , in the mask body 2 , a plurality of bonding through holes 7 are provided over the entire circumference of the outer peripheral edge 4 a of the pattern forming region 4 .

The mask body 2 is formed by an electroforming method using an electrodeposited metal composed of nickel alloys such as nickel and nickel-cobalt as a raw material. The thickness of the mask body 2 is preferably in the range of 3 to 20 μm, and is set to 8 μm in this embodiment. The size of the mask body 2 in plan view is set to 108 mm in the longitudinal direction and 62 mm in the short direction, and 30 mask bodies 2 are arranged in a matrix of 6 rows and 5 columns. When the vapor deposition mask 1 of the present embodiment is applied to a vapor deposition mask for an organic EL element, the vapor deposition pattern 6 is formed so as to correspond to the light-emitting layer of the organic EL element.

In addition to nickel and nickel alloys, the mask body 2 can be formed of copper, other electrodeposited metals, or alloys as raw materials. In addition, the mask body 2 can also have a multilayer structure of two or more layers, and can be formed by selecting various metals and alloys. Specifically, considering the two-layer structure of the glossy nickel layer and the matt nickel layer, in the case of the two-layer structure in which the matt nickel layer is formed on the glossy nickel layer, the glossy nickel layer does not easily adhere to the master mold 10, Therefore, the peeling step of peeling off the vapor deposition mask 1 from the master mold 10 among the manufacturing steps can be performed efficiently. However, in this case, there is a fear of occurrence of interlayer peeling, and contrary to the above, a two-layer structure in which a glossy nickel layer is formed on a matte nickel layer is preferable. Here, the relationship between the thicknesses of the respective layers in the two-layer structure of the matt nickel layer and the glossy nickel layer is that, if the matt nickel layer is too thick, the thickness of the mask body 2 after completion (after peeling from the master mold 10 ) will occur. If the tension becomes too large and may cause deformation of the frame body 3, the thickness ratio of the glossy nickel layer to the matte nickel layer is preferably about 5/7. In this way, by setting the two-layer structure in which the glossy nickel layer is arranged on the upper side of the matt nickel layer, and by making the matt nickel layer appropriately thicker than the glossy nickel layer, the mask body 2 after completion can increase the size of the desired thickness. Even if the tension (tensile stress) shrinking inward is affected by the expansion of each part due to heat, the mask body 2 is not deformed, and the vapor deposition mask 1 excellent in heat resistance can be obtained.

In addition, in the case where the mask body 2 is formed of only the matte nickel layer, the tension generated in the completed mask body 2 becomes too large, which may cause deformation of the frame body 3. In addition, due to this Since the surface of the matte nickel layer is rough, the bonding force of the plating or the like on the surface increases, and problems such as the inability to separate the primary electrodeposited layer 30a and the metal layer 8 easily occur in the mask manufacturing step. As described above, Such a problem can also be avoided by having a two-layer structure in which a glossy nickel layer is formed on a matte nickel layer. In the case of the two-layer structure in which the glossy nickel layer is formed on the matte nickel layer, the bonding force of the glossy nickel layer is smaller than that of the matte nickel layer, so that the mask body 2 and the metal layer 8 are easily separated, but by virtue of By forming the through hole 7 in the mask body 2, activating it, or forming a thin layer such as strike nickel or matte nickel (see later), the bonding strength with the metal layer can be sufficiently secured.

As shown in FIG. 4 , the frame body 3 includes an outer peripheral frame 10 , a rectangular frame-shaped vertical frame 12 and a horizontal frame 13 defining the mask opening 11 in the outer peripheral frame 10 . The vertical frame 12 is set to be parallel to the long side of the mask body 2 , and the horizontal frame 13 is set to be parallel to the short side of the mask body 2 . The casing 3 can be made of various materials such as metals such as aluminum and iron, resins, etc., and has various shapes and sizes. The metal plate structure is formed to be sufficiently thicker than the mask body 2, and its thickness dimension is set in the range of 0.5 to 5 mm, and is set to 1.0 mm in this embodiment. In addition, in plan view, the size of the housing 3 is set to 460×730 mm, the size of the mask opening 11 is set to 110 mm in the longitudinal direction, and the size in the short direction is set to 64 mm. The frame body 3 may also be formed of a nickel-iron-cobalt alloy super-constant steel material, a ceramic material, or the like. In addition, as the forming material of the frame body 3, the use of Hengfan steel material, ultra-constant steel material, and ceramic material is because its thermal linear expansion coefficient is extremely small, which can well suppress the shield body 2 caused by the thermal influence in the evaporation step. size changes.

When the width dimension of the vertical frame 12 is W1 and the width dimension of the horizontal frame 13 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are set to satisfy the inequality (W1≤W2≤W1 ×1.1). In this embodiment, the width dimension W1 of the vertical frame 12 is set to 10 mm, and the width dimension W2 of the horizontal frame 13 is set to 10.64 mm. In this way, if the width W2 of the horizontal frame 13 is appropriately set to be larger than the width W1 of the vertical frame 12, the cross-sectional area of the horizontal frame 13 can be made larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 can be increased. By being smaller than the length of the vertical frame 12, the vertical frame 12 can be reliably supported by the horizontal frame 13, and the vertical frame 12 having a long length can be prevented from being flexed and deformed by its own weight. Therefore, it is possible to prevent the deformation of the frame body 3 due to its own weight, and to increase the size of the vapor deposition mask 1, and to maintain the flatness of the vapor deposition mask 1, so that the reproduction accuracy of the vapor deposition pattern and the improvement of the vapor deposition accuracy can be achieved. High precision. In addition, since the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform as a whole, when an external force for flexing and deforming the vapor deposition mask 1 is applied, the external force can be distributed in a balanced manner and localized elimination can be achieved. By concentrating, deformation and breakage of the vapor deposition mask 1 can be effectively prevented. In addition, since the width dimension W2 of the horizontal frame 13 is set to (W2≦W1×1.1), it is possible to suppress an increase in the weight of the frame body 3 caused by the cross-sectional area of the horizontal frame 13 becoming larger than necessary. It is possible to eliminate unnecessary increase in the weight of the entire vapor deposition mask, and to enhance the structural strength and rigidity of the frame body 3 .

The frame body 3 may be cut out from a sheet of metal plate, but in this embodiment, as shown in FIG. 1 and FIG. 5( a ), the upper frame 16 and the lower frame are formed with the same thickness and the same shape. 17, and the upper frame 16 and the lower frame 17 are joined together via the adhesive layer 18 to be integrated. Specifically, as shown in FIG. 5( b ), the upper frame 16 and the lower frame 17 are joined in a state in which the protruding arc surfaces face each other, and the frame body 3 is formed to be flat in a state where the two-dimensional curved surface is canceled. shape. In addition, the above-mentioned two-dimensional curved surface warp is a minute warpage caused by the metal sheet, and there may be a three-dimensional curved surface shape. In the present embodiment, a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18, and after the bonding of the upper frame 16 and the lower frame 17, the unnecessary part of the adhesive layer 18 is removed. Various commercially available adhesives can also be used for the adhesive layer 18 . The thickness dimension of the upper and lower frames 16 and 17 constituting the frame body 3 is set to be the same thickness in order to facilitate the formation of the frame body 3 in a flat shape for joining in a state where the two-dimensional curved surface is canceled. The protruding arc may also be a concave arc, and may also include both. In addition, the thickness dimension of the upper and lower frames 16 and 17 may be different if they can be joined flatly in a state where the two-dimensional curved surface-shaped warp is canceled. In this way, if the upper frame 16 and the lower frame 17 are joined in a state in which the two-dimensionally curved curvature of the upper frame 16 is canceled, and the frame body 3 is formed into a flat shape, the minute warpage caused by the metal plate can be eliminated, and the improvement can be further improved. Flatness, and good reproducibility and deposition accuracy of the vapor deposition layer can be ensured.

As described above, if the upper frame 16 and the lower frame 17 are joined in a state in which the two-dimensionally curved curvature of the upper frame 17 is canceled, and the frame body 3 is formed into a flat shape, the minute warpage caused by the metal plate can be eliminated. The flatness can be further improved, and good reproducibility and deposition accuracy of the vapor deposition layer can be ensured.

As shown in FIGS. 6 and 7 , the frame body 3 may be laminated with a pair (a plurality of) of the frame bodies 3 and 3 formed by the above-described method, and the adjacent frame bodies 3 and 3 in the stacking direction may be joined via the adhesive layer 19 . each other. The upper frame body 3 and the lower frame body 3 may have the same thickness or different thicknesses, and if the thicknesses of the upper frame body 3 and the lower frame body 3 are the same, for example, the upper frame body 3 is formed. The thickness dimension of the upper and lower frames 16 and 17 and the thickness dimension of the upper and lower frames 16 and 17 constituting the lower surface side frame body 3 are both set to 0.25 mm. When the thicknesses are different, for example, the thickness dimension of the upper and lower frames 16 and 17 constituting the upper frame body 3 may be set to 0.2 mm, respectively, and the thickness of the upper and lower frames 16 and 17 constituting the lower frame body 3 may be set to 0.2 mm. Thickness dimensions can be set to 0.3mm, respectively.

In FIG. 1 , reference numeral 8 denotes a metal layer formed on the upper surface of the outer peripheral edge 4 a of the pattern forming region 4 of the mask body 2 . The metal layer 8 is formed by lamination by nickel plating (electroforming). The mask bodies 2 are respectively disposed in the mask openings 11 of the frame body 3 , and the outer peripheral edge 4 a of the pattern forming region 4 of the mask body 2 is positioned relative to the frame body 3 by the metal layer 8 formed by plating (electroforming). It is integrally joined without separation. As shown in FIG. 1 and FIG. 4 , the metal layer 8 covers the upper surface of the outer periphery 4 a of the pattern forming area 4 , the upper surface of the frame body 3 and the side surface facing the pattern forming area 4 , and the shield body 2 and the frame body 3 . The gap portion is formed in a hat shape in cross section. In addition, the metal layer 8 is also formed in the bonding through hole 7 , thereby enhancing the bonding strength between the mask body 2 and the frame body 3 . In addition, like the mask body 2 , the metal layer 8 can be formed by using nickel, copper, other electrodeposited metals, or alloys as raw materials, in addition to nickel alloys.

FIG. 5 shows a frame body forming step for forming the frame body 3 for reinforcement. 8 to 10 illustrate a method of manufacturing the vapor deposition mask 1 of the present embodiment using the frame body 3 obtained by the frame body forming step. (frame forming step)

First, a cutting step of cutting out the size of the upper frame 16 and the lower frame 17 from the metal sheet is performed using, for example, a wire electric discharge machine or the like that has little thermal influence on the metal sheet. Next, by performing etching and laser processing on the cut upper frame 16 and the lower frame 17 , as shown in FIG. Next, as shown in FIG. 5( b ), in a state where the protruding arc surfaces of the upper frame 16 and the lower frame 17 from the metal sheet face each other, the two frames 16 and 17 are joined by the adhesive layer 18 . The joining step of forming the frame body 3 into a flat shape is performed in a state in which the curvature of the curved surface is canceled. The next layer 18 is composed of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG.5(c), the fixing process which passes and pinches between the upper and lower rotating rollers 22 and 22 arrange|positioned by the predetermined dimension between rollers is performed. In addition, the frame body 3 is obtained by removing (developing) the unnecessary part of the adhesive layer 18 (the part exposed to the outside of the mask opening 11 and the outer peripheral frame 10 ). In this way, the reason why a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is because the uncured photosensitive dry film resist has adhesiveness and is also used in the primary patterning step, which will be described later, and the like. Therefore, there is no need to separately prepare commercially available adhesives, etc., and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly. In addition, in the cutting step, a laser cutting machine may be used to cool the metal plate and cut out the upper and lower frames 16 and 17 at the same time.

Here, for example, metal plates with different thicknesses are prepared, the above-mentioned steps are performed, a pair of frame bodies 3 and 3 are produced as shown in FIG. 6( a ), and the frame bodies are laminated as shown in FIG. 6( b ). 3 and 3, the frame bodies 3 and 3 are joined to each other by the adhesive layer 19 made of a sheet-like uncured photosensitive dry film resist, and then, as shown in FIG. A pair of frame bodies 3 and 3 that are laminated can be obtained as shown in FIG. At this time, as a pair of frame bodies 3 and 3 to be laminated, frame bodies 3 and 3 of the same thickness may be laminated. (Pre-patterning stage body formation step)

As shown in FIG. 8( a ), a photoresist layer 25 is formed on the surface of a master mold 24 made of, for example, stainless steel or brass having conductivity. The photoresist layer 25 is formed by laminating one or a plurality of negative-type sheet-like photosensitive dry film resists and thermocompression bonding, and has a predetermined thickness. Next, the patterned film 26 (glass mask) having the light-transmitting holes 26a corresponding to the vapor-deposited through-holes 5 and the bonding through-holes 7 (primary patterning) is brought into close contact with the photoresist layer 25 to obtain a pre-patterning stage Body 27. (preheating step)

The pre-patterning stage body 27 (in particular, the master mold 24 and the patterned film 26 ) is preheated to the furnace temperature of the ultraviolet irradiation device (exposure device) during the exposure operation using, for example, a hot plate, a preheating furnace, or the like. At this time, in parallel with the preheating of the pre-patterning stage body 27 , the inside of the furnace of the ultraviolet irradiation device may also be preheated to the temperature inside the furnace at the time of exposure work. (one patterning step)

After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 is completed, the pre-patterning stage body 27 is housed in the furnace of the ultraviolet irradiation device, and as shown in FIG. 8( a ), is heated by an ultraviolet lamp. 28 is irradiated with ultraviolet light to perform exposure, and each process of development and drying is performed. Next, the unexposed portion is removed by dissolving, and as shown in FIG. 8( b ), a primary pattern resist having a resist body 29 a corresponding to the vapor-deposited through hole 5 and the bonding through hole 7 is formed on the master mold 24 . Etch 29. In this way, if the exposure operation is performed in a state where the inside of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 are preheated to the temperature in the furnace at the time of exposure operation, it is possible to eliminate the problem of "the pre-patterning stage body 27 being damaged by the ultraviolet radiation." It is heated and expanded, and the exposure operation is performed when the relative positional relationship of the above-mentioned three 24, 25, and 26 is deviated." Therefore, the primary pattern resist 29 formed in a desired shape with good positional accuracy can be provided on the master mold 24, thereby contributing to the reproducing accuracy of the vapor deposition layer and the high precision of the vapor deposition accuracy. (first electroforming step)

Next, the above-mentioned master mold 24 is put into an electroforming tank, and as shown in FIG. 8( c ), within the range of the height of the above-mentioned resist body 29 a , the part of the master mold 24 that is not covered by the resist body 29 a On the surface of , an electrodeposited metal composed of nickel is electroformed once, thereby forming a primary electroformed layer 30 , that is, a layer that becomes the mask body 2 . Next, the resist body 29 a is removed by dissolving, and as shown in FIG. 8( d ), the mask body 2 including the vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5 and the bonding through holes 7 is obtained. . In addition, in FIG.8(d), the code|symbol 30a shows the primary electrodeposition layer formed between the mask main bodies 2 and 2 and removed by the peeling process mentioned later. (activation treatment step)

Here, in order to improve the bonding strength between the mask body 2 (primary electroformed layer 30 ) and the metal layer 8 , an activation treatment step can be performed. Specifically, as shown in FIG. 9( a ), a photoresist layer 33 is formed on the surfaces of the primary electroformed layers 30 and 30 a as a whole, and then a patterned film having light-transmitting holes 34 a corresponding to the peripheral portions of the bonding through holes 7 is formed. 34 is closely contacted and housed in a furnace of an ultraviolet irradiation device, and is exposed by irradiation with ultraviolet light by an ultraviolet lamp 28, and each process of development and drying is performed. The photoresist layer 33 here is formed by laminating one or several negative-type sheet-like photosensitive dry film resists and thermocompression bonding, as described above, and has a predetermined thickness. Next, by dissolving and removing the photoresist layer 33 of the unexposed portion, as shown in FIG. 9( b ), a pattern resist 35 having openings 35 a corresponding to the peripheral portions of the bonding through holes 7 is obtained. That is, the pattern resist 35 is formed so that only the peripheral portion of the bonding through hole 7 is exposed to the surface.

9 The pattern resist 35 was dissolved and removed as shown in (c). In FIG. 9( c ), reference numeral 36 indicates a portion after the activation treatment. Specifically, the inner wall surface of the bonding through hole 7 and the upper surface of the primary electroforming layer 30 around the bonding through hole 7 are subjected to Activation treatment. When the activation treatment is performed on the periphery of the bonding through hole 7 in this way, the bonding strength between the primary electroforming layer 30 and the metal layer 8 formed in the second electroforming step described later can be significantly improved compared with the case where no treatment is performed. . In addition, instead of the above-described activation treatment, a thin layer may be formed on the primary electroformed layer 30 around the bonding through hole 7 by strike nickel plating, matte nickel plating, or the like. Thereby, the bonding strength between the peripheral portion of the bonding through hole 7 and the metal layer 8 can also be improved. (Secondary patterning step and frame arranging step)

As shown in FIG. 10( a ), a photoresist layer 38 is formed on the entire surface of the master mold 24 including the portion where the primary electroformed layers 30 and 30 a are formed. The photoresist layer 38 is formed by laminating one or several negative-type sheet-like photosensitive dry film resists and thermocompression bonding, as described above, and has a predetermined thickness. Next, the patterned film 39 having the light-transmitting holes 39a corresponding to the pattern-forming regions 4 is brought into close contact with the patterned film 39, which is housed in a furnace of an ultraviolet irradiation device, exposed to ultraviolet light by the ultraviolet lamp 28, developed and dried. of each treatment. In this state, the photoresist layer 38 of the portion ( 38 b ) where the portion ( 38 a ) related to the pattern forming region 4 is exposed and the other portion ( 38 b ) is not exposed is obtained (see FIG. 10( b )).

Next, as shown in FIG. 10( b ), on the master mold 24 , the frame body 3 is positioned so as to surround the primary electroforming layer 30 . Here, the frame body 3 is temporarily fixed to the master mold 24 (primary electroforming layer 30 a ) by utilizing the adhesiveness of the unexposed photoresist layer 38 b. Further, as shown in FIG. 10( c ), the unexposed photoresist layer 38 b exposed to the surface is dissolved and removed, thereby forming a secondary pattern resist 40 having a resist body 40 a covering the pattern formation region 4 . At this time, the unexposed photoresist layer 38b located on the lower surface of the frame body 3 is covered by the frame body 3 and remains on the master mold 24 without being dissolved and removed. In addition, it is also possible to prepare the frame body 3 in which the adhesive layer is formed in advance, and arrange such frame body 3 on the master mold 24 before and after the formation of the secondary pattern resist 40 . (Second electroforming step)

The above-mentioned master mold 24 is placed in an electroforming tank, and as shown in FIG. 10( d ), an electrodeposited metal composed of nickel is electroformed on the upper surface and frame of the primary electroforming layer 30 facing the outer peripheral edge 4 a of the pattern forming region 4 . The metal layer 8 is formed on the surface of the body 3 , the surface of the master mold 24 exposed to the surface between the frame body 3 and the primary electroforming layer 30 , and the bonding through holes 7 . Thereby, the primary electrodeposited layer 30 and the frame body 3 can be integrally joined by the metal layer 8 without being separated. (peeling step)

After the primary electroforming layer 30 and the metal layer 8 are peeled off from the master mold 24 , the primary electroforming layer 30 a located on the lower surface of the frame body 3 is peeled off from the two layers 30 and 8 . Finally, by removing the secondary pattern resist 40 and the unexposed photoresist layer 38b, the vapor deposition mask 1 shown in FIG. 3 is obtained.

In the present embodiment, the temperature range of the electroforming solution in the first electroforming step is set to a temperature range higher than room temperature (normal temperature) and the temperature range of the electroforming solution in the second electroforming step. Thereby, the mask main body 2 can be held by the frame body 3 in a state in which tension such as a stress acting in a direction of shrinking inward is applied to the mask main body 2 . Therefore, the amount of expansion of the mask body 2 caused by the temperature increase in the vapor deposition furnace is absorbed by this tension, thereby preventing positional displacement of the mask body 2 relative to the frame body 3 and generation of wrinkles caused by the expansion. In addition, as a method of applying tension to the mask body 2 such as a stress acting in a direction of shrinking inward, the master mold 10 is made of a material with a low thermal linear expansion coefficient (constant steel, 42 alloy, SUS430, etc.) , and increase the temperature in the electroforming tank when the primary electrodeposited layer 15 is formed, so that due to such a temperature difference, the difference in thermal expansion coefficient between the master mold 10 and the primary electroforming layer 30 (electrodeposited metal) can be used, or the The content ratio of carbon in the additive (gloss agent) added to the electroforming tank when it becomes the primary electrodeposited layer 30 of the mask body 2 can also be applied to the mask body 2 with a stress in the direction of shrinking inward. that kind of tension. In addition, by adjusting the content ratio of carbon in the additive (gloss agent) added to the electroforming tank in the second electroforming step, it is possible to mask the main body 2 (primary electroforming layer after applying the active metal layer 8 ). 30) The metal layer 8 is formed in a state of tension such as the stress to the frame body 3 side. Therefore, the expansion amount of the mask main body 2 caused by the temperature rise during vapor deposition can be absorbed by the tension, and the positional displacement of the mask main body 2 relative to the frame body 3 and the occurrence of wrinkles due to the expansion can be prevented. (Second Embodiment)

11 and 12 show a second embodiment of the vapor deposition mask of the present invention and its manufacturing method. In this embodiment, as shown in FIG. 11 , in order to prevent the occurrence of deformation of the frame body 3 caused by the internal stress of the metal layer 8 that integrally joins the mask body 2 and the frame body 3 without separation, the following aspects are related to the above-mentioned first One embodiment is different in that the stress relaxation portion 42 is provided by disconnecting the metal layer 8 by not forming the metal layer 8 on the upper surface of the frame body 3 except on the periphery of the mask opening 11 ; and laminating a pair of frame bodies 3 , 3 and the frame bodies 3 and 3 adjacent to each other in the lamination direction are joined via the adhesive layer 19 .

The upper surface of the frame body 3 of the first embodiment and the both edges of the mask opening 11 continuous with the upper surface are surrounded by the metal layer 8, so that when the metal layer 8 is formed by electroforming, if If it is formed in a state where internal stress is generated, the frame body 3 is deformed by the internal stress, and the flatness of the vapor deposition mask 1 may be adversely affected. However, by providing the stress relaxation part 42 as in the present embodiment, the internal stress of the metal layer 8 is relieved by the stress relaxation part 42 , and the deformation of the frame body 3 can be prevented. In addition, the "disconnection metal layer 8" mentioned here means that the metal layer 8 may be formed in a discontinuous manner over the entire upper surface of the frame body 3, and this aspect is not limited to this embodiment. Others are the same as those of the first embodiment, so the same members are assigned the same reference numerals and their descriptions are omitted. The same applies to the following embodiments.

In the manufacturing method of the vapor deposition mask 1 of the present embodiment, the step of forming the resist body 42a corresponding to the stress relaxation portion 42 on the upper surface of the frame body 3 is performed in the final stage of the frame body forming step, so that the A resist body 42 a is provided on the upper surface of the frame body 3 . Next, the pre-patterning step body formation step to the secondary patterning step and FIGS. 8( a ) to ( d ), FIGS. 9 ( a ) to ( c ), and FIG. 10 ( a ) described in the first embodiment The method shown is the same. (Frame configuration steps)

As shown in FIG. 12( a ), on the master mold 24 , the frame body 3 provided with the resist body 42 a is positioned so as to surround the primary electroforming layer 30 . Here, the frame body 3 is temporarily fixed to the master mold 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Further, as shown in FIG. 12( b ), the unexposed photoresist layer 38 b exposed to the surface is dissolved and removed to form a secondary pattern resist 40 having a resist body 40 a covering the pattern formation region 4 . At this time, the unexposed photoresist layer 38b located on the lower surface of the frame body 3 is covered by the frame body 3 and remains on the master mold 24 without being dissolved and removed. (Second electroforming step)

The above-mentioned master mold 24 is placed in an electroforming tank, and as shown in FIG. 12( c ), an electrodeposited metal composed of nickel is electroformed on the upper surface and frame of the primary electroforming layer 30 facing the outer peripheral edge 4 a of the pattern forming region 4 . The metal layer 8 is formed on the surface of the body 3 not covered by the resist body 42a, the surface of the master mold 24 exposed to the surface between the frame body 3 and the primary electroforming layer 30, and in the bonding through hole 7. Thereby, the primary electrodeposited layer 30 and the frame body 3 can be integrally joined by the metal layer 8 without being separated. In the present embodiment, the temperature range of the electroforming solution used in the first electroforming step and the second electroforming step is set to be approximately the same (temperature difference ±3°C). This can prevent the primary electroformed layer 30, that is, the mask body 2 from being bonded to the frame body 3 when thermally expanded, so that the positional accuracy of the bonding position of the mask body 2 with respect to the frame body 3 can be improved. A vapor deposition mask that achieves higher accuracy in reproducing vapor deposition layers and vapor deposition accuracy. In addition, in both the first electroforming step and the second electroforming step, the lower the temperature of the electroforming solution in the electroforming tank is set, the thermal expansion of the primary electroforming layer 30 and the metal layer 8 can be suppressed as much as possible. (peeling step)

After the primary electroforming layer 30 and the metal layer 8 are peeled off from the master mold 24 , the primary electroforming layer 30 a located on the lower surface of the frame body 3 is peeled off from the two layers 30 and 8 . Finally, by removing the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b, the vapor deposition mask 1 provided with the stress relaxation portion 42 shown in FIG. 11 is obtained. (third embodiment)

13 to 15 show a third embodiment of the vapor deposition mask and its manufacturing method of the present invention. In this embodiment, as shown in FIG. 13 , the bonding through hole 7 of the mask body 2 into which the metal layer 8 penetrates is eliminated, which is different from the above-described first embodiment. The upper frame 16 and the lower frame 17 constituting the frame body 3 in this embodiment are formed with a 0.8 mm metal plate as a base material, and the frame body 3 is set to the same thickness dimension as the above-described first embodiment.

FIGS. 14 and 15 show a method of manufacturing the vapor deposition mask 1 of the present embodiment. First, a frame body forming step is performed to form the frame body 3 for reinforcement. In addition, since such a frame formation process is the same as the process shown in FIG. 5 of 1st Embodiment, the description is abbreviate|omitted. (Pre-patterning stage body formation step)

As shown in FIG. 14( a ), for example, a photoresist layer 25 is formed on the surface of a master mold 24 having conductivity such as stainless steel or brass. The photoresist layer 25 is formed by laminating one or a plurality of negative-type sheet-like photosensitive dry film resists and thermocompression bonding, and has a predetermined thickness. Next, the patterned film 26 (glass mask) having the light-transmitting holes 26 a corresponding to the vapor-deposited through holes 5 is brought into close contact with the photoresist layer 25 to obtain the pre-patterned stage body 27 . (preheating step)

The pre-patterning stage body 27 is preheated to the furnace temperature of the ultraviolet irradiation device (exposure device) at the time of exposure operation, for example, using a hot plate, a preheating furnace, or the like. At this time, in parallel with the preheating of the pre-patterning stage body 27 , the inside of the furnace of the ultraviolet irradiation device may also be preheated to the temperature inside the furnace at the time of exposure work. (one patterning step)

After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 is completed, the pre-patterning stage body 27 is accommodated in the furnace of the ultraviolet irradiation device, and as shown in FIG. 28 is irradiated with ultraviolet light to perform exposure, and each process of development and drying is performed. Next, the unexposed portion is removed by dissolving, and as shown in FIG. 14( b ), a primary pattern resist having a resist body 29 a corresponding to the vapor-deposited through hole 5 (primary patterning) is formed on the master mold 24 . Etch 29. In this way, if the exposure operation is performed in a state where the inside of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 are preheated to the temperature in the furnace at the time of exposure operation, it is possible to eliminate the problem of "the pre-patterning stage body 27 being damaged by the ultraviolet radiation." It is heated and expanded, and the exposure operation is performed when the relative positional relationship of the above-mentioned three 24, 25, and 26 is deviated." Therefore, the primary pattern resist 29 formed in a desired shape with good positional accuracy can be provided on the master mold 24, thereby contributing to the reproducing accuracy of the vapor deposition layer and the high precision of the vapor deposition accuracy. (first electroforming step)

Next, the above-mentioned master mold 24 is put into an electroforming tank, and as shown in FIG. 14( c ), within the range of the height of the above-mentioned resist body 29 a , the part of the master mold 24 that is not covered by the resist body 29 a On the surface of , an electrodeposited metal composed of nickel is electroformed once, thereby forming a primary electroformed layer 30 , that is, a layer that becomes the mask body 2 . Next, the resist body 29 a is removed by dissolving, and as shown in FIG. 14( d ), the mask body 2 provided with the vapor deposition pattern 6 including a plurality of independent vapor deposition through holes 5 is obtained. Further, as in the first embodiment, the primary electroforming layer 30a may be formed between the mask bodies 2 and 2, and the frame body 3 may be arranged on the primary electroforming layer 30a. (Secondary patterning step and frame arranging step)

As shown in FIG. 15( a ), a photoresist layer 38 is formed on the entire surface of the master mold 24 including the portion where the primary electroformed layer 30 is formed. The photoresist layer 38 is formed by laminating one or several negative-type sheet-like photosensitive dry film resists and thermocompression bonding, as described above, and has a predetermined thickness. Next, the patterned film 39 having the light-transmitting holes 39a corresponding to the pattern-forming region 4 is brought into close contact with the patterned film 39, housed in a furnace of an ultraviolet irradiation device, and exposed by irradiation with ultraviolet light from the ultraviolet lamp 28 . In this state, the photoresist layer 38 of the portion ( 38 b ) in which the portion ( 38 a ) related to the pattern forming region 4 is exposed and the other portion ( 38 b ) is not exposed is obtained (see FIG. 15( b )). In addition, in the present embodiment, similarly, before the secondary patterning step, the outer peripheral edge 4a of the pattern forming region 4 in the primary electroforming layer 30 is subjected to an activation treatment step and strike plating by performing an activation treatment step. , the bonding strength between the primary electroformed layer 30 and the metal layer 8 described later can be improved.

Next, as shown in FIG. 15( b ), on the mother mold 24 , the frame body 3 is positioned so as to surround the primary electroforming layer 30 . Here, the frame body 3 is temporarily fixed to the master mold 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Further, as shown in FIG. 15( c ), the unexposed photoresist layer 38 b exposed to the surface is dissolved and removed, thereby forming a secondary pattern resist 40 having a resist body 40 a covering the pattern formation region 4 . At this time, the unexposed photoresist layer 38b located on the lower surface of the frame body 3 is covered by the frame body 3 and remains on the master mold 24 without being dissolved and removed. (Second electroforming step)

Next, the above-mentioned master mold 24 is placed in an electroforming tank, and as shown in FIG. 15( d ), an electrodeposited metal composed of nickel is electroformed on the primary electroforming layer 30 facing the outer peripheral edge 4 a of the pattern forming region 4 . The metal layer 8 is formed on the surface, the surface of the frame body 3 , and the surface of the master mold 24 exposed to the surface between the frame body 3 and the primary electroforming layer 30 . Thereby, the primary electrodeposited layer 30 and the frame body 3 can be integrally joined by the metal layer 8 without being separated. (peeling step)

After the primary electroforming layer 30 and the metal layer 8 are peeled off from the master mold 24 , the primary electroforming layer 30 a located on the lower surface of the frame body 3 is peeled off from the two layers 30 and 8 . Finally, by removing the secondary pattern resist 40 and the unexposed photoresist layer 38b, the vapor deposition mask 1 shown in FIG. 13 is obtained. (Fourth Embodiment)

16 and 17 show a fourth embodiment of the vapor deposition mask of the present invention and its manufacturing method. In this embodiment, as shown in FIG. 16 , the mask body 2 and the frame body 3 are integrally joined by the metal layer 8 without being separated, but the primary electroforming layer 30 and the metal layer 8 constituting the mask body 2 are integrally formed. On the one hand, it is different from each of the above-mentioned embodiments. In this way, if the metal layer 8 is integrally formed with the mask body 2, the labor and time of separately forming the metal layer 8 to join the mask body 2 and the frame body 3 can be omitted, and the steps required for manufacturing can be omitted and the time can be shortened. In addition, the manufacturing cost of the vapor deposition mask 1 can be reduced.

FIG. 17 shows the manufacturing method of the vapor deposition mask 1 of this embodiment. First, a frame body forming step is performed to form the frame body 3 for reinforcement. In addition, since such a frame body formation step is the same as the step shown in FIG. 5 demonstrated in 1st Embodiment, the description is abbreviate|omitted. (Pre-patterning stage body formation step)

First, as shown in FIG. 17( a ), for example, a photoresist layer 25 is formed on the surface of a master mold 24 having conductivity such as stainless steel or brass. The photoresist layer 25 is formed by laminating one or a plurality of negative-type sheet-like photosensitive dry film resists and thermocompression bonding, and has a predetermined thickness. Next, the patterned film 26 (glass mask) having the light-transmitting holes 26 a corresponding to the mask body 2 is brought into close contact with the photoresist layer 25 , thereby obtaining the pre-patterned stage body 27 . (preheating step)

The pre-patterning stage body 27 is preheated to the furnace temperature (exposure device) of the ultraviolet irradiation device at the time of exposure operation, for example, using a hot plate, a preheating furnace, or the like. At this time, in parallel with the preheating of the pre-patterning stage body 27 , the inside of the furnace of the ultraviolet irradiation device may also be preheated to the temperature inside the furnace at the time of exposure work. (one patterning step)

After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 is completed, the pre-patterning stage body 27 is accommodated in the furnace of the ultraviolet irradiation device, and as shown in FIG. 17( a ), is heated by an ultraviolet lamp. 28 is irradiated with ultraviolet light to perform exposure, and each process of development and drying is performed. Next, as shown in FIG. 17( b ), a primary pattern resist having a resist body 29 a corresponding to the mask body 2 (primary patterning) is formed on the master die 24 by removing the unexposed portion by dissolving Agent 29. In this way, if the exposure operation is performed in a state where the inside of the furnace of the ultraviolet irradiation device and the pre-patterning stage body 27 are preheated to the temperature in the furnace at the time of exposure operation, it is possible to eliminate the problem of "the pre-patterning stage body 27 being damaged by the ultraviolet radiation." It is heated and expanded, and the exposure operation is performed when the relative positional relationship of the above-mentioned three 24, 25, and 26 is deviated." Therefore, the primary pattern resist 29 formed in a desired shape with good positional accuracy can be provided on the master mold 24, thereby contributing to the reproducing accuracy of the vapor deposition layer and the high precision of the vapor deposition accuracy. (Frame configuration steps)

As shown in FIG.17(c), the adhesive resist 43 is formed in the whole surface of the master mold 24 including the formation part of the primary pattern resist 29. The adhesive resist 43 is formed by laminating one or several negative-type sheet-like photosensitive dry film resists and thermocompression bonding in the same manner as described above, and has a predetermined thickness. Next, on the master mold 24 , the frame body 3 is positioned so as to surround the primary pattern resist 29 . Here, the frame body 3 is temporarily fixed to the master mold 24 by utilizing the adhesiveness of the unexposed adhesive resist 43 . Moreover, as shown in FIG.17(d), the unexposed adhesive resist 43 exposed to the surface is dissolved and removed. At this time, the adhesive resist 43 located on the lower surface of the frame body 3 is covered by the frame body 3 and remains on the master mold 24 without being dissolved and removed. (Integrated electroforming step)

Next, the above-mentioned master mold 24 is placed in an electroforming tank, and as shown in FIG. 17( e ), an electrodeposited metal composed of nickel is electroformed on the surface of the master mold 24 not covered with the resist body 29 a and the frame The surface of the body 3 is formed, and the metal layer 8 is formed. Thereby, the primary electroformed layer 30 constituting the mask main body 2 and the metal layer 8 joining the mask main body 2 and the frame body 3 can be integrally formed. (peeling step)

After the primary electroforming layer 30 , the metal layer 8 , and the frame body 3 are integrally peeled off from the master mold 24 , the adhesive resist 43 located on the lower surface of the frame body 3 is removed from the two layers 30 and 8 , thereby obtaining The vapor deposition mask 1 shown in FIG. 16 .

According to the manufacturing method of the above-described fourth embodiment, labor and time for forming the metal layer 8 can be omitted, steps required for manufacturing can be saved and time can be shortened, and the rigidity of the frame body 3 can be enhanced as described above. Therefore, the increase in manufacturing cost can be further suppressed, the size can be increased, the flatness can be maintained, and the vapor deposition mask 1 can be obtained that can ensure good reproduction accuracy and vapor deposition accuracy of the vapor deposition layer. (Fifth Embodiment)

18 to 20 show a fifth embodiment of the vapor deposition mask of the present invention. As shown in FIG. 18 , the vapor deposition mask 1 in the present embodiment includes a support frame 46 fixed to the lower surface of the frame body 3 (the side of the substrate to be vapor-deposited), and a lower surface (the vapor-deposited substrate side) fixed to the support frame 46 . Auxiliary frame 47 on the substrate side). That is, the frame body 3 is provided on one side (the vapor deposition source side) of the support frame 46 , and the auxiliary frame 47 is provided on the other side (the vapor deposition target side) of the support frame 46 . The external shapes of the support frame 46 and the auxiliary frame 47 are the same as those of the frame body 3 . As shown in FIGS. 19 and 20 , a frame opening 48 corresponding to the mask opening 11 of the frame body 3 is formed in the support frame 46 , and the frame opening 48 is formed to be the same as the mask opening 11 or larger than the mask opening 11 . shape of the opening. The entire vertical frame 12 and the horizontal frame 13 of the housing 3 are supported by the support frame 46 . In addition, the auxiliary frame 47 is formed in a frame shape, and the surrounding edges of the support frame 46 are supported by the auxiliary frame 47 . After the frame body 3 , the support frame 46 , and the auxiliary frame 47 are aligned, respectively, the three parts 3 , 46 , and 47 are joined by spot welding to form one body. Welded parts 49 by spot welding are provided at the four corners and the peripheral edge parts on the extension lines of the vertical frame 12 and the horizontal frame 13 (see FIG. 20 ).

As described above, if the entire vertical frame 12 and the horizontal frame 13 of the frame body 3 are supported by the support frame 46, and the peripheral edges of the support frame 46 are supported by the auxiliary frame 47, the structural strength and rigidity of the entire vapor deposition mask can be further enhanced. Therefore, the flexural deformation of the vapor deposition mask 1 can be prevented, the flatness can be maintained, and the reproduction accuracy of the vapor deposition layer and the higher accuracy of the vapor deposition accuracy can be achieved.

FIG. 21 shows a modification of the fifth embodiment of the vapor deposition mask of the present invention. In the vapor deposition mask 1 in the present embodiment, three "ten mask bodies 2 arranged in a matrix of 2 rows and 5 columns by a metal layer and a frame arranged around the mask bodies 2 are manufactured. The three vapor deposition mask bodies 50 are supported by the support frame 46 and the auxiliary frame 47 . Specifically, first, one vapor deposition mask body 50 is prepared and fixed to the support frame 46 after the position and tension are adjusted by the tension applying device. In such a fixation, the corner portions of the frame body 3 and the peripheral portions on the extension lines of the vertical frame 12 and the horizontal frame 13 are fixed by spot welding. The remaining two vapor deposition masks 50 are also fixed to the support frame 46 in the same manner. Finally, the auxiliary frame 47 is fixed (spot welding) on the side of the support frame 46 opposite to the side on which the vapor deposition mask body 50 is fixed. In this way, if the plurality of vapor deposition mask bodies 50 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of the adjacent vapor deposition mask bodies 50 can be finely arranged, and the adjacent vapor deposition mask bodies 50 can be arranged in a fine-tuned manner. Relative positional accuracy of the mask body 2 of the mask body 50 . Therefore, good reproduction accuracy and vapor deposition accuracy can be ensured. Furthermore, the vapor deposition mask 1 of a desired size can be freely set. In addition, the smaller the shape of the vapor deposition mask body 50, the higher the dimensional accuracy, so that large adjustment is not required, and fine adjustment is easy, so that the positional accuracy can be easily ensured. Further, when the shape of the vapor deposition mask body 50 is formed into a rectangle, fine adjustment can be easily performed.

As described above, in the vapor deposition mask and the vapor deposition mask manufacturing method of the above-described embodiments, the upper frame 16 and the lower frame 17 constitute the frame body 3 , and the upper and lower frames 16 and 17 are joined via the adhesive layer 18 . Since these are integrally formed, when forming the frame body 3 of the same thickness as the conventional one, the frame body 3 can be formed using a thinner metal plate material, and the thickness variation of the whole frame body 3 can be reduced. This is because the thinner the thickness dimension of the generally distributed metal sheet serving as the base material of the frame body 3, the greater the number of passes of the calender rolls in the manufacturing step, and the thinner the sheet thickness, the smaller the variation in sheet thickness tends to be. . Therefore, even if it is a large-sized vapor deposition mask 1, it is possible to suppress the occurrence of deformation due to thermal expansion due to variations in the thickness of the metal sheet. In addition, only a thin metal plate that is generally distributed is used as the base material, so that it is not necessary to use a dedicated metal plate to form the frame body 3 . As described above, according to the vapor deposition masks of the above-described embodiments, the increase in manufacturing cost can be suppressed, the size of the vapor deposition mask 1 can be increased, the flatness of the vapor deposition mask 1 can be maintained, and good reproduction can be ensured Accuracy and deposition accuracy. Furthermore, according to the frame body 3 in which the adhesive layer 18 is sandwiched between the upper frame 16 and the lower frame 17 , when an external force is applied to the vapor deposition mask 1 to cause deflection and deformation, the amount of the adhesive layer 18 corresponds to the amount of the adhesive layer 18 . The frame body 3 is soft and elastically deformed, and the vapor deposition mask 1 can be effectively prevented from being damaged. In addition, if the two-dimensional curved surface and the three-dimensional curved surface of the upper frame 16 and the lower frame 17 are joined in a state where the two-dimensional curved surface and the three-dimensional curved surface shape are canceled, and the frame body 3 is formed into a flat shape, the minute warpage caused by the metal plate can be eliminated. , the flatness can be further improved, so that better reproduction accuracy and vapor deposition accuracy of the vapor deposition layer can be ensured. It is possible to suppress an increase in the manufacturing cost and also contribute to the increase in size of the mask.

Furthermore, in the vapor deposition masks of the first, second, fourth, and fifth embodiments, a plurality of frame bodies 3 and 3 are stacked, and the frame bodies 3 adjacent in the stacking direction are joined via the adhesive layer 19 . , 3, so that when the frame body 3 is formed with the same thickness as the conventional one, the frame body 3 can be formed by using a thinner metal plate, and the occurrence of deformation caused by thermal expansion caused by the thickness variation of the metal plate can be further suppressed. Therefore, the size of the vapor deposition mask can be increased, and the flatness of the vapor deposition mask can be maintained, so that better reproduction accuracy and vapor deposition accuracy of the vapor deposition layer can be ensured. In addition, by increasing the adhesive layers 18 and 19 for joining the frame bodies 3 to each other, it is possible to elastically deform more flexibly against an external force, so that damage to the vapor deposition mask can be more effectively prevented.

As described in each of the above-described embodiments, the number and arrangement of the mask bodies 2 included in the vapor deposition mask 1 are not limited to those shown in the above-described embodiments. The number of mask bodies 2 does not need to be plural, and may be one. The material of the mask body 2 is not limited to metal, and may be formed of resin, and further explained, may also be formed by etching or laser. Furthermore, before the joining step of the upper and lower frames 16 and 17 , the frame body 3 can give a two-dimensional curved surface or a three-dimensional curved surface by subjecting the upper and lower frames 16 and 17 to be cut out by pressing the upper and lower frames 17 using upper and lower dies for providing curved surfaces. At this time, by providing a two-dimensional curved surface or a three-dimensional curved surface in a line-symmetric relationship, the frame body 3 can be easily formed into a flat shape in the subsequent joining step. In addition, the metal layer 8 may have a multilayer structure of two or more layers as in the above-described mask body 2 (primary electroforming layer 30 ).

In each of the above-described embodiments, the mask main body 2 and the frame body 3 are integrally bonded to each other without being separated via the metal layer 8, but the mask main body 2 and the frame body 3 may be bonded via an adhesive layer. At this time, as described in the fifth embodiment, when the support frame 46 and the auxiliary frame 47 are provided, the support frame is fixed and supported on the lower surface of the mask main body 2 (the surface on the opposite side to the surface to which the frame body 3 is joined). The frame 46 is attached, and the auxiliary frame 47 is fixed to the lower surface of the support frame 46 (the surface on the opposite side to the surface on which the mask body 2 is provided). In addition, the adhesive layer is preferably excellent in heat resistance and solvent resistance.

In each of the above-described embodiments, the support frame 46 and the auxiliary frame 47 are not limited to metals such as aluminum and iron, and various materials such as resin can be used, similar to the frame body 3 , but it is preferable to use a constant gauge steel material and a super constant gauge steel material. , ceramics and other materials with a small thermal expansion coefficient. In addition, like the frame body 3, the support frame 46 and the auxiliary frame 47 may be constituted by an upper frame and a lower frame, and the upper and lower frames may be joined together via an adhesive layer to form them integrally. In addition, a plurality of support frames 46 and auxiliary frames 47 may be separately prepared, and the support frames 46 and 46 and the auxiliary frames 47 and 47 which are adjacent to each other in the stacking direction may be bonded to each other via a bonding layer. Thereby, the thickness variation of the support frame 46 and the auxiliary frame 47 can be reduced. In addition, in the frame body 3 and the support frame 46 , the material may be different for the outer peripheral portion and the frame line portion that defines the openings (the mask opening 11 , the frame opening 48 ).

1‧‧‧Evaporation mask 2‧‧‧Mask body 3‧‧‧Frame body 4‧‧‧Pattern forming area 4a‧‧‧Outer periphery 5‧‧‧Evaporation deposition through hole 6‧‧‧Evaporation deposition pattern 8 ‧‧‧Metal layer 10‧‧‧Outer frame 11‧‧‧Shield opening 12‧‧‧Vertical frame 13‧‧‧Horizontal frame 16‧‧‧Upper frame 17‧‧‧Lower frame 18‧‧‧Adhesion layer 19‧ ‧‧Adhesive layer 24‧‧‧Master mold 25‧‧‧Photoresist layer 26‧‧‧Patterned film 26a‧‧‧Transparent hole 27‧‧‧Pre-patterning stage 29‧‧‧Primary pattern resist 29a‧ ‧‧Resist body 30‧‧‧Electroforming layer 43‧‧‧Subsequent resist 46‧‧‧Support frame 47‧‧‧Auxiliary frame 48‧‧‧Frame opening 50‧‧‧Evaporation mask body W1 ‧‧‧Width dimension of vertical frame W2‧‧‧Width dimension of horizontal frame

FIG. 1 is a vertical cross-sectional front view showing a main part of a vapor deposition mask according to a first embodiment of the present invention. 2 is a perspective view showing the entire vapor deposition mask according to the first embodiment of the present invention. 3 is a plan view showing a main part of the vapor deposition mask according to the first embodiment of the present invention. 4 is a plan view of a frame body of the vapor deposition mask according to the first embodiment of the present invention. FIG. 5 is an explanatory view showing a frame body forming step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention. 6 is an explanatory diagram showing a modification of the frame forming step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention. 7 is a plan view showing a modification of the frame of the vapor deposition mask according to the first embodiment of the present invention. FIG. 8 is an explanatory diagram showing a first patterning step and a first electroforming step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention. 9 is an explanatory diagram showing an activation treatment step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention. 10 is an explanatory diagram showing a secondary patterning step, a frame arranging step, a second electroforming step, and a peeling step in the manufacturing method of the vapor deposition mask according to the first embodiment of the present invention. 11 is a vertical cross-sectional front view showing a main part of a vapor deposition mask according to a second embodiment of the present invention. 12 is an explanatory diagram showing a frame arrangement step, a second electroforming step, and a peeling step of the vapor deposition mask according to the second embodiment of the present invention. FIG. 13 is a vertical cross-sectional front view showing a main part of a vapor deposition mask according to a third embodiment of the present invention. 14 is an explanatory diagram showing a first patterning step and a first electroforming step in the method of manufacturing the vapor deposition mask according to the third embodiment of the present invention. 15 is an explanatory diagram showing a secondary patterning step, a frame arranging step, a second electroforming step, and a peeling step in the method of manufacturing the vapor deposition mask according to the third embodiment of the present invention. 16 is a longitudinal cross-sectional front view showing a main part of a vapor deposition mask according to a fourth embodiment of the present invention. FIG. 17 is an explanatory diagram showing a method of manufacturing a vapor deposition mask according to a fourth embodiment of the present invention. 18 is a vertical cross-sectional front view showing a vapor deposition mask according to a fifth embodiment of the present invention. 19 is an exploded perspective view of a vapor deposition mask according to a fifth embodiment of the present invention. 20 is a plan view of a vapor deposition mask according to a fifth embodiment of the present invention. 21 is an exploded perspective view showing a modification of the vapor deposition mask according to the fifth embodiment of the present invention.

1‧‧‧Evaporation mask

2‧‧‧Mask the subject

3‧‧‧Frame

7‧‧‧Bond Through Holes

8‧‧‧Metal layer

10‧‧‧Peripheral frame

11‧‧‧Mask opening

12‧‧‧Vertical frame

13‧‧‧Horizontal

16‧‧‧Top frame

17‧‧‧Lower frame

18‧‧‧Second layer

19‧‧‧Second layer

46‧‧‧Support Framework

47‧‧‧Auxiliary frame

48‧‧‧Frame opening

Claims (9)

A vapor deposition mask comprising a mask body (2) and a frame body (3) arranged around the mask body (2), wherein the mask body (2) is provided with a plurality of independent vapor deposition through holes (5). ), the vapor deposition mask is characterized in that a support frame (46) is fixed on the lower surface side of the frame body (3), and the support frame (46) is formed with the frame body (3) The frame opening (48) corresponding to the mask opening (11) of the frame (47). The vapor deposition mask according to claim 1, wherein the frame body (3) includes an outer peripheral frame (10), a vertical frame (12) defining the mask opening (11) in the outer peripheral frame (10), and a horizontal frame ( 13), the vertical frame (12) and the horizontal frame (13) are supported by the supporting frame (46) as a whole, the auxiliary frame (47) is formed into a frame shape, and the periphery of the supporting frame (46) is supported by the auxiliary frame (47). The vapor deposition mask according to claim 1 or 2, wherein the frame body (3), the support frame (46), and the auxiliary frame (47) are integrally formed by welding, and the welding parts (49) are provided at four corners Part and the peripheral part on the extension line of the vertical frame (12) and the horizontal frame (13) of the frame body (3). The vapor deposition mask according to claim 1 or 2, wherein the mask body (2) and the frame body (3) are integrally joined via a metal layer (8). The vapor deposition mask according to claim 1 or 2, wherein a plurality of frame bodies (3, 3) are laminated, and adjacent frame bodies (3, 3) in the lamination direction are joined to each other via an adhesive layer (19). . A manufacturing method of an evaporation mask, the evaporation mask is provided with a mask main body (2) and A frame body (3) arranged around a mask body (2), the mask body (2) having a vapor deposition pattern (6) composed of a plurality of independent vapor deposition through holes (5), and the vapor deposition mask The manufacturing method of a cover is characterized by comprising: a step of preparing a mask main body (2) and a frame body (3); a step of integrally joining the mask main body (2) and the frame body (3); The step of engaging the support frame (46) on the lower surface side of the support frame (46); and the step of engaging the auxiliary frame (47) on the lower surface side of the support frame (46). The manufacturing method of the vapor deposition mask according to claim 6, wherein, in the step of preparing the mask body (2) and the frame body (3), it comprises: a frame body forming step of forming the frame body (3); A primary patterning step of forming a primary patterned resist (29) having a resist body (29a) corresponding to the vapor-deposited through hole (5) on the surface of the master mold (24); and electroforming the electrodeposited metal on the master The first electroforming step of forming the primary electroforming layer (30) on the surface of the mold (24) that is not covered by the resist body (29a) is in the integral bonding of the mask body (2) and the frame body (3). In the step, the mask body (2) and the frame body (3) are integrally bonded through a metal layer formed by electroforming. The method of manufacturing a vapor deposition mask according to claim 6 or 7, wherein a plurality of vapor deposition mask bodies (2) formed by integrally bonding the mask body (2) and the frame body (3) via a metal layer are prepared. 50), when a plurality of vapor deposition mask bodies (50) are joined to the support frame (46) one by one, on the opposite side of the support frame (46) to the side where the vapor deposition mask body (50) is fixed Engage the auxiliary frame (47). The manufacturing method of the vapor deposition mask according to claim 6 or 7, wherein the frame body (3), the support frame (46), and the auxiliary frame (47) are integrally joined by welding, and the welding portion (49) is provided with The four corners and the peripheral portion of the vertical frame (12) and the horizontal frame (13) of the frame body (3).

Images